ES2008638A6 - Composicion y procedimiento para acondicionar la superficie de resinas de policarbonato antes del chapado metalico. - Google Patents
Composicion y procedimiento para acondicionar la superficie de resinas de policarbonato antes del chapado metalico.Info
- Publication number
- ES2008638A6 ES2008638A6 ES8803054A ES8803054A ES2008638A6 ES 2008638 A6 ES2008638 A6 ES 2008638A6 ES 8803054 A ES8803054 A ES 8803054A ES 8803054 A ES8803054 A ES 8803054A ES 2008638 A6 ES2008638 A6 ES 2008638A6
- Authority
- ES
- Spain
- Prior art keywords
- composition
- metal plating
- conditioning
- polycarbonate resins
- resins prior
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/02—Chemical treatment or coating of shaped articles made of macromolecular substances with solvents, e.g. swelling agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2369/00—Characterised by the use of polycarbonates; Derivatives of polycarbonates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemically Coating (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Electroplating Methods And Accessories (AREA)
- Materials For Medical Uses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Paints Or Removers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
UN PROCEDIMIENTO PARA ACONDICIONAR Y ATACAR QUIMICAMENTE EN ESPECIAL UNA RESINA DE POLICARBONATO ANTES DEL CHAPADO METALICO PARA MEJORAR EL REVESTIMIENTO Y LA ADHESIVIDAD DEL CHAPADO METALICO A LA RESINA. LA COMPOSICION DE HINCHAMIENTO COMPRENDE UN COMPUESTO REPRESENTADO POR LA FORMULA GENERAL R1(OCN H2N) M-O-R2 EN LA QUE R1 Y R2 SE SELECCIONAN INDEPENDIENTEMENTE DEL GRUPO CONSTITUIDO POR GRUPOS ARILO Y GRUPOS ALQUILO DE 1-4 ATOMOS DE CARBONO, N ES 2 A 4 Y M ES 1 A 5. LA RESINA HINCHADA SE SOMETE LUEGO A ATAQUE QUIMICO UTILIZANDO, PREFERIBLEMENTE, UNA COMPOSICION ALTAMENTE ALCALINA TAL COMO UNA SOLUCION QUE CONTIENE MAS QUE APROXIMADAMENTE 100 G/L DE NAOH. TAMBIEN SE PUEDEN UTILIZAR OTROS REACTIVOS DE ATAQUE QUIMICO TALES COMO ACIDO CROMICO. LA RESINA ESTA LISTA ENTONCES PARA EL CHAPADO UTILIZANDO TECNICAS CONVENCIONALES.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/118,811 US4775557A (en) | 1987-11-09 | 1987-11-09 | Composition and process for conditioning the surface of polycarbonate resins prior to metal plating |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2008638A6 true ES2008638A6 (es) | 1989-07-16 |
Family
ID=22380887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES8803054A Expired ES2008638A6 (es) | 1987-11-09 | 1988-10-07 | Composicion y procedimiento para acondicionar la superficie de resinas de policarbonato antes del chapado metalico. |
Country Status (13)
Country | Link |
---|---|
US (1) | US4775557A (es) |
EP (1) | EP0316061B1 (es) |
JP (1) | JPH01142085A (es) |
KR (1) | KR960003735B1 (es) |
AT (1) | ATE82776T1 (es) |
AU (1) | AU609506B2 (es) |
BR (1) | BR8804411A (es) |
CA (1) | CA1306409C (es) |
DE (1) | DE3876215T2 (es) |
DK (1) | DK443488A (es) |
ES (1) | ES2008638A6 (es) |
IL (1) | IL87392A (es) |
MX (1) | MX166697B (es) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3740369A1 (de) * | 1987-11-25 | 1989-06-08 | Schering Ag | Verfahren zur vorbehandlung von kunststoffen |
US5032427A (en) * | 1988-04-25 | 1991-07-16 | Macdermid, Incorporated | Process for preparation printed circuit through-holes for metallization |
