EP3881658A4 - Plate-forme de refroidissement par immersion dans un liquide - Google Patents

Plate-forme de refroidissement par immersion dans un liquide Download PDF

Info

Publication number
EP3881658A4
EP3881658A4 EP19883541.5A EP19883541A EP3881658A4 EP 3881658 A4 EP3881658 A4 EP 3881658A4 EP 19883541 A EP19883541 A EP 19883541A EP 3881658 A4 EP3881658 A4 EP 3881658A4
Authority
EP
European Patent Office
Prior art keywords
liquid immersion
immersion cooling
cooling platform
platform
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19883541.5A
Other languages
German (de)
English (en)
Other versions
EP3881658A1 (fr
Inventor
John David Enright
Jacob Mertel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Modine LLC
Original Assignee
TMGcore Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/283,181 external-priority patent/US10477726B1/en
Priority claimed from US16/576,191 external-priority patent/US11129298B2/en
Priority claimed from US16/576,239 external-priority patent/US10624237B2/en
Priority claimed from US16/576,309 external-priority patent/US10694643B2/en
Priority claimed from US16/576,285 external-priority patent/US10617032B1/en
Priority claimed from PCT/US2019/051924 external-priority patent/WO2020061305A1/fr
Priority claimed from US16/576,405 external-priority patent/US10653043B2/en
Priority claimed from US16/576,363 external-priority patent/US10969842B2/en
Application filed by TMGcore Inc filed Critical TMGcore Inc
Publication of EP3881658A1 publication Critical patent/EP3881658A1/fr
Publication of EP3881658A4 publication Critical patent/EP3881658A4/fr
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20381—Thermal management, e.g. evaporation control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP19883541.5A 2018-11-16 2019-11-11 Plate-forme de refroidissement par immersion dans un liquide Pending EP3881658A4 (fr)

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
US201862768633P 2018-11-16 2018-11-16
US16/283,181 US10477726B1 (en) 2018-09-19 2019-02-22 Liquid immersion cooling platform
US201962815682P 2019-03-08 2019-03-08
US201962875222P 2019-07-17 2019-07-17
US201962897457P 2019-09-09 2019-09-09
US16/576,191 US11129298B2 (en) 2018-09-19 2019-09-19 Process for liquid immersion cooling
US16/576,239 US10624237B2 (en) 2018-09-19 2019-09-19 Liquid immersion cooling vessel and components thereof
US16/576,309 US10694643B2 (en) 2018-09-19 2019-09-19 Ballast blocks for a liquid immersion cooling system
US16/576,285 US10617032B1 (en) 2018-09-19 2019-09-19 Robot for a liquid immersion cooling system
PCT/US2019/051924 WO2020061305A1 (fr) 2018-09-19 2019-09-19 Plate-forme de refroidissement par immersion dans un liquide
US16/576,405 US10653043B2 (en) 2018-09-19 2019-09-19 Vapor management system for a liquid immersion cooling system
US16/576,363 US10969842B2 (en) 2018-09-19 2019-09-19 Chassis for a liquid immersion cooling system
PCT/US2019/060759 WO2020102090A1 (fr) 2018-11-16 2019-11-11 Plate-forme de refroidissement par immersion dans un liquide

Publications (2)

Publication Number Publication Date
EP3881658A1 EP3881658A1 (fr) 2021-09-22
EP3881658A4 true EP3881658A4 (fr) 2022-09-14

Family

ID=70732132

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19883541.5A Pending EP3881658A4 (fr) 2018-11-16 2019-11-11 Plate-forme de refroidissement par immersion dans un liquide

Country Status (8)

Country Link
EP (1) EP3881658A4 (fr)
JP (1) JP2022504024A (fr)
KR (1) KR20210119384A (fr)
CN (1) CN113647204A (fr)
AU (1) AU2019378713A1 (fr)
CA (2) CA3128868A1 (fr)
MX (1) MX2021003176A (fr)
WO (1) WO2020102090A1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11357131B1 (en) * 2021-08-03 2022-06-07 Tmgcore, Inc. Fluid breakdown detection systems and processes useful for liquid immersion cooling
JP2022554400A (ja) 2019-11-11 2022-12-28 ティーエムジーコア，インコーポレイテッド 液浸冷却プラットフォームのための外部ロボットシステム
CN111921468A (zh) * 2020-08-05 2020-11-13 重庆大学 一种新材料合成智能均相反应釜***及控制方法
US12035508B2 (en) 2020-12-29 2024-07-09 Modine LLC Liquid immersion cooling platform and components thereof
KR20230174228A (ko) * 2021-03-22 2023-12-27 티엠지코어, 인크. 필터 재료를 모니터링하기 위한 프로세스 및 시스템
US11729950B2 (en) 2021-04-01 2023-08-15 Ovh Immersion cooling system with dual dielectric cooling liquid circulation
CA3153037A1 (fr) 2021-04-01 2022-10-01 Ovh Systeme hybride de refroidissement par immersion pour les ensembles electroniques montes sur bati
EP4068921B1 (fr) * 2021-04-01 2024-07-17 Ovh Systèmes de refroidissement par immersion pour composants électroniques
WO2022261470A1 (fr) * 2021-06-10 2022-12-15 TMGCore, INC Plateforme de refroidissement par immersion dans un liquide et ses composants
US12010820B2 (en) 2021-09-15 2024-06-11 Modine LLC Liquid immersion cooling platform and components thereof
TWI803982B (zh) * 2021-09-17 2023-06-01 英業達股份有限公司 冷卻系統及其操作方法
WO2024089552A1 (fr) * 2022-10-25 2024-05-02 3M Innovative Properties Company Traversée de fibre optique pour refroidissement par immersion avec prévention de condensat

