EP3549414A1 - Elektrische baugruppe - Google Patents
Elektrische baugruppeInfo
- Publication number
- EP3549414A1 EP3549414A1 EP17764542.1A EP17764542A EP3549414A1 EP 3549414 A1 EP3549414 A1 EP 3549414A1 EP 17764542 A EP17764542 A EP 17764542A EP 3549414 A1 EP3549414 A1 EP 3549414A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- printed circuit
- circuit board
- board substrate
- cap
- protective cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 64
- 239000000463 material Substances 0.000 claims abstract description 39
- 230000001681 protective effect Effects 0.000 claims abstract description 39
- 230000005540 biological transmission Effects 0.000 claims abstract description 13
- 239000012530 fluid Substances 0.000 claims abstract description 6
- 239000003990 capacitor Substances 0.000 claims description 8
- 230000007704 transition Effects 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 3
- 238000005429 filling process Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 8
- 239000004020 conductor Substances 0.000 description 4
- 230000009969 flowable effect Effects 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000004382 potting Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000010136 thermoset moulding Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000013598 vector Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/26—Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/304—Protecting a component during manufacturing
Definitions
- Electronic transmission control modules are installed for control on or in the gearbox and can be exposed to the aggressive transmission fluid.
- Transmission control modules have electrical assemblies that must be protected from the transmission fluid.
- the electrical components may have a printed circuit board substrate as a circuit carrier, on which electrical components are fitted, which are electrically contacted via conductor tracks of the printed circuit board substrate.
- metallic cover parts which protect over the electrical components on the
- Printed circuit substrate applied wrapper material to protect the electrical components.
- the wrapping material can be applied as a molding compound in a Ummoldungsvon or as a potting compound on the protected electrical components on the printed circuit board substrate.
- an electronic module for a transmission control unit in which the electronic module has a printed circuit board substrate, on which at least one ungephasetes semiconductor device is arranged. To protect the unpackaged semiconductor device from ionizing radiation is above the
- Semiconductor device arranged a protective cap on the printed circuit board substrate.
- the protective cap is completely covered with a covering material made of, for example, duroplastic, applied to the printed circuit board substrate (and to further electrical components arranged outside the protective cap).
- the invention relates to an electrical assembly, in particular for use in a hydraulic fluid of a motor vehicle transmission, which comprises a printed circuit board substrate and comprises at least one arranged on the printed circuit substrate and electrically contacted with the printed circuit substrate substrate electrical component. Over the electrical component, a protective cap is arranged.
- an electrical assembly in particular for use in a hydraulic fluid of a motor vehicle transmission, which comprises a printed circuit board substrate and comprises at least one arranged on the printed circuit substrate and electrically contacted with the printed circuit substrate substrate electrical component.
- a protective cap is arranged over the electrical component.
- Printed circuit board substrate applied over the protective cap covering material at least the protective cap.
- the protective cap is provided with at least one filling opening and for the wrapping material to be introduced through the at least one filling opening into a cap interior between the protective cap and the printed circuit board substrate in such a way that a free space not filled with the wrapping material between the protective cap and the electrical component remains, which is directly adjacent to the at least one electrical component.
- the electrical assembly may be part of an electronic transmission control module or include, but not limited to, an electronic transmission control module.
- the electrical assembly may also be part of a sensor module or a
- the electrical assembly can be in or on
- a printed circuit board substrate is understood to mean a carrier substrate of electrical components which has printed conductors for connecting the electrical components to a control circuit or for contacting the electrical components with one another.
- a printed circuit board substrate may in particular be a rigid printed circuit board made of glass fiber reinforced epoxy resin (FR4 or higher), a ceramic carrier substrate (for example a hybrid circuit) or a flexible conductor foil.
- Under a wrapping material is understood to be a flowable in the original state and cured during or after application protective composition. Preferably, it is a thermoset, in particular an epoxy resin.
- the wrapping material may for example be applied to the printed circuit substrate by a transfer molding method, a compression molding method, a thermoset molding method or a potting method.
- the electrical assembly according to the invention advantageously forms a protection for the at least one electrical component during application of the Enveloping material before the resulting thermal and / or mechanical loads. This is particularly advantageous, for example, to protect the large cup-shaped housing of electrolytic capacitors from damage caused by pressure peaks in thermoset molding or Transfermolden.
- the protective cap reduces stress on the component. Characterized in that the protective cap is provided with at least one filling opening and the wrapping material is partially introduced through the at least one filling opening in a cap interior between the protective cap and the printed circuit board substrate, a protection of the electrical connections of the device is achieved and prevents too large air spaces below the sheath material, which could lead to cracking in the sheath material during operation due to temperature fluctuations or pressure fluctuations.
