EP3649580A1 - Interferenzoptimierter metallischer datenträger - Google Patents
Interferenzoptimierter metallischer datenträgerInfo
- Publication number
- EP3649580A1 EP3649580A1 EP18735180.4A EP18735180A EP3649580A1 EP 3649580 A1 EP3649580 A1 EP 3649580A1 EP 18735180 A EP18735180 A EP 18735180A EP 3649580 A1 EP3649580 A1 EP 3649580A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- antenna
- shielding
- metal layer
- arrangement according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07771—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
Definitions
- the present invention is directed to a layer arrangement for producing an interference-optimized metallic and card-shaped data carrier and to a layered laminate comprising
- the present invention is directed to a computer program product with control commands which implement the method proposed here or operate the proposed device.
- DE 1020141116537 A1 shows a functional skin patch which has a first surface and a second surface, as well as a metal layer, a ferrite layer and an antenna layer.
- a functional skin patch which has a first surface and a second surface, as well as a metal layer, a ferrite layer and an antenna layer.
- the antenna layer is arranged, for example, on the surface of the plaster, whereby it is not protected.
- a skin patch is proposed, which is subject to other requirements such as a smart card, since a skin patch must always be read only from one side, as soon as it is attached to a human skin.
- US 9,390,366 B1 shows a smart card with a layer structure, which provides that an antenna arrangement is incorporated in a metal layer. These are therefore not separate layers and in particular the antenna is substantially integrated in a layer on the Surface of the shown layer arrangement. A flat
- Antenna layer is not shown, which would be arranged between a metal layer and a ferrite layer.
- different layer arrangements are known, which relate for example to smartcards or skin patches. In this case, however, problems may arise in that, in the case of wireless communication with an antenna, interference arises because metallic elements or layers within the
- Layer arrangement act on a radiation such that a signal is corrupted or can no longer be detected.
- metallic layers it is often desired by the customer to incorporate metallic layers into corresponding models. This may be advantageous because the metal layer stabilizes the card body as a whole or simply creates an aesthetic visual effect.
- metallic surfaces or at least metallic layers in card-shaped data carriers are considered to be particularly noble and offer a special haptic experience.
- smart cards which include a
- Microcontroller have a memory and other components.
- Such other components include induction coils, which as
- Antenna can act, so that in a current is induced, which is used to power the corresponding electronic components.
- a metallic layer may possibly impair the function of the antenna.
- Layer arrangements are known, for example, it has been proposed to integrate the antenna in a shielding layer so that the antenna is exposed to the surface of the card body and the
- shielding layer encloses the antenna arrangement only laterally.
- the present invention is further directed to a corresponding method and apparatus for producing the Layer arrangement as well as on a computer program product with
- proposed interference-optimized, metallic and card-shaped data carrier comprising a metal layer for stabilizing a card body, a shield layer for reducing
- an antenna layer for receiving the antenna wherein the shielding layer between the metal layer and the antenna layer is arranged.
- the layer arrangement can be used for the production of the data carrier, wherein the
- a card-shaped data carrier is preferably a chip card, wherein the shape of a card can also be provided by being a format of an identity card. In particular, therefore, a
- the preferred embodiment seems to be a smart card. or a chip card.
- the proposed layer arrangement is therefore especially compact
- An antenna is typically a conductive coil that can be printed or etched, or a wire that is shielded from the metal layer by the shielding layer according to the invention. In particular, this also applies to the
- Antenna layer which is adapted to receive the antenna.
- the metal layer can be used to stabilize the card body, but this is not to be understood as limiting. So can the metal layer of purely optical or haptic
- the shielding layer may comprise, for example, ferrite, e.g.
- Ferrite particles in a carrier matrix of polymer or be made entirely of ferrite.
- This layer can be applied, for example, by means of an adhesive layer on the metal layer and / or the adhesive layer can Be part of the ferrite layer.
- the shielding layer may be referred to as a reflector or a shield, which delimits the metal layer from the antenna layer or the antenna in such a way that a shielding arises between the metal layer and the antenna layer or antenna.
- An operation of an antenna can generally be understood as a transmission or reception of signals, the antenna typically being designed as a coil, preferably an induction coil.
- the antenna is held on a corresponding reader, whereupon the antenna is excited in such a way that a current is induced in it. This power is used to operate the electronic components of the data carrier.