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140218859A1 (en) * 2013-02-01 2014-08-07 Dell Products L.P. System for Cooling Hard Disk Drives Using Vapor Momentum Driven By Boiling of Dielectric Liquid
WO2018163180A1 (fr) * 2017-03-09 2018-09-13 Zuta-Core Ltd. Systèmes et procédés de régulation thermique

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US3952182A (en) * 1974-01-25 1976-04-20 Flanders Robert D Instantaneous electric fluid heater
JPH05190715A (ja) * 1992-01-17 1993-07-30 Toshiba Corp 沸騰冷却装置
JP2569284B2 (ja) * 1994-09-19 1997-01-08 株式会社日立製作所 半導体冷却装置
US7128142B2 (en) * 2004-08-24 2006-10-31 Halliburton Energy Services, Inc. Apparatus and methods for improved fluid displacement in subterranean formations
WO2006075493A1 (fr) * 2004-12-22 2006-07-20 Tokyo University Of Science Educational Foundation Administrative Organization Procede et appareil de refroidissement de vapeur, structure de passage d'ecoulement et application associee
US7403392B2 (en) * 2006-05-16 2008-07-22 Hardcore Computer, Inc. Liquid submersion cooling system
JP2008244182A (ja) * 2007-03-28 2008-10-09 Kaneka Corp 高輝度発光の有機ｅｌ発光装置
DE112008003714T5 (de) * 2008-10-29 2010-11-25 Advantest Corp. Temperatursteuerung für elektronische Bauelemente
NL2005207A (en) * 2009-09-28 2011-03-29 Asml Netherlands Bv Heat pipe, lithographic apparatus and device manufacturing method.
US8184436B2 (en) * 2010-06-29 2012-05-22 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems
JP5996648B2 (ja) * 2011-08-05 2016-09-21 グリーン・レヴォリューション・クーリング・インコーポレイテッド ハードドライブ冷却用浸液冷却システム
US9921622B2 (en) * 2013-02-01 2018-03-20 Dell Products, L.P. Stand alone immersion tank data center with contained cooling
US9351429B2 (en) * 2013-02-01 2016-05-24 Dell Products, L.P. Scalable, multi-vessel distribution system for liquid level control within immersion cooling tanks
WO2014182724A1 (fr) * 2013-05-06 2014-11-13 Green Revolution Cooling, Inc. Système et procédé de conditionnement de ressources informatiques garantissant de l'espace et une résistance au feu
DE102014102720B4 (de) * 2014-02-28 2017-03-23 Ushio Denki Kabushiki Kaisha Anordnung zum Kühlen einer plasmabasierten Strahlungsquelle mit einer metallischen Kühlflüssigkeit und Verfahren zur Inbetriebnahme einer solchen Kühlanordnung
CN105762437B (zh) * 2014-12-17 2019-04-02 北京长城华冠汽车科技股份有限公司 浸液式电池箱温度控制***
GB2542844B (en) * 2015-10-01 2021-06-16 Iceotope Group Ltd An immersion cooling system
US10405459B2 (en) * 2016-08-04 2019-09-03 Hamilton Sundstrand Corporation Actuated immersion cooled electronic assemblies
JP2017050548A (ja) * 2016-10-13 2017-03-09 株式会社ＥｘａＳｃａｌｅｒ 電子機器の冷却システム
US10605477B2 (en) * 2017-01-20 2020-03-31 Johnson Controls Technology Company HVAC system with free cooling optimization based on coolant flowrate
CN107564593B (zh) * 2017-08-09 2019-06-18 华北电力大学 一种压力容器外部冷却试验***和方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140218859A1 (en) * 2013-02-01 2014-08-07 Dell Products L.P. System for Cooling Hard Disk Drives Using Vapor Momentum Driven By Boiling of Dielectric Liquid
WO2018163180A1 (fr) * 2017-03-09 2018-09-13 Zuta-Core Ltd. Systèmes et procédés de régulation thermique

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2020102090A1 *

Also Published As

Publication number Publication date
CA3113668A1 (fr) 2020-05-22
KR20210119384A (ko) 2021-10-05
CN113647204A (zh) 2021-11-12
MX2021003176A (es) 2021-08-11
CA3128868A1 (fr) 2020-05-22
WO2020102090A1 (fr) 2020-05-22
AU2019378713A1 (en) 2021-06-03
EP3881658A1 (fr) 2021-09-22
JP2022504024A (ja) 2022-01-13

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Owner name: TMGCORE, INC.

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Owner name: MODINE LLC