Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
  • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
  • H01L23/495—Lead-frames or other flat leads
  • H01L23/49541—Geometry of the lead-frame
  • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
  • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
  • H01L23/495—Lead-frames or other flat leads
  • H01L23/49541—Geometry of the lead-frame
  • H01L23/49548—Cross section geometry
  • H01L23/49551—Cross section geometry characterised by bent parts
  • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
  • H01M10/00—Secondary cells; Manufacture thereof
  • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
  • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
  • H01M10/4257—Smart batteries, e.g. electronic circuits inside the housing of the cells or batteries
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
  • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
  • H01M50/50—Current conducting connections for cells or batteries
  • H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
  • H01M50/519—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing comprising printed circuit boards [PCB]
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/18—Printed circuits structurally associated with non-printed electric components
  • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
  • H05K3/341—Surface mounted components
  • H05K3/3421—Leaded components
  • H05K3/3426—Leaded components characterised by the leads
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/10—Details of semiconductor or other solid state devices to be connected
  • H01L2924/11—Device type
  • H01L2924/13—Discrete devices, e.g. 3 terminal devices
  • H01L2924/1304—Transistor
  • H01L2924/1306—Field-effect transistor [FET]
  • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
  • H01L2924/181—Encapsulation
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/14—Structural association of two or more printed circuits
  • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10007—Types of components
  • H05K2201/10037—Printed or non-printed battery
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10007—Types of components
  • H05K2201/10166—Transistor
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10227—Other objects, e.g. metallic pieces
  • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10227—Other objects, e.g. metallic pieces
  • H05K2201/10287—Metal wires as connectors or conductors
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10431—Details of mounted components
  • H05K2201/10439—Position of a single component
  • H05K2201/10492—Electrically connected to another device
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
  • H05K2201/10621—Components characterised by their electrical contacts
  • H05K2201/10628—Leaded surface mounted device
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
  • H05K2201/10621—Components characterised by their electrical contacts
  • H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
  • H05K2201/10742—Details of leads
  • H05K2201/1075—Shape details
  • H05K2201/10757—Bent leads
  • H05K2201/10772—Leads of a surface mounted component bent for providing a gap between the lead and the pad during soldering
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
  • Y02E60/10—Energy storage using batteries
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
  • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
  • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

• the present invention relates to a semiconductor device (e.g. MOSFET), a printed circuit board (PCB) with a semiconductor device (e.g. MOSFET), and method of interfacing control pin of a power semiconductor device (e.g. MOSFET) to a printed circuit board in a battery management system (BMS) of a lithium ion battery.
• a semiconductor device e.g. MOSFET
• PCB printed circuit board
• MOSFET e.g. MOSFET
• BMS battery management system
• Lithium ion batteries require a battery management system (BMS) in order to provide protection against various fault conditions.
• BMS battery management system
• the BMS disconnects the internal battery cells from the external battery terminals when a fault condition occurs.
• Semiconductor power devices typically MOSFETs, are used to provide this disconnect function. Since the MOSFETs are in series with the battery cells, they must be able to handle the full battery current passing through the MOSFETS, which can be quite high in some applications.
• MOSFETs in a BMS can be required to conduct very high current
• MOSFET selected for the application must have an appropriate drain voltage rating for the application. With these requirements, the highest performing MOSFETs available for a given BMS application will often be configured in a surface mount package.
• MOSFETs are soldered directly to a printed circuit board (PCB).
• PCB printed circuit board
• MOSFETs in surface mount packages are appropriate for this case.
• electrically conductive plates or bars e.g. copper plates or bars
• heatsinks in order to decrease heat rise, and increase the maximum current that can be conducted through the MOSFETs.
• the configuration of standard MOSFET surface mount packages is problematic, since the gate pin on each standard MOSFET must be connected to the system controller integrated circuit (1C), and not to a copper plate or bar.
