ES2021487A6 - Process for bonding copper-based alloys with shape-memory effect by liquid phase diffusion welding - Google Patents

Process for bonding copper-based alloys with shape-memory effect by liquid phase diffusion welding

Info

Publication number
ES2021487A6
ES2021487A6 ES8904309A ES8904309A ES2021487A6 ES 2021487 A6 ES2021487 A6 ES 2021487A6 ES 8904309 A ES8904309 A ES 8904309A ES 8904309 A ES8904309 A ES 8904309A ES 2021487 A6 ES2021487 A6 ES 2021487A6
Authority
ES
Spain
Prior art keywords
melting point
shape
memory effect
liquid phase
based alloys
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
ES8904309A
Other languages
Spanish (es)
Inventor
Calvo Felipe Angel Calvo
De Salazar Y Caso De Los Gomez
Martin Javier Mendez
Casademon Josep M Guilemany
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Universidad Complutense de Madrid
Original Assignee
Universidad Complutense de Madrid
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Universidad Complutense de Madrid filed Critical Universidad Complutense de Madrid
Priority to ES8904309A priority Critical patent/ES2021487A6/en
Publication of ES2021487A6 publication Critical patent/ES2021487A6/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

The process for bonding copper-based alloys with shape- memory effect by liquid phase diffusion welding comprises a technique through which diffusive processes are encouraged under specific temperature and pressure conditions to achieve an alloy composition with a low melting point a technique which comprises the following stages: A) Optimally roughening the metal surfaces of the base material having shape-memory effect and of the intermediary which will be joined. B) Encouraging diffusion processes under the effect of heat and pressure, in vacuum or under controlled atmosphere, until an alloy composition having a low melting point is reached. C) Increasing the temperature without applying load and in a controlled and/or inert atmosphere until the melting point of the low melting point alloy is reached. D) Maintaining the whole at the melting temperature for the time necessary for the alloy to be completely melted.
ES8904309A 1989-12-20 1989-12-20 Process for bonding copper-based alloys with shape-memory effect by liquid phase diffusion welding Expired - Fee Related ES2021487A6 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ES8904309A ES2021487A6 (en) 1989-12-20 1989-12-20 Process for bonding copper-based alloys with shape-memory effect by liquid phase diffusion welding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES8904309A ES2021487A6 (en) 1989-12-20 1989-12-20 Process for bonding copper-based alloys with shape-memory effect by liquid phase diffusion welding

Publications (1)

Publication Number Publication Date
ES2021487A6 true ES2021487A6 (en) 1991-11-01

Family

ID=8265194

Family Applications (1)

Application Number Title Priority Date Filing Date
ES8904309A Expired - Fee Related ES2021487A6 (en) 1989-12-20 1989-12-20 Process for bonding copper-based alloys with shape-memory effect by liquid phase diffusion welding

Country Status (1)

Country Link
ES (1) ES2021487A6 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2050562A1 (en) * 1991-06-28 1994-05-16 Univ Madrid Complutense Diffusion welding of copper@, alloys with memory effect - using intermediate ductile alloy with low m.pt. which disappears by diffusion into the copper@ at a higher temp.
WO2007001392A2 (en) * 2004-10-01 2007-01-04 The Regents Of The University Of Michigan Manufacture of shape-memory alloy cellular meterials and structures by transient-liquid reactive joining

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2050562A1 (en) * 1991-06-28 1994-05-16 Univ Madrid Complutense Diffusion welding of copper@, alloys with memory effect - using intermediate ductile alloy with low m.pt. which disappears by diffusion into the copper@ at a higher temp.
WO2007001392A2 (en) * 2004-10-01 2007-01-04 The Regents Of The University Of Michigan Manufacture of shape-memory alloy cellular meterials and structures by transient-liquid reactive joining
WO2007001392A3 (en) * 2004-10-01 2007-05-18 Univ Michigan State Manufacture of shape-memory alloy cellular meterials and structures by transient-liquid reactive joining
US7896222B2 (en) 2004-10-01 2011-03-01 Regents Of The University Of Michigan Manufacture of shape memory alloy cellular materials and structures by transient-liquid reactive joining
US8273194B2 (en) 2004-10-01 2012-09-25 Board of Trustees of Michigan State University the Regents of the University of Michigan Manufacture of shape-memory alloy cellular materials and structures by transient-liquid reactive joining
US8465847B2 (en) 2004-10-01 2013-06-18 The Regents Of The University Of Michigan Manufacture of shape-memory alloy cellular materials and structures by transient-liquid reactive joining

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Legal Events

Date Code Title Description
SA6 Expiration date (snapshot 920101)

Free format text: 2009-12-20

FD2A Announcement of lapse in spain

Effective date: 20110223