ES2146128B1 - PHOTOENMASKING PROCESS OF PHOTOSENSIBLE POLYIMIDES WITH ORGANOMETAL COMPOUNDS FOR PHOTOLITHOGRAPHIC PROCESSES IN SILICON TECHNOLOGY. - Google Patents
PHOTOENMASKING PROCESS OF PHOTOSENSIBLE POLYIMIDES WITH ORGANOMETAL COMPOUNDS FOR PHOTOLITHOGRAPHIC PROCESSES IN SILICON TECHNOLOGY.Info
- Publication number
- ES2146128B1 ES2146128B1 ES9500645A ES9500645A ES2146128B1 ES 2146128 B1 ES2146128 B1 ES 2146128B1 ES 9500645 A ES9500645 A ES 9500645A ES 9500645 A ES9500645 A ES 9500645A ES 2146128 B1 ES2146128 B1 ES 2146128B1
- Authority
- ES
- Spain
- Prior art keywords
- polyimides
- silicon technology
- photolithographic processes
- photoenmasking
- photosensible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Formation Of Insulating Films (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Abstract
Procedimiento de fotoenmascaramiento de poliimidas fotosensibles con compuestos organometálicos para procesos fotolitográficos en tecnología de silicio. Es un proceso fotolitográfico monocapa sobre topografías irregulares que se basa en la silanización superficial de los grupos metacrilato del ácido poliámico precursor de la poliimida fotosensible para que actúen como máscara ante el revelado por plasma en modo RIE, con oxígeno como gas reactivo. El proceso permite la obtención de motivos positivos o negativos, con respecto a la máscara, utilizando los mismos precursores fotosensibles ya que esto depende únicamente de la secuencia con que se realicen los pasos de exposición y silanización. Este proceso puede aplicarle a la fotodefinición de capas poliméricas de cualquier espesor. Aplicación en la encapsulación se sensores químicos, módulos multichip, tecnología microelectrónica, sectores electrónicos, óptica integrada.Photo-masking process of photosensitive polyimides with organometallic compounds for photolithographic processes in silicon technology. It is a monolayer photolithographic process on irregular topographies that is based on the surface silanization of the methacrylate groups of the precursor polyamide polyamide acid so that they act as a mask before plasma development in RIE mode, with oxygen as a reactive gas. The process allows obtaining positive or negative motives, with respect to the mask, using the same photosensitive precursors since this depends solely on the sequence with which the exposure and silanization steps are performed. This process can be applied to the photodefinition of polymeric layers of any thickness. Application in encapsulation is chemical sensors, multichip modules, microelectronic technology, electronic sectors, integrated optics.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES9500645A ES2146128B1 (en) | 1995-03-31 | 1995-03-31 | PHOTOENMASKING PROCESS OF PHOTOSENSIBLE POLYIMIDES WITH ORGANOMETAL COMPOUNDS FOR PHOTOLITHOGRAPHIC PROCESSES IN SILICON TECHNOLOGY. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES9500645A ES2146128B1 (en) | 1995-03-31 | 1995-03-31 | PHOTOENMASKING PROCESS OF PHOTOSENSIBLE POLYIMIDES WITH ORGANOMETAL COMPOUNDS FOR PHOTOLITHOGRAPHIC PROCESSES IN SILICON TECHNOLOGY. |
Publications (2)
Publication Number | Publication Date |
---|---|
ES2146128A1 ES2146128A1 (en) | 2000-07-16 |
ES2146128B1 true ES2146128B1 (en) | 2001-03-16 |
Family
ID=8289963
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES9500645A Expired - Lifetime ES2146128B1 (en) | 1995-03-31 | 1995-03-31 | PHOTOENMASKING PROCESS OF PHOTOSENSIBLE POLYIMIDES WITH ORGANOMETAL COMPOUNDS FOR PHOTOLITHOGRAPHIC PROCESSES IN SILICON TECHNOLOGY. |
Country Status (1)
Country | Link |
---|---|
ES (1) | ES2146128B1 (en) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3469608D1 (en) * | 1983-07-01 | 1988-04-07 | Philips Nv | Photosensitive polyamic acid derivative, method of manufacturing polyimide pattern on a substrate, and semiconductor device comprising a polyimide pattern obtained by using the said method |
EP0176062A3 (en) * | 1984-09-27 | 1987-07-15 | Dow Corning Corporation | Silane bonding agents for high temperature applications and method therefor |
EP0467516A1 (en) * | 1990-07-20 | 1992-01-22 | Cabot Technology Corporation | Hemostatic stent |
JP2687751B2 (en) * | 1991-03-18 | 1997-12-08 | 信越化学工業株式会社 | Photopolymer material |
EP0568476B1 (en) * | 1992-04-30 | 1995-10-11 | International Business Machines Corporation | Silicon-containing positive resist and method of using the same in thin film packaging technology |
JP3687988B2 (en) * | 1993-09-03 | 2005-08-24 | 日立化成工業株式会社 | Photosensitive resin composition for i-line stepper |
-
1995
- 1995-03-31 ES ES9500645A patent/ES2146128B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
ES2146128A1 (en) | 2000-07-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FC2A | Grant refused |
Effective date: 19990107 |
|
EC2A | Search report published |
Date of ref document: 20000716 Kind code of ref document: A1 Effective date: 20000716 |