Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01Q—ANTENNAS, i.e. RADIO AERIALS
  • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
  • H01Q9/04—Resonant antennas
  • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
  • H01Q9/0421—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with a shorting wall or a shorting pin at one end of the element
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01Q—ANTENNAS, i.e. RADIO AERIALS
  • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
  • H01Q5/30—Arrangements for providing operation on different wavebands
  • H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
  • H01Q5/342—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes
  • H01Q5/35—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes using two or more simultaneously fed points
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01Q—ANTENNAS, i.e. RADIO AERIALS
  • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
  • H01Q5/30—Arrangements for providing operation on different wavebands
  • H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
  • H01Q5/342—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes
  • H01Q5/357—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes using a single feed point
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01Q—ANTENNAS, i.e. RADIO AERIALS
  • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
  • H01Q9/04—Resonant antennas
  • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
  • H01Q9/045—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means

Definitions

• This description relates generally to the field of electromagnetic field probes. It applies in particular to wireless information transmissions, in particular in environments, such as at least partially closed cavities, in which the distribution of the magnetic and electric fields is not homogeneous.
• the orientation and the distribution of the electric and magnetic fields are mainly governed by the size and the shape of the cavity as well as by the materials constituting it.
• the electric and magnetic fields can be established in a quasi-homogeneous manner (so-called "fundamental" mode ).
• the known probes generally remain sensitive to the orientation of the magnetic field, so that certain magnetic field orientations cannot or are difficult to be detected by these probes.
• an electromagnetic field probe which can be sensitive to the two components which are the electric field and the magnetic field at any point in the volume of a medium (for example a cavity), and which is suitable to the transmission of information in the medium considered, in particular a medium in which the distribution of the magnetic and electric fields is not always homogeneous.
• an electromagnetic field probe which can operate regardless of the orientation of the magnetic field in the plane of the probe.
• One embodiment overcomes all or part of the drawbacks of known electromagnetic field probes.
• One embodiment provides an electromagnetic field probe extending along a main plane and comprising:
• an electrically conductive ground plane an electrically conductive capacitive roof, arranged at a distance from the ground plane; the ground plane and the capacitive roof being separated, at least over part of their interface, by a dielectric material;
• each of said at least three vias being either an excitation via electrically connected to the capacitive roof, electrically insulated from the ground plane and intended to be connected to a source of power supply, or a ground return via electrically connecting the ground plane and the capacitive roof, the at least three vias comprising at least one excitation via and at least one ground return via; the at least three vias being arranged so as to form, when the at least one excitation via is powered, a first current loop and a second current loop, each current loop extending in the plane of the capacitive roof and in a direction substantially orthogonal to said capacitive roof, so as to be sensitive to a magnetic field substantially parallel to the plane of the capacitive roof, the first and second current loops having directions substantially orthogonal to each other in the plane capacitive roof
• the at least three electrically conductive vias comprise: an excitation via, a first ground return via and a second ground return via; the first current loop traveling between the excitation via, the capacitive roof and the first ground return via; the second current loop traveling between the excitation via, the capacitive roof and the second ground return via.
• the straight line connecting a connection point of the first ground return via in the plane of the capacitive roof and a connection point of the excitation via in the plane of the capacitive roof is substantially orthogonal to the line connecting a connection point of the second ground return via in the plane of the capacitive roof and a connection point of the excitation via in the plane of the capacitive roof.
• the at least three electrically conductive vias comprise: a ground return via, a first excitation via and a second excitation via; the first current loop traveling between the first excitation via, the capacitive roof and the ground return via; the second current loop traveling between the second excitation via, the capacitive roof and the ground return via.
• the straight line connecting a connection point of the first excitation via in the plane of the capacitive roof and a connection point of the ground return via in the plane of the capacitive roof is substantially orthogonal to the straight line connecting a connection point of the second excitation via in the plane of the capacitive roof and a connection point of the ground return via in the plane of the capacitive roof.
