ES2146128B1 - PHOTOENMASKING PROCESS OF PHOTOSENSIBLE POLYIMIDES WITH ORGANOMETAL COMPOUNDS FOR PHOTOLITHOGRAPHIC PROCESSES IN SILICON TECHNOLOGY. - Google Patents

PHOTOENMASKING PROCESS OF PHOTOSENSIBLE POLYIMIDES WITH ORGANOMETAL COMPOUNDS FOR PHOTOLITHOGRAPHIC PROCESSES IN SILICON TECHNOLOGY.

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Publication number
ES2146128B1
ES2146128B1 ES9500645A ES9500645A ES2146128B1 ES 2146128 B1 ES2146128 B1 ES 2146128B1 ES 9500645 A ES9500645 A ES 9500645A ES 9500645 A ES9500645 A ES 9500645A ES 2146128 B1 ES2146128 B1 ES 2146128B1
Authority
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Spain
Prior art keywords
polyimides
silicon technology
photolithographic processes
photoenmasking
photosensible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES9500645A
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Spanish (es)
Other versions
ES2146128A1 (en
Inventor
Pascual Francisco J Munoz
Horna Carlos Dominguez
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Consejo Superior de Investigaciones Cientificas CSIC
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Consejo Superior de Investigaciones Cientificas CSIC
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Publication date
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Priority to ES9500645A priority Critical patent/ES2146128B1/en
Publication of ES2146128A1 publication Critical patent/ES2146128A1/en
Application granted granted Critical
Publication of ES2146128B1 publication Critical patent/ES2146128B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Formation Of Insulating Films (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)

Abstract

Procedimiento de fotoenmascaramiento de poliimidas fotosensibles con compuestos organometálicos para procesos fotolitográficos en tecnología de silicio. Es un proceso fotolitográfico monocapa sobre topografías irregulares que se basa en la silanización superficial de los grupos metacrilato del ácido poliámico precursor de la poliimida fotosensible para que actúen como máscara ante el revelado por plasma en modo RIE, con oxígeno como gas reactivo. El proceso permite la obtención de motivos positivos o negativos, con respecto a la máscara, utilizando los mismos precursores fotosensibles ya que esto depende únicamente de la secuencia con que se realicen los pasos de exposición y silanización. Este proceso puede aplicarle a la fotodefinición de capas poliméricas de cualquier espesor. Aplicación en la encapsulación se sensores químicos, módulos multichip, tecnología microelectrónica, sectores electrónicos, óptica integrada.Photo-masking process of photosensitive polyimides with organometallic compounds for photolithographic processes in silicon technology. It is a monolayer photolithographic process on irregular topographies that is based on the surface silanization of the methacrylate groups of the precursor polyamide polyamide acid so that they act as a mask before plasma development in RIE mode, with oxygen as a reactive gas. The process allows obtaining positive or negative motives, with respect to the mask, using the same photosensitive precursors since this depends solely on the sequence with which the exposure and silanization steps are performed. This process can be applied to the photodefinition of polymeric layers of any thickness. Application in encapsulation is chemical sensors, multichip modules, microelectronic technology, electronic sectors, integrated optics.

ES9500645A 1995-03-31 1995-03-31 PHOTOENMASKING PROCESS OF PHOTOSENSIBLE POLYIMIDES WITH ORGANOMETAL COMPOUNDS FOR PHOTOLITHOGRAPHIC PROCESSES IN SILICON TECHNOLOGY. Expired - Lifetime ES2146128B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ES9500645A ES2146128B1 (en) 1995-03-31 1995-03-31 PHOTOENMASKING PROCESS OF PHOTOSENSIBLE POLYIMIDES WITH ORGANOMETAL COMPOUNDS FOR PHOTOLITHOGRAPHIC PROCESSES IN SILICON TECHNOLOGY.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES9500645A ES2146128B1 (en) 1995-03-31 1995-03-31 PHOTOENMASKING PROCESS OF PHOTOSENSIBLE POLYIMIDES WITH ORGANOMETAL COMPOUNDS FOR PHOTOLITHOGRAPHIC PROCESSES IN SILICON TECHNOLOGY.

Publications (2)

Publication Number Publication Date
ES2146128A1 ES2146128A1 (en) 2000-07-16
ES2146128B1 true ES2146128B1 (en) 2001-03-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
ES9500645A Expired - Lifetime ES2146128B1 (en) 1995-03-31 1995-03-31 PHOTOENMASKING PROCESS OF PHOTOSENSIBLE POLYIMIDES WITH ORGANOMETAL COMPOUNDS FOR PHOTOLITHOGRAPHIC PROCESSES IN SILICON TECHNOLOGY.

Country Status (1)

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ES (1) ES2146128B1 (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3469608D1 (en) * 1983-07-01 1988-04-07 Philips Nv Photosensitive polyamic acid derivative, method of manufacturing polyimide pattern on a substrate, and semiconductor device comprising a polyimide pattern obtained by using the said method
EP0176062A3 (en) * 1984-09-27 1987-07-15 Dow Corning Corporation Silane bonding agents for high temperature applications and method therefor
EP0467516A1 (en) * 1990-07-20 1992-01-22 Cabot Technology Corporation Hemostatic stent
JP2687751B2 (en) * 1991-03-18 1997-12-08 信越化学工業株式会社 Photopolymer material
EP0568476B1 (en) * 1992-04-30 1995-10-11 International Business Machines Corporation Silicon-containing positive resist and method of using the same in thin film packaging technology
JP3687988B2 (en) * 1993-09-03 2005-08-24 日立化成工業株式会社 Photosensitive resin composition for i-line stepper

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Publication number Publication date
ES2146128A1 (en) 2000-07-16

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