ES2187960T3 - Tampon para pulir para un sustrato semiconductor. - Google Patents
Tampon para pulir para un sustrato semiconductor.Info
- Publication number
- ES2187960T3 ES2187960T3 ES98918462T ES98918462T ES2187960T3 ES 2187960 T3 ES2187960 T3 ES 2187960T3 ES 98918462 T ES98918462 T ES 98918462T ES 98918462 T ES98918462 T ES 98918462T ES 2187960 T3 ES2187960 T3 ES 2187960T3
- Authority
- ES
- Spain
- Prior art keywords
- polish
- stamp
- semi
- buffer
- conductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title 1
- 239000011247 coating layer Substances 0.000 abstract 3
- 238000005498 polishing Methods 0.000 abstract 2
- 239000002245 particle Substances 0.000 abstract 1
- 229920005992 thermoplastic resin Polymers 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
- B24B41/047—Grinding heads for working on plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Sustrato del tampón para pulir que comprende partículas sinterizadas de resina termoplástica, en el que dicho sustrato del tampón para pulir es de célula abierta y tiene una superficie superior y una superficie inferior que incluye una capa de revestimiento, en el que las células están interconectadas mediante una red de conductos de capilaridad desde la superficie superior hasta la capa de revestimiento de la superficie inferior, en el que la superficie superior del tampón tiene una irregularidad media de superficie no pulimentada que es superior a la irregularidad media de la superficie no pulimentada de la capa de revestimiento de la superficie inferior del tampón.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US4564697P | 1997-04-18 | 1997-04-18 | |
US5256597P | 1997-07-15 | 1997-07-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2187960T3 true ES2187960T3 (es) | 2003-06-16 |
Family
ID=26723048
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES98918462T Expired - Lifetime ES2187960T3 (es) | 1997-04-18 | 1998-04-17 | Tampon para pulir para un sustrato semiconductor. |
Country Status (12)
Country | Link |
---|---|
US (1) | US6062968A (es) |
EP (1) | EP1011922B1 (es) |
JP (1) | JP2001522316A (es) |
KR (1) | KR20010006518A (es) |
CN (1) | CN1258241A (es) |
AT (1) | ATE227194T1 (es) |
AU (1) | AU7138198A (es) |
DE (1) | DE69809265T2 (es) |
ES (1) | ES2187960T3 (es) |
IL (1) | IL132412A0 (es) |
TW (1) | TW447027B (es) |
WO (1) | WO1998047662A1 (es) |
Families Citing this family (109)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6126532A (en) * | 1997-04-18 | 2000-10-03 | Cabot Corporation | Polishing pads for a semiconductor substrate |
US6592776B1 (en) * | 1997-07-28 | 2003-07-15 | Cabot Microelectronics Corporation | Polishing composition for metal CMP |
JP3291701B2 (ja) * | 1997-11-17 | 2002-06-10 | 日本ミクロコーティング株式会社 | 研磨テープ |
US6224466B1 (en) * | 1998-02-02 | 2001-05-01 | Micron Technology, Inc. | Methods of polishing materials, methods of slowing a rate of material removal of a polishing process |
JP3185753B2 (ja) | 1998-05-22 | 2001-07-11 | 日本電気株式会社 | 半導体装置の製造方法 |
US6390890B1 (en) | 1999-02-06 | 2002-05-21 | Charles J Molnar | Finishing semiconductor wafers with a fixed abrasive finishing element |
