ES2021487A6 - Process for bonding copper-based alloys with shape-memory effect by liquid phase diffusion welding - Google Patents
Process for bonding copper-based alloys with shape-memory effect by liquid phase diffusion weldingInfo
- Publication number
- ES2021487A6 ES2021487A6 ES8904309A ES8904309A ES2021487A6 ES 2021487 A6 ES2021487 A6 ES 2021487A6 ES 8904309 A ES8904309 A ES 8904309A ES 8904309 A ES8904309 A ES 8904309A ES 2021487 A6 ES2021487 A6 ES 2021487A6
- Authority
- ES
- Spain
- Prior art keywords
- melting point
- shape
- memory effect
- liquid phase
- based alloys
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The process for bonding copper-based alloys with shape- memory effect by liquid phase diffusion welding comprises a technique through which diffusive processes are encouraged under specific temperature and pressure conditions to achieve an alloy composition with a low melting point a technique which comprises the following stages: A) Optimally roughening the metal surfaces of the base material having shape-memory effect and of the intermediary which will be joined. B) Encouraging diffusion processes under the effect of heat and pressure, in vacuum or under controlled atmosphere, until an alloy composition having a low melting point is reached. C) Increasing the temperature without applying load and in a controlled and/or inert atmosphere until the melting point of the low melting point alloy is reached. D) Maintaining the whole at the melting temperature for the time necessary for the alloy to be completely melted.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES8904309A ES2021487A6 (en) | 1989-12-20 | 1989-12-20 | Process for bonding copper-based alloys with shape-memory effect by liquid phase diffusion welding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES8904309A ES2021487A6 (en) | 1989-12-20 | 1989-12-20 | Process for bonding copper-based alloys with shape-memory effect by liquid phase diffusion welding |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2021487A6 true ES2021487A6 (en) | 1991-11-01 |
Family
ID=8265194
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES8904309A Expired - Fee Related ES2021487A6 (en) | 1989-12-20 | 1989-12-20 | Process for bonding copper-based alloys with shape-memory effect by liquid phase diffusion welding |
Country Status (1)
Country | Link |
---|---|
ES (1) | ES2021487A6 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2050562A1 (en) * | 1991-06-28 | 1994-05-16 | Univ Madrid Complutense | Diffusion welding of copper@, alloys with memory effect - using intermediate ductile alloy with low m.pt. which disappears by diffusion into the copper@ at a higher temp. |
WO2007001392A2 (en) * | 2004-10-01 | 2007-01-04 | The Regents Of The University Of Michigan | Manufacture of shape-memory alloy cellular meterials and structures by transient-liquid reactive joining |
-
1989
- 1989-12-20 ES ES8904309A patent/ES2021487A6/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2050562A1 (en) * | 1991-06-28 | 1994-05-16 | Univ Madrid Complutense | Diffusion welding of copper@, alloys with memory effect - using intermediate ductile alloy with low m.pt. which disappears by diffusion into the copper@ at a higher temp. |
WO2007001392A2 (en) * | 2004-10-01 | 2007-01-04 | The Regents Of The University Of Michigan | Manufacture of shape-memory alloy cellular meterials and structures by transient-liquid reactive joining |
WO2007001392A3 (en) * | 2004-10-01 | 2007-05-18 | Univ Michigan State | Manufacture of shape-memory alloy cellular meterials and structures by transient-liquid reactive joining |
US7896222B2 (en) | 2004-10-01 | 2011-03-01 | Regents Of The University Of Michigan | Manufacture of shape memory alloy cellular materials and structures by transient-liquid reactive joining |
US8273194B2 (en) | 2004-10-01 | 2012-09-25 | Board of Trustees of Michigan State University the Regents of the University of Michigan | Manufacture of shape-memory alloy cellular materials and structures by transient-liquid reactive joining |
US8465847B2 (en) | 2004-10-01 | 2013-06-18 | The Regents Of The University Of Michigan | Manufacture of shape-memory alloy cellular materials and structures by transient-liquid reactive joining |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
SA6 | Expiration date (snapshot 920101) |
Free format text: 2009-12-20 |
|
FD2A | Announcement of lapse in spain |
Effective date: 20110223 |