ES538681A0 - Procedimiento para depositar aleaciones de oro-cobre-cinc de pocos quilates - Google Patents

Procedimiento para depositar aleaciones de oro-cobre-cinc de pocos quilates

Info

Publication number: ES538681A0
Authority: ES; Spain
Prior art keywords: depositing; copper; few; procedure; zinc alloys
Prior art date: 1983-12-17
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

ES538681A

Other languages

English (en)

Other versions

ES8600791A1 (es

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

LPW Chemie GmbH

Original Assignee

LPW Chemie GmbH

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1983-12-17

Filing date

1984-12-17

Publication date

1985-11-01

1984-12-17 Application filed by LPW Chemie GmbH filed Critical LPW Chemie GmbH

1985-11-01 Publication of ES8600791A1 publication Critical patent/ES8600791A1/es

1985-11-01 Publication of ES538681A0 publication Critical patent/ES538681A0/es

Status Granted legal-status Critical Current

Links

229910001297 Zn alloy Inorganic materials 0.000 title 1
SXKZZFLSYPUIAN-UHFFFAOYSA-N [Cu].[Zn].[Au] Chemical compound [Cu].[Zn].[Au] SXKZZFLSYPUIAN-UHFFFAOYSA-N 0.000 title 1
238000000151 deposition Methods 0.000 title 1
238000000034 method Methods 0.000 title 1

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroplating And Plating Baths Therefor (AREA)
Electroplating Methods And Accessories (AREA)

ES538681A 1983-12-17 1984-12-17 Procedimiento para depositar aleaciones de oro-cobre-cinc de pocos quilates Granted ES538681A0 (es)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DE19833345795 DE3345795A1 (de)	1983-12-17	1983-12-17	Elektrolyt zur galvanischen abscheidung niedrigkaraetiger gold-kupfer-zink-legierungen

Publications (2)

Publication Number	Publication Date
ES8600791A1 ES8600791A1 (es)	1985-11-01
ES538681A0 true ES538681A0 (es)	1985-11-01

Family

ID=6217308

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
ES538681A Granted ES538681A0 (es)	1983-12-17	1984-12-17	Procedimiento para depositar aleaciones de oro-cobre-cinc de pocos quilates

Country Status (7)

Country	Link
JP (1)	JPS60141891A (es)
DE (1)	DE3345795A1 (es)
ES (1)	ES538681A0 (es)
FR (1)	FR2556745A1 (es)
GB (1)	GB2151661A (es)
IE (1)	IE56138B1 (es)
IT (1)	IT1177440B (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE3601559A1 (de) *	1986-01-21	1987-07-23	Lpw Chemie Gmbh	Verfahren zur einstellung der "goldfarbe" bei der galvanischen abscheidung niedrigkaraetiger gold-kupfer-zink-legierungen
DE3633529A1 (de) *	1986-10-02	1988-05-19	Lpw Chemie Gmbh	Verfahren zum galvanischen abscheiden niedrigkaraetiger gold/kupfer/zink-legierungen
ATE86313T1 (de) *	1987-08-21	1993-03-15	Engelhard Ltd	Bad fuer das elektroplattieren einer gold-kupfer- zink-legierung.
CH680927A5 (es) *	1990-10-08	1992-12-15	Metaux Precieux Sa
US5085744A (en) *	1990-11-06	1992-02-04	Learonal, Inc.	Electroplated gold-copper-zinc alloys
AU7320996A (en)	1995-11-03	1997-05-29	Enthone-Omi Inc	Electroplating processes compositions and deposits
JP7352515B2 (ja) *	2020-05-19	2023-09-28	Ｅｅｊａ株式会社	電解金合金めっき浴及び電解金合金めっき方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CH595463A5 (en) *	1974-11-29	1978-02-15	Heinz Emmenegger	Electroplating of gold and its alloys
DE3020765A1 (de) *	1980-05-31	1981-12-10	Degussa Ag, 6000 Frankfurt	Alkalisches bad zum galvanischen abscheiden niederkaraetiger rosa- bis gelbfarbener goldlegierungsschichten

1983
- 1983-12-17 DE DE19833345795 patent/DE3345795A1/de not_active Withdrawn
1984
- 1984-12-05 JP JP59255881A patent/JPS60141891A/ja active Pending
- 1984-12-14 FR FR8419135A patent/FR2556745A1/fr active Pending
- 1984-12-17 IE IE3234/84A patent/IE56138B1/xx unknown
- 1984-12-17 GB GB08431765A patent/GB2151661A/en not_active Withdrawn
- 1984-12-17 ES ES538681A patent/ES538681A0/es active Granted
- 1984-12-17 IT IT24102/84A patent/IT1177440B/it active

Also Published As

Publication number	Publication date
ES8600791A1 (es)	1985-11-01
IE843234L (en)	1985-06-17
IE56138B1 (en)	1991-04-24
IT1177440B (it)	1987-08-26
GB8431765D0 (en)	1985-01-30
DE3345795A1 (de)	1985-07-04
FR2556745A1 (fr)	1985-06-21
JPS60141891A (ja)	1985-07-26
IT8424102A0 (it)	1984-12-17
GB2151661A (en)	1985-07-24
IT8424102A1 (it)	1986-06-17

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