EP3156522A4 - Tin electroplating bath and tin plating film - Google Patents

Tin electroplating bath and tin plating film Download PDF

Info

Publication number
EP3156522A4
EP3156522A4 EP15807050.8A EP15807050A EP3156522A4 EP 3156522 A4 EP3156522 A4 EP 3156522A4 EP 15807050 A EP15807050 A EP 15807050A EP 3156522 A4 EP3156522 A4 EP 3156522A4
Authority
EP
European Patent Office
Prior art keywords
tin
plating film
electroplating bath
tin plating
tin electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP15807050.8A
Other languages
German (de)
French (fr)
Other versions
EP3156522A1 (en
Inventor
Toshikazu Kano
Raihei Ikumoto
Masanobu Tsujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Original Assignee
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uemera Kogyo Co Ltd, C Uyemura and Co Ltd filed Critical Uemera Kogyo Co Ltd
Publication of EP3156522A1 publication Critical patent/EP3156522A1/en
Publication of EP3156522A4 publication Critical patent/EP3156522A4/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
EP15807050.8A 2014-06-11 2015-06-04 Tin electroplating bath and tin plating film Pending EP3156522A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014120714A JP6618241B2 (en) 2014-06-11 2014-06-11 Tin electroplating bath and tin plating film
PCT/JP2015/066187 WO2015190390A1 (en) 2014-06-11 2015-06-04 Tin electroplating bath and tin plating film

Publications (2)

Publication Number Publication Date
EP3156522A1 EP3156522A1 (en) 2017-04-19
EP3156522A4 true EP3156522A4 (en) 2017-11-08

Family

ID=54833483

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15807050.8A Pending EP3156522A4 (en) 2014-06-11 2015-06-04 Tin electroplating bath and tin plating film

Country Status (6)

Country Link
EP (1) EP3156522A4 (en)
JP (1) JP6618241B2 (en)
KR (1) KR102402402B1 (en)
CN (1) CN106414808B (en)
TW (1) TWI688679B (en)
WO (1) WO2015190390A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106676598B (en) * 2016-12-13 2019-08-23 上海交通大学 A method of growth of tin crystal whisker is inhibited based on micro-nano needle wimble structure
CN107502927B (en) * 2017-07-24 2019-07-02 奎克化学（中国）有限公司 A kind of methanesulfonate tin deposit solution
CN107675209A (en) * 2017-10-18 2018-02-09 江西理工大学 A kind of green tin electrorefining electrolyte
EP3486240A1 (en) * 2017-11-21 2019-05-22 Orsatec GmbH Synthesis of morin and morin derivatives
CN111788337A (en) * 2018-03-20 2020-10-16 三菱综合材料株式会社 Tin or tin alloy plating solution, method for forming bump, and method for manufacturing circuit board
JP7070360B2 (en) * 2018-11-16 2022-05-18 トヨタ自動車株式会社 A tin solution for forming a tin film and a method for forming a tin film using the solution.
CN110306213B (en) * 2019-07-08 2020-08-04 广州三孚新材料科技股份有限公司 Tin plating solution for solar cell and preparation method thereof
US20220411647A1 (en) 2019-11-22 2022-12-29 Basf Coatings Gmbh Electrodeposition Coating Material Containing Organic Polyhydroxy-Functional Anticorrosion Agents
WO2021099469A1 (en) 2019-11-22 2021-05-27 Basf Coatings Gmbh Electrodeposition coating material containing catechol derivatives as anticorrosion agents
CN110760902B (en) * 2019-11-29 2022-01-25 上海天承化学有限公司 Tin electroplating solution and preparation method and application thereof
CN114318434B (en) * 2021-12-10 2023-08-08 胜宏科技（惠州）股份有限公司 Electrolytic copper plating solution and preparation method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2846381A (en) * 1956-01-16 1958-08-05 Max Schlotter Dr Ing Method of electrolytically depositing smooth layers of tin
US5492615A (en) * 1994-11-22 1996-02-20 Learonal Inc. Cyclodextrin stabilization of organic metal finishing additives in aqueous metal treating baths
EP1477587A2 (en) * 2003-05-12 2004-11-17 Rohm and Haas Electronic Materials, L.L.C. Improved tin plating method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5215305A (en) 1975-07-25 1977-02-04 Fujitsu Ltd Magnetic recording media
US4582576A (en) 1985-03-26 1986-04-15 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
JPH0819536B2 (en) * 1987-01-26 1996-02-28 株式会社ジャパンエナジー anti-rust
JPH0394095A (en) * 1988-12-26 1991-04-18 Nippon Mining Co Ltd Tin and tin alloy plated material
JP2856857B2 (en) 1990-07-27 1999-02-10 石原薬品株式会社 Tin, lead or tin-lead alloy plating bath
JPH07173676A (en) 1993-12-21 1995-07-11 Nikko Kinzoku Kk Surface treatment of tin or tin-lead alloy plated material
DE19623274A1 (en) * 1996-05-31 1997-12-04 Atotech Deutschland Gmbh Aqueous solution for the electrolytic deposition of tin or a tin alloy
JPH1036994A (en) 1996-07-23 1998-02-10 Nikko Kinzoku Kk Tin and tin/lead alloy plating liquid
JP5337352B2 (en) * 2007-04-24 2013-11-06 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． Tin or tin alloy electroplating solution
EP2221396A1 (en) * 2008-12-31 2010-08-25 Rohm and Haas Electronic Materials LLC Lead-Free Tin Alloy Electroplating Compositions and Methods
JP5730500B2 (en) 2009-05-18 2015-06-10 日本モレックス合同会社 connector

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2846381A (en) * 1956-01-16 1958-08-05 Max Schlotter Dr Ing Method of electrolytically depositing smooth layers of tin
US5492615A (en) * 1994-11-22 1996-02-20 Learonal Inc. Cyclodextrin stabilization of organic metal finishing additives in aqueous metal treating baths
EP1477587A2 (en) * 2003-05-12 2004-11-17 Rohm and Haas Electronic Materials, L.L.C. Improved tin plating method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2015190390A1 *

Also Published As

Publication number Publication date
CN106414808A (en) 2017-02-15
TW201612361A (en) 2016-04-01
TWI688679B (en) 2020-03-21
JP6618241B2 (en) 2019-12-11
JP2016000844A (en) 2016-01-07
KR20170016843A (en) 2017-02-14
WO2015190390A1 (en) 2015-12-17
EP3156522A1 (en) 2017-04-19
CN106414808B (en) 2019-02-15
KR102402402B1 (en) 2022-05-25

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