• the difficulty with connecting standard MOSFETs in this manner is that the connecting end of the gate pin on each standard MOSFET surface mount package is located in the same plane as the connecting ends of the power pins, as shown in the conventional MOSFET shown in FIG. 1. This makes it difficult to electrically isolate the gate pin from the power pins connected to the copper plate or bar, and to connect the gate pin to the controller integrated circuit (IC).
• IC controller integrated circuit
• a solution is to isolate the power pin (e.g. gate pin) of the MOSFET from a copper plate or bar installed on the printed circuit board (PCB) using insulating material to insulate the gate pin from the copper plate or bar.
• insulating material e.g. a polyamide tape or other insulating materials commonly used in electronics manufacturing could be used for this purpose.
• soldering a wire to the gate pin is difficult to perform in manufacturing, and prone to failure due to shorts. Therefore, a better method for isolating and connecting to the MOSFET gate pin method is desired.
• the present invention is directed to provide a MOSFET having a raised or elevated gate pin.
• the gate pin of the MOSFET is made to be straight or partially bent during manufacturing of the gate pin and/or during manufacturing of the MOSFET.
• a bent gate pin can be bent straight or partially bent during manufacturing of the gate pin and/or during manufacturing of the MOSFET.
• the gate pin on a manufactured MOSFET is bent upward to provide physical and electrical isolation from the copper plate or bar of the printed circuit board (PCB), or other conductor that the power pins are attached.
• the gate pin is connected to circuit of the battery management system (BMS), for example, connected to an integrated circuit (1C) of the battery management system (BMS).
• BMS battery management system
• a connecting wire is used to connect the gate pin or lead on the MOSFET which is raised or elevated to a PCB containing the controller electronics.
• each MOSFET may have an individual wire connecting to the PCB, or the individual pins may be wired together in a daisy- chain fashion, and then a single wire is used to connect to the printed circuit board (PCB).
• the battery management system (BMS) must operate in a harsh environment and must withstand severe shock and vibration.
• the MOSFET installed on the printed circuit board will include a material placed under and around the gate pin on the MOSFET (e.g. between PCB and gate pin) to provide physical stability and resistance to shock and vibration.
• An example of an appropriate material for this application is RTV (Room Temperature Vulcanizing Silicone). Other materials may also be suitable for this application.
• the printed circuit board (BCB) is provided with another printed circuit board (e.g. gate printed circuit board (PCB)) to connect to the raised or elevated gate lead of the MOSFET, which is raised or elevated relative to the tips of the power pins.
• PCB gate printed circuit board
• the gate printed circuit board (PCB) interfaces to each MOSFET.
• the gate printed circuit board (PCB) is connected to the main PCB containing the battery management system (BMS) controller using a wire.
• BMS battery management system
• Other standard electrical connection methods such as electrical connectors can be used to make the connection.
• the gate printed circuit board may contain electrical components that interface to the MOSFET gate.
• the gate printed circuit board provides mechanical stability to the connections. However, if the operating environment for the BMS is harsh, RTV or similar material can be added, as described in the invention above, to further stabilize the MOSFET gates against shock and vibration.
• the presently described subject matter is directed to a MOSFET device for use with a printed circuit board (PCB) of a battery management system (BMS), the device comprising or consisting of: a semiconductor body; a metal conductor extending outwardly from a side of the semiconductor body; a plurality of power pins extending outwardly from at least one side of the semiconductor body, the power pins having tips bent downwardly; a gate pin extending outwardly from at least one side of the semiconductor body, wherein the tip of the gate pin is raised or elevated relative to the tips of the power pins so as to avoid electrical contact with the one of the spaced apart copper plates, and wherein the tip of the gate pin is connected to a circuit of the battery management system (BMS).