• the probe comprises a slot constituted by an opening passing through the entire thickness of the capacitive roof.
• the slot has axial symmetry with respect to a straight line passing through the connection point of the excitation via in the plane of the capacitive roof and passing substantially at equal distance from the connection point of the first via back ground in the plane of the capacitive roof and the connection point of the second ground return via in the plane of the capacitive roof.
• the slot has axial symmetry with respect to a straight line passing through the connection point of the ground return via in the plane of the capacitive roof and passing substantially at equal distance from the connection point of the first excitation via in the plane of the capacitive roof and of the connection point of the second excitation via in the plane of the capacitive roof.
• the probe further comprises at least one complementary electrically conductive via, the at least one complementary via being a complementary ground return via or a complementary excitation via.
• the dielectric material is air.
• the dielectric material is a substrate, for example an organic substrate or a ceramic substrate.
• the dimensions of the probe in the main plane are less than a quarter of the wavelength of use of said probe, for example between a twentieth and a quarter of the length of wavelength of use of said probe, or even between one twentieth and one tenth of the wavelength of use of said probe.
• the height of the probe is less than one thirtieth of the wavelength of use of said probe, for example between one hundredth and one thirtieth of the wavelength of use of said probe, or even between one hundred fifth and one thirtieth of the wavelength of use of said probe.
• the ground plane is parallel to the capacitive roof.
• One embodiment provides a method of manufacturing an electromagnetic field probe comprising:
• a considered medium is for example an at least partially closed cavity, such as for example a metal cavity.
• FIG. 1A represents a probe according to one embodiment in top view (main plane);
• Figure IB shows the probe of Figure IA seen in section along a plane perpendicular to the main plane (section BB);
• FIG. IC represents the probe of FIG. IA according to a 3D view
• FIG. 2 represents the block diagram of a probe according to one embodiment
• FIG. 3 represents a probe according to another embodiment in top view
• FIG. 4 represents a probe according to another embodiment in top view
• FIG. 5A [0038] FIG. 5A;
• FIG. 5C illustrates the results of measurements obtained for a probe oriented in two orientations at 90° relative to each other so as to be equivalent to a probe according to one embodiment
• FIG. 6A illustrates a first example of use of a probe according to one embodiment
• FIG. 6B illustrates a second example of use of a probe according to one embodiment
• FIG. 6C illustrates a third example of use of a probe according to one embodiment.
• the dimensions of a probe in the main plane correspond to the dimensions in two directions perpendicular to the main plane, for example a first direction X and a second direction Y.
• a probe of rectangular shape e.g. square
• the dimensions in the main plane correspond to the two sides of the rectangle
• the dimensions in the main plane correspond to the diameter of the circle
• the dimensions in the principal plane correspond to the two axes of the ellipse.
• the wavelength of use of a probe is defined as follows: if the probe is designed to work at one wavelength, then the wavelength of use of the probe is this length of wave.
• FIGS. 1A, 1B and 1C show three views of a probe 10 according to one embodiment: a top view (main plane), a section BB along a plane perpendicular to the main plane XY and a 3D view.
• the electromagnetic field probe 10 represented comprising:
• ground return vias being able to electrically connect the ground plane 12 and the capacitive roof
• the excitation via 110 is not electrically connected to the ground plane 12.
• ground return vias can be referred to as "ground via”.
• a ground return via has the function of forming a short-circuit between the ground plane 12 and the capacitive roof 13.
• the capacitive roof 13 is electrically conductive and preferably adopts a planar shape (for example in the form of a plate or a metal deposit on a substrate).
• the ground plane 12 is electrically conductive and preferably adopts a planar shape (for example in the form of a plate or a metal deposit on a substrate).
• the capacitive roof 13 is preferably substantially parallel to the ground plane 12.
• the probe extends along a main XY plane.
