EP3978145A4 - Method for manufacturing piezoelectric film, piezoelectric film, and piezoelectric element - Google Patents
Method for manufacturing piezoelectric film, piezoelectric film, and piezoelectric element Download PDFInfo
- Publication number
- EP3978145A4 EP3978145A4 EP20814784.3A EP20814784A EP3978145A4 EP 3978145 A4 EP3978145 A4 EP 3978145A4 EP 20814784 A EP20814784 A EP 20814784A EP 3978145 A4 EP3978145 A4 EP 3978145A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- piezoelectric
- piezoelectric film
- manufacturing
- film
- piezoelectric element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8548—Lead-based oxides
- H10N30/8554—Lead-zirconium titanate [PZT] based
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/077—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
- H10N30/078—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/079—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/093—Forming inorganic materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/093—Forming inorganic materials
- H10N30/097—Forming inorganic materials by sintering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Dispersion Chemistry (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Compositions Of Oxide Ceramics (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019102536 | 2019-05-31 | ||
JP2019102452 | 2019-05-31 | ||
JP2020059572 | 2020-03-30 | ||
PCT/JP2020/021091 WO2020241743A1 (en) | 2019-05-31 | 2020-05-28 | Method for manufacturing piezoelectric film, piezoelectric film, and piezoelectric element |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3978145A1 EP3978145A1 (en) | 2022-04-06 |
EP3978145A4 true EP3978145A4 (en) | 2023-09-06 |
Family
ID=73552580
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP20814784.3A Pending EP3978145A4 (en) | 2019-05-31 | 2020-05-28 | Method for manufacturing piezoelectric film, piezoelectric film, and piezoelectric element |
Country Status (6)
Country | Link |
---|---|
US (1) | US20220158073A1 (en) |
EP (1) | EP3978145A4 (en) |
JP (1) | JP7168079B2 (en) |
CN (1) | CN113711372A (en) |
TW (1) | TW202112670A (en) |
WO (1) | WO2020241743A1 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003133604A (en) * | 2001-10-26 | 2003-05-09 | Seiko Epson Corp | Piezo-electric thin film element and manufacturing method thereof as well as ink jet recording head and ink jet printer employing the element |
US20060175643A1 (en) * | 2005-02-04 | 2006-08-10 | Fujitsu Limited | Ferroelectric element and method of manufacturing ferroelectric element |
EP3125317A1 (en) * | 2014-03-27 | 2017-02-01 | Mitsubishi Materials Corporation | Mn-doped pzt-based piezoelectric film formation composition and mn-doped pzt-based piezoelectric film |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3890634B2 (en) * | 1995-09-19 | 2007-03-07 | セイコーエプソン株式会社 | Piezoelectric thin film element and ink jet recording head |
JP2001048645A (en) | 1999-08-06 | 2001-02-20 | Sharp Corp | Ferroelectric thin film and its production |
JP4918673B2 (en) * | 2002-12-19 | 2012-04-18 | 独立行政法人産業技術総合研究所 | Piezoelectric conversion sheet |
JP4521751B2 (en) * | 2003-03-26 | 2010-08-11 | 国立大学法人東京工業大学 | Lead zirconate titanate-based film, dielectric element, and method for manufacturing dielectric film |
CN103198923A (en) * | 2012-01-05 | 2013-07-10 | 三菱综合材料株式会社 | Manufacturing method of thin-film capacitor and thin-film capacitor obtained through manufacturing method |
JP2014154741A (en) | 2013-02-12 | 2014-08-25 | Ricoh Co Ltd | Method of manufacturing electromechanical conversion film, electromechanical conversion element, liquid discharge head, and ink-jet recording device |
JP2015065430A (en) * | 2013-08-27 | 2015-04-09 | 三菱マテリアル株式会社 | PNbZT THIN FILM MANUFACTURING METHOD |
US9136460B2 (en) | 2014-01-29 | 2015-09-15 | Canon Kabushiki Kaisha | Piezoelectric element, method for manufacturing piezoelectric element, and electronic apparatus |
JP2016134404A (en) | 2015-01-15 | 2016-07-25 | セイコーエプソン株式会社 | Vibration power generation element and vibration power generation device using the same |
EP3343654B1 (en) * | 2015-08-28 | 2020-04-15 | Japan Advanced Institute of Science and Technology | Method for forming pzt ferroelectric film |
JP6690253B2 (en) * | 2016-01-22 | 2020-04-28 | 株式会社リコー | PZT precursor solution and its manufacturing method, PZT film manufacturing method, electromechanical transducer manufacturing method, liquid ejection head manufacturing method |
JP6787192B2 (en) | 2017-03-08 | 2020-11-18 | 三菱マテリアル株式会社 | Piezoelectric membrane |
JP6958300B2 (en) | 2017-11-29 | 2021-11-02 | Tdk株式会社 | Multilayer circuit board |
US10923244B2 (en) | 2017-11-30 | 2021-02-16 | Elbit Systems Of America, Llc | Phosphor screen for MEMS image intensifiers |
JP6498821B1 (en) | 2018-06-13 | 2019-04-10 | アドバンストマテリアルテクノロジーズ株式会社 | Membrane structure and manufacturing method thereof |
JP7212492B2 (en) | 2018-10-09 | 2023-01-25 | サトーホールディングス株式会社 | Warehousing/dispatching work support program, warehousing/dispatching work support method, and warehousing/dispatching work support system |
-
2020
- 2020-05-27 TW TW109117663A patent/TW202112670A/en unknown
- 2020-05-28 WO PCT/JP2020/021091 patent/WO2020241743A1/en unknown
- 2020-05-28 EP EP20814784.3A patent/EP3978145A4/en active Pending
- 2020-05-28 CN CN202080027670.6A patent/CN113711372A/en active Pending
- 2020-05-28 US US17/440,426 patent/US20220158073A1/en active Pending
- 2020-05-28 JP JP2021522852A patent/JP7168079B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003133604A (en) * | 2001-10-26 | 2003-05-09 | Seiko Epson Corp | Piezo-electric thin film element and manufacturing method thereof as well as ink jet recording head and ink jet printer employing the element |
US20060175643A1 (en) * | 2005-02-04 | 2006-08-10 | Fujitsu Limited | Ferroelectric element and method of manufacturing ferroelectric element |
EP3125317A1 (en) * | 2014-03-27 | 2017-02-01 | Mitsubishi Materials Corporation | Mn-doped pzt-based piezoelectric film formation composition and mn-doped pzt-based piezoelectric film |
Non-Patent Citations (1)
Title |
---|
See also references of WO2020241743A1 * |
Also Published As
Publication number | Publication date |
---|---|
JP7168079B2 (en) | 2022-11-09 |
JPWO2020241743A1 (en) | 2020-12-03 |
US20220158073A1 (en) | 2022-05-19 |
CN113711372A (en) | 2021-11-26 |
TW202112670A (en) | 2021-04-01 |
WO2020241743A1 (en) | 2020-12-03 |
EP3978145A1 (en) | 2022-04-06 |
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