FI117590B - Kylelement - Google Patents
Kylelement Download PDFInfo
- Publication number
- FI117590B FI117590B FI20045216A FI20045216A FI117590B FI 117590 B FI117590 B FI 117590B FI 20045216 A FI20045216 A FI 20045216A FI 20045216 A FI20045216 A FI 20045216A FI 117590 B FI117590 B FI 117590B
- Authority
- FI
- Finland
- Prior art keywords
- flow channel
- cooling element
- channel
- inlet
- cooling
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/08—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by varying the cross-section of the flow channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
- F28F7/02—Blocks traversed by passages for heat-exchange media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/40—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only inside the tubular element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/16—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes extruded
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Thermotherapy And Cooling Therapy Devices (AREA)
- Resistance Heating (AREA)
Claims (5)
1. Ett kylelement (1) för en elektronikappärat, vilket kylelement om- fattar: 5 en inloppsöppning (2) för att mottaga kylmedium, en utloppsöppning (3) för att avlägsna kylmedium ur kylelementet, och en strömningskanal (4, 5, 6, 7, 8) för att leda kylmedium frän in-loppsöppningen tili utloppsöppningen, k ä n n e t e c k n a t av 10 att i strömningskanalen (7) finns ätminstone en sektion med ett mindre genomsnitt för att orsaka en tyckdifferens mellan strömningskanalens startände (4) och slutände (6), att en matningsöppning (10) för en sidocirkulation (11) har anord-nats i kylelementets strömingskanals startände (4) i strömningsriktningen före 15 nämnda sektion med ett mindre genomsnitt, där trycket är högre, via vilken matningsöppning kylmedium kan ledas tili en frän kylelementet (1) extern sidocirkulation, och att en inloppsöppning (12) för nämnda sidocirkulation (11) har an- , ordnats i kylelementets strömingskanals slutände (6) i strömningsriktningen 20 efter nämnda sektion med ett mindre genomsnitt, där trycket är lägre, via vil-ken inloppsöppning kylmedium som atervänder frän sidocirkulationen kan le-·:*·· das tili kylelementets strömningskanal. ;\i
2. Kylelement enligt patentkrav 1, kännetecknat av att i : .\ strömningskanalens (4, 5, 6) inneryta finns i strömningskanalens längdriktning “V 25 löpande ribbor (13) som skjuter ut frän strömningskanalens väggar för att öka "II innerytans area.
**··* 3. Kylelement enligt patentkrav 2, k ä n n e t e c k n a t av att rib- borna (13) är kapade med bestämda intervall i strömningskanalens längdrikt- ‘•:V ning. • · ·
4. Kylelement enligt nagot av patentkraven 1 - 3, kä n n e tee k- n at av • · · .···. att strömningskanalen är utformad tili att slingra av och an, varvid • · strömningskanalen omfattar flera sinsemellan väsentligen parallella kanalsek- v.: tioner (4, 5, 6), och • · * * » • · • · · 117590 att mellan ändarna pa atminstone tva (5, 6) väsentligen parallella kanalsektioner har bildats en tömningskanal (14), vars tvärsnitt är väsentligen mindre än strömningskanalens tvärsnitt, och vars ena ände öppnar sig i närhe-ten av strömningskanalens inlopps- eller utloppsöppning (3) för att möjliggöra 5 tömning av strömningskanalen.
5. Kylelement enligt nagot av patentkraven 1-4, känneteck-nat av att nämnda kylelement (1) utgörs av ett enhetligt stycke i vilket strömningskanalen har gjorts genom strängsprutning och/eller borming. « • · * • * · • * * · • · • · • tt • # • · • · · ’ ··· ··♦ · *:· ' ' ΐ *··« • · · : ϊ ··· « • ♦ · • « « • · • · · • · • · ·*♦ ··· • · « ♦ · · • · · • · • · ··· • · • · · * * * « * • · • · » · ·
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20045216A FI117590B (sv) | 2004-06-11 | 2004-06-11 | Kylelement |
EP05103688A EP1605741B1 (en) | 2004-06-11 | 2005-05-03 | Cooling element |
US11/120,192 US7059390B2 (en) | 2004-06-11 | 2005-05-03 | Cooling element |
DE602005003058T DE602005003058T2 (de) | 2004-06-11 | 2005-05-03 | Kühlkörper |
AT05103688T ATE377349T1 (de) | 2004-06-11 | 2005-05-03 | Kühlkörper |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20045216A FI117590B (sv) | 2004-06-11 | 2004-06-11 | Kylelement |
FI20045216 | 2004-06-11 |
Publications (3)
Publication Number | Publication Date |
---|---|
FI20045216A0 FI20045216A0 (sv) | 2004-06-11 |
FI20045216A FI20045216A (sv) | 2005-12-12 |
FI117590B true FI117590B (sv) | 2006-11-30 |
Family
ID=32524590
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20045216A FI117590B (sv) | 2004-06-11 | 2004-06-11 | Kylelement |
Country Status (5)
Country | Link |
---|---|
US (1) | US7059390B2 (sv) |
EP (1) | EP1605741B1 (sv) |
AT (1) | ATE377349T1 (sv) |