• the capacitive roof 13 being parallel to the ground plane 12, it is considered that the capacitive roof, the ground plane and therefore the probe extend along the same main plane XY (of thickness equal to the distance between the ground plane and the capacitive roof, to which are added the thicknesses of the ground plane and the capacitive roof).
• ground plane 12, the capacitive roof 13 and each via can each be at least partially, in a non-limiting manner, made of metal, for example copper, aluminum or steel.
• the line CC connecting the connection point 111A of the first ground via 111 in the plane of the capacitive roof 13 and the connection point 110A of the excitation via 110 in the plane of the capacitive roof 13 is substantially orthogonal to the line DD connecting the connection point 112A of the second ground via 112 in the plane of the capacitive roof 13 and the connection point 110A of the excitation via 110 in the plane of the capacitive roof 13.
• the second ground via 112 is located symmetrically to the first ground via 111 with respect to the diagonal AA (or axis of symmetry AA) of the capacitive roof 13 passing through the connection point 110A of the excitation via 110 in the plane of the capacitive roof.
• the first 111 and second 112 ground return vias are not arranged according to a central symmetry with respect to the excitation via 110, and this, so as to be able to pick up the magnetic field in two different directions of the main plane XY , as explained later.
• each current loop is substantially orthogonal to the ground plane, although it also travels in the plane of the capacitive roof.
• the power supply loop extends along a profile included, or which can be projected orthogonally, in a plane orthogonal to the ground plane. In other words, the profile of such a loop can travel, along the length of the loop, within a plane substantially orthogonal to the ground plane.
• each current loop extends vertically (in the direction Z) and in a direction of the main plane XY, the two current loops having directions substantially orthogonal to each other in the plane principal XY. Therefore, the first current loop 201 is sensitive to the magnetic field H1 in the first direction X of the main plane XY, and the second current loop 202 is sensitive to the magnetic field H2 in the second direction Y of the main plane XY, as this is explained later. It is specified that the second direction Y is orthogonal to the first direction X.
• the capacitive roof 13 comprises a slot 130 corresponding to an opening in the entire thickness of the capacitive roof, and having two parts 1301, 1302 substantially symmetrical to each other with respect to the axis of AA symmetry.
• Each part has a rectangular spiral shape forming an angle of 45° with the axis of symmetry AA. This spiral shape makes it possible to obtain a large slot length even when the dimensions of the capacitive roof are small.
• Increasing the length of the slot makes it possible to reduce the working frequency of the probe. More broadly, the presence and dimensioning of a slot in the capacitive roof makes it possible to adjust the working frequency of the probe. In particular, the length of the slit has an impact on the resonant frequency of the probe.
• slot shape is not limiting and other slot shapes are possible to obtain a given slot length.
• the slot may have other rectilinear shapes, other spiral shapes or meandering shapes.
• the slot can be divided into several sections connected to each other to form a continuous slot.
• the presence and dimensioning of a slot also make it possible to adjust the input impedance (and/or the output impedance) of a probe to a given value according to different embodiments. This dimensioning is carried out by taking into account the propagation of the currents on the capacitive roof and by modifying the latter so as to obtain a desired input impedance (and/or output impedance).
• the slot can be sized to adjust the input impedance of a probe to a given value, for example 50 Ohms, which is a typical impedance in the field of wireless information transmissions.
• a probe according to different embodiments has several design parameters to be able to act on all or part of its characteristics, in particular on its working frequency and wavelength, its impedance input, its output impedance, and/or its radiation efficiency: the diameters of the vias: mainly make it possible to act on the impedance of the probe; the distances between the vias: mainly allow to act on the impedance of the probe; the dimensions of the probe / of the capacitive roof: mainly make it possible to act on the resonance frequency of the probe;
• the height of the probe mainly allows to act on the bandwidth of the probe (quality factor); the choice of the dielectric material: mainly allows to act on the resonance frequency of the probe.