• PCB printed circuit board
• BMS battery management system
• the presently described subject matter is directed to a MOSFET device for use with a printed circuit board (PCB) of a battery management system (BMS), the device comprising or consisting of: a semiconductor body; a metal conductor extending outwardly from a side of the semiconductor body; a plurality of power pins extending outwardly from at least one side of the semiconductor body, the power pins having tips bent downwardly; a gate pin extending outwardly from at least one side of the semiconductor body, wherein the tip of the gate pin is raised or elevated relative to the tips of the power pins so as to avoid electrical contact with the one of the spaced apart copper plates, and wherein the tip of the gate pin is connected to a circuit of the battery management system (BMS), wherein the gate pin is a straight gate pin.
• PCB printed circuit board
• BMS battery management system
• the presently described subject matter is directed to a MOSFET device for use with a printed circuit board (PCB) of a battery management system (BMS), the device comprising or consisting of: a semiconductor body; a metal conductor extending outwardly from a side of the semiconductor body; a plurality of power pins extending outwardly from at least one side of the semiconductor body, the power pins having tips bent downwardly; a gate pin extending outwardly from at least one side of the semiconductor body, wherein the tip of the gate pin is raised or elevated relative to the tips of the power pins so as to avoid electrical contact with the one of the spaced apart copper plates, and wherein the tip of the gate pin is connected to a circuit of the battery management system (BMS), wherein the power pins have a fully bent configuration and the gate pin has a partially bent configuration.
• PCB printed circuit board
• BMS battery management system
• the presently described subject matter is directed to a MOSFET device for use with a printed circuit board (PCB) of a battery management system (BMS), the device comprising or consisting of: a semiconductor body; a metal conductor extending outwardly from a side of the semiconductor body; a plurality of power pins extending outwardly from at least one side of the semiconductor body, the power pins having tips bent downwardly; a gate pin extending outwardly from at least one side of the semiconductor body, wherein the tip of the gate pin is raised or elevated relative to the tips of the power pins so as to avoid electrical contact with the one of the spaced apart copper plates, and wherein the tip of the gate pin is connected to a circuit of the battery management system (BMS), wherein a lower surface of the tips of the power pins are located in a same plane as a lower surface of the semiconductor body.
• PCB printed circuit board
• BMS battery management system
• the presently described subject matter is directed to a MOSFET device for use with a printed circuit board (PCB) of a battery management system (BMS), the device comprising or consisting of: a semiconductor body; a metal conductor extending outwardly from a side of the semiconductor body; a plurality of power pins extending outwardly from at least one side of the semiconductor body, the power pins having tips bent downwardly; a gate pin extending outwardly from at least one side of the semiconductor body, wherein the tip of the gate pin is raised or elevated relative to the tips of the power pins so as to avoid electrical contact with the one of the spaced apart copper plates, and wherein the tip of the gate pin is connected to a circuit of the battery management system (BMS), wherein the gate pin is connected to a trace of the printed circuit board (PCB) for connecting the gate pin to a circuit of the battery management system (BMS).
• PCB printed circuit board
• the presently described subject matter is directed to a MOSFET device for use with a printed circuit board (PCB) of a battery management system (BMS), the device comprising or consisting of: a semiconductor body; a metal conductor extending outwardly from a side of the semiconductor body; a plurality of power pins extending outwardly from at least one side of the semiconductor body, the power pins having tips bent downwardly; a gate pin extending outwardly from at least one side of the semiconductor body, wherein the tip of the gate pin is raised or elevated relative to the tips of the power pins so as to avoid electrical contact with the one of the spaced apart copper plates, and wherein the tip of the gate pin is connected to a circuit of the battery management system (BMS), wherein the gate pin is connected to a trace of the printed circuit board (PCB) for connecting the gate pin to a circuit of the battery management system (BMS), wherein the gate pin is connected to the trace of the printed circuit board by a connector wire.
