EP3578692A4 - Tin alloy plating solution - Google Patents

Tin alloy plating solution Download PDF

Info

Publication number: EP3578692A4
Authority: EP; European Patent Office
Prior art keywords: plating solution; alloy plating; tin alloy; tin; solution
Prior art date: 2017-01-31
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

EP17895170.3A

Other languages

German (de)

French (fr)

Other versions

EP3578692A1 (en

Inventor

Kouji Tatsumi

Tsukasa Yasoshima

Takuma KATASE

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Mitsubishi Materials Corp

Original Assignee

Mitsubishi Materials Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2017-01-31

Filing date

2017-12-13

Publication date

2020-12-09

2017-12-13 Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp

2017-12-13 Priority claimed from PCT/JP2017/044668 external-priority patent/WO2018142776A1/en

2019-12-11 Publication of EP3578692A1 publication Critical patent/EP3578692A1/en

2020-12-09 Publication of EP3578692A4 publication Critical patent/EP3578692A4/en

Status Withdrawn legal-status Critical Current

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors

EP17895170.3A 2017-01-31 2017-12-13 Tin alloy plating solution Withdrawn EP3578692A4 (en)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2017015219		2017-01-31
JP2017222433A JP6432667B2 (en)	2017-01-31	2017-11-20	Tin alloy plating solution
PCT/JP2017/044668 WO2018142776A1 (en)	2017-01-31	2017-12-13	Tin alloy plating solution

Publications (2)

Publication Number	Publication Date
EP3578692A1 EP3578692A1 (en)	2019-12-11
EP3578692A4 true EP3578692A4 (en)	2020-12-09

Family

ID=63110055

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP17895170.3A Withdrawn EP3578692A4 (en)	2017-01-31	2017-12-13	Tin alloy plating solution

Country Status (6)

Country	Link
US (1)	US20190390357A1 (en)
EP (1)	EP3578692A4 (en)
JP (1)	JP6432667B2 (en)
KR (1)	KR102174876B1 (en)
CN (1)	CN110249076A (en)
TW (1)	TWI681084B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP7243002B2 (en) *	2018-07-20	2023-03-22	三菱マテリアル株式会社	Tin plating solution and tin alloy plating solution
US20240116861A1 (en) *	2019-12-12	2024-04-11	Mitsubishi Materials Corporation	Dithiapolyether diol, method for producing same, snag plating solution containing dithiapolyether diol, and method for forming plating film with use of snag plating solution
CN111188069A (en) *	2019-12-31	2020-05-22	大连长丰实业总公司	Tin-plated bismuth alloy solution and preparation method thereof
CN112981459A (en) *	2021-03-12	2021-06-18	昆明理工大学	Method for electrolytic refining of coarse soldering tin

Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH11269691A (en) *	1998-01-21	1999-10-05	Ishihara Chem Co Ltd	Silver and silver alloy plating bath
US7628903B1 (en) *	2000-05-02	2009-12-08	Ishihara Chemical Co., Ltd.	Silver and silver alloy plating bath

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3718790B2 (en)	1998-12-24	2005-11-24	石原薬品株式会社	Silver and silver alloy plating bath
JP3433291B2 (en) *	1999-09-27	2003-08-04	石原薬品株式会社	Tin-copper-containing alloy plating bath, tin-copper-containing alloy plating method, and article formed with tin-copper-containing alloy plating film
JP4756886B2 (en) *	2005-03-22	2011-08-24	石原薬品株式会社	Non-cyan tin-silver alloy plating bath
JP4162246B2 (en)	2005-08-12	2008-10-08	石原薬品株式会社	Cyanide-free silver-based plating bath, plated body and plating method
EP2221396A1 (en) *	2008-12-31	2010-08-25	Rohm and Haas Electronic Materials LLC	Lead-Free Tin Alloy Electroplating Compositions and Methods
JP2016148085A (en) *	2015-02-12	2016-08-18	ユケン工業株式会社	Tin-copper plating liquid and conductive member
JP6631348B2 (en) *	2015-03-26	2020-01-15	三菱マテリアル株式会社	Plating solution using phosphonium salt

