ES1053051U - Placa de circuitos impresos con plaqueta dorsal de masa. - Google Patents
Placa de circuitos impresos con plaqueta dorsal de masa.Info
- Publication number
- ES1053051U ES1053051U ES200202577U ES200202577U ES1053051U ES 1053051 U ES1053051 U ES 1053051U ES 200202577 U ES200202577 U ES 200202577U ES 200202577 U ES200202577 U ES 200202577U ES 1053051 U ES1053051 U ES 1053051U
- Authority
- ES
- Spain
- Prior art keywords
- circuit board
- printed circuit
- dorsal
- translation
- machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09254—Branched layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Pens And Brushes (AREA)
- Non-Reversible Transmitting Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
1. Placa de circuitos impresos con plaqueta dorsal de masa (10), que está equipada en uno de sus dos lados, el lado delantero (5), con componentes eléctricos y/o electrónicos (15, 20, 22), teniendo en el lado delantero (5) de la placa de circuitos impresos (10) por lo menos un hilo conductor eléctrico de masa (25), caracterizada porque: - en el lado dorsal (30) de la placa de circuitos impresos (10) está situado por lo menos un hilo conductor adicional de masa (40), que está conectado eléctricamente a por lo menos un hilo conductor de masa (25) situado en el lado delantero, y - éste por lo menos un hilo adicional conductor de masa (40) esté acoplado físicamente por lo menos a un componente (22) situado en el lado delantero.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE20208478U DE20208478U1 (de) | 2002-05-29 | 2002-05-29 | Leiterplatte mit rückseitigem Massepad |
Publications (2)
Publication Number | Publication Date |
---|---|
ES1053051U true ES1053051U (es) | 2003-03-01 |
ES1053051Y ES1053051Y (es) | 2003-06-16 |
Family
ID=7971699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES200202577U Expired - Fee Related ES1053051Y (es) | 2002-05-29 | 2002-10-25 | Placa de circuitos impresos con plaqueta dorsal de masa. |
Country Status (5)
Country | Link |
---|---|
CN (1) | CN2572720Y (es) |
DE (1) | DE20208478U1 (es) |
ES (1) | ES1053051Y (es) |
FR (1) | FR2840503B3 (es) |
IT (1) | ITMI20030013U1 (es) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE20314526U1 (de) * | 2003-09-12 | 2003-11-20 | Siemens Ag | Leiterplatte für ein Funkmodul |
CN102509957B (zh) * | 2011-10-18 | 2014-02-19 | 华为终端有限公司 | 一种通用串行总线usb公头 |
-
2002
- 2002-05-29 DE DE20208478U patent/DE20208478U1/de not_active Expired - Lifetime
- 2002-08-21 CN CN02247544U patent/CN2572720Y/zh not_active Expired - Fee Related
- 2002-09-12 FR FR0211315A patent/FR2840503B3/fr not_active Expired - Fee Related
- 2002-10-25 ES ES200202577U patent/ES1053051Y/es not_active Expired - Fee Related
-
2003
- 2003-01-16 IT ITMI20030013 patent/ITMI20030013U1/it unknown
Also Published As
Publication number | Publication date |
---|---|
CN2572720Y (zh) | 2003-09-10 |
FR2840503B3 (fr) | 2004-04-30 |
ES1053051Y (es) | 2003-06-16 |
DE20208478U1 (de) | 2002-08-29 |
FR2840503A3 (fr) | 2003-12-05 |
ITMI20030013U1 (it) | 2003-11-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG1K | Utility model granted | ||
FD1K | Utility model lapsed |
Effective date: 20100309 |