DE (1) | DE602005003058T2 (sv) |
FI (1) | FI117590B (sv) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7450384B2 (en) | 2006-07-06 | 2008-11-11 | Hybricon Corporation | Card cage with parallel flow paths having substantially similar lengths |
US7802636B2 (en) | 2007-02-23 | 2010-09-28 | Atwood Oceanics, Inc. | Simultaneous tubular handling system and method |
DE102007038510B4 (de) | 2007-08-14 | 2020-01-16 | Rauch Landmaschinenfabrik Gmbh | Vorrichtung zum Dosieren und Verteilen von landwirtschaftlichen und kommunalen Schüttgütern |
FI121863B (sv) * | 2007-09-07 | 2011-05-13 | Abb Oy | Drossel för en elektronikapparat |
EP2131641A1 (en) * | 2008-06-04 | 2009-12-09 | ABB Oy | Cooling element for an electrical circuit |
SE533224C2 (sv) | 2008-09-16 | 2010-07-27 | Sapa Profiler Ab | Kylkropp för kretskortkomponenter |
IT1401386B1 (it) | 2010-07-30 | 2013-07-18 | Eurotech S P A | Dispositivo di raffreddamento a liquido per schede elettroniche, in particolare per unita' di elaborazione ad elevate prestazioni |
US8869877B2 (en) * | 2010-10-11 | 2014-10-28 | Hamilton Sundstrand Space Systems International, Inc. | Monolithic cold plate configuration |
US20120138281A1 (en) * | 2010-12-06 | 2012-06-07 | Transistor Devices, Inc. D/B/A Tdi Power | Heat Exchanger for Electronic Assemblies |
EP2629594A1 (en) * | 2012-02-14 | 2013-08-21 | ABB Oy | Electronic apparatus |
GB2527338B (en) * | 2014-06-19 | 2018-11-07 | ECONOTHERM UK Ltd | Heat transfer apparatus |
US20180328285A1 (en) * | 2017-05-11 | 2018-11-15 | Unison Industries, Llc | Heat exchanger |
DE102018129160B4 (de) * | 2018-11-20 | 2022-11-24 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Verfahren zur Herstellung eines Kühlkörpers |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1905653A (en) * | 1931-05-08 | 1933-04-25 | Walter Wood | Plug for steam platens and other metallic articles |
NL298883A (sv) * | 1963-09-06 | |||
US3327776A (en) * | 1965-10-24 | 1967-06-27 | Trane Co | Heat exchanger |
US3437132A (en) * | 1967-08-30 | 1969-04-08 | Vemaline Products Co Inc | Water cooled heat sink |
US3887004A (en) * | 1972-06-19 | 1975-06-03 | Hayden Trans Cooler Inc | Heat exchange apparatus |
JPS5271625A (en) * | 1975-12-10 | 1977-06-15 | Semikron Gleichrichterbau | Semiconductor rectifier device |
US4268850A (en) * | 1979-05-11 | 1981-05-19 | Electric Power Research Institute | Forced vaporization heat sink for semiconductor devices |
JPS61222242A (ja) * | 1985-03-28 | 1986-10-02 | Fujitsu Ltd | 冷却装置 |
DE3717649A1 (de) * | 1987-05-26 | 1988-12-15 | Held Kurt | Doppelbandpresse mit erwaerm- oder kuehlbaren teilen und verfahren zu deren herstellung |
FR2729044B1 (fr) * | 1994-12-30 | 1997-01-24 | Atherm | Element refroisisseur et connecteur pour un composant electronique de puissance refroidi par un fluide electriquement isole du composant |
US5957194A (en) * | 1996-06-27 | 1999-09-28 | Advanced Thermal Solutions, Inc. | Plate fin heat exchanger having fluid control means |
US6058010A (en) * | 1998-11-06 | 2000-05-02 | International Business Machines Corporation | Enhanced test head liquid cooled cold plate |
EP1056323A1 (en) | 1999-05-25 | 2000-11-29 | Lucent Technologies Inc. | Cooling unit using pressure differential |
GB2354062A (en) * | 1999-09-13 | 2001-03-14 | British Broadcasting Corp | Cooling system for use in cooling electronic equipment |
AU2002306161A1 (en) * | 2001-06-12 | 2002-12-23 | Liebert Corporation | Single or dual buss thermal transfer system |
US6615911B1 (en) * | 2002-03-07 | 2003-09-09 | Delphi Technologies, Inc. | High performance liquid-cooled heat sink with twisted tape inserts for electronics cooling |
DE10227008B4 (de) * | 2002-06-18 | 2012-10-18 | Robert Bosch Gmbh | Kühlvorrichtung für Halbleitermodule und Elektronikanordnung |
-
2004
- 2004-06-11 FI FI20045216A patent/FI117590B/sv not_active IP Right Cessation
-
2005
- 2005-05-03 DE DE602005003058T patent/DE602005003058T2/de active Active
- 2005-05-03 EP EP05103688A patent/EP1605741B1/en active Active
- 2005-05-03 AT AT05103688T patent/ATE377349T1/de not_active IP Right Cessation
- 2005-05-03 US US11/120,192 patent/US7059390B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
DE602005003058T2 (de) | 2008-02-28 |
ATE377349T1 (de) | 2007-11-15 |
DE602005003058D1 (de) | 2007-12-13 |
US7059390B2 (en) | 2006-06-13 |
EP1605741B1 (en) | 2007-10-31 |
US20050274505A1 (en) | 2005-12-15 |
EP1605741A1 (en) | 2005-12-14 |
FI20045216A (sv) | 2005-12-12 |
FI20045216A0 (sv) | 2004-06-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Patent granted |
Ref document number: 117590 Country of ref document: FI |
|
PC | Transfer of assignment of patent |
Owner name: ABB SCHWEIZ AG |
|
MM | Patent lapsed |