EP1161322A4 (en) * | 1999-01-21 | 2003-09-24 | Rodel Inc | IMPROVED POLISHING CUSHIONS AND RELATED METHODS |
US6641463B1 (en) | 1999-02-06 | 2003-11-04 | Beaver Creek Concepts Inc | Finishing components and elements |
EP1043378B1 (en) * | 1999-04-09 | 2006-02-15 | Tosoh Corporation | Molded abrasive product and polishing wheel using it |
TWI228522B (en) * | 1999-06-04 | 2005-03-01 | Fuji Spinning Co Ltd | Urethane molded products for polishing pad and method for making same |
US6364749B1 (en) * | 1999-09-02 | 2002-04-02 | Micron Technology, Inc. | CMP polishing pad with hydrophilic surfaces for enhanced wetting |
JP4542647B2 (ja) * | 1999-09-21 | 2010-09-15 | 東洋ゴム工業株式会社 | 研磨パッド |
US6626740B2 (en) | 1999-12-23 | 2003-09-30 | Rodel Holdings, Inc. | Self-leveling pads and methods relating thereto |
JP2001198796A (ja) * | 2000-01-20 | 2001-07-24 | Toray Ind Inc | 研磨方法 |
JP4591980B2 (ja) * | 2000-02-22 | 2010-12-01 | 東洋ゴム工業株式会社 | 研磨パッド及びその製造方法 |
US6860802B1 (en) * | 2000-05-27 | 2005-03-01 | Rohm And Haas Electric Materials Cmp Holdings, Inc. | Polishing pads for chemical mechanical planarization |
US6964604B2 (en) * | 2000-06-23 | 2005-11-15 | International Business Machines Corporation | Fiber embedded polishing pad |
US6477926B1 (en) | 2000-09-15 | 2002-11-12 | Ppg Industries Ohio, Inc. | Polishing pad |
US20050266226A1 (en) * | 2000-11-29 | 2005-12-01 | Psiloquest | Chemical mechanical polishing pad and method for selective metal and barrier polishing |
US6846225B2 (en) * | 2000-11-29 | 2005-01-25 | Psiloquest, Inc. | Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor |
US6383065B1 (en) | 2001-01-22 | 2002-05-07 | Cabot Microelectronics Corporation | Catalytic reactive pad for metal CMP |
US6840843B2 (en) | 2001-03-01 | 2005-01-11 | Cabot Microelectronics Corporation | Method for manufacturing a polishing pad having a compressed translucent region |
US6517426B2 (en) | 2001-04-05 | 2003-02-11 | Lam Research Corporation | Composite polishing pad for chemical-mechanical polishing |
JP2002326169A (ja) * | 2001-05-02 | 2002-11-12 | Nihon Micro Coating Co Ltd | 接触子クリーニングシート及び方法 |
JP3664676B2 (ja) * | 2001-10-30 | 2005-06-29 | 信越半導体株式会社 | ウェーハの研磨方法及びウェーハ研磨用研磨パッド |
US20030138201A1 (en) * | 2002-01-18 | 2003-07-24 | Cabot Microelectronics Corp. | Self-aligned lens formed on a single mode optical fiber using CMP and thin film deposition |
US6682575B2 (en) | 2002-03-05 | 2004-01-27 | Cabot Microelectronics Corporation | Methanol-containing silica-based CMP compositions |
US20030194959A1 (en) * | 2002-04-15 | 2003-10-16 | Cabot Microelectronics Corporation | Sintered polishing pad with regions of contrasting density |
US7677956B2 (en) | 2002-05-10 | 2010-03-16 | Cabot Microelectronics Corporation | Compositions and methods for dielectric CMP |
US6913517B2 (en) * | 2002-05-23 | 2005-07-05 | Cabot Microelectronics Corporation | Microporous polishing pads |
US20040171339A1 (en) * | 2002-10-28 | 2004-09-02 | Cabot Microelectronics Corporation | Microporous polishing pads |
US20050276967A1 (en) * | 2002-05-23 | 2005-12-15 | Cabot Microelectronics Corporation | Surface textured microporous polishing pads |
KR20030092787A (ko) * | 2002-05-31 | 2003-12-06 | 장명식 | 다공성 연마 패드를 구비하는 연마 장치 및 이를 이용한연마방법 |