US4921736A (en) * | 1988-10-12 | 1990-05-01 | Occidental Chemical Corporation | Low friction, wear resistant plastic parts |
US4941940A (en) * | 1988-11-07 | 1990-07-17 | Jp Laboratories, Inc. | Pre-swelling and etching of plastics for plating |
US5015329A (en) * | 1988-11-07 | 1991-05-14 | Jp Laboratories, Inc. | Pre-swelling and etching of plastics for plating |
US5049230A (en) * | 1988-11-07 | 1991-09-17 | Jp Laboratories, Inc. | Single step pre-swelling and etching of plastics for plating |
DE3922477A1 (de) * | 1989-07-06 | 1991-01-17 | Schering Ag | Quellmittel zur vorbehandlung von kunstharzen vor einer stromlosen metallisierung |
US4978569A (en) * | 1989-08-14 | 1990-12-18 | Eastman Kodak Company | Process for preparing selectively metallized articles |
US5120578A (en) * | 1990-05-31 | 1992-06-09 | Shipley Company Inc. | Coating composition |
US5075039A (en) * | 1990-05-31 | 1991-12-24 | Shipley Company Inc. | Platable liquid film forming coating composition containing conductive metal sulfide coated inert inorganic particles |
US5288313A (en) * | 1990-05-31 | 1994-02-22 | Shipley Company Inc. | Electroless plating catalyst |
US5132191A (en) * | 1990-10-26 | 1992-07-21 | General Electric Company | Polymer surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom |
US5180639A (en) * | 1990-10-26 | 1993-01-19 | General Electric Company | Method of preparing polymer surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom |
US5198096A (en) * | 1990-11-28 | 1993-03-30 | General Electric Company | Method of preparing polycarbonate surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom |
JP2768390B2 (ja) * | 1990-12-11 | 1998-06-25 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 無電解金属付着のために基体をコンディショニングする方法 |
DE4108461C1 (es) * | 1991-03-13 | 1992-06-25 | Schering Ag Berlin Und Bergkamen, 1000 Berlin, De | |
US5498440A (en) * | 1992-01-21 | 1996-03-12 | General Electric Company | Adhesion of electroless coating to resinous articles |
US5229169A (en) * | 1992-01-21 | 1993-07-20 | General Electric Company | Adhesion of electroless coatings to resinous articles by treatment with permanganate |
DE4221948C1 (de) * | 1992-07-02 | 1993-10-21 | Schering Ag | Verfahren zur Metallisierung von Kunststoffen und Verwendung |
DE4326079A1 (de) * | 1993-07-30 | 1995-02-02 | Atotech Deutschland Gmbh | Verfahren zur Behandlung von Kunststoffoberflächen und Anquell-Lösung |
US5332465A (en) * | 1993-09-08 | 1994-07-26 | Macdermid, Incorporated | Process for preparing plastic surfaces to be plated |
US5336370A (en) * | 1993-12-09 | 1994-08-09 | Chipalkatti Makarand H | Pre-treatment for plating technique |
US5985040A (en) * | 1998-09-21 | 1999-11-16 | Electrochemicals Inc. | Permanganate desmear process for printed wiring boards |
KR100336297B1 (ko) * | 1999-05-17 | 2002-05-13 | 남상진 | 페수처리시스템 |
US6454868B1 (en) | 2000-04-17 | 2002-09-24 | Electrochemicals Inc. | Permanganate desmear process for printed wiring boards |
US7354870B2 (en) | 2005-11-14 | 2008-04-08 | National Research Council Of Canada | Process for chemical etching of parts fabricated by stereolithography |
JP5482343B2 (ja) * | 2010-03-18 | 2014-05-07 | コニカミノルタ株式会社 | 難燃性ポリエステル樹脂組成物 |
KR101628806B1 (ko) * | 2014-05-16 | 2016-06-09 | 주식회사 아모센스 | 발광소자 패키지의 제조방법 |
