EP3978145A4 - Method for manufacturing piezoelectric film, piezoelectric film, and piezoelectric element - Google Patents

Method for manufacturing piezoelectric film, piezoelectric film, and piezoelectric element Download PDF

Info

Publication number
EP3978145A4
EP3978145A4 EP20814784.3A EP20814784A EP3978145A4 EP 3978145 A4 EP3978145 A4 EP 3978145A4 EP 20814784 A EP20814784 A EP 20814784A EP 3978145 A4 EP3978145 A4 EP 3978145A4
Authority
EP
European Patent Office
Prior art keywords
piezoelectric
piezoelectric film
manufacturing
film
piezoelectric element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20814784.3A
Other languages
German (de)
French (fr)
Other versions
EP3978145A1 (en
Inventor
Toshihiro Doi
Nobuyuki Soyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of EP3978145A1 publication Critical patent/EP3978145A1/en
Publication of EP3978145A4 publication Critical patent/EP3978145A4/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/85Piezoelectric or electrostrictive active materials
    • H10N30/853Ceramic compositions
    • H10N30/8548Lead-based oxides
    • H10N30/8554Lead-zirconium titanate [PZT] based
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/704Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/06Forming electrodes or interconnections, e.g. leads or terminals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/07Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/077Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
    • H10N30/078Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/07Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/079Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/09Forming piezoelectric or electrostrictive materials
    • H10N30/093Forming inorganic materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/09Forming piezoelectric or electrostrictive materials
    • H10N30/093Forming inorganic materials
    • H10N30/097Forming inorganic materials by sintering
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Compositions Of Oxide Ceramics (AREA)
EP20814784.3A 2019-05-31 2020-05-28 Method for manufacturing piezoelectric film, piezoelectric film, and piezoelectric element Pending EP3978145A4 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019102536 2019-05-31
JP2019102452 2019-05-31
JP2020059572 2020-03-30
PCT/JP2020/021091 WO2020241743A1 (en) 2019-05-31 2020-05-28 Method for manufacturing piezoelectric film, piezoelectric film, and piezoelectric element

Publications (2)

Publication Number Publication Date
EP3978145A1 EP3978145A1 (en) 2022-04-06
EP3978145A4 true EP3978145A4 (en) 2023-09-06

Family

ID=73552580

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20814784.3A Pending EP3978145A4 (en) 2019-05-31 2020-05-28 Method for manufacturing piezoelectric film, piezoelectric film, and piezoelectric element

Country Status (6)

Country Link
US (1) US20220158073A1 (en)
EP (1) EP3978145A4 (en)
JP (1) JP7168079B2 (en)
CN (1) CN113711372A (en)
TW (1) TW202112670A (en)
WO (1) WO2020241743A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133604A (en) * 2001-10-26 2003-05-09 Seiko Epson Corp Piezo-electric thin film element and manufacturing method thereof as well as ink jet recording head and ink jet printer employing the element
US20060175643A1 (en) * 2005-02-04 2006-08-10 Fujitsu Limited Ferroelectric element and method of manufacturing ferroelectric element
EP3125317A1 (en) * 2014-03-27 2017-02-01 Mitsubishi Materials Corporation Mn-doped pzt-based piezoelectric film formation composition and mn-doped pzt-based piezoelectric film

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3890634B2 (en) * 1995-09-19 2007-03-07 セイコーエプソン株式会社 Piezoelectric thin film element and ink jet recording head
JP2001048645A (en) 1999-08-06 2001-02-20 Sharp Corp Ferroelectric thin film and its production
JP4918673B2 (en) * 2002-12-19 2012-04-18 独立行政法人産業技術総合研究所 Piezoelectric conversion sheet
JP4521751B2 (en) * 2003-03-26 2010-08-11 国立大学法人東京工業大学 Lead zirconate titanate-based film, dielectric element, and method for manufacturing dielectric film
CN103198923A (en) * 2012-01-05 2013-07-10 三菱综合材料株式会社 Manufacturing method of thin-film capacitor and thin-film capacitor obtained through manufacturing method
JP2014154741A (en) 2013-02-12 2014-08-25 Ricoh Co Ltd Method of manufacturing electromechanical conversion film, electromechanical conversion element, liquid discharge head, and ink-jet recording device
JP2015065430A (en) * 2013-08-27 2015-04-09 三菱マテリアル株式会社 PNbZT THIN FILM MANUFACTURING METHOD
US9136460B2 (en) 2014-01-29 2015-09-15 Canon Kabushiki Kaisha Piezoelectric element, method for manufacturing piezoelectric element, and electronic apparatus
JP2016134404A (en) 2015-01-15 2016-07-25 セイコーエプソン株式会社 Vibration power generation element and vibration power generation device using the same
EP3343654B1 (en) * 2015-08-28 2020-04-15 Japan Advanced Institute of Science and Technology Method for forming pzt ferroelectric film
JP6690253B2 (en) * 2016-01-22 2020-04-28 株式会社リコー PZT precursor solution and its manufacturing method, PZT film manufacturing method, electromechanical transducer manufacturing method, liquid ejection head manufacturing method
JP6787192B2 (en) 2017-03-08 2020-11-18 三菱マテリアル株式会社 Piezoelectric membrane
JP6958300B2 (en) 2017-11-29 2021-11-02 Tdk株式会社 Multilayer circuit board
US10923244B2 (en) 2017-11-30 2021-02-16 Elbit Systems Of America, Llc Phosphor screen for MEMS image intensifiers
JP6498821B1 (en) 2018-06-13 2019-04-10 アドバンストマテリアルテクノロジーズ株式会社 Membrane structure and manufacturing method thereof
JP7212492B2 (en) 2018-10-09 2023-01-25 サトーホールディングス株式会社 Warehousing/dispatching work support program, warehousing/dispatching work support method, and warehousing/dispatching work support system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133604A (en) * 2001-10-26 2003-05-09 Seiko Epson Corp Piezo-electric thin film element and manufacturing method thereof as well as ink jet recording head and ink jet printer employing the element
US20060175643A1 (en) * 2005-02-04 2006-08-10 Fujitsu Limited Ferroelectric element and method of manufacturing ferroelectric element
EP3125317A1 (en) * 2014-03-27 2017-02-01 Mitsubishi Materials Corporation Mn-doped pzt-based piezoelectric film formation composition and mn-doped pzt-based piezoelectric film