US6604987B1 (en) | 2002-06-06 | 2003-08-12 | Cabot Microelectronics Corporation | CMP compositions containing silver salts |
US6641630B1 (en) | 2002-06-06 | 2003-11-04 | Cabot Microelectronics Corp. | CMP compositions containing iodine and an iodine vapor-trapping agent |
US6974777B2 (en) * | 2002-06-07 | 2005-12-13 | Cabot Microelectronics Corporation | CMP compositions for low-k dielectric materials |
US6936543B2 (en) * | 2002-06-07 | 2005-08-30 | Cabot Microelectronics Corporation | CMP method utilizing amphiphilic nonionic surfactants |
CN100445091C (zh) * | 2002-06-07 | 2008-12-24 | 普莱克斯S.T.技术有限公司 | 控制渗透子垫 |
US7025668B2 (en) * | 2002-06-18 | 2006-04-11 | Raytech Innovative Solutions, Llc | Gradient polishing pad made from paper-making fibers for use in chemical/mechanical planarization of wafers |
US20040007690A1 (en) * | 2002-07-12 | 2004-01-15 | Cabot Microelectronics Corp. | Methods for polishing fiber optic connectors |
US6811474B2 (en) | 2002-07-19 | 2004-11-02 | Cabot Microelectronics Corporation | Polishing composition containing conducting polymer |
US7021993B2 (en) * | 2002-07-19 | 2006-04-04 | Cabot Microelectronics Corporation | Method of polishing a substrate with a polishing system containing conducting polymer |
US20070010169A1 (en) * | 2002-09-25 | 2007-01-11 | Ppg Industries Ohio, Inc. | Polishing pad with window for planarization |
US7435165B2 (en) * | 2002-10-28 | 2008-10-14 | Cabot Microelectronics Corporation | Transparent microporous materials for CMP |
US7267607B2 (en) * | 2002-10-28 | 2007-09-11 | Cabot Microelectronics Corporation | Transparent microporous materials for CMP |
US7311862B2 (en) * | 2002-10-28 | 2007-12-25 | Cabot Microelectronics Corporation | Method for manufacturing microporous CMP materials having controlled pore size |
US7071105B2 (en) | 2003-02-03 | 2006-07-04 | Cabot Microelectronics Corporation | Method of polishing a silicon-containing dielectric |
JP3910921B2 (ja) * | 2003-02-06 | 2007-04-25 | 株式会社東芝 | 研磨布および半導体装置の製造方法 |
EP1594656B1 (en) * | 2003-02-18 | 2007-09-12 | Parker-Hannifin Corporation | Polishing article for electro-chemical mechanical polishing |
US20040209066A1 (en) * | 2003-04-17 | 2004-10-21 | Swisher Robert G. | Polishing pad with window for planarization |
US6884156B2 (en) * | 2003-06-17 | 2005-04-26 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
US7435161B2 (en) * | 2003-06-17 | 2008-10-14 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
TWI220006B (en) * | 2003-06-18 | 2004-08-01 | Macronix Int Co Ltd | Chemical mechanical polishing process and apparatus |
CN1316571C (zh) * | 2003-07-02 | 2007-05-16 | 旺宏电子股份有限公司 | 化学机械研磨工艺及装置 |
US6899602B2 (en) * | 2003-07-30 | 2005-05-31 | Rohm And Haas Electronic Materials Cmp Holdings, Nc | Porous polyurethane polishing pads |
US20050032464A1 (en) * | 2003-08-07 | 2005-02-10 | Swisher Robert G. | Polishing pad having edge surface treatment |
US20050153634A1 (en) * | 2004-01-09 | 2005-07-14 | Cabot Microelectronics Corporation | Negative poisson's ratio material-containing CMP polishing pad |
EP1561541B1 (en) * | 2004-02-05 | 2008-04-30 | JSR Corporation | Chemical mechanical polishing pad and polishing process |
