EP3881658A4 - COOLING PLATFORM WITH LIQUID IMMERSION - Google Patents

COOLING PLATFORM WITH LIQUID IMMERSION Download PDF

Info

Publication number
EP3881658A4
EP3881658A4 EP19883541.5A EP19883541A EP3881658A4 EP 3881658 A4 EP3881658 A4 EP 3881658A4 EP 19883541 A EP19883541 A EP 19883541A EP 3881658 A4 EP3881658 A4 EP 3881658A4
Authority
EP
European Patent Office
Prior art keywords
liquid immersion
immersion cooling
cooling platform
platform
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19883541.5A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP3881658A1 (en
Inventor
John David Enright
Jacob Mertel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Modine LLC
Original Assignee
TMGcore Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/283,181 external-priority patent/US10477726B1/en
Priority claimed from US16/576,363 external-priority patent/US10969842B2/en
Priority claimed from US16/576,405 external-priority patent/US10653043B2/en
Priority claimed from US16/576,309 external-priority patent/US10694643B2/en
Priority claimed from US16/576,191 external-priority patent/US11129298B2/en
Priority claimed from US16/576,239 external-priority patent/US10624237B2/en
Priority claimed from US16/576,285 external-priority patent/US10617032B1/en
Priority claimed from PCT/US2019/051924 external-priority patent/WO2020061305A1/en
Application filed by TMGcore Inc filed Critical TMGcore Inc
Publication of EP3881658A1 publication Critical patent/EP3881658A1/en
Publication of EP3881658A4 publication Critical patent/EP3881658A4/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/206Cooling means comprising thermal management
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20381Thermal management, e.g. evaporation control
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208Liquid cooling with phase change
    • H05K7/20818Liquid cooling with phase change within cabinets for removing heat from server blades
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP19883541.5A 2018-11-16 2019-11-11 COOLING PLATFORM WITH LIQUID IMMERSION Pending EP3881658A4 (en)

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
US201862768633P 2018-11-16 2018-11-16
US16/283,181 US10477726B1 (en) 2018-09-19 2019-02-22 Liquid immersion cooling platform
US201962815682P 2019-03-08 2019-03-08
US201962875222P 2019-07-17 2019-07-17
US201962897457P 2019-09-09 2019-09-09
US16/576,363 US10969842B2 (en) 2018-09-19 2019-09-19 Chassis for a liquid immersion cooling system
US16/576,405 US10653043B2 (en) 2018-09-19 2019-09-19 Vapor management system for a liquid immersion cooling system
US16/576,309 US10694643B2 (en) 2018-09-19 2019-09-19 Ballast blocks for a liquid immersion cooling system
US16/576,191 US11129298B2 (en) 2018-09-19 2019-09-19 Process for liquid immersion cooling
US16/576,239 US10624237B2 (en) 2018-09-19 2019-09-19 Liquid immersion cooling vessel and components thereof
US16/576,285 US10617032B1 (en) 2018-09-19 2019-09-19 Robot for a liquid immersion cooling system
PCT/US2019/051924 WO2020061305A1 (en) 2018-09-19 2019-09-19 Liquid immersion cooling platform
PCT/US2019/060759 WO2020102090A1 (en) 2018-11-16 2019-11-11 Liquid immersion cooling platform

Publications (2)

Publication Number Publication Date
EP3881658A1 EP3881658A1 (en) 2021-09-22
EP3881658A4 true EP3881658A4 (en) 2022-09-14

Family

ID=70732132

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19883541.5A Pending EP3881658A4 (en) 2018-11-16 2019-11-11 COOLING PLATFORM WITH LIQUID IMMERSION

Country Status (8)

Country Link
EP (1) EP3881658A4 (zh)
JP (1) JP2022504024A (zh)
KR (1) KR20210119384A (zh)
CN (1) CN113647204A (zh)
AU (1) AU2019378713A1 (zh)
CA (2) CA3113668A1 (zh)
MX (1) MX2021003176A (zh)
WO (1) WO2020102090A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11357131B1 (en) * 2021-08-03 2022-06-07 Tmgcore, Inc. Fluid breakdown detection systems and processes useful for liquid immersion cooling
MX2022005713A (es) 2019-11-11 2022-08-16 Tmgcore Llc Sistema robótico externo para plataforma de enfriamiento por inmersión en líquido.
CN111921468A (zh) * 2020-08-05 2020-11-13 重庆大学 一种新材料合成智能均相反应釜***及控制方法
WO2022204177A1 (en) * 2021-03-22 2022-09-29 TMGCore, LLC Processes and systems for monitoring filter materials
US11924998B2 (en) 2021-04-01 2024-03-05 Ovh Hybrid immersion cooling system for rack-mounted electronic assemblies
US11729950B2 (en) 2021-04-01 2023-08-15 Ovh Immersion cooling system with dual dielectric cooling liquid circulation
EP4068048A1 (en) * 2021-04-01 2022-10-05 Ovh Systems and methods for autonomously activable redundant cooling of a heat generating component
TW202303067A (zh) * 2021-06-10 2023-01-16 美商Tmg科爾有限責任公司 液體浸入式冷卻平台及其部件
US12010820B2 (en) 2021-09-15 2024-06-11 Modine LLC Liquid immersion cooling platform and components thereof
TWI803982B (zh) * 2021-09-17 2023-06-01 英業達股份有限公司 冷卻系統及其操作方法
WO2024089552A1 (en) * 2022-10-25 2024-05-02 3M Innovative Properties Company Fiber optic feedthrough for immersion cooling with condensate prevention

