ES2080965T3 - Procedimiento para la union superficial de discos semiconductores de silicio. - Google Patents
Procedimiento para la union superficial de discos semiconductores de silicio.Info
- Publication number
- ES2080965T3 ES2080965T3 ES92100220T ES92100220T ES2080965T3 ES 2080965 T3 ES2080965 T3 ES 2080965T3 ES 92100220 T ES92100220 T ES 92100220T ES 92100220 T ES92100220 T ES 92100220T ES 2080965 T3 ES2080965 T3 ES 2080965T3
- Authority
- ES
- Spain
- Prior art keywords
- procedure
- silicon semiconductor
- semiconductor discs
- surface union
- union
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Pressure Sensors (AREA)
- Die Bonding (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
EL PROCEDIMIENTO SE CARACTERIZA PORQUE SOBRE UNA SUPERFICIE A UNIR, SE APLICA UNA CAPA (2, 3) DELGADA DE MATERIAL SEMICONDUCTOR.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4105592A DE4105592A1 (de) | 1991-02-22 | 1991-02-22 | Verfahren zum flaechenhaften verbinden von siliziumhalbleiterscheiben |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2080965T3 true ES2080965T3 (es) | 1996-02-16 |
Family
ID=6425673
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES92100220T Expired - Lifetime ES2080965T3 (es) | 1991-02-22 | 1992-01-09 | Procedimiento para la union superficial de discos semiconductores de silicio. |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0501108B1 (es) |
JP (1) | JP2529799B2 (es) |
DE (2) | DE4105592A1 (es) |
ES (1) | ES2080965T3 (es) |
FI (1) | FI920422A (es) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4219132A1 (de) * | 1992-06-11 | 1993-12-16 | Suess Kg Karl | Verfahren zum Herstellen von Silizium/Glas- oder Silizium/Silizium-Verbindungen |
JP5021098B2 (ja) * | 2009-12-11 | 2012-09-05 | パイオニア株式会社 | 半導体基板の接合方法およびmemsデバイス |
JP5367842B2 (ja) * | 2009-12-11 | 2013-12-11 | パイオニア株式会社 | 半導体基板の接合方法およびmemsデバイス |
JP5367841B2 (ja) * | 2009-12-11 | 2013-12-11 | パイオニア株式会社 | 半導体基板の接合方法およびmemsデバイス |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DD82790A (es) * | ||||
US3925808A (en) * | 1974-08-08 | 1975-12-09 | Westinghouse Electric Corp | Silicon semiconductor device with stress-free electrodes |
US4411060A (en) * | 1981-07-06 | 1983-10-25 | Western Electric Co., Inc. | Method of manufacturing dielectrically-isolated single-crystal semiconductor substrates |
EP0263146A1 (en) * | 1986-03-19 | 1988-04-13 | Analog Devices, Inc. | Aluminum-backed wafer and chip |
-
1991
- 1991-02-22 DE DE4105592A patent/DE4105592A1/de not_active Ceased
-
1992
- 1992-01-09 ES ES92100220T patent/ES2080965T3/es not_active Expired - Lifetime
- 1992-01-09 EP EP92100220A patent/EP0501108B1/de not_active Expired - Lifetime
- 1992-01-09 DE DE59204451T patent/DE59204451D1/de not_active Expired - Lifetime
- 1992-01-30 FI FI920422A patent/FI920422A/fi unknown
- 1992-02-19 JP JP4032043A patent/JP2529799B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE59204451D1 (de) | 1996-01-11 |
EP0501108B1 (de) | 1995-11-29 |
FI920422A0 (fi) | 1992-01-30 |
EP0501108A1 (de) | 1992-09-02 |
FI920422A (fi) | 1992-08-23 |
JP2529799B2 (ja) | 1996-09-04 |
DE4105592A1 (de) | 1992-08-27 |
JPH04317313A (ja) | 1992-11-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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