- the wrapping material stabilizes the at least one electrical components against shock and / or vibration loads and thus relieves the electrical connections thereof.
- Compensation space in which the electrical component or parts of the electrical component can partially expand.
- the space may be filled with air or another gas.
- the free space forms, for example, a receiving space, which in the unlikely event of outgassing or bursting of a
- Electrolytic capacitor can absorb the exiting gases or acids without the sheathing material can break. The remaining electrical components on the printed circuit board substrate and the electronic circuit are therefore protected even against a defect of a single electrical component against the aggressive transmission fluid.
- At least one filling opening of the protective cap is connected to the free space by a labyrinth-like, in particular U-shaped, channel structure viewed in cross section perpendicular to the printed circuit substrate.
- a labyrinth-like, in particular U-shaped, channel structure viewed in cross section perpendicular to the printed circuit substrate.
- the at least one filling opening can be designed as a throttle point in order to dampen pressure spraying during the application of the wrapping material.
- Pressure peaks of the enveloping material penetrating into the filling opening can therefore advantageously not act undamped on the electrical component.
- the protective cap can advantageously have a circumferential wall surrounding the electrical component, perpendicular to the printed circuit substrate patch cap wall and a cover portion on the side facing away from the printed circuit board substrate over the electrical component, wherein the filling opening is provided in the transition region between the lid portion and cap wall.
- the cap wall protects the electrical component with regard to all the force vectors acting parallel to the printed circuit substrate, while the cover part effects a protection of the side facing away from the printed circuit board substrate of the electrical component.
- the filling opening can be arranged particularly easily.
- the cover section has a collar projecting into the cap interior.
- the projecting into the cap interior collar of the lid portion may advantageously comprises the electrical component at its end remote from the printed circuit board substrate end such that between the collar and the electrical component only a very narrow gap exists, which is in communication with the free space. In this way it can be very easily achieved that the space is not completely filled with the wrapping material.
- the protective cap has a plurality of cap interiors, in each of which an electrical component is arranged.
- the protective cap can be advantageously produced as a low-priced plastic component for the electrical assembly and inexpensive and easy on the
- the electrical assembly can be used to particular advantage for electrical components used as a capacitor, in particular as
- Electrolytic capacitor are provided.
- FIG. 1 shows a cross section through a finished electrical assembly according to the invention
- FIG. 2 is a plan view of an electrical assembly according to the invention without the wrapping material
- FIG. 1 shows a cross section through a finished electrical assembly 1 according to the invention. Shown is only a partial section, which has a printed circuit board substrate 2, which is equipped here by way of example with two electrical components 3.
- the electrical components 3 are, for example, electrolytic capacitors,
- the electrical components 3 have on their mounting side connecting elements 31, which with contact surfaces 13 on the
- Placement side 1 1 of the printed circuit board substrate 2 are contacted by, for example, soldering electrically.
- the electrical components 3 may be a substantially
- the printed circuit board substrate 2 may be a multi-layer printed circuit board.
- the contact surfaces 13 may be connected via conductor tracks of the printed circuit board substrate 2 with a control circuit, not shown, which may also be arranged on the printed circuit substrate (not shown).
- the electrical module 1 can be, for example, a subarea of a transmission control module or a sensor module.
- a protective cap 4 is disposed on the printed circuit substrate 2.
- the protective cap 4 may be made of plastic or metal or a plastic-metal composite and is preferably formed in one piece.
- the protective cap 4 For each of the electrical components 3, a cap interior 44 assigned to this component 3 can be provided.
- the respective cap interior 3 is delimited by a circumferential cap wall 41 and a cover section 42.
- the protective cap 4 is placed vertically on the component side 1 1 of the printed circuit substrate in such a way that the cap wall 41 surrounds each of the electrical components 3 on the circumferential side and the respective cover section 42 over that of FIG the printed circuit board substrate 2 facing away from the associated electrical component 3 is seconded.
- each cap interior two filling openings 5 are assigned.
- Each cover section 42 has a collar 43 projecting into the cap interior 44.
- Cap interior 44 projecting collar 43 of the lid portion 42 includes the associated electrical component 3 at its end facing away from the printed circuit substrate 2 end 14 such that between the collar 43 and the electrical component 3 is a very narrow gap 66, which is in communication with a space 45 ,
- the free space 45 is located on the side facing away from the printed circuit board substrate 2 side of the electrical component 3 between the component 3 and the inside of the lid portion 42 and therefore directly adjacent to the electrical component 3.
- each filling opening 5 of the protective cap 4 is connected to the associated free space 45 by a labyrinth-like, in particular U-shaped channel structure 67, as indicated by the dot-dash line in FIG. 4.
