EP3664958A4 - Leadless stack comprising multiple components - Google Patents
Leadless stack comprising multiple components Download PDFInfo
- Publication number
- EP3664958A4 EP3664958A4 EP18844928.4A EP18844928A EP3664958A4 EP 3664958 A4 EP3664958 A4 EP 3664958A4 EP 18844928 A EP18844928 A EP 18844928A EP 3664958 A4 EP3664958 A4 EP 3664958A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- multiple components
- leadless stack
- leadless
- stack
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
- B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
- B32B2037/1215—Hot-melt adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Composite Materials (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Coils Or Transformers For Communication (AREA)
- Details Of Resistors (AREA)
- Conductive Materials (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/670,247 US10381162B2 (en) | 2010-05-26 | 2017-08-07 | Leadless stack comprising multiple components |
PCT/US2018/043649 WO2019032294A1 (en) | 2017-08-07 | 2018-07-25 | Leadless stack comprising multiple components |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3664958A1 EP3664958A1 (en) | 2020-06-17 |
EP3664958A4 true EP3664958A4 (en) | 2021-08-25 |
Family
ID=65271690
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP18844928.4A Withdrawn EP3664958A4 (en) | 2017-08-07 | 2018-07-25 | Leadless stack comprising multiple components |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP3664958A4 (en) |
JP (2) | JP2020530656A (en) |
CN (1) | CN110997223A (en) |
WO (1) | WO2019032294A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220078887A (en) | 2020-12-04 | 2022-06-13 | 삼성전기주식회사 | Electronic component |
KR102663242B1 (en) * | 2021-09-02 | 2024-05-03 | 한국원자력연구원 | Precision sealing type rf acceleration cavity |
US20230241725A1 (en) * | 2022-01-19 | 2023-08-03 | Ning-Cheng Lee | Solder pastes and methods of using the same |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5038996A (en) * | 1988-10-12 | 1991-08-13 | International Business Machines Corporation | Bonding of metallic surfaces |
WO2014081666A1 (en) * | 2012-11-26 | 2014-05-30 | Kemet Electronics Corporation | Leadless multi-layered ceramic capacitor stacks |
US20160118190A1 (en) * | 2014-10-23 | 2016-04-28 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic component and board having the same |
US20170025223A1 (en) * | 2010-05-26 | 2017-01-26 | Kemet Electronics Corporation | Electronic Component Structures with Reduced Microphonic Noise |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4513350A (en) * | 1984-02-02 | 1985-04-23 | Sprague Electric Company | Monolithic ceramic capacitor and method for manufacturing to predetermined capacity value |
US4571276A (en) * | 1984-06-22 | 1986-02-18 | North American Philips Corporation | Method for strengthening terminations on reduction fired multilayer capacitors |
JPH0590067A (en) * | 1991-09-27 | 1993-04-09 | Kyocera Corp | Manufacture of laminated ceramic capacitor |
JP3514670B2 (en) | 1999-07-29 | 2004-03-31 | 松下電器産業株式会社 | Soldering method |
US20020092895A1 (en) * | 2001-01-12 | 2002-07-18 | Edmund Blackshear | Formation of a solder joint having a transient liquid phase by annealing and quenching |
JP2004186540A (en) * | 2002-12-05 | 2004-07-02 | Tdk Corp | Laminated electronic parts |
US8264816B2 (en) * | 2009-08-24 | 2012-09-11 | Kemet Electronics Corporation | Externally fused and resistively loaded safety capacitor |
US9472342B2 (en) * | 2010-05-26 | 2016-10-18 | Kemet Electronics Corporation | Leadless multi-layered ceramic capacitor stacks |
US8902565B2 (en) * | 2010-05-26 | 2014-12-02 | Kemet Electronics Corporation | Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastes |
JP2012043947A (en) | 2010-08-18 | 2012-03-01 | Tdk Corp | Package structure of multilayer capacitor |
KR101525666B1 (en) * | 2013-07-11 | 2015-06-03 | 삼성전기주식회사 | Multi-layered ceramic capacitor and manufacturing method the same |
KR20150118385A (en) * | 2014-04-14 | 2015-10-22 | 삼성전기주식회사 | Multi-layered ceramic capacitor, manufacturing method for the same and board having the same mounted thereon |
KR101630037B1 (en) | 2014-05-08 | 2016-06-13 | 삼성전기주식회사 | Multi-layered ceramic capacitor, array-type multi-layered ceramic capacitor, manufacturing method for the same and board having the same mounted thereon |
JP2016072603A (en) | 2014-09-26 | 2016-05-09 | 株式会社村田製作所 | Electronic component |
KR102149786B1 (en) * | 2015-03-05 | 2020-08-31 | 삼성전기주식회사 | Multi-layered ceramic capacitor board having the same mounted thereon |
JP6806354B2 (en) | 2015-04-20 | 2021-01-06 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | Capacitor components and mounting boards equipped with them |
US10224149B2 (en) * | 2015-12-09 | 2019-03-05 | Kemet Electronics Corporation | Bulk MLCC capacitor module |
-
2018
- 2018-07-25 EP EP18844928.4A patent/EP3664958A4/en not_active Withdrawn
- 2018-07-25 CN CN201880051625.7A patent/CN110997223A/en active Pending
- 2018-07-25 JP JP2020506336A patent/JP2020530656A/en active Pending
- 2018-07-25 WO PCT/US2018/043649 patent/WO2019032294A1/en active Search and Examination
-
2022
- 2022-02-21 JP JP2022024677A patent/JP7334285B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5038996A (en) * | 1988-10-12 | 1991-08-13 | International Business Machines Corporation | Bonding of metallic surfaces |
US20170025223A1 (en) * | 2010-05-26 | 2017-01-26 | Kemet Electronics Corporation | Electronic Component Structures with Reduced Microphonic Noise |
WO2014081666A1 (en) * | 2012-11-26 | 2014-05-30 | Kemet Electronics Corporation | Leadless multi-layered ceramic capacitor stacks |
US20160118190A1 (en) * | 2014-10-23 | 2016-04-28 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic component and board having the same |
Also Published As
Publication number | Publication date |
---|---|
JP2022068307A (en) | 2022-05-09 |
CN110997223A (en) | 2020-04-10 |
EP3664958A1 (en) | 2020-06-17 |
JP2020530656A (en) | 2020-10-22 |
JP7334285B2 (en) | 2023-08-28 |
WO2019032294A1 (en) | 2019-02-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
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17P | Request for examination filed |
Effective date: 20200127 |
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AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: BA ME |
|
DAV | Request for validation of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20210727 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01G 4/38 20060101AFI20210721BHEP Ipc: H01G 4/40 20060101ALI20210721BHEP Ipc: H01G 4/232 20060101ALI20210721BHEP Ipc: H01G 2/06 20060101ALI20210721BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20220224 |