• PCB printed circuit board
• BMS
• the presently described subject matter is directed to a MOSFET device for use with a printed circuit board (PCB) of a battery management system (BMS), the device comprising or consisting of: a semiconductor body; a metal conductor extending outwardly from a side of the semiconductor body; a plurality of power pins extending outwardly from at least one side of the semiconductor body, the power pins having tips bent downwardly; a gate pin extending outwardly from at least one side of the semiconductor body, wherein the tip of the gate pin is raised or elevated relative to the tips of the power pins so as to avoid electrical contact with the one of the spaced apart copper plates, and wherein the tip of the gate pin is connected to a circuit of the battery management system (BMS), wherein the gate pin is connected to a gate printed circuit board connected to the printed circuit board (PCB) for connecting the gate pin to a circuit of the battery management system (BMS).
• PCB printed circuit board
• BMS battery management system
• PCB printed circuit board
• BMS battery management system
• MOSFETs each comprising: a semiconductor body; a plurality of power pins extending outwardly from at least one side of the semiconductor body, the power pins having tips bent downwardly and connected to one of the spaced apart copper plates; a gate pin extending outwardly from at least one side of the semiconductor body, the gate pin connected to a circuit of the battery management system (BMS), wherein the tip of the gate pin is raised or elevated relative to the tips of the power pins so as to avoid electrical contact with the one of the spaced apart cooper plates, and wherein the tip of the gate pin is connected to a circuit of the battery management system (BMS).
• BMS battery management system
• PCB printed circuit board
• BMS battery management system
• MOSFETs each comprising: a semiconductor body; a plurality of power pins extending outwardly from at least one side of the semiconductor body, the power pins having tips bent downwardly and connected to one of the spaced apart copper plates; a gate pin extending outwardly from at least one side of the semiconductor body, the gate pin connected to a circuit of the battery management system (BMS), wherein the tip of the gate pin is raised or elevated relative to the tips of the power pins so as to avoid electrical contact with the one of the spaced apart cooper plates, and wherein the tip of the gate pin is connected to a circuit of the battery management system (BMS), wherein the gate pin is a straight gate pin.
• BMS battery management system
• PCB printed circuit board
• BMS battery management system
• MOSFETs each comprising: a semiconductor body; a plurality of power pins extending outwardly from at least one side of the semiconductor body, the power pins having tips bent downwardly and connected to one of the spaced apart copper plates; a gate pin extending outwardly from at least one side of the semiconductor body, the gate pin connected to a circuit of the battery management system (BMS), wherein the tip of the gate pin is raised or elevated relative to the tips of the power pins so as to avoid electrical contact with the one of the spaced apart cooper plates, and wherein the tip of the gate pin is connected to a circuit of the battery management system (BMS), wherein the gate pin is a partially bent gate pin.
• BMS battery management system
• the presently described subject matter is directed to a method of connecting a MOSFET to a printed circuit board (PCB) of a battery management system (BMS), the method comprising: locating a tip of a gate pin of the MOSFET at a raised or elevated position relative to tips of power pins of the MOSFET; installing the MOSFET bridging a pair of spaced apart copper plates located on a printed circuit board (PCB) of the battery management system (BMS) with the tips of the power pins connected to one of the spaced apart copper plates and a metal connector of the MOSFET connected to the other of the spaced apart copper plates; and electrically connecting the raised or elevated tip of the gate pin to a circuit of the battery management system (BMS).
• PCB printed circuit board
• BMS battery management system
• the presently described subject matter is directed to a method of connecting a MOSFET to a printed circuit board (PCB) of a battery management system (BMS), the method comprising: locating a tip of a gate pin of the MOSFET at a raised or elevated position relative to tips of power pins of the MOSFET; installing the MOSFET bridging a pair of spaced apart copper plates located on a printed circuit board (PCB) of the battery management system (BMS) with the tips of the power pins connected to one of the spaced apart copper plates and a metal connector of the MOSFET connected to the other of the spaced apart copper plates; and electrically connecting the raised or elevated tip of the gate pin to a circuit of the battery management system (BMS), wherein the power pins of the MOSFET are bent, and the gate pin of the MOSFET is a straight gate pin with a raised or elevated tip.