• the diameters of the vias and the distances between the vias can make it possible to adjust the input impedance of the probe so that it is adapted, for example, to that of a measurement system (for example a sensor), and/or to that of a communicating system (for example an RFIC radiofrequency chip).
• a measurement system for example a sensor
• a communicating system for example an RFIC radiofrequency chip
• the dimensions in the main plane of the ground plane are greater than or equal, for example equal, to those of the capacitive roof.
• the dielectric material can be:
• a dielectric substrate for example: an organic substrate, for example a Rogers 4003® substrate, a duroid 5880® substrate, an FR4 substrate; a ceramic substrate, for example a Rogers Curamik® substrate, or a substrate based on low temperature cofired ceramics (LTCC for “Low Temperature Cofired Ceramic”).
• an organic substrate for example a Rogers 4003® substrate, a duroid 5880® substrate, an FR4 substrate
• a ceramic substrate for example a Rogers Curamik® substrate, or a substrate based on low temperature cofired ceramics (LTCC for “Low Temperature Cofired Ceramic”).
• a dielectric substrate may consist of a superposition of several layers of dielectric materials, optionally with different dielectric materials, or even mixed organic/ceramic materials.
• the vias can perform a mechanical support function for the capacitive roof on the ground plane.
• pillars made of insulating material for example plastic or nylon, can be added between the ground plane and the capacitive roof to reinforce the mechanical retention of the capacitive roof on the ground plane. These pillars can be placed under the capacitive roof or on the edges of said roof.
• the ground and excitation vias can have different profiles (circular, polygonal, etc.).
• their diameters can be of the order of 1 mm or between 100 ⁇ m and 5 mm.
• the electrical dimensions of the probe (reduced to the working wavelength of the probe) in the plane can be between 1/20 and 1/4, or even between 1/20 and 1/10, or still between 1/20 and 1/15.
• the electrical height of the probe (reduced to the working wavelength of the probe) is preferably less than or equal to 1/30.
• the probe has a height, reduced to its working wavelength, very below standard heights. It may be between 1/150 and 1/30, or even between 1/100 and 1/30, for example substantially equal to 1/100.
• the probe can have reduced dimensions.
• the dimensions can be reduced without it being necessary to increase the number of ground return vias and/or without it being necessary to dispose the ground return vias within a magneto-magnetic material.
• dielectric the dielectric material between the ground plane and the capacitive roof can be air or a dielectric material that is not necessarily magnetic.
• the probe can in particular be integrated into different types of medium and/or transmission systems.
• the probe 10 of FIG. 2 can be intended to work at a frequency of 433 MHz.
• the dimensions of the probe in the main plane XY equivalent in this example to the dimensions of the capacitive roof, can be 40 ⁇ 40 mm 2 .
• the height hl of the probe can be 4 mm.
• the diameters of the vias can be 1.5 mm for the excitation via and 0.3 mm for the ground vias and the distance D4 between each ground via and the excitation via can be 8 mm.
• the length of the slot can be equal to 164.4 mm and the width equal to 1.65 mm.
• This length can be obtained by forming two rectangular spirals with five segments, two consecutive segments being perpendicularly connected to each other as illustrated in figure IA, each spiral comprising: a first segment of length L1 equal to 21 mm, a second segment of length L2 equal to at 13.15 mm, a third segment of length L3 equal to 24.65 mm, a fourth segment of length L4 equal to 11.2 mm and a fifth segment of length L5 equal to 12.2 mm.
• the first spiral 1301 is separated by a distance DI from the line CC.
• the second spiral is a same distance DI from the line DD. In the example, the distance DI is equal to 3 mm.
• Figure 2 shows the block diagram of a probe, taking as an example the probe 10 of Figures IA to IC, although the block diagram can be applied to a probe according to another embodiment.
• the probe shown in the principle diagram is a probe of FIGS. IA to IC seen in section CC according to a plane perpendicular to the main plane XY (the section plane is visible in FIG. IA).
