ES208825U - Disposicion de semiconductor. - Google Patents
Disposicion de semiconductor.Info
- Publication number
- ES208825U ES208825U ES0208825U ES208825U ES208825U ES 208825 U ES208825 U ES 208825U ES 0208825 U ES0208825 U ES 0208825U ES 208825 U ES208825 U ES 208825U ES 208825 U ES208825 U ES 208825U
- Authority
- ES
- Spain
- Prior art keywords
- semiconductor
- translation
- machine
- legally binding
- *** translate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Gasket Seals (AREA)
Abstract
Disposición de semiconductor, caracterizada porque incluye un vástago conductor, un dispositivo semiconductor montado en dicho vástago, de modo que una primera zona de contacto del dispositivo esté conectada térmica y eléctricamente con el mismo, un conductor eléctrico que incluye una porción ensanchada de cabeza que está conectada térmica y eléctricamente con una segunda zona de contacto del dispositivo, un cuerpo configurado para definir un alojamiento en el que está introducido dicho vástago, de modo que el dispositivo quede alojado en el espacio definido entre el vástago y las paredes del alojamiento, extendiéndose el conductor eléctrico a través de una abertura de una de dichas paredes, medios de hermetización, para impedir la entrada de materia extraña a través de dicha abertura y hacia dicho espacio, y un órgano elástico aprisionado y deformado entre la porción de cabeza del conductor y dicho cuerpo, de modo que la porción de cabeza sea forzada hacia un contacto a presión con el dispositivo.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2391/74A GB1489603A (en) | 1974-01-18 | 1974-01-18 | Semi-conductor assemblies |
Publications (2)
Publication Number | Publication Date |
---|---|
ES208825U true ES208825U (es) | 1976-04-01 |
ES208825Y ES208825Y (es) | 1976-07-16 |
Family
ID=9738724
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES1974208825U Expired ES208825Y (es) | 1974-01-18 | 1974-12-31 | Disposicion de semiconductor. |
Country Status (8)
Country | Link |
---|---|
US (1) | US4007477A (es) |
AR (1) | AR201530A1 (es) |
DE (1) | DE2501337A1 (es) |
ES (1) | ES208825Y (es) |
FR (1) | FR2258709B1 (es) |
GB (1) | GB1489603A (es) |
IN (1) | IN149708B (es) |
IT (1) | IT1026361B (es) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4099201A (en) * | 1977-04-11 | 1978-07-04 | General Electric Company | Semiconductor rectifier assembly having an insulating material therein that evolves gases when exposed to an arc |
DE2734571A1 (de) * | 1977-07-30 | 1979-02-15 | Bosch Gmbh Robert | Gleichrichteranordnung |
US4167744A (en) * | 1978-03-23 | 1979-09-11 | Rca Corporation | Electroluminescent semiconductor device having optical fiber window |
FR2421465A1 (fr) * | 1978-03-30 | 1979-10-26 | Sev Marchal | Diode de puissance a element semi-conducteur destinee notamment a equiper un pont redresseur d'alternateur |
US4403102A (en) * | 1979-11-13 | 1983-09-06 | Thermalloy Incorporated | Heat sink mounting |
DE3124692A1 (de) * | 1981-06-24 | 1983-01-13 | Robert Bosch Gmbh, 7000 Stuttgart | "halbleitergleichrichter" |
US4521827A (en) * | 1981-10-23 | 1985-06-04 | Thermalloy, Inc. | Heat sink mounting |
US4587377A (en) * | 1984-09-21 | 1986-05-06 | Illinois Tool Works Inc. | Electrically insulating fastener for heat sinks of different thicknesses |
US20040042178A1 (en) * | 2002-09-03 | 2004-03-04 | Vadim Gektin | Heat spreader with surface cavity |
DE102011056848A1 (de) * | 2011-12-22 | 2013-06-27 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul oder Ansteuermodul hierfür |
DE102013103116B3 (de) * | 2013-03-27 | 2014-09-18 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1250005B (es) * | 1961-02-06 | 1967-09-14 | ||
DE1514152A1 (de) * | 1964-12-16 | 1969-09-11 | Licentia Gmbh | Halbleiter-Gleichrichterzelle |
GB1140677A (en) * | 1965-05-07 | 1969-01-22 | Ass Elect Ind | Improvements relating to semi-conductor devices |
SE333197B (sv) * | 1966-12-27 | 1971-03-08 | Asea Ab | Halvledaranordning foer stora stroemstyrkor |
US3449506A (en) * | 1967-05-11 | 1969-06-10 | Int Rectifier Corp | Aluminum rectifier base having copper insert |
DE1944515A1 (de) * | 1969-09-02 | 1971-03-04 | Siemens Ag | Halbleiterbauelement mit Kunststoffuellung |
-
1974
- 1974-01-18 GB GB2391/74A patent/GB1489603A/en not_active Expired
- 1974-12-24 IN IN2846/CAL/74A patent/IN149708B/en unknown
- 1974-12-30 US US05/537,337 patent/US4007477A/en not_active Expired - Lifetime
- 1974-12-31 ES ES1974208825U patent/ES208825Y/es not_active Expired
-
1975
- 1975-01-06 FR FR7501186A patent/FR2258709B1/fr not_active Expired
- 1975-01-15 DE DE19752501337 patent/DE2501337A1/de not_active Ceased
- 1975-01-16 IT IT47704/75A patent/IT1026361B/it active
- 1975-01-17 AR AR257338A patent/AR201530A1/es active
Also Published As
Publication number | Publication date |
---|---|
FR2258709B1 (es) | 1978-06-23 |
IN149708B (es) | 1982-03-20 |
US4007477A (en) | 1977-02-08 |
ES208825Y (es) | 1976-07-16 |
DE2501337A1 (de) | 1975-07-24 |
AU7687474A (en) | 1976-06-24 |
IT1026361B (it) | 1978-09-20 |
FR2258709A1 (es) | 1975-08-18 |
AR201530A1 (es) | 1975-03-21 |
GB1489603A (en) | 1977-10-26 |
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