ES8306194A1 - Un metodo para la deposicion de estano metalico brillante o de aleaciones de estano con cobre o rodio sobre un sustrato. - Google Patents

Un metodo para la deposicion de estano metalico brillante o de aleaciones de estano con cobre o rodio sobre un sustrato.

Info

Publication number
ES8306194A1
ES8306194A1 ES511040A ES511040A ES8306194A1 ES 8306194 A1 ES8306194 A1 ES 8306194A1 ES 511040 A ES511040 A ES 511040A ES 511040 A ES511040 A ES 511040A ES 8306194 A1 ES8306194 A1 ES 8306194A1
Authority
ES
Spain
Prior art keywords
tin
electroplating
divalent
bright
baths
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES511040A
Other languages
English (en)
Other versions
ES511040A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Occidental Chemical Corp
Original Assignee
Hooker Chemicals and Plastics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hooker Chemicals and Plastics Corp filed Critical Hooker Chemicals and Plastics Corp
Publication of ES8306194A1 publication Critical patent/ES8306194A1/es
Publication of ES511040A0 publication Critical patent/ES511040A0/es
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

METODO PARA LA DEPOSICION DE ESTAÑO METALICO BRILLANTE O DE ALEACIONES DE ESTAÑO CON COBRE O RODIO SOBRE UN SUSTRATO. COMPRENDE LAS SIGUIENTES OPERACIONES: PRIMERA, SE PREPARA UN BAÑO GALVANOPLASTICO CONSTITUIDO POR UN COMPUESTO DE ESTAÑO DIVALENTE, POR UN ACIDO INORGANICO EN CANTIDAD SUFICIENTE PARA MANTENER EL PH DEL BAÑO EN UN VALOR NO SUPERIOR A 2, Y POR UN ABRILLANTADOR FORMADO POR UNA AMINA AROMATICA, UN AGENTE TENSOACTIVO NO IONICO Y UNA CANTIDAD SUFICIENTE DE UN ACIDO SULFONICO AROMATICO PARA MANTENER LA ESTABILIDAD DEL BAÑO GALVANIZANTE Y EXALTAR EL BRILLO DEL ELECTRODEPOSITO; SEGUNDA, SE SUMERGE EL SUSTRATO A REVESTIR EN EL BAÑO GALVANOPLASTICO; Y POR ULTIMO, SE HACE PASAR UNA CORRIENTE ELECTRICA A TRAVES DE DICHO BAÑO, DURANTE EL TIEMPO NECESARIO, PARA QUE SE PRODUZCA LA ELECTRODEPOSICION DESEADA.
ES511040A 1981-04-02 1982-04-01 Un metodo para la deposicion de estano metalico brillante o de aleaciones de estano con cobre o rodio sobre un sustrato. Granted ES511040A0 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/250,373 US4347107A (en) 1981-04-02 1981-04-02 Electroplating tin and tin alloys and baths therefor

Publications (2)

Publication Number Publication Date
ES8306194A1 true ES8306194A1 (es) 1983-05-01
ES511040A0 ES511040A0 (es) 1983-05-01

Family

ID=22947464

Family Applications (1)

Application Number Title Priority Date Filing Date
ES511040A Granted ES511040A0 (es) 1981-04-02 1982-04-01 Un metodo para la deposicion de estano metalico brillante o de aleaciones de estano con cobre o rodio sobre un sustrato.

Country Status (13)

Country Link
US (1) US4347107A (es)
JP (1) JPS57177987A (es)
BE (1) BE892731A (es)
BR (1) BR8201863A (es)
CA (1) CA1184872A (es)
DE (1) DE3211329A1 (es)
ES (1) ES511040A0 (es)
FR (1) FR2503192A1 (es)
GB (1) GB2096175B (es)
HK (1) HK67786A (es)
IT (1) IT8248133A0 (es)
NL (1) NL8201278A (es)
SE (1) SE8201736L (es)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4405412A (en) * 1982-03-29 1983-09-20 Dart Industries Inc. Removal of copper contamination from tin plating baths
US4749626A (en) * 1985-08-05 1988-06-07 Olin Corporation Whisker resistant tin coatings and baths and methods for making such coatings
JPS62274087A (ja) * 1986-05-22 1987-11-28 Permelec Electrode Ltd 耐久性を有する電解用電極及びその製造方法
US5393573A (en) * 1991-07-16 1995-02-28 Microelectronics And Computer Technology Corporation Method of inhibiting tin whisker growth
US5385661A (en) * 1993-09-17 1995-01-31 International Business Machines Corporation Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition
TW577938B (en) * 1998-11-05 2004-03-01 Uyemura C & Co Ltd Tin-copper alloy electroplating bath and plating process therewith
US6562220B2 (en) 1999-03-19 2003-05-13 Technic, Inc. Metal alloy sulfate electroplating baths
US6251253B1 (en) 1999-03-19 2001-06-26 Technic, Inc. Metal alloy sulfate electroplating baths
EP1091023A3 (en) * 1999-10-08 2003-05-14 Shipley Company LLC Alloy composition and plating method
US20020166774A1 (en) * 1999-12-10 2002-11-14 Shipley Company, L.L.C. Alloy composition and plating method
JP2001181889A (ja) * 1999-12-22 2001-07-03 Nippon Macdermid Kk 光沢錫−銅合金電気めっき浴
GB0106131D0 (en) 2001-03-13 2001-05-02 Macdermid Plc Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys
US6860981B2 (en) * 2002-04-30 2005-03-01 Technic, Inc. Minimizing whisker growth in tin electrodeposits
US20070007144A1 (en) * 2005-07-11 2007-01-11 Schetty Robert A Iii Tin electrodeposits having properties or characteristics that minimize tin whisker growth
JP4632186B2 (ja) * 2007-08-01 2011-02-16 太陽化学工業株式会社 電子部品用錫電解めっき液、電子部品の錫電解めっき方法及び錫電解めっき電子部品
WO2009061984A2 (en) * 2007-11-09 2009-05-14 Technic, Inc. Method of metallizing solar cell conductors by electroplating with minimal attack on underlying materials of construction
US8226807B2 (en) 2007-12-11 2012-07-24 Enthone Inc. Composite coatings for whisker reduction
US20090145764A1 (en) * 2007-12-11 2009-06-11 Enthone Inc. Composite coatings for whisker reduction
US10072347B2 (en) * 2012-07-31 2018-09-11 The Boeing Company Systems and methods for tin antimony plating