- the antenna When transmitting data, the antenna is also excited and a reader to which the data carrier is held receives corresponding signals from the antenna.
- the shielding layer is provided.
- the antenna layer serves to receive the antenna, wherein the antenna can be etched, printed or simply inserted into the antenna layer, for example. So the expert already knows different technologies, how he creates an antenna.
- An antenna may, for example, be present as a wire, preferably a copper wire, which may be placed on the
- Antenna layer is applied and glued, for example, with her or laminated together with her.
- the antenna layer which acts as a support layer for receiving the antenna.
- the antenna layer may also be referred to as a carrier layer.
- the shielding layer is between the metal layer and the
- Antenna layer is arranged.
- the proposed layer arrangement can be simply laminated together by means of known methods or devices.
- the person skilled in the art recognizes that he can use further simple methods, such as, for example, gluing or even coextrusion insofar as the materials used permit.
- conventional methods for connecting the layers can be used and also the layers can be made flat and simply hot-pressed.
- Shielding layer and the antenna layer configured as separate layers.
- This has the advantage that the antenna does not have to be complexly integrated into an existing shielding layer, or the antenna has to be integrated into another layer, such as a second layer. the metal layer has to be integrated.
- the antenna layer also has a planar design and thus the shielding layer and the antenna layer can be easily connected in such a way that the shielding layer covers the antenna layer in a planar manner or the shielding layer flatly covers the antenna layer
- Shielding layer arranged flat with respect to the antenna layer. This has the advantage that a particularly favorable shielding takes place such that the antenna layer as completely as possible by means of
- Shielding layer is covered and thus interference can be avoided or reduced. Furthermore, this arrangement is particularly advantageous since common methods for joining layers can be used, such as a hot lamination. Thus, it is thus possible according to the invention that the layer arrangement by means of little technical
- Production machines can be connected. Since layers are always arranged and connected in accordance with conventional production machines, it is now only necessary to ensure that the shielding layer is arranged between the metal layer and the antenna layer.
- Shielding layer as a coating of the metal layer before. This has the advantage that the metal layer and the shielding layer can be produced in one working step, and in particular that the
- Shielding layer can be produced with little technical effort.
- the shielding layer and the shielding layer can be produced with little technical effort.
- Shielding layer disposed directly on the metal layer. This has the advantage that no further intermediate layers or intermediate components are arranged between the metal layer and the shielding layer so interference can also be reduced.
- the shielding layer it is also possible according to the invention not necessarily to provide the shielding layer as a separate layer, but rather the person skilled in the art knows further methods of how to connect or coat the shielding layer directly with the metal layer.
- further layers may be provided,
- an adhesive layer which adheres the shielding layer to the metal layer.
- the embodiment of coating the metal layer with the shielding layer e.g. by means of spraying, e.g. Powder coating or wet painting or other type or by means of printing, e.g. Screen printing or other suitable printing process.
- Shielding layer as a ferrite layer before. This has the advantage that the shielding properties for reducing interference can also be used here, and in particular that a proven material is used, so that the reduction of interference can be optimized.
- the antenna layer can be introduced, which is a decorative film or represents a layer in which further optical features are introduced.
- the antenna layer can be made translucent or at least partially translucent.
- a dual interface module is provided which is electrically coupled to the antenna. This has the advantage that the metal layer has no negative effects even in the case of a contactless or air interface and that it is thus possible to provide metallic cards which also have a contactless interface.
- interfaces are referred to which can be read both contactless and contact-based.
- the protective layer directly connected to the antenna layer, such that the protective layer is an outer layer of the layer assembly.
- the protective layer is preferably to be attached to that side of the antenna layer on which neither the shielding layer nor the metal layer are located. This has the advantage that the antenna layer is protected and yet can be operated in combination with a metal layer.
- the protective layer may be, for example, a transparent overlay.
- the dual-interface module is electrically or electromagnetically coupled to the antenna by means of an anisotropically conductive layer (ACF or ACP).
- ACF anisotropically conductive layer
- ACP anisotropically conductive adhesive paste
- anistropic conductive paste (anistropic conductive paste) can be used.
- further electronic components are provided within the layer arrangement.
- chip card-type components can be integrated into the layer arrangement, such as an electrical circuit or a microcontroller together with corresponding components
- the layer arrangement is suitable for producing a
- Data carrier in particular a data carrier in the form of a chip card or a passbook page, wherein a layer laminate is proposed.