• PCB printed circuit board
• BMS battery management system
• the presently described subject matter is directed to a method of connecting a MOSFET to a printed circuit board (PCB) of a battery management system (BMS), the method comprising: locating a tip of a gate pin of the MOSFET at a raised or elevated position relative to tips of power pins of the MOSFET; installing the MOSFET bridging a pair of spaced apart copper plates located on a printed circuit board (PCB) of the battery management system (BMS) with the tips of the power pins connected to one of the spaced apart copper plates and a metal connector of the MOSFET connected to the other of the spaced apart copper plates; and electrically connecting the raised or elevated tip of the gate pin to a circuit of the battery management system (BMS), wherein the power pins of the MOSFET are bent, and the gate pin of the MOSFET is a partially bent gate pin with a raised or elevated tip.
• PCB printed circuit board
• BMS battery management system
• the presently described subject matter is directed to a method of connecting a MOSFET to a printed circuit board (PCB) of a battery management system (BMS), the method comprising: locating a tip of a gate pin of the MOSFET at a raised or elevated position relative to tips of power pins of the MOSFET; installing the MOSFET bridging a pair of spaced apart copper plates located on a printed circuit board (PCB) of the battery management system (BMS) with the tips of the power pins connected to one of the spaced apart copper plates and a metal connector of the MOSFET connected to the other of the spaced apart copper plates; and electrically connecting the raised or elevated tip of the gate pin to a circuit of the battery management system (BMS), wherein the gate pin is electrically connected to the circuit of the battery management system (BMS) with a connecting wire.
• PCB printed circuit board
• BMS battery management system
• the presently described subject matter is directed to a method of connecting a MOSFET to a printed circuit board (PCB) of a battery management system (BMS), the method comprising: locating a tip of a gate pin of the MOSFET at a raised or elevated position relative to tips of power pins of the MOSFET; installing the MOSFET bridging a pair of spaced apart copper plates located on a printed circuit board (PCB) of the battery management system (BMS) with the tips of the power pins connected to one of the spaced apart copper plates and a metal connector of the MOSFET connected to the other of the spaced apart copper plates; and electrically connecting the raised or elevated tip of the gate pin to a circuit of the battery management system (BMS), wherein the gate pin is electrically connected to the circuit of the battery management system (BMS) with a gate printed circuit board (PCB).
• PCB printed circuit board
• the presently described subject matter is directed to a method of connecting a MOSFET to a printed circuit board (PCB) of a battery management system (BMS), the method comprising: locating a tip of a gate pin of the MOSFET at a raised or elevated position relative to tips of power pins of the MOSFET; installing the MOSFET bridging a pair of spaced apart copper plates located on a printed circuit board (PCB) of the battery management system (BMS) with the tips of the power pins connected to one of the spaced apart copper plates and a metal connector of the MOSFET connected to the other of the spaced apart copper plates; and electrically connecting the raised or elevated tip of the gate pin to a circuit of the battery management system (BMS), wherein a connection of the gate pin with the circuit of the battery management system (BMS) is mechanically stabilized by providing a resilient material between the connection of the gate pin and the surface of the printed circuit board (PCB).
• FIG. 1 is a perspective view of a conventional MOSFET having a standard configuration of the power pins and gate pin. Specifically, the tips of the power pins and gate pin are all located is a same plane and along a same axis in the same plane.
• FIG. 2 is a perspective view of a semiconductor device (e.g. MOSFET) according to the present invention.
• a semiconductor device e.g. MOSFET
• FIG. 3 is a side elevational view of the semiconductor device shown in FIG. 2.
• FIG. 4 is a side elevational view of the semiconductor device shown in FIGS. 2 and 3 installed onto a printed circuit board of a battery management system (BMS) for use in a lithium ion battery.
• BMS battery management system
• FIG. 5 is a side elevational view of the semiconductor device shown in FIG. 4 installed onto a printed circuit board of a battery management system (BMS) for use in a lithium ion battery showing the connector wire protected.