• the excitation via 110 when powered by a power source 300, generates a first current 200 which is concentrated in the first ground via 111, which makes the probe sensitive to vertical electric fields E . Furthermore, a second current is generated, which forms a first current loop 201 between the excitation via 110, the capacitive roof 13 and the first ground via 111, which makes the probe sensitive to the magnetic field components H1 according to the first X direction of the main XY plane of the probe.
• the probe can be coupled omnidirectionally to the electromagnetic field: to the vertical electric field E (in the Z direction) and to the magnetic field H in the main XY plane (being sensitive to the components in the two perpendicular directions X, Y of the plane).
• FIG. 3 represents a probe 10' according to another embodiment, in a top view.
• the probe 10' represented differs from the probe of FIGS. 1A-1C by the shape of the slot 131, and by the reduction in its length.
• the slot 131 has two parts 1311, 1312 substantially symmetrical with respect to the axis of symmetry AA of the capacitive roof 13, each part forming an angle of 45° with said axis of symmetry, but it differs in that each of the two parts 1311, 1312 is arranged in three segments connected perpendicularly to each other, thus reducing the length of the slot compared to a five-segment slot. Reducing the length of the slot makes it possible to increase the working frequency of the probe.
• the probe 10' of FIG. 3 can be intended to operate at a frequency of 900 MHz.
• the dimensions of the probe in the main plane XY equivalent in this example to the dimensions of the capacitive roof, can be 30 ⁇ 30 mm 2 .
• the height of the probe can be 4 mm.
• the diameters of the vias can be 1.8 mm for the drive via and 0.8 mm for the ground vias and the distance between each ground via and the drive via can be 5 mm.
• the slot length can be 65mm and the width 1mm.
• the length can be obtained by forming two rectangular spirals with three segments each, two consecutive segments being connected perpendicularly to each other as illustrated in figure 3, each spiral comprising: a first segment of length L1 equal to 14.93 mm, a second segment of length L2 equal to 8.95 mm and a third segment of length L3 equal to 8.7 mm.
• the first spiral 1311 is separated by a distance DI from the line CC.
• the second spiral 1312 is a same distance DI from the line DD.
• the distance DI is equal to 4.2 mm.
• each second segment is distant by a distance D2 from the edge of the capacitive roof, for example equal to 4.2 mm and each third segment is distant by a distance D3 from the edge of the capacitive roof, for example equal to 1.8 mm.
• FIG. 4 represents a 10′′ probe according to another embodiment in top view.
• the probe represented differs from the probe of FIGS. 1A-1C in that it comprises a ground return via 113 and first and second excitation vias 114, 115 (instead of a via of excitation 110 and two ground return vias 111, 112 for probe 10 of FIGS. 1A-1C).
• Figure 2 The description of Figure 2 applies to this other embodiment, except that the first current loop 201 is formed by the first excitation via 114 and the ground via 113 connected with the capacitive roof 13 and that the second current loop 202 is formed by formed by the second excitation via 115 and the ground via 113 connected with the roof 13.
• This other embodiment makes it possible to discriminate between the two orthogonal components of the magnetic field in the main plane XY.
• the proportion of the magnetic field H1 oriented along the X axis couples with the first current loop 201.
• the magnetic field oriented along the Y axis is not or is very weakly coupled to the first current loop 201
• the proportion of the magnetic field H2 oriented along the Y axis couples with the second current loop 202.
• the magnetic field oriented along the X axis is not or is very weakly at the second current loop 202.
• the first and second excitation vias 114, 115 are not electrically connected to the ground plane 12.
• the first and second excitation vias 114, 115 can be powered either by the same power source capable of supplying two currents (which can be out of phase with respect to each other), or by two independent power sources.
• the second excitation via 115 is located symmetrically to the first excitation via 114 with respect to the diagonal (or axis of symmetry) AA of the capacitive roof 13 passing through the connection point 113A of the ground via 113 in the plane of the capacitive roof.