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140218859A1 (en) * 2013-02-01 2014-08-07 Dell Products L.P. System for Cooling Hard Disk Drives Using Vapor Momentum Driven By Boiling of Dielectric Liquid
WO2018163180A1 (en) * 2017-03-09 2018-09-13 Zuta-Core Ltd. Systems and methods for thermal regulation

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US3952182A (en) * 1974-01-25 1976-04-20 Flanders Robert D Instantaneous electric fluid heater
US7128142B2 (en) * 2004-08-24 2006-10-31 Halliburton Energy Services, Inc. Apparatus and methods for improved fluid displacement in subterranean formations
WO2006075493A1 (ja) * 2004-12-22 2006-07-20 Tokyo University Of Science Educational Foundation Administrative Organization 沸騰冷却方法、沸騰冷却装置および流路構造体並びにその応用
US7403392B2 (en) * 2006-05-16 2008-07-22 Hardcore Computer, Inc. Liquid submersion cooling system
DE112008003714T5 (de) * 2008-10-29 2010-11-25 Advantest Corp. Temperatursteuerung für elektronische Bauelemente
NL2005207A (en) * 2009-09-28 2011-03-29 Asml Netherlands Bv Heat pipe, lithographic apparatus and device manufacturing method.
US8184436B2 (en) * 2010-06-29 2012-05-22 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems
JP5996648B2 (ja) * 2011-08-05 2016-09-21 グリーン・レヴォリューション・クーリング・インコーポレイテッド ハードドライブ冷却用浸液冷却システム
US9351429B2 (en) * 2013-02-01 2016-05-24 Dell Products, L.P. Scalable, multi-vessel distribution system for liquid level control within immersion cooling tanks
US9921622B2 (en) * 2013-02-01 2018-03-20 Dell Products, L.P. Stand alone immersion tank data center with contained cooling
AU2014262796A1 (en) * 2013-05-06 2015-12-24 Green Revolution Cooling, Inc. System and method of packaging computing resources for space and fire-resistance
DE102014102720B4 (de) * 2014-02-28 2017-03-23 Ushio Denki Kabushiki Kaisha Anordnung zum Kühlen einer plasmabasierten Strahlungsquelle mit einer metallischen Kühlflüssigkeit und Verfahren zur Inbetriebnahme einer solchen Kühlanordnung
CN105762437B (zh) * 2014-12-17 2019-04-02 北京长城华冠汽车科技股份有限公司 浸液式电池箱温度控制***
GB2542844B (en) * 2015-10-01 2021-06-16 Iceotope Group Ltd An immersion cooling system
US10405459B2 (en) 2016-08-04 2019-09-03 Hamilton Sundstrand Corporation Actuated immersion cooled electronic assemblies
JP2017050548A (ja) * 2016-10-13 2017-03-09 株式会社ExaScaler 電子機器の冷却システム
US10605477B2 (en) * 2017-01-20 2020-03-31 Johnson Controls Technology Company HVAC system with free cooling optimization based on coolant flowrate
CN107564593B (zh) * 2017-08-09 2019-06-18 华北电力大学 一种压力容器外部冷却试验***和方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140218859A1 (en) * 2013-02-01 2014-08-07 Dell Products L.P. System for Cooling Hard Disk Drives Using Vapor Momentum Driven By Boiling of Dielectric Liquid
WO2018163180A1 (en) * 2017-03-09 2018-09-13 Zuta-Core Ltd. Systems and methods for thermal regulation

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2020102090A1 *

Also Published As

Publication number Publication date
CN113647204A (zh) 2021-11-12
AU2019378713A1 (en) 2021-06-03
CA3128868A1 (en) 2020-05-22
EP3881658A1 (en) 2021-09-22
KR20210119384A (ko) 2021-10-05
WO2020102090A1 (en) 2020-05-22
CA3113668A1 (en) 2020-05-22
MX2021003176A (es) 2021-08-11
JP2022504024A (ja) 2022-01-13

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Owner name: TMGCORE, INC.

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Owner name: MODINE LLC