CN100356516C (zh) * | 2004-05-05 | 2007-12-19 | 智胜科技股份有限公司 | 单层研磨垫及其制造方法 |
US7776758B2 (en) | 2004-06-08 | 2010-08-17 | Nanosys, Inc. | Methods and devices for forming nanostructure monolayers and devices including such monolayers |
US7968273B2 (en) * | 2004-06-08 | 2011-06-28 | Nanosys, Inc. | Methods and devices for forming nanostructure monolayers and devices including such monolayers |
US8075372B2 (en) * | 2004-09-01 | 2011-12-13 | Cabot Microelectronics Corporation | Polishing pad with microporous regions |
US20060089093A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
US20060089094A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
US20060089095A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
US20060096179A1 (en) * | 2004-11-05 | 2006-05-11 | Cabot Microelectronics Corporation | CMP composition containing surface-modified abrasive particles |
US7531105B2 (en) * | 2004-11-05 | 2009-05-12 | Cabot Microelectronics Corporation | Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios |
US7504044B2 (en) | 2004-11-05 | 2009-03-17 | Cabot Microelectronics Corporation | Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios |
US20060154579A1 (en) * | 2005-01-12 | 2006-07-13 | Psiloquest | Thermoplastic chemical mechanical polishing pad and method of manufacture |
KR100699522B1 (ko) * | 2005-06-30 | 2007-03-27 | (주)제이티앤씨 | 웨이퍼용 연마패드의 제조방법 및 그 연마패드 |
US20070161720A1 (en) * | 2005-11-30 | 2007-07-12 | Applied Materials, Inc. | Polishing Pad with Surface Roughness |
US7517488B2 (en) * | 2006-03-08 | 2009-04-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of forming a chemical mechanical polishing pad utilizing laser sintering |
US20070235904A1 (en) * | 2006-04-06 | 2007-10-11 | Saikin Alan H | Method of forming a chemical mechanical polishing pad utilizing laser sintering |
JP2007329342A (ja) * | 2006-06-08 | 2007-12-20 | Toshiba Corp | 化学的機械的研磨方法 |
JP5013586B2 (ja) * | 2006-09-12 | 2012-08-29 | 東洋ゴム工業株式会社 | 研磨パッド及びその製造方法 |
US20090136785A1 (en) * | 2007-01-03 | 2009-05-28 | Nanosys, Inc. | Methods for nanopatterning and production of magnetic nanostructures |
WO2008085813A2 (en) * | 2007-01-03 | 2008-07-17 | Nanosys, Inc, Et Al. | Methods for nanopatterning and production of nanostructures |
KR101232442B1 (ko) * | 2007-09-21 | 2013-02-12 | 캐보트 마이크로일렉트로닉스 코포레이션 | 아미노실란으로 처리된 연마제 입자를 이용한 연마 조성물 및 방법 |
KR101232585B1 (ko) | 2007-09-21 | 2013-02-12 | 캐보트 마이크로일렉트로닉스 코포레이션 | 아미노실란으로 처리된 연마제 입자를 이용한 연마 조성물 및 방법 |
US8177603B2 (en) * | 2008-04-29 | 2012-05-15 | Semiquest, Inc. | Polishing pad composition |
US8083570B2 (en) * | 2008-10-17 | 2011-12-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having sealed window |
JP5522929B2 (ja) * | 2008-12-03 | 2014-06-18 | 国立大学法人九州大学 | 研磨パッド及び研磨方法 |
TWI573864B (zh) | 2012-03-14 | 2017-03-11 | 卡博特微電子公司 | 具有高移除率及低缺陷率之對氧化物及氮化物有選擇性之cmp組成物 |
US8916061B2 (en) | 2012-03-14 | 2014-12-23 | Cabot Microelectronics Corporation | CMP compositions selective for oxide and nitride with high removal rate and low defectivity |
US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
CN113579992A (zh) | 2014-10-17 | 2021-11-02 | 应用材料公司 | 使用加成制造工艺的具复合材料特性的cmp衬垫建构 |
US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
