EP3887093A4 - Polishing pads and systems and methods of making and using the same - Google Patents
Polishing pads and systems and methods of making and using the same Download PDFInfo
- Publication number
- EP3887093A4 EP3887093A4 EP19890633.1A EP19890633A EP3887093A4 EP 3887093 A4 EP3887093 A4 EP 3887093A4 EP 19890633 A EP19890633 A EP 19890633A EP 3887093 A4 EP3887093 A4 EP 3887093A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- systems
- making
- methods
- same
- polishing pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862771738P | 2018-11-27 | 2018-11-27 | |
PCT/IB2019/060064 WO2020109947A1 (en) | 2018-11-27 | 2019-11-22 | Polishing pads and systems and methods of making and using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3887093A1 EP3887093A1 (en) | 2021-10-06 |
EP3887093A4 true EP3887093A4 (en) | 2022-08-17 |
Family
ID=70852829
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19890633.1A Pending EP3887093A4 (en) | 2018-11-27 | 2019-11-22 | Polishing pads and systems and methods of making and using the same |
Country Status (6)
Country | Link |
---|---|
US (1) | US20220023991A1 (en) |
EP (1) | EP3887093A4 (en) |
JP (1) | JP2022511763A (en) |
KR (1) | KR20210094024A (en) |
TW (1) | TW202033310A (en) |
WO (1) | WO2020109947A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11911870B2 (en) | 2021-09-10 | 2024-02-27 | Applied Materials, Inc. | Polishing pads for high temperature processing |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050197050A1 (en) * | 2003-06-17 | 2005-09-08 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
WO2015127077A1 (en) * | 2014-02-20 | 2015-08-27 | Thomas West, Inc. | Method and systems to control optical transmissivity of a polish pad material |
US20150298286A1 (en) * | 2012-12-06 | 2015-10-22 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
US20150325451A1 (en) * | 2014-05-07 | 2015-11-12 | Cabot Microelectronics Corporation | Multi-layer polishing pad for cmp |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2701191A (en) * | 1949-02-02 | 1955-02-01 | American Optical Corp | Polishing pads |
TW421620B (en) * | 1997-12-03 | 2001-02-11 | Siemens Ag | Device and method to control an end-point during polish of components (especially semiconductor components) |
US6908366B2 (en) * | 2003-01-10 | 2005-06-21 | 3M Innovative Properties Company | Method of using a soft subpad for chemical mechanical polishing |
CN100352605C (en) * | 2003-07-17 | 2007-12-05 | Jsr株式会社 | Chemical mechanical polishing pad and chemical mechanical polishing method |
US7204742B2 (en) * | 2004-03-25 | 2007-04-17 | Cabot Microelectronics Corporation | Polishing pad comprising hydrophobic region and endpoint detection port |
TWI385050B (en) * | 2005-02-18 | 2013-02-11 | Nexplanar Corp | Customized polishing pads for cmp and methods of fabrication and use thereof |
JP2006245445A (en) * | 2005-03-07 | 2006-09-14 | Nihon Micro Coating Co Ltd | Abrasive pad |
US20060286906A1 (en) * | 2005-06-21 | 2006-12-21 | Cabot Microelectronics Corporation | Polishing pad comprising magnetically sensitive particles and method for the use thereof |
US8062096B2 (en) * | 2005-06-30 | 2011-11-22 | Cabot Microelectronics Corporation | Use of CMP for aluminum mirror and solar cell fabrication |
US7520797B2 (en) * | 2005-09-06 | 2009-04-21 | Freescale Semiconductor, Inc. | Platen endpoint window with pressure relief |
US8129278B2 (en) * | 2005-11-14 | 2012-03-06 | United Microelectronics Corp. | Chemical mechanical polishing process |
CN101678527B (en) * | 2007-03-20 | 2011-08-03 | 可乐丽股份有限公司 | Cushion for polishing pad and polishing pad using the cushion |
TWI411495B (en) * | 2007-08-16 | 2013-10-11 | Cabot Microelectronics Corp | Polishing pad |
WO2009126171A1 (en) * | 2008-04-11 | 2009-10-15 | Innopad, Inc. | Chemical mechanical planarization pad with void network |
TWM367052U (en) * | 2009-04-24 | 2009-10-21 | Bestac Advanced Material Co Ltd | Polishing pad and polishing device |
PT2961570T (en) * | 2013-02-26 | 2020-03-26 | Mirka Ltd | A method to provide an abrasive product surface and abrasive products thereof |
US9108290B2 (en) * | 2013-03-07 | 2015-08-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Multilayer chemical mechanical polishing pad |
JP6425973B2 (en) * | 2014-10-31 | 2018-11-21 | 日東電工株式会社 | Resin foam and foam member |
US10593574B2 (en) * | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
WO2017164842A1 (en) * | 2016-03-22 | 2017-09-28 | Intel Corporation | Improved optical metrology for chemical mechanical polish |
JP2018029142A (en) * | 2016-08-18 | 2018-02-22 | 株式会社クラレ | Polishing pad and polishing method using the same |
KR101889081B1 (en) * | 2017-03-16 | 2018-08-16 | 에스케이씨 주식회사 | Polishing pad and preparation method thereof |
JP6923342B2 (en) * | 2017-04-11 | 2021-08-18 | 株式会社荏原製作所 | Polishing equipment and polishing method |
-
2019
- 2019-11-22 KR KR1020217019427A patent/KR20210094024A/en not_active Application Discontinuation
- 2019-11-22 WO PCT/IB2019/060064 patent/WO2020109947A1/en active Search and Examination
- 2019-11-22 EP EP19890633.1A patent/EP3887093A4/en active Pending
- 2019-11-22 US US17/297,221 patent/US20220023991A1/en active Pending
- 2019-11-22 JP JP2021529686A patent/JP2022511763A/en active Pending
- 2019-11-26 TW TW108142872A patent/TW202033310A/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050197050A1 (en) * | 2003-06-17 | 2005-09-08 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
US20150298286A1 (en) * | 2012-12-06 | 2015-10-22 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
WO2015127077A1 (en) * | 2014-02-20 | 2015-08-27 | Thomas West, Inc. | Method and systems to control optical transmissivity of a polish pad material |
US20150325451A1 (en) * | 2014-05-07 | 2015-11-12 | Cabot Microelectronics Corporation | Multi-layer polishing pad for cmp |
Non-Patent Citations (1)
Title |
---|
See also references of WO2020109947A1 * |
Also Published As
Publication number | Publication date |
---|---|
TW202033310A (en) | 2020-09-16 |
KR20210094024A (en) | 2021-07-28 |
JP2022511763A (en) | 2022-02-01 |
US20220023991A1 (en) | 2022-01-27 |
WO2020109947A1 (en) | 2020-06-04 |
EP3887093A1 (en) | 2021-10-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
17P | Request for examination filed |
Effective date: 20210526 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
DAV | Request for validation of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20220718 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: B24B 37/24 20120101ALI20220712BHEP Ipc: B24B 29/00 20060101ALI20220712BHEP Ipc: B24B 1/00 20060101ALI20220712BHEP Ipc: B24B 37/22 20120101ALI20220712BHEP Ipc: B24B 37/04 20120101ALI20220712BHEP Ipc: B24B 37/00 20120101AFI20220712BHEP |