ES2139841T3 - Dispositivo de plaquita con inductor. - Google Patents

Dispositivo de plaquita con inductor.

Info

Publication number
ES2139841T3
ES2139841T3 ES95303410T ES95303410T ES2139841T3 ES 2139841 T3 ES2139841 T3 ES 2139841T3 ES 95303410 T ES95303410 T ES 95303410T ES 95303410 T ES95303410 T ES 95303410T ES 2139841 T3 ES2139841 T3 ES 2139841T3
Authority
ES
Spain
Prior art keywords
chip
substrate
inductor
multilayer
solder bumps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95303410T
Other languages
English (en)
Inventor
David John Pedder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intarsia Corp
Original Assignee
Intarsia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intarsia Corp filed Critical Intarsia Corp
Application granted granted Critical
Publication of ES2139841T3 publication Critical patent/ES2139841T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

UN DISPOSITIVO DE PASTILLA INDUCTORA PARA MONTARLO EN UN MODULO DE MULTIPLES PASTILLAS, MONTAJES DE ACOPLAMIENTO DIRECTO A LA PASTILLA O DE MONTAJE EN UNA SUPERFICIE QUE CONSTA DE UN SUSTRATO DIELECTRICO (12), UNA ESTRUCTURA DE METALIZACION EN ESPIRAL (14) DEFINIDA EN UNA SUPERFICIE PRINCIPAL DEL SUSTRATO Y UNA PLURALIDAD DE PROTUBERANCIAS DE SOLDADURA (18, 19) DEFINIDAS EN LA OTRA SUPERFICIE PRINCIPAL DEL SUSTRATO, EN DONDE LA ESTRUCTURA EN ESPIRAL SE ENCUENTRA CONECTADA ELECTRICAMENTE A LA PLURALIDAD DE PROTUBERANCIAS DE SOLDADURA MEDIANTE UNAS PLACAS RELLENAS DE METAL. SE PUEDEN DEFINIR INDUCTORES DE UNA O MULTIPLES CAPAS, EN DONDE LOS ULTIMOS PROPORCIONAN UNOS VALORES DE INDUCTANCIA MAS ALTOS EN EL MISMO AREA DE LA PASTILLA. LOS INDUCTORES DE MULTIPLES CAPAS SE FORMAN UTILIZANDO UNA ESTRUCTURA DE ESTRUCTURA DE POLIIMIDA METALICA DE MULTIPLES CAPAS O ESTRUCTURA DIELECTRICA SIMILAR. CON INDUCTOR DE PASTILLA SE PUEDE OBTENER UN DISPOSITIVO MUY PEQUEÑO, PRECISO Y DISCRETO CON UNA ALTA INDUCTANCIA, UN ALTO FACTOR Q Y UNA ALTA FRECUENCIA AUTORRESONANTE.
ES95303410T 1994-06-03 1995-05-22 Dispositivo de plaquita con inductor. Expired - Lifetime ES2139841T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9411107A GB2290171B (en) 1994-06-03 1994-06-03 Inductor chip device

Publications (1)

Publication Number Publication Date
ES2139841T3 true ES2139841T3 (es) 2000-02-16

Family

ID=10756121

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95303410T Expired - Lifetime ES2139841T3 (es) 1994-06-03 1995-05-22 Dispositivo de plaquita con inductor.

Country Status (6)