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3616291A (en) * 1969-09-16 1971-10-26 Vulcan Materials Co Stannous solutions containing hydroxy carboxylic acid ions their preparation and their use in plating tin on conductive surfaces particularly on aluminum
US3785939A (en) * 1970-10-22 1974-01-15 Conversion Chem Corp Tin/lead plating bath and method
US3905878A (en) * 1970-11-16 1975-09-16 Hyogo Prefectural Government Electrolyte for and method of bright electroplating of tin-lead alloy
US3730853A (en) * 1971-06-18 1973-05-01 Schloetter M Electroplating bath for depositing tin-lead alloy plates
US3749649A (en) * 1971-12-16 1973-07-31 M & T Chemicals Inc Bright tin-lead alloy plating
US3926749A (en) * 1971-12-20 1975-12-16 M & T Chemicals Inc Tin-lead alloy plating
SU445708A1 (ru) * 1972-11-04 1974-10-05 Предприятие П/Я А-7284 Электролит дл осаждени сплава олово-свинец
US3850765A (en) * 1973-05-21 1974-11-26 Oxy Metal Finishing Corp Bright solder plating
US4132610A (en) * 1976-05-18 1979-01-02 Hyogo Prefectural Government Method of bright electroplating of tin-lead alloy
US4135991A (en) * 1977-08-12 1979-01-23 R. O. Hull & Company, Inc. Bath and method for electroplating tin and/or lead

Also Published As

Publication number Publication date
JPS57177987A (en) 1982-11-01
DE3211329A1 (de) 1982-10-14
SE8201736L (sv) 1982-10-03
BE892731A (fr) 1982-10-01
BR8201863A (pt) 1983-03-08
GB2096175A (en) 1982-10-13
CA1184872A (en) 1985-04-02
FR2503192B1 (es) 1984-11-30
HK67786A (en) 1986-09-18
GB2096175B (en) 1984-06-13
ES511040A0 (es) 1983-05-01
FR2503192A1 (fr) 1982-10-08
IT8248133A0 (it) 1982-03-31
NL8201278A (nl) 1982-11-01
US4347107A (en) 1982-08-31

Similar Documents

Publication Publication Date Title
ES8306194A1 (es) Un metodo para la deposicion de estano metalico brillante o de aleaciones de estano con cobre o rodio sobre un sustrato.
US2830014A (en) Electroplating process
GB957778A (en) Improvements in or relating to immersion tin coating and to electrodepositing tin-copper alloys on aluminium
US3730853A (en) Electroplating bath for depositing tin-lead alloy plates
GB857849A (en) Additives for electroplating baths
GB503008A (en) Improvements in the electrodeposition of metals on alloys containing chromium
US2916423A (en) Electrodeposition of copper and copper alloys
ES8307930A1 (es) Un metodo para depositar estano metalico brillante sobre un sustrato.
US4440608A (en) Process and bath for the electrodeposition of tin-lead alloys
SE7905198L (sv) Nytt bad for elektropletering av glensande tenn
ES475996A1 (es) Un metodo de producir depositos electroliticos de zinc bri- llantes.
GB1000721A (en) Improvements in or relating to the electrolytic deposition on a workpiece
JP2983548B2 (ja) スズービスマス合金の電気めっき法
ES8308367A1 (es) Un bano de electrodeposicion de estano-plomo.
GB1224966A (en) Tin plating baths
US2677654A (en) Copper electroplating and compositions therefor
ES8402368A1 (es) Metodo para producir un articulo resistente a la corrosion chapado electroliticamente con zinc-niquel.
US3397127A (en) Method and bath for electroplating gold
US2870070A (en) Electrodeposition of tin and electrolyte therefor
KR860001221A (ko) 스테인레스강의 금속도금 방법
JPS63161186A (ja) リフロ−処理錫−鉛合金めつき材の製造方法
JPS63161183A (ja) リフロ−処理錫めつき材の製造方法
CA2054201A1 (en) Protection of lead-containing anodes during chromium electroplating
CN85100385A (zh) 快速滚镀镍铁合金的电镀液及方法
JPS63161188A (ja) リフロ−半田めつき材の製造法

Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19991108