- a layer laminate is proposed.
- Layer laminate to provide which can be connected in further steps with other layers. Overall, therefore, the layer arrangement only provides a part of a card body, which may optionally have further layers.
- the object is also achieved by a layered laminate comprising the proposed layer arrangement.
- the object is also achieved by a device for providing a layer arrangement for producing an interference-optimized, metallic and card-shaped data carrier, comprising a first device configured to provide a metal layer for
- Stabilization of a card body a second set up for Providing a shielding layer for reducing interference caused by interaction of the metal layer and operation of an antenna, and a third device configured to provide an antenna layer for receiving the antenna, the device being arranged to connect the shielding layer between the antenna
- the object is also achieved by a method for providing a layer arrangement for producing an interference-optimized, metallic and card-shaped data carrier, which analogous to
- Control commands which implement the proposed method or operate the proposed device.
- the layer arrangement it is particularly advantageous for the layer arrangement to have structural features which are proposed by means of the proposed method
- Device can be created and also created by the proposed method. This is how the procedure shows
- Figure 1 a layer arrangement for producing a
- a data carrier according to one aspect of the present invention is a data carrier according to one aspect of the present invention.
- Figure 2 a layer arrangement for producing a
- FIG. 3 shows a layer arrangement for producing a
- FIG. 4 shows a layer arrangement for producing a
- Figure 5 is a schematic flow diagram of a method for
- Figure 1 shows the layer structure according to the invention wherein on the
- a metal layer 1 is arranged, on which a ferrite layer 2 follows.
- the antenna 4 is, for example, etched, printed or wired or introduced according to another known technology.
- the layer 5 may, for example, be a decorative layer which is printed.
- a dual-interface module 7 is integrated, for example by means of adhesive bonding.
- silver paste for example, which may be used during soldering, possibly also during laser welding, spot welding, etc., or generally by means of an electrically conductive material may be provided.
- Figure 2 shows a further layer arrangement, wherein the antenna layer 3 is closer to the back of the card body, for example by
- ACF anisotropically conductive film
- ACP anisotropically conductive paste
- FIG. 3 shows that the ferrite material 2 can be applied directly to the metal layer 1. This can be done, for example, by screen printing, slot o.a. Printing process, steaming, spraying, sintering or by means of a coating. In separate production steps can
- the layers 3, 5 and 6 are laminated together.
- the separate layers can be interconnected. This can be done by means of bonding.
- the bonding can be carried out in such a low temperature that it
- FIG. 4 shows a further layer arrangement, wherein the dual-interface unit 7 is arranged on the front side of the card.
- all layers may also be referred to as film and vary in their respective thicknesses.
- FIG. 5 shows, in a schematic sequence diagram, a method for providing a layer arrangement for producing a
- interference-optimized, metallic and card-shaped data carrier comprising providing a metal layer 1 for stabilizing a card body, providing a shield layer 2
- the person skilled in the art recognizes that the individual method steps can be carried out iteratively and / or in a different order.
- further process steps may be necessary or it may be provided further layers or even the indicated layers may be provided multiple times.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762528220P | 2017-07-03 | 2017-07-03 | |
PCT/EP2018/000333 WO2019007545A1 (de) | 2017-07-03 | 2018-06-29 | Interferenzoptimierter metallischer datenträger |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3649580A1 true EP3649580A1 (de) | 2020-05-13 |
Family
ID=62784090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP18735180.4A Withdrawn EP3649580A1 (de) | 2017-07-03 | 2018-06-29 | Interferenzoptimierter metallischer datenträger |