• the first 114 and second 115 excitation vias are not arranged in a central symmetry with respect to the ground return via 113, and this, so as to be able to pick up the magnetic field in two different directions of the main plane XY , as explained later.
• the probe may comprise a fourth via which may be: - an additional ground return via: according to a variant referring to the mode of FIGS. 1A-1B or 2,
• a complementary ground return via can be substantially aligned with the first ground via 111 and the excitation via 110 or with the second ground via 112 and the excitation via 110, and this, either on the same side as the first or second ground via with respect to the axis of symmetry AA, or on the other side; according to another variant referring to the mode of FIG.
• a complementary ground return via can be substantially aligned with the ground via 113 and the first excitation via 114 or with the ground via 113 and the second via d excitation 115, either on the same side as the first or second excitation via with respect to the axis of symmetry AA, or on the other side;
• an additional excitation via can be substantially aligned with the first ground via 111 and the excitation via 110 or with the second ground via 112 and the excitation via 110, either on the same side as the first or second ground via with respect to the axis of symmetry AA, or on the other side; in this case, all of the excitation vias of the same current loop 201 and 202 are electrically connected together.
• a complementary ground return via for example, mainly controls the amplitude of the probe's resonance and a complementary excitation via, for example, controls the imaginary part of the probe's input impedance. .
• the capacitive roof preferably has a substantially square shape, but the embodiments are of course not limited to this type of shape.
• the capacitive roof can for example have a polygonal shape other than square, a circular or oval shape, or any other suitable shape.
• a substrate 14 made of dielectric material for example an FR4 type substrate, then:
• a metal layer is formed on the lower surface 14B of the substrate to produce a ground plane 12 according to defined dimensions
• a metal layer is formed on the upper surface 14A of the substrate to produce a capacitive roof 13 according to defined dimensions
• a slot 130, 131 is formed in the thickness of the capacitive roof 13 according to a defined length and pattern
• ground vias 111, 112 are formed in the dielectric substrate electrically connecting the ground plane 12 and the capacitive roof 13 as well as an excitation via 110 (or excitation vias (114, 115) electrically connected to the capacitive roof 13, but electrically isolated from the ground plane 12;
• a fifth step (which can be before or after the fourth step), an opening is formed in the thickness of the ground plane 12 in order to pass the excitation via 110 (or in certain cases, several openings to pass several excitation vias 114, 115), and each excitation via is electrically isolated from the ground plane, for example by adding electrical insulation at each drive via pass through the ground plane.
• the first step may comprise a step of metallization of the substrate made of dielectric material entirely on its lower surface to form the ground plane.
• the second step may include a step of metallization of the substrate in dielectric material at least partially on its upper surface to form the capacitive roof.
• the third step can include a step of machining or etching the capacitive roof to form the slot.
• the fourth step may include a step of printing the vias in the substrate, according to known techniques in the field of microelectronics.
• the first and second steps are then no longer necessary.
• two single-sided substrates one side metallized on an insulating layer
• the metallized face of each substrate can be etched, if necessary, to form the slot in the substrate forming the capacitive roof and/or to form the opening(s) in the substrate forming the ground plane in order to make pass the excitation via(s).
• the two single-sided substrates are then assembled by their insulating layers, each previously coated with a layer of glue. The structure thus obtained is then drilled and the holes are metallized in order to form the ground and excitation vias.
• the dielectric material being air.
• the first and second steps are then eliminated and can be replaced by a step of arranging a metal plate to form a ground plane according to defined dimensions and another step of arranging another metal plate to form a capacitive roof according to defined sizes.
• the ground and excitation vias are not formed in the substrate.
• the ground via(s) can be assembled (for example welded or screwed) to the ground plane and to the capacitive roof, and the via(s) ) excitation can (Fri) t be assembled (for example welded (s) or screwed (s)) to the capacitive roof while being electrically isolated (s) from the ground plane.
