EP4247006A3 - Micromechanical acoustic transducer - Google Patents

Micromechanical acoustic transducer Download PDF

Info

Publication number
EP4247006A3
EP4247006A3 EP23189034.4A EP23189034A EP4247006A3 EP 4247006 A3 EP4247006 A3 EP 4247006A3 EP 23189034 A EP23189034 A EP 23189034A EP 4247006 A3 EP4247006 A3 EP 4247006A3
Authority
EP
European Patent Office
Prior art keywords
bending transducer
free end
transducer
acoustic transducer
bending
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP23189034.4A
Other languages
German (de)
French (fr)
Other versions
EP4247006A2 (en
Inventor
Fabian STOPPEL
Bernhard Wagner
Shanshan Gu-Stoppel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV filed Critical Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Publication of EP4247006A2 publication Critical patent/EP4247006A2/en
Publication of EP4247006A3 publication Critical patent/EP4247006A3/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H04R7/06—Plane diaphragms comprising a plurality of sections or layers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H04R7/06—Plane diaphragms comprising a plurality of sections or layers
    • H04R7/10—Plane diaphragms comprising a plurality of sections or layers comprising superposed layers in contact
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/26—Damping by means acting directly on free portion of diaphragm or cone
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/02—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2440/00—Bending wave transducers covered by H04R, not provided for in its groups
    • H04R2440/01—Acoustic transducers using travelling bending waves to generate or detect sound
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Micromachines (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Circuit For Audible Band Transducer (AREA)
  • Pressure Sensors (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

Ein mikromechanischer Schallwandler umfasst entsprechend einem ersten Aspekt einen ersten Biegewandler mit einem freien Ende und einem zweiten Biegewandler mit einem freien Ende, die in einer gemeinsamen Ebene angeordnet sind, wobei das freie Ende des ersten Biegewandlers von dem freien Ende des zweiten Biegewandlers durch einen Spalt getrennt ist. Der zweite Biegewandler wird phasengleich zu der vertikalen Schwingung des ersten Biegewandlers angeregt. Ein mikromechanischer Schallwandler umfasst gemäß einem zweiten Aspekt einen ersten Biegewandler, der vertikal zur Schwingung angeregt wird und einen vertikal zu dem ersten Biegewandler erstreckendes Blendenelement, das durch einen Spalt von einem freien Ende des ersten Biegewandlers getrennt ist.According to a first aspect, a micromechanical sound transducer comprises a first bending transducer with a free end and a second bending transducer with a free end, which are arranged in a common plane, the free end of the first bending transducer being separated from the free end of the second bending transducer by a gap is. The second bending transducer is excited in phase with the vertical oscillation of the first bending transducer. According to a second aspect, a micromechanical sound transducer comprises a first bending transducer which is vertically excited to vibrate and a diaphragm element which extends vertically to the first bending transducer and is separated from a free end of the first bending transducer by a gap.

EP23189034.4A 2017-05-26 2018-05-28 Micromechanical acoustic transducer Pending EP4247006A3 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102017208911.3A DE102017208911A1 (en) 2017-05-26 2017-05-26 Micromechanical transducer
EP18729366.7A EP3632135B1 (en) 2017-05-26 2018-05-28 Micromechanical acoustic transducer
PCT/EP2018/063961 WO2018215669A2 (en) 2017-05-26 2018-05-28 Micromechanical acoustic transducer

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
EP18729366.7A Division EP3632135B1 (en) 2017-05-26 2018-05-28 Micromechanical acoustic transducer

Publications (2)

Publication Number Publication Date
EP4247006A2 EP4247006A2 (en) 2023-09-20
EP4247006A3 true EP4247006A3 (en) 2023-12-27

Family

ID=62530200

Family Applications (3)

Application Number Title Priority Date Filing Date
EP23189032.8A Pending EP4247005A3 (en) 2017-05-26 2018-05-28 Micromechanical acoustic transducer
EP18729366.7A Active EP3632135B1 (en) 2017-05-26 2018-05-28 Micromechanical acoustic transducer
EP23189034.4A Pending EP4247006A3 (en) 2017-05-26 2018-05-28 Micromechanical acoustic transducer

Family Applications Before (2)

Application Number Title Priority Date Filing Date
EP23189032.8A Pending EP4247005A3 (en) 2017-05-26 2018-05-28 Micromechanical acoustic transducer
EP18729366.7A Active EP3632135B1 (en) 2017-05-26 2018-05-28 Micromechanical acoustic transducer

Country Status (6)

Country Link
US (1) US11350217B2 (en)
EP (3) EP4247005A3 (en)
JP (2) JP7303121B2 (en)
CN (2) CN116668926A (en)
DE (1) DE102017208911A1 (en)
WO (1) WO2018215669A2 (en)

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JP7452476B2 (en) * 2021-03-10 2024-03-19 株式会社デンソー Piezoelectric element, piezoelectric device, and method for manufacturing piezoelectric element
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US20240022859A1 (en) * 2021-05-11 2024-01-18 xMEMS Labs, Inc. Package structure, apparatus and forming methods thereof
US11711653B2 (en) 2021-05-11 2023-07-25 xMEMS Labs, Inc. Sound producing cell and manufacturing method thereof
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CN113365196B (en) * 2021-07-05 2023-06-02 瑞声开泰科技(武汉)有限公司 MEMS speaker and MEMS speaker manufacturing method
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Also Published As

Publication number Publication date
US11350217B2 (en) 2022-05-31
JP7303121B2 (en) 2023-07-04
JP2023029908A (en) 2023-03-07
EP3632135B1 (en) 2023-08-02
CN111034223A (en) 2020-04-17
JP2020522178A (en) 2020-07-27
EP4247006A2 (en) 2023-09-20
EP3632135A2 (en) 2020-04-08
WO2018215669A2 (en) 2018-11-29
EP4247005A3 (en) 2023-12-06
US20200100033A1 (en) 2020-03-26
EP4247005A2 (en) 2023-09-20
WO2018215669A3 (en) 2019-01-24
CN116668926A (en) 2023-08-29
DE102017208911A1 (en) 2018-11-29

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