Country Link
EP (1) EP0685857B1 (es)
JP (1) JPH07335439A (es)
AT (1) ATE184419T1 (es)
DE (1) DE69511940T2 (es)
ES (1) ES2139841T3 (es)
GB (1) GB2290171B (es)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2292016B (en) * 1994-07-29 1998-07-22 Plessey Semiconductors Ltd Inductor device
WO1999033108A1 (en) * 1997-12-22 1999-07-01 Conexant Systems, Inc. Wireless inter-chip communication system and method
US6303423B1 (en) 1998-12-21 2001-10-16 Megic Corporation Method for forming high performance system-on-chip using post passivation process
JP2001358551A (ja) 2000-06-15 2001-12-26 Matsushita Electric Ind Co Ltd フィルタ
DE10144464C2 (de) * 2001-09-10 2003-07-17 Infineon Technologies Ag Elektronisches Bauteil mit Induktionsspule für Hochfrequenzanwendungen und Verfahren zur Herstellung desselben
FR2830683A1 (fr) * 2001-10-10 2003-04-11 St Microelectronics Sa Realisation d'inductance et de via dans un circuit monolithique
KR20030048691A (ko) * 2001-12-12 2003-06-25 삼성전자주식회사 작은 값의 적은 변화를 가지는 고주파 인덕터 및 그 제조방법
US8384189B2 (en) 2005-03-29 2013-02-26 Megica Corporation High performance system-on-chip using post passivation process
DE102006057332B4 (de) 2006-12-05 2018-01-25 Infineon Technologies Ag Zusammenbau aufweisend ein Substrat und einen auf dem Substrat montierten Chip
NL1036092C (nl) * 2008-10-21 2010-04-22 Tetradon B V Werkwijze en inrichting voor een modulair opgebouwde transformator.
WO2015171597A1 (en) 2014-05-05 2015-11-12 3D Glass Solutions, Inc. 2d and 3d inductors antenna and transformers fabricating photoactive substrates
KR102479144B1 (ko) 2016-02-25 2022-12-20 3디 글래스 솔루션즈 인코포레이티드 3d 커패시터 및 커패시터 어레이 제작용 광활성 기재
US11161773B2 (en) 2016-04-08 2021-11-02 3D Glass Solutions, Inc. Methods of fabricating photosensitive substrates suitable for optical coupler
JP6390825B1 (ja) 2017-03-01 2018-09-19 株式会社村田製作所 実装用基板
KR102418671B1 (ko) 2017-07-07 2022-07-12 3디 글래스 솔루션즈 인코포레이티드 패키지 광활성 유리 기판들에서 ｒｆ 시스템을 위한 2ｄ 및 3ｄ 집중 소자 디바이스들
KR102614826B1 (ko) 2017-12-15 2023-12-19 3디 글래스 솔루션즈 인코포레이티드 결합 전송 라인 공진 rf 필터
AU2018399638B2 (en) 2018-01-04 2021-09-02 3D Glass Solutions, Inc. Impedance matching conductive structure for high efficiency RF circuits
AU2019344542B2 (en) 2018-09-17 2022-02-24 3D Glass Solutions, Inc. High efficiency compact slotted antenna with a ground plane
JP7257707B2 (ja) 2018-12-28 2023-04-14 スリーディー グラス ソリューションズ，インク 環状コンデンサｒｆ、マイクロ波及びｍｍ波システム
KR102393450B1 (ko) 2018-12-28 2022-05-04 3디 글래스 솔루션즈 인코포레이티드 광활성 유리 기판들에서 ｒｆ, 마이크로파, 및 ｍｍ 파 시스템들을 위한 이종 통합
AU2020253553A1 (en) 2019-04-05 2021-10-28 3D Glass Solutions, Inc. Glass based empty substrate integrated waveguide devices
WO2020214788A1 (en) 2019-04-18 2020-10-22 3D Glass Solutions, Inc. High efficiency die dicing and release
US11908617B2 (en) 2020-04-17 2024-02-20 3D Glass Solutions, Inc. Broadband induction

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5873127A (ja) * 1981-10-28 1983-05-02 Hitachi Ltd Ｉｃチツプのはんだ溶融接続方法
DE3502770A1 (de) * 1985-01-28 1986-07-31 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung einer flachspule sowie flachspule fuer ein stosswellenrohr
JPS6215850A (ja) * 1985-07-13 1987-01-24 Oki Electric Ind Co Ltd マルチチツプパツケ−ジ基板
JP2615151B2 (ja) * 1988-08-19 1997-05-28 株式会社村田製作所 チップ型コイル及びその製造方法
US4942076A (en) * 1988-11-03 1990-07-17 Micro Substrates, Inc. Ceramic substrate with metal filled via holes for hybrid microcircuits and method of making the same
DE69021438T2 (de) * 1989-05-16 1996-01-25 Marconi Gec Ltd Verfahren zur Herstellung einer Flip-Chip-Lötstruktur für Anordnungen mit Gold-Metallisierung.
JPH04245410A (ja) * 1991-01-30 1992-09-02 Sharp Corp 複同調回路用プリントコイル
US5349743A (en) * 1991-05-02 1994-09-27 At&T Bell Laboratories Method of making a multilayer monolithic magnet component
GB2263582B (en) * 1992-01-21 1995-11-01 Dale Electronics Laser-formed electrical component and method for making same

Also Published As

Publication number Publication date
EP0685857B1 (en) 1999-09-08
DE69511940D1 (de) 1999-10-14
EP0685857A1 (en) 1995-12-06
DE69511940T2 (de) 2000-05-04
ATE184419T1 (de) 1999-09-15
JPH07335439A (ja) 1995-12-22
GB9411107D0 (en) 1994-07-27
GB2290171A (en) 1995-12-13
GB2290171B (en) 1998-01-21

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