KR101596621B1 (ko) * | 2015-01-21 | 2016-02-22 | 주식회사 엘지실트론 | 웨이퍼 연마 패드 |
US10946495B2 (en) * | 2015-01-30 | 2021-03-16 | Cmc Materials, Inc. | Low density polishing pad |
CN104802102A (zh) * | 2015-05-20 | 2015-07-29 | 王昊平 | 聚氨酯填埋式砂纸 |
KR20180026779A (ko) * | 2015-07-30 | 2018-03-13 | 제이에이치 로드스 컴퍼니, 인크 | 폴리머 래핑 재료, 매질, 폴리머 래핑 재료를 포함하는 시스템, 및 이들을 사용하고 형성하는 방법 |
WO2017074773A1 (en) | 2015-10-30 | 2017-05-04 | Applied Materials, Inc. | An apparatus and method of forming a polishing article that has a desired zeta potential |
US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
KR102629800B1 (ko) | 2016-01-19 | 2024-01-29 | 어플라이드 머티어리얼스, 인코포레이티드 | 다공성 화학적 기계적 연마 패드들 |
US10259099B2 (en) * | 2016-08-04 | 2019-04-16 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Tapering method for poromeric polishing pad |
US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
KR101949905B1 (ko) * | 2017-08-23 | 2019-02-19 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이의 제조방법 |
KR20210042171A (ko) | 2018-09-04 | 2021-04-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 진보한 폴리싱 패드들을 위한 제형들 |
JP7111609B2 (ja) * | 2018-12-27 | 2022-08-02 | 株式会社クラレ | 繊維複合研磨パッドおよびそれを用いたガラス系基材の研磨方法 |
US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3835212A (en) * | 1970-05-25 | 1974-09-10 | Congoleum Ind Inc | Method for producing resinous sheet-like products |
US3763054A (en) * | 1970-12-07 | 1973-10-02 | Bayer Ag | Process for the production of microporous polyurethane (urea) sheet structures permeable to water vapor |
US3942903A (en) * | 1973-02-27 | 1976-03-09 | Glasrock Products, Inc. | Unitary porous themoplastic writing nib |
US3917761A (en) * | 1973-05-15 | 1975-11-04 | Du Pont | Process of making a porous polyimide shaped article |
US4247498A (en) * | 1976-08-30 | 1981-01-27 | Akzona Incorporated | Methods for making microporous products |
US4519909A (en) * | 1977-07-11 | 1985-05-28 | Akzona Incorporated | Microporous products |
US4256845A (en) * | 1979-02-15 | 1981-03-17 | Glasrock Products, Inc. | Porous sheets and method of manufacture |
US4664683A (en) * | 1984-04-25 | 1987-05-12 | Pall Corporation | Self-supporting structures containing immobilized carbon particles and method for forming same |
US4728552A (en) * | 1984-07-06 | 1988-03-01 | Rodel, Inc. | Substrate containing fibers of predetermined orientation and process of making the same |
US4828772A (en) * | 1984-10-09 | 1989-05-09 | Millipore Corporation | Microporous membranes of ultrahigh molecular weight polyethylene |
US4708039A (en) * | 1986-02-18 | 1987-11-24 | Tube Fab Of Afton Corporation | Bar feeding apparatus |
US4927432A (en) * | 1986-03-25 | 1990-05-22 | Rodel, Inc. | Pad material for grinding, lapping and polishing |
US5073344A (en) * | 1987-07-17 | 1991-12-17 | Porex Technologies Corp. | Diagnostic system employing a unitary substrate to immobilize microspheres |
US4841680A (en) * | 1987-08-25 | 1989-06-27 | Rodel, Inc. | Inverted cell pad material for grinding, lapping, shaping and polishing |
JPS6458475A (en) * | 1987-08-25 | 1989-03-06 | Rodeele Nitta Kk | Grinding pad |
JPH01193166A (ja) * | 1988-01-28 | 1989-08-03 | Showa Denko Kk | 半導体ウェハ鏡面研磨用パッド |