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2020241743A1 *

Also Published As

Publication number Publication date
JP7168079B2 (en) 2022-11-09
JPWO2020241743A1 (en) 2020-12-03
US20220158073A1 (en) 2022-05-19
CN113711372A (en) 2021-11-26
TW202112670A (en) 2021-04-01
WO2020241743A1 (en) 2020-12-03
EP3978145A1 (en) 2022-04-06

Similar Documents

Publication Publication Date Title
EP3364471A4 (en) Multilayer substrate with piezoelectric thin film, piezoelectric thin film element and method for manufacturing same
EP4047671A4 (en) Piezoelectric film and method for manufacturing piezoelectric film
EP3637486A4 (en) Layered substrate having piezoelectric film, element having piezoelectric film and production method for layered substrate having piezoelectric film
EP3901097A4 (en) Piezoelectric laminate, piezoelectric element, and piezoelectric laminate manufacturing method
EP4019918A4 (en) Element and method for manufacturing element
EP3869557A4 (en) Light-emitting element and method for manufacturing same
EP3859802A4 (en) Piezoelectric device, and piezoelectric device manufacturing method
EP3507645A4 (en) Piezoelectric actuator, deformable mirror and method for manufacturing deformable mirror
EP3907293A4 (en) Biochip and manufacturing method and application thereof
EP3748701A4 (en) Light-emitting element and method for manufacturing same
EP3848926A4 (en) Sound-blocking sheet member, sound-blocking structure using same, and method for manufacturing sound-blocking sheet member
EP3992698A4 (en) Method for manufacturing polarizing lens, polarizing film, and polarizing lens
EP3859971A4 (en) Composite substrate, piezoelectric element, and method for manufacturing composite substrate
EP3928980A4 (en) Laminated film and method for manufacturing same
EP3950627A4 (en) Method for manufacturing laminate, and laminate
EP3859801A4 (en) Piezoelectric device and piezoelectric device manufacturing method
EP3699968A4 (en) Piezoelectric element for speaker and manufacturing method therefor
EP4082961A4 (en) Piezoelectric element, piezoelectric device and manufacturing method of piezoelectric element
EP4006002A4 (en) Bonded substrate, and method for manufacturing bonded substrate
EP4006995A4 (en) Light-emitting element, and method for manufacturing light-emitting element
EP4040126A4 (en) Electroconductive film, method for manufacturing same, temperature sensor film, and method for manufacturing same
EP3992696A4 (en) Method for manufacturing polarizing lens, polarizing film, and polarizing lens
EP3972000A4 (en) Piezoelectric film and piezoelectric element
EP3904949A4 (en) Optical member manufacturing method, and optical member
EP3654528A4 (en) Laminated substrate provided with piezoelectric film, element provided with piezoelectric film, and method for producing laminated substrate provided with piezoelectric film

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20210927

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Free format text: PREVIOUS MAIN CLASS: B05D0001380000

Ipc: H10N0030010000

A4 Supplementary search report drawn up and despatched

Effective date: 20230803

RIC1 Information provided on ipc code assigned before grant

Ipc: H10N 30/853 20230101ALI20230728BHEP

Ipc: H10N 30/85 20230101ALI20230728BHEP

Ipc: H10N 30/80 20230101ALI20230728BHEP

Ipc: H10N 30/093 20230101ALI20230728BHEP

Ipc: H10N 30/01 20230101AFI20230728BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN