ES2712858T3 - Uso de fosfa-adamantanos solubles en agua y estables en aire como estabilizadores en electrolitos para deposición no electrolítica de metal - Google Patents
Uso de fosfa-adamantanos solubles en agua y estables en aire como estabilizadores en electrolitos para deposición no electrolítica de metal Download PDFInfo
- Publication number
- ES2712858T3 ES2712858T3 ES15189465T ES15189465T ES2712858T3 ES 2712858 T3 ES2712858 T3 ES 2712858T3 ES 15189465 T ES15189465 T ES 15189465T ES 15189465 T ES15189465 T ES 15189465T ES 2712858 T3 ES2712858 T3 ES 2712858T3
- Authority
- ES
- Spain
- Prior art keywords
- metal
- group
- electrolyte
- carbon atoms
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP15189465.6A EP3156517B1 (fr) | 2015-10-13 | 2015-10-13 | Utilisation de phosphaadamantanes solubles dans l'eau et stables dans l'air en tant qu'agents de stabilisation dans des électrolytes pour dépôt de métal auto-catalytique |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2712858T3 true ES2712858T3 (es) | 2019-05-16 |
Family
ID=54324851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES15189465T Active ES2712858T3 (es) | 2015-10-13 | 2015-10-13 | Uso de fosfa-adamantanos solubles en agua y estables en aire como estabilizadores en electrolitos para deposición no electrolítica de metal |
Country Status (7)
Country | Link |
---|---|
US (1) | US20190085461A1 (fr) |
EP (1) | EP3156517B1 (fr) |
KR (1) | KR20180089398A (fr) |
CN (1) | CN108495952A (fr) |
ES (1) | ES2712858T3 (fr) |
TW (1) | TW201718938A (fr) |
WO (1) | WO2017066069A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI646215B (zh) * | 2017-11-03 | 2019-01-01 | 陳始明 | 無電極電鍍金屬的裝置及其方法 |
CN109457238B (zh) * | 2018-08-30 | 2021-01-15 | 上海昕沐化学科技有限公司 | 高速稳定的化学镀铜液及其制备方法 |
JP7228411B2 (ja) * | 2019-03-06 | 2023-02-24 | 上村工業株式会社 | 無電解金めっき浴 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0769572A1 (fr) | 1995-06-06 | 1997-04-23 | ENTHONE-OMI, Inc. | Procédé et bain de dépÔt chimique d'un alliage nickel-cobalt-phosphore |
JP3816241B2 (ja) * | 1998-07-14 | 2006-08-30 | 株式会社大和化成研究所 | 金属を還元析出させるための水溶液 |
DE10015214C1 (de) * | 2000-03-27 | 2002-03-21 | Infineon Technologies Ag | Verfahren zur Metallisierung eines Isolators und/oder eines Dielektrikums |
DE10246453A1 (de) | 2002-10-04 | 2004-04-15 | Enthone Inc., West Haven | Verfahren zur stromlosen Abscheidung von Nickel |
JP2005290415A (ja) | 2004-03-31 | 2005-10-20 | Okuno Chem Ind Co Ltd | 無電解銅めっき液 |
JP5247142B2 (ja) | 2007-12-19 | 2013-07-24 | 株式会社大和化成研究所 | 銀めっき方法 |
CN101348927B (zh) | 2008-09-05 | 2010-10-06 | 江南机器(集团)有限公司 | 无氰预镀铜溶液 |
GB2467163B (en) * | 2009-01-26 | 2013-11-06 | Rhodia Operations | Ligands |
WO2011003116A2 (fr) * | 2009-07-03 | 2011-01-06 | Enthone Inc. | Electrolyte contenant un acide bêta-aminé et procédé de dépôt d'une couche métallique |
-
2015
- 2015-10-13 EP EP15189465.6A patent/EP3156517B1/fr active Active
- 2015-10-13 ES ES15189465T patent/ES2712858T3/es active Active
-
2016
- 2016-10-06 CN CN201680059667.6A patent/CN108495952A/zh active Pending
- 2016-10-06 US US15/765,637 patent/US20190085461A1/en not_active Abandoned
- 2016-10-06 WO PCT/US2016/055655 patent/WO2017066069A1/fr active Application Filing
- 2016-10-06 KR KR1020187013527A patent/KR20180089398A/ko not_active Application Discontinuation
- 2016-10-12 TW TW105132884A patent/TW201718938A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
EP3156517B1 (fr) | 2018-12-05 |
US20190085461A1 (en) | 2019-03-21 |
WO2017066069A8 (fr) | 2018-07-19 |
KR20180089398A (ko) | 2018-08-08 |
EP3156517A8 (fr) | 2017-06-07 |
CN108495952A (zh) | 2018-09-04 |
WO2017066069A1 (fr) | 2017-04-20 |
TW201718938A (zh) | 2017-06-01 |
EP3156517A1 (fr) | 2017-04-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES2714824T3 (es) | Electrolito que comprende beta-aminoácidos y método para la deposición de una capa de metal | |
ES2280652T3 (es) | Soluciones de chapado no electrolitico de niquel. | |
JP6298530B2 (ja) | 無電解ニッケルめっき液、及び無電解ニッケルめっき方法 | |
ES2712858T3 (es) | Uso de fosfa-adamantanos solubles en agua y estables en aire como estabilizadores en electrolitos para deposición no electrolítica de metal | |
US7022169B2 (en) | Electroless gold plating solution | |
JP4105205B2 (ja) | 無電解金めっき液 | |
TWI709663B (zh) | 用於金之無電電鍍之鍍浴組合物、沉積金層之方法及乙二胺衍生物之用途 | |
JP6569026B1 (ja) | 無電解パラジウムめっき液、およびパラジウム皮膜 | |
TW201309844A (zh) | 無電鎳鍍浴組合物 | |
KR102497590B1 (ko) | 니켈 층들의 무전해 성막을 위한 도금욕 및 방법 | |
TW201812097A (zh) | 化學鍍鉑鍍浴 | |
TW201723225A (zh) | 鍍金溶液 | |
TWI804539B (zh) | 無電鍍金鍍浴 | |
JP5602790B2 (ja) | 無電解めっき浴および無電解めっき膜 | |
US20170350016A1 (en) | Use of Water Soluble Lanthanide Compounds As Stabilizer In Electrolytes For Electroless Metal Deposition | |
WO2013094544A1 (fr) | Solution de dépôt autocatalytique de platine, procédé pour sa préparation et procédé de formation de film de platine | |
JP2000008174A (ja) | 自己触媒型無電解銀めっき液 |