US4880843A (en) * | 1988-03-28 | 1989-11-14 | Hoechst Celanese Corporation | Composition and process for making porous articles from ultra high molecular weight polyethylene |
US5019311A (en) * | 1989-02-23 | 1991-05-28 | Koslow Technologies Corporation | Process for the production of materials characterized by a continuous web matrix or force point bonding |
JPH0398759A (ja) * | 1989-09-07 | 1991-04-24 | Nec Corp | ポリシングパッド及びその製造方法 |
JPH03198332A (ja) * | 1989-12-26 | 1991-08-29 | Nec Corp | 研磨方法及びその装置 |
US5020283A (en) * | 1990-01-22 | 1991-06-04 | Micron Technology, Inc. | Polishing pad with uniform abrasion |
US5257478A (en) * | 1990-03-22 | 1993-11-02 | Rodel, Inc. | Apparatus for interlayer planarization of semiconductor material |
US5230579A (en) * | 1991-06-19 | 1993-07-27 | Carter-Wallace, Inc. | Porous dome applicator with push/pull cap |
US5212910A (en) * | 1991-07-09 | 1993-05-25 | Intel Corporation | Composite polishing pad for semiconductor process |
US5197999A (en) * | 1991-09-30 | 1993-03-30 | National Semiconductor Corporation | Polishing pad for planarization |
MY114512A (en) * | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
US5216843A (en) * | 1992-09-24 | 1993-06-08 | Intel Corporation | Polishing pad conditioning apparatus for wafer planarization process |
US5329734A (en) * | 1993-04-30 | 1994-07-19 | Motorola, Inc. | Polishing pads used to chemical-mechanical polish a semiconductor substrate |
US5554064A (en) * | 1993-08-06 | 1996-09-10 | Intel Corporation | Orbital motion chemical-mechanical polishing apparatus and method of fabrication |
US5394655A (en) * | 1993-08-31 | 1995-03-07 | Texas Instruments Incorporated | Semiconductor polishing pad |
US5453312A (en) * | 1993-10-29 | 1995-09-26 | Minnesota Mining And Manufacturing Company | Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface |
US5422377A (en) * | 1994-04-06 | 1995-06-06 | Sandia Corporation | Microporous polymer films and methods of their production |
US5489233A (en) * | 1994-04-08 | 1996-02-06 | Rodel, Inc. | Polishing pads and methods for their use |
US5562530A (en) * | 1994-08-02 | 1996-10-08 | Sematech, Inc. | Pulsed-force chemical mechanical polishing |
US5609719A (en) * | 1994-11-03 | 1997-03-11 | Texas Instruments Incorporated | Method for performing chemical mechanical polish (CMP) of a wafer |
WO1996015887A1 (en) * | 1994-11-23 | 1996-05-30 | Rodel, Inc. | Polishing pads and methods for their manufacture |
US5533923A (en) * | 1995-04-10 | 1996-07-09 | Applied Materials, Inc. | Chemical-mechanical polishing pad providing polishing unformity |
US5611943A (en) * | 1995-09-29 | 1997-03-18 | Intel Corporation | Method and apparatus for conditioning of chemical-mechanical polishing pads |
-
1998
- 1998-04-17 CN CN98805585A patent/CN1258241A/zh active Pending
- 1998-04-17 ES ES98918462T patent/ES2187960T3/es not_active Expired - Lifetime
- 1998-04-17 AT AT98918462T patent/ATE227194T1/de not_active IP Right Cessation
- 1998-04-17 JP JP54622998A patent/JP2001522316A/ja active Pending
- 1998-04-17 US US09/062,327 patent/US6062968A/en not_active Expired - Lifetime
- 1998-04-17 EP EP98918462A patent/EP1011922B1/en not_active Expired - Lifetime
- 1998-04-17 DE DE69809265T patent/DE69809265T2/de not_active Expired - Fee Related
- 1998-04-17 AU AU71381/98A patent/AU7138198A/en not_active Abandoned
- 1998-04-17 IL IL13241298A patent/IL132412A0/xx unknown
- 1998-04-17 WO PCT/US1998/007908 patent/WO1998047662A1/en not_active Application Discontinuation
- 1998-04-17 KR KR1019997009608A patent/KR20010006518A/ko not_active Application Discontinuation
- 1998-04-18 TW TW087105952A patent/TW447027B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1011922A1 (en) | 2000-06-28 |
DE69809265D1 (de) | 2002-12-12 |
DE69809265T2 (de) | 2003-03-27 |
WO1998047662A1 (en) | 1998-10-29 |
IL132412A0 (en) | 2001-03-19 |
AU7138198A (en) | 1998-11-13 |
CN1258241A (zh) | 2000-06-28 |
TW447027B (en) | 2001-07-21 |
ATE227194T1 (de) | 2002-11-15 |
KR20010006518A (ko) | 2001-01-26 |
EP1011922B1 (en) | 2002-11-06 |
US6062968A (en) | 2000-05-16 |
JP2001522316A (ja) | 2001-11-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES2187960T3 (es) | Tampon para pulir para un sustrato semiconductor. | |
ID28011A (id) | Bantalan penggosok untuk substrat semikonduktor | |
GEP20063922B (en) | Composite abrasive compact | |
TW200610611A (en) | Electrochemical-mechanical polishing system | |
ATE383655T1 (de) | Doppelaufhärtungs-b-stapelbare unterfüllung für das wafer-niveau | |
ES2194663T3 (es) | Estructuras absorbentes multicapa. | |
BR9911021A (pt) | Célula fotovoltaica | |
DE60034840D1 (de) | Photovoltaisches Modul | |
ATE227192T1 (de) | Polierkissen zum chemisch-mechanischen polieren | |
AR011374A1 (es) | Proceso para la produccion de un abrasivo revestido | |
ATE311958T1 (de) | Artikel mit flixiertem schleifmittel zum verändern einer halbleiterscheibe | |
BR0313108B1 (pt) | Processo para preparação de lascas de filme com perfume, lasca de filme com perfume, composição granular para limpeza, e, métodos para melhorar a estabilidade na armazenagem de partículas de perfume e para depositar perfume sobre uma superfície | |
HUP0102559A2 (hu) | Elosztótagok víztelenítésére képes folyadéktároló tagokat tartalmazó abszorbens szerkezetek | |
ATE459453T1 (de) | Polierkissen zum chemisch-mechanischen polieren von substraten in gegenwart von schleifpartikeln enthaltende aufschlämmung | |
BR9811787A (pt) | Abrasivos estruturados com pós funcionais aderidos | |
ES2105299T3 (es) | Celula fotovoltaica. | |
WO2007050420A3 (en) | Semiconductor device with reduced package cross-talk and loss | |
CO4440652A1 (es) | Empaque apropiado para contener y aplicar un parche repelen- te de insectos | |
ES2032906T3 (es) | Procedimiento para la reutilizacion de material base silicio de una celula solar de capa de inversion (mis) con semiconductor de aislador de metal. | |
ES2030686T3 (es) | Procedimiento para revestir con material sintetico y revestimiento producido segun el procedimiento. | |
TW200517477A (en) | Chemical mechanical abrasive slurry and method of using the same | |
AR011373A1 (es) | Proceso para la produccion de un abrasivo revestido | |
ES2102209T3 (es) | Placa de impresion y metodo de fabricacion. | |
WO2001069676A3 (en) | Method and apparatus for bonding substrates | |
WO2004070089A3 (en) | Deposition of layers on substrates |