2017
- 2017-11-20 JP JP2017222433A patent/JP6432667B2/en active Active
- 2017-12-13 EP EP17895170.3A patent/EP3578692A4/en not_active Withdrawn
- 2017-12-13 US US16/481,959 patent/US20190390357A1/en not_active Abandoned
- 2017-12-13 KR KR1020197024869A patent/KR102174876B1/en active IP Right Grant
- 2017-12-13 CN CN201780084824.3A patent/CN110249076A/en active Pending
- 2017-12-22 TW TW106145193A patent/TWI681084B/en active

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH11269691A (en) *	1998-01-21	1999-10-05	Ishihara Chem Co Ltd	Silver and silver alloy plating bath
US7628903B1 (en) *	2000-05-02	2009-12-08	Ishihara Chemical Co., Ltd.	Silver and silver alloy plating bath

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2018142776A1 *

Also Published As

Publication number	Publication date
TW201833391A (en)	2018-09-16
JP6432667B2 (en)	2018-12-05
US20190390357A1 (en)	2019-12-26
JP2018123421A (en)	2018-08-09
EP3578692A1 (en)	2019-12-11
TWI681084B (en)	2020-01-01
KR20190103460A (en)	2019-09-04
CN110249076A (en)	2019-09-17
KR102174876B1 (en)	2020-11-05

Legal Events

Date	Code	Title	Description
2018-08-11	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE
2019-11-08	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2019-11-08	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE
2019-12-11	17P	Request for examination filed	Effective date: 20190729
2019-12-11	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
2019-12-11	AX	Request for extension of the european patent	Extension state: BA ME
2020-05-06	DAV	Request for validation of the european patent (deleted)
2020-05-06	DAX	Request for extension of the european patent (deleted)
2020-12-09	A4	Supplementary search report drawn up and despatched	Effective date: 20201110
2020-12-09	RIC1	Information provided on ipc code assigned before grant	Ipc: C25D 3/56 20060101ALI20201104BHEP Ipc: C25D 7/12 20060101ALN20201104BHEP Ipc: C25D 3/60 20060101AFI20201104BHEP
2021-10-18	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN
2021-11-17	18D	Application deemed to be withdrawn	Effective date: 20210608

Publication	Publication Date	Title
EP3575433A4 (en)	2020-09-23	Plated steel
EP3575434A4 (en)	2020-07-01	Plated steel
HUE050206T2 (en)	2020-11-30	Titanium alloy
EP3643801A4 (en)	2020-11-11	Aluminium-based alloy
EP3138658A4 (en)	2018-04-11	Lead-free solder alloy
EP3597356A4 (en)	2020-06-03	Solder alloy
EP3363922A4 (en)	2019-08-21	Cobalt silicide-containing copper alloy
EP3212815A4 (en)	2018-08-29	Metal alloys including copper
EP3437127A4 (en)	2019-11-27	Laser-seeding for electro-conductive plating
EP3585914A4 (en)	2020-11-18	Titanium alloys for additive manufacturing
EP3042985A4 (en)	2016-08-17	Zinc alloy plating method
EP3156522A4 (en)	2017-11-08	Tin electroplating bath and tin plating film
EP3042984A4 (en)	2016-11-23	Zinc alloy plating method
EP3578692A4 (en)	2020-12-09	Tin alloy plating solution
EP3375898A4 (en)	2019-04-03	Copper alloy material
EP3647461A4 (en)	2021-05-05	Electroless plating process
EP3178968A4 (en)	2018-01-17	Copper-nickel alloy electroplating bath
EP3640355A4 (en)	2021-03-17	High-strength aluminium-based alloy
EP3628754A4 (en)	2021-04-07	Titanium alloy member
EP3524701A4 (en)	2020-04-01	CORROSION-RESISTANT CuZn ALLOY
EP3438306A4 (en)	2019-12-18	Ni-Fe-Cr ALLOY
EP3375897A4 (en)	2019-04-03	Copper alloy material
EP3715508A4 (en)	2021-10-27	Tin or tin-alloy plating liquid
EP3701054C0 (en)	2023-12-20	Titanium alloy
EP3604622A4 (en)	2020-12-23	Plating liquid