• BMS battery management system
• FIG. 6 is a perspective view of the printed circuit board (PCB) of the battery management system (BMS) showing multiple semiconductor devices shown in FIGS. 2 and 3 installed onto the printed circuit board (PCB) of a battery management system (BMS) for use in a lithium ion battery.
• PCB printed circuit board
• BMS battery management system
• FIG. 7 is a side elevational view of the semiconductor device shown in FIG. 2 installed in an alternative manner onto a printed circuit board of a battery management system (BMS) for use in a lithium ion battery.
• BMS battery management system
• FIGS. 2 and 3 A semiconductor device (e.g. MOSFET 10) according to the present invention is shown in FIGS. 2 and 3.
• the MOSFET 10 comprises a body 12, a metal connector 12A, five (5) power pins 13, and one (1) gate pin 14.
• the power pins 13 and gate pin 14 extend outwardly from the side of the body 12.
• the gate pin 14, for example, is a straight gate pin 14, or a partially bent gate pin 14 ‘ (FIG. 2), and the power pins 14 are fully bent, as shown in FIG. 4).
• the tips of the power pins 13 are located at height H 1 , as shown in FIG. 2.
• the height of the tip of the partially bent gate pin 14’ is at the height H2 (i.e. half height location), and the height of the tip of the straight gate pin 14 is at the height H3 (i.e. full height).
• the tip of the partially bent gate pin 14’ and the tip of the straight gate pin 14 are elevated relative to the tips of the power pins 13 located at height H 1.
• the tip of the partially bent gate pin 14’ and the tip of the straight gate pin 14 are raised or elevated relative to the conductive plate 18 (FIG. 4) to avoid electrically contact therebetween.
• the MOSFET 10 and copper plates 17, 18 are installed onto the printed circuit board (PCB) 16.
• the copper plates 17, 18 are spaced apart, and then soldered onto anchors located on the printed circuit board (PCB) 16 (e.g. copper plates embedded into the surface or thickness or through the printed circuit board (PCB) 16).
• the MOSFET 10 is then soldered onto the spaced apart copper plates 17, 18.
• the metal connector 12A of the MOSFET 10 is soldered (e.g. via soldered layer 20) onto the copper plate 17, and the tips of the power pins 13 of the MOSFET 10 are soldered (e.g. via soldered layer 21) onto the copper plate 18.
• one end of a wire connector 15 is soldered to the gate pin 14, and an opposite end of the wire connector 15 is soldered (e.g. via soldered layer 19) onto a particular trace of the printed circuit board (PCB) 16.
• a material 22 e.g. Room Temperature Vulcanizing (RTV) Silicone
• PCB printed circuit board
• FIGS. 6 and 7 Another arrangement for installing one or more MOFETs 112 onto a printed circuit board (PCB) 116 according to the present invention is shown in FIGS. 6 and 7.
• a plurality of MOFETs 112 e.g. six (6) shown
• the tips of the power pins 113 are soldered onto the respective copper plates 118.
• the tips of the gate pins 114 are soldered onto respective gate printed circuit boards123 connected to the copper plates 118, 118 (e.g. by soldering).
• the gate printed circuit boards 123 are provided with a plurality of soldering tabs or soldering areas 124, which are soldered to the respective tips of the straight gate pins 114.
• the gate printed circuit boards 123 act as insulating spacers located between the copper plates 118, 118 and the tips of the gate pins 124.
• the gate printed circuit boards have a conductive trace or a conductive layer that can be connected (e.g. soldered) to other circuits or components of the printed circuit board 116 (e.g. via wire or conductive lead(s)).
• the gate printed circuit boards 123 occupy the space located between the copper plates 118 and the tips of the gate pins 114 of the MOSFETs 112, and insulate the tips of the gate pins 114 of the MOSFETs 112 from the copper plates 118.

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• 2020
  • 2020-11-25 EP EP20894420.7A patent/EP4066317A4/de active Pending

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