Country Status (4)
Country | Link |
---|---|
US (1) | US10445636B2 (de) |
EP (1) | EP3649580A1 (de) |
CN (1) | CN110832506A (de) |
WO (1) | WO2019007545A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7208266B2 (ja) * | 2018-06-19 | 2023-01-18 | コナ アイ カンパニー リミテッド | メタルカード及びカードの製造方法 |
US11347993B2 (en) | 2019-08-12 | 2022-05-31 | Federal Card Services, LLC | Dual interface metal cards and methods of manufacturing |
US11113593B2 (en) | 2019-08-15 | 2021-09-07 | Federal Card Services; LLC | Contactless metal cards with fingerprint sensor and display |
US20210049431A1 (en) | 2019-08-14 | 2021-02-18 | Federal Card Services, LLC | Metal-containing dual interface smartcards |
US11416728B2 (en) | 2019-08-15 | 2022-08-16 | Federal Card Services, LLC | Durable dual interface metal transaction cards |
US11455507B2 (en) | 2019-10-13 | 2022-09-27 | Federal Card Services, LLC | Metal transaction cards containing ceramic having selected coloring and texture |
US11341385B2 (en) | 2019-11-16 | 2022-05-24 | Federal Card Services, LLC | RFID enabled metal transaction card with shaped opening and shaped slit |
WO2023034642A1 (en) | 2021-09-06 | 2023-03-09 | Metaland Llc | Encapsulating a metal inlay with thermosetting resin and method for making a metal transaction card |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10148563A1 (de) * | 2001-10-01 | 2003-04-10 | Tyco Electronics Idento Gmbh | Transponder-Etikett |
US7374102B2 (en) * | 2004-05-14 | 2008-05-20 | Wavezero, Inc. | Radiofrequency antennae and identification tags and methods of manufacturing radiofrequency antennae and radiofrequency identification tags |
EP1720120A1 (de) * | 2005-05-04 | 2006-11-08 | Axalto S.A. | Herstellungsverfahren einer Chipkarte und einer Drahtantenne, und Chipkarte |
US7349221B2 (en) * | 2006-07-20 | 2008-03-25 | Honeywell International Inc. | Device for increased thermal conductivity between a printed wiring assembly and a chassis |
JP4924332B2 (ja) * | 2007-09-27 | 2012-04-25 | 富士通東芝モバイルコミュニケーションズ株式会社 | 無線システム、無線装置及びアンテナ装置 |
DE102008005795A1 (de) * | 2008-01-23 | 2009-07-30 | Soheil Hamedani | Anordnung bestehend aus einem mobilen Kommunikationsendgerät und zumindest einem RFID-Transponder |
DE102010005809A1 (de) * | 2010-01-27 | 2011-07-28 | Giesecke & Devrient GmbH, 81677 | Tragbarer Datenträger mit funkbasierter Datenkommunikationseinrichtung |
DE102011017168B4 (de) * | 2011-04-15 | 2017-12-21 | Giesecke+Devrient Mobile Security Gmbh | Tragbarer Datenträger mit über Spulenkopplung arbeitender Datenkommunikationseinrichtung und einer Dämpfungsschicht |
US9836684B2 (en) * | 2014-08-10 | 2017-12-05 | Féinics Amatech Teoranta | Smart cards, payment objects and methods |
US9903508B2 (en) * | 2013-03-07 | 2018-02-27 | Debiotech S.A. | Microfluidic valve having improved tolerance to particles |
DE102013105575A1 (de) * | 2013-05-30 | 2014-12-04 | Infineon Technologies Ag | Chipkartenmodul, Chipkarte, und Verfahren zum Herstellen eines Chipkartenmoduls |
US9502401B2 (en) | 2013-08-16 | 2016-11-22 | Infineon Technologies Austria Ag | Integrated circuit with first and second switching devices, half bridge circuit and method of manufacturing |
DE102014116537B4 (de) | 2014-11-12 | 2024-05-29 | Infineon Technologies Ag | Funktionales Hautpflaster sowie System zum Überwachen eines Körpergesundheitsparameters |
WO2016106251A2 (en) * | 2014-12-23 | 2016-06-30 | Composecure, Llc | Smart metal card with radio frequency (rf) transmission capability |
US9390366B1 (en) | 2015-07-08 | 2016-07-12 | Composecure, Llc | Metal smart card with dual interface capability |
CN205486225U (zh) * | 2016-02-01 | 2016-08-17 | 李怀广 | Rfid标签 |
-
2018
- 2018-06-29 WO PCT/EP2018/000333 patent/WO2019007545A1/de unknown
- 2018-06-29 EP EP18735180.4A patent/EP3649580A1/de not_active Withdrawn
- 2018-06-29 CN CN201880043213.9A patent/CN110832506A/zh active Pending
- 2018-06-29 US US16/023,070 patent/US10445636B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2019007545A1 (de) | 2019-01-10 |
CN110832506A (zh) | 2020-02-21 |
US20190005372A1 (en) | 2019-01-03 |
US10445636B2 (en) | 2019-10-15 |
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