• pillars made of insulating material for example plastic or nylon, can be added between the ground plane and the capacitive roof. These pillars can be placed under the capacitive roof or on the edges of said roof.
• FIGS. 5A to 5C illustrate the results of measurements, obtained for a probe oriented according to two orientations at 90° relative to each other so as to be equivalent to a probe according to one embodiment, compared with measurement results obtained for probes of the state of the art, and this, within a cylindrical metal cavity with a diameter of 336 millimeters.
• the abscissa represents the operating frequency of each probe considered.
• the ordinate represents the transmission loss in dB between a transmitting antenna placed at one point of the cavity and the probe considered at different points of the cavity.
• curves 501 and 502 represent the minimum and maximum transmission levels between a transmitting antenna and the probe according to one embodiment, the curves 501 representing the minimum levels and the curves 502 representing the maximum levels .
• Other graphs 503, 504 show results obtained with prior art probes positioned in two orientations orthogonal to each other.
• FIG. 5A illustrates the measurement results obtained for frequencies between 300 and 500 MHz.
• FIG. 5B illustrates the results of measurements obtained for frequencies comprised between 600 and 1100 MHz.
• FIG. 5C illustrates the results of measurements obtained for frequencies comprised between 1800 and 2600 MHz.
• the curves 501, 502 show that the probe according to one embodiment makes it possible to compensate for these transmission losses, even for very high frequencies.
• the areas surrounded by dotted lines correspond to examples of areas in which the probe very clearly improves the transmission compared with the probes of the state of the art.
• FIGS. 6A, 6B and 6C illustrate three examples of use of a probe according to one embodiment.
• a component 20 for example a sensor or an RFIC chip
• a probe 10 is coupled with a probe 10 according to one embodiment, the probe-component assembly being in a cavity 40.
• an antenna 30 is adapted to emit electromagnetic waves 50 into the cavity 40 in order to communicate with the component coupled to the probe. Modes are established in the cavity, the electromagnetic field is picked up by the probe, which can back-scatter the information from the component to the antenna 30.
• the component is placed under the probe, in contact with it. this .
• a component 20 is connected by a connector to a probe 10 according to one embodiment, only the probe is in a cavity 40. Furthermore, an antenna 30 is adapted to emit waves 50 in the cavity 40, and is also connected by a connector to the component 20. Modes are established in the cavity, the electromagnetic field generated by the antenna 30 (respectively the probe 10) is picked up by the probe 10 (respectively the antenna 30) in order to perform, for example, measurements in transmission.
• a component 20 is connected by a connector to a probe 10 according to one embodiment, only the probe is in a cavity 40. Furthermore, an antenna 30 is adapted to emit electromagnetic waves 50 in the cavity 40.
• One objective of this configuration is for example to measure the field emitted by the antenna 30 in order to map the value of the components of the electromagnetic field for any position of the probe 10 in the cavity.
• the illustrated cavity may be closed or partially closed.
• - metrology for example near-field measurements
• communication for example the wireless transmission of information in large cavities
• ground plane and the capacitive roof are represented as being of the same surface.
• the ground plane may have a larger area than the capacitive roof, or even the capacitive roof may have a larger area than the ground plane.
• the capacitive roof does not necessarily include a slot.

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• Measuring Leads Or Probes (AREA)
• Testing Or Measuring Of Semiconductors Or The Like (AREA)

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• 2021
  • 2021-07-27 FR FR2108129A patent/FR3125886B1/fr active Active
• 2022
  • 2022-07-19 CN CN202280053066.XA patent/CN117716579A/zh active Pending
  • 2022-07-19 KR KR1020247005311A patent/KR20240032136A/ko unknown
  • 2022-07-19 EP EP22754369.1A patent/EP4378025A1/de active Pending
  • 2022-07-19 WO PCT/EP2022/070205 patent/WO2023006506A1/fr active Application Filing

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