EP3452635B1 (en) | 2016-05-04 | 2020-02-26 | ATOTECH Deutschland GmbH | Process for depositing a metal or metal alloy on a surface of a substrate including its activation |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2037988A5 (en) * | 1969-03-13 | 1970-12-31 | Ampex | Surface treatment of hydro-phobic plastics - surfaces to make them hydrophilic and plat |
US3770528A (en) * | 1971-09-29 | 1973-11-06 | Martin Processing Co Inc | Method for the surface treatment of polyimide materials |
FR2223438A1 (fr) * | 1973-03-28 | 1974-10-25 | Air Ind | Compositions de denaturation des peintures, notamment pour le nettoyage des cabines de peinture |
ZA77897B (en) * | 1976-04-13 | 1977-12-28 | Kollmorgen Corp | Liquid seeders and catalyzation processes for electroless metal deposition |
AT367081B (de) * | 1977-09-19 | 1982-05-25 | Semperit Ag | Elastomerkoerper |
US4131698A (en) * | 1977-12-16 | 1978-12-26 | Rca Corporation | Pretreatment of polyvinyl chloride plastics for electroless deposition |
JPS575855A (en) * | 1980-06-12 | 1982-01-12 | Kakihara Kogyo Kk | Formation of metal film onto electric unconductive resin |
FR2565699A1 (fr) * | 1984-06-11 | 1985-12-13 | Suwa Seikosha Kk | Procede de modification de la surface d'une matiere de base comprenant des motifs carbonate et ester d'allyle, pour former ensuite un revetement superficiel dur, dans le cas de lentilles pour verres ophtalmiques |
EP0187176B1 (en) * | 1985-01-08 | 1991-03-20 | Toray Industries, Inc. | Metal-plated molding |
JPS61252691A (ja) * | 1985-05-02 | 1986-11-10 | キヤノン株式会社 | プリント配線板の製造方法 |
EP0309243B1 (en) * | 1987-09-25 | 1993-08-18 | Engelhard Technologies Limited | Pre-etch treatment of a plastics substrate |
-
1987
- 1987-11-09 US US07/118,811 patent/US4775557A/en not_active Expired - Lifetime
-
1988
- 1988-08-08 DK DK443488A patent/DK443488A/da not_active Application Discontinuation
- 1988-08-09 IL IL87392A patent/IL87392A/xx not_active IP Right Cessation
- 1988-08-10 CA CA000574350A patent/CA1306409C/en not_active Expired - Fee Related
- 1988-08-11 AU AU20666/88A patent/AU609506B2/en not_active Ceased
- 1988-08-23 MX MX012788A patent/MX166697B/es unknown
- 1988-08-23 KR KR1019880010685A patent/KR960003735B1/ko not_active IP Right Cessation
- 1988-08-29 BR BR8804411A patent/BR8804411A/pt not_active IP Right Cessation
- 1988-09-21 DE DE8888308753T patent/DE3876215T2/de not_active Expired - Fee Related
- 1988-09-21 EP EP88308753A patent/EP0316061B1/en not_active Expired - Lifetime
- 1988-09-21 AT AT88308753T patent/ATE82776T1/de active
- 1988-09-26 JP JP63239105A patent/JPH01142085A/ja active Pending
- 1988-10-07 ES ES8803054A patent/ES2008638A6/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
BR8804411A (pt) | 1989-05-23 |
AU2066688A (en) | 1989-05-11 |
KR890008345A (ko) | 1989-07-10 |
MX166697B (es) | 1993-01-28 |
DE3876215D1 (de) | 1993-01-07 |
KR960003735B1 (ko) | 1996-03-21 |
CA1306409C (en) | 1992-08-18 |
DK443488A (da) | 1989-05-10 |
IL87392A0 (en) | 1989-01-31 |
IL87392A (en) | 1991-11-21 |
JPH01142085A (ja) | 1989-06-02 |
DE3876215T2 (de) | 1993-04-15 |
EP0316061A1 (en) | 1989-05-17 |
DK443488D0 (da) | 1988-08-08 |
EP0316061B1 (en) | 1992-11-25 |
US4775557A (en) | 1988-10-04 |
AU609506B2 (en) | 1991-05-02 |
ATE82776T1 (de) | 1992-12-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
SA6 | Expiration date (snapshot 920101) |
Free format text: 2008-10-07 |