ES397976A1 - Un procedimiento para precipitar capas metalicas sobre pie-zas moldeadas de poliesteres. - Google Patents
Un procedimiento para precipitar capas metalicas sobre pie-zas moldeadas de poliesteres.Info
- Publication number
- ES397976A1 ES397976A1 ES397976A ES397976A ES397976A1 ES 397976 A1 ES397976 A1 ES 397976A1 ES 397976 A ES397976 A ES 397976A ES 397976 A ES397976 A ES 397976A ES 397976 A1 ES397976 A1 ES 397976A1
- Authority
- ES
- Spain
- Prior art keywords
- solution
- laywers
- depostion
- polyesters
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2062215A DE2062215C3 (de) | 1970-12-17 | 1970-12-17 | Verfahren zur Abscheidung von Metallschichten auf Formkörpern aus Polyestern |
Publications (1)
Publication Number | Publication Date |
---|---|
ES397976A1 true ES397976A1 (es) | 1974-07-01 |
Family
ID=5791316
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES397976A Expired ES397976A1 (es) | 1970-12-17 | 1971-12-15 | Un procedimiento para precipitar capas metalicas sobre pie-zas moldeadas de poliesteres. |
Country Status (14)
Country | Link |
---|---|
JP (1) | JPS5426494B1 (es) |
AT (1) | AT320371B (es) |
AU (1) | AU464464B2 (es) |
BE (1) | BE776681A (es) |
CA (1) | CA962146A (es) |
CH (1) | CH574505A5 (es) |
DE (1) | DE2062215C3 (es) |
ES (1) | ES397976A1 (es) |
FR (1) | FR2118150B1 (es) |
GB (1) | GB1377515A (es) |
IT (1) | IT945452B (es) |
NL (1) | NL7116792A (es) |
SE (1) | SE377945B (es) |
ZA (1) | ZA718403B (es) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4125649A (en) * | 1975-05-27 | 1978-11-14 | Crown City Plating | Pre-etch conditioning of polysulfone and other polymers for electroless plating |
JPS5832489A (ja) * | 1981-08-20 | 1983-02-25 | 日東電工株式会社 | 印刷回路用ポリエステルフイルム |
DE3243190A1 (de) * | 1982-11-23 | 1984-05-24 | Bayer Ag, 5090 Leverkusen | Verfahren zur herstellung metallisierter textiler flaechengebilde |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1042816A (en) * | 1964-06-15 | 1966-09-14 | Ibm | Improvements in or relating to the production of metallic coatings upon the surfacesof other materials |
FR1481700A (fr) * | 1965-06-01 | 1967-05-19 | Photocircuits Corp | Perfectionnements apportés aux procédés de dépôt non galvanique de métaux |
US3561995A (en) * | 1967-04-03 | 1971-02-09 | M & T Chemicals Inc | Method of activating a polymer surface and resultant article |
-
1970
- 1970-12-17 DE DE2062215A patent/DE2062215C3/de not_active Expired
-
1971
- 1971-12-07 NL NL7116792A patent/NL7116792A/xx unknown
- 1971-12-14 CA CA130,077A patent/CA962146A/en not_active Expired
- 1971-12-14 AU AU36841/71A patent/AU464464B2/en not_active Expired
- 1971-12-14 AT AT1073371A patent/AT320371B/de not_active IP Right Cessation
- 1971-12-14 BE BE776681A patent/BE776681A/xx unknown
- 1971-12-15 IT IT54757/71A patent/IT945452B/it active
- 1971-12-15 GB GB5824571A patent/GB1377515A/en not_active Expired
- 1971-12-15 ES ES397976A patent/ES397976A1/es not_active Expired
- 1971-12-15 CH CH1830171A patent/CH574505A5/xx not_active IP Right Cessation
- 1971-12-15 ZA ZA718403A patent/ZA718403B/xx unknown
- 1971-12-16 SE SE7116142A patent/SE377945B/xx unknown
- 1971-12-17 FR FR7145413A patent/FR2118150B1/fr not_active Expired
- 1971-12-17 JP JP10254571A patent/JPS5426494B1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
FR2118150B1 (es) | 1975-10-03 |
SE377945B (es) | 1975-08-04 |
CA962146A (en) | 1975-02-04 |
AU3684171A (en) | 1973-06-21 |
IT945452B (it) | 1973-05-10 |
JPS5426494B1 (es) | 1979-09-04 |
DE2062215A1 (de) | 1972-07-06 |
CH574505A5 (es) | 1976-04-15 |
AT320371B (de) | 1975-02-10 |
ZA718403B (en) | 1972-09-27 |
AU464464B2 (en) | 1975-08-28 |
BE776681A (fr) | 1972-06-14 |
DE2062215C3 (de) | 1978-05-18 |
GB1377515A (en) | 1974-12-18 |
NL7116792A (es) | 1972-06-20 |
DE2062215B2 (de) | 1977-09-15 |
FR2118150A1 (es) | 1972-07-28 |
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