- Fig. 2 shows an external view of a further embodiment of the invention, without the applied wrapping material.
- the protective cap 4 is formed as a molded part with a circumferential cap wall 41, which also forms intermediate walls between the four cap inner spaces 44, and with, for example, four lid sections 42, which are assigned to the respective electrical component.
- Cap interior are assigned here, for example, four filling openings 5.
- Printed circuit board substrate 2 first de cap 4 placed such that the
- Cap wall 41 rests on the component side 1 1 of the printed circuit board substrate and each electrical component 3 is arranged in a separate cap interior 44.
- the electrical assembly 1 is then together with the cap 4 in a Tool mold used.
- the tool mold can be formed in two parts and has a patch on the component side 1 1 of the printed circuit substrate 2 first
- a sprue 63 is provided between the component side 1 1 and the first mold half 61.
- a flowable wrapping material 6 is applied to the component side 1 1 of the printed circuit substrate 2.
- the wrapping material 6 may be, for example, a thermoset, in particular an epoxy resin.
- the wrapping material may for example be applied to the printed circuit substrate by a transfer molding method, a compression molding method, a thermoset molding method or a potting method. This pressure can be expended, so that the flowable
- Enveloping material 6 penetrates into the casting channel 63. As shown in Fig. 5, the flowable wrapping material 6 rises in the gap between the first tool half 61 and the cap wall 41 and flows over the lid portions 42. As indicated by the arrows in Fig. 5, this penetrates
- Cap interior 44 The at least one filling opening 5 acts advantageously as a throttle point and prevents pressurized spraying during the filling process of the wrapping material 6 unattenuated acting on the electrical component 3.
- the wrapping material 6 penetrating into the cap interior 44 initially penetrates in the direction of the surface 11 of the printed circuit board substrate 2 facing the cap interior and flows around the electrical connections 31 of the electrical components 2.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102016224083.8A DE102016224083A1 (de) | 2016-12-02 | 2016-12-02 | Elektrische Baugruppe |
PCT/EP2017/072188 WO2018099620A1 (de) | 2016-12-02 | 2017-09-05 | Elektrische baugruppe |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3549414A1 true EP3549414A1 (de) | 2019-10-09 |
EP3549414B1 EP3549414B1 (de) | 2020-08-12 |
Family
ID=59829351
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP17764542.1A Active EP3549414B1 (de) | 2016-12-02 | 2017-09-05 | Elektrische baugruppe |
Country Status (6)
Country | Link |
---|---|
US (1) | US11122700B2 (de) |
EP (1) | EP3549414B1 (de) |
KR (1) | KR102383265B1 (de) |
CN (1) | CN109997420B (de) |
DE (1) | DE102016224083A1 (de) |
WO (1) | WO2018099620A1 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT201800005294A1 (it) * | 2018-05-11 | 2019-11-11 | Componente di bicicletta in materiale composito e relativo processo di fabbricazione | |
IT201800005299A1 (it) | 2018-05-11 | 2019-11-11 | Componente di bicicletta dotato di sensore di sforzi/deformazioni compensato in temperatura | |
CA3042547A1 (en) | 2018-05-11 | 2019-11-11 | Campagnolo S.R.L. | Bicycle crankarm provided with electric/electronic system |
DE102018218783A1 (de) * | 2018-11-05 | 2020-05-07 | Zf Friedrichshafen Ag | Elektronische Einheit mit elektronischen Bauelementen und einer Anordnung zum Schutz derselben vor Druckbeaufschlagung |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3092771U (ja) * | 2002-09-13 | 2003-03-28 | アルプス電気株式会社 | 無線モジュールの取付構造 |
US6969640B1 (en) * | 2004-09-02 | 2005-11-29 | Stats Chippac Ltd. | Air pocket resistant semiconductor package system |
US8476591B2 (en) * | 2005-09-21 | 2013-07-02 | Analog Devices, Inc. | Radiation sensor device and method |
JP3940423B1 (ja) * | 2006-03-02 | 2007-07-04 | ソニーケミカル&インフォメーションデバイス株式会社 | 機能素子実装モジュール及びその製造方法 |
KR20090023886A (ko) * | 2007-09-03 | 2009-03-06 | 삼성전자주식회사 | 전기전자제품 및 그 제조방법 |
JP4934559B2 (ja) * | 2007-09-27 | 2012-05-16 | オンセミコンダクター・トレーディング・リミテッド | 回路装置およびその製造方法 |
JP5263895B2 (ja) * | 2010-01-12 | 2013-08-14 | ルネサスエレクトロニクス株式会社 | 半導体装置、及び半導体装置の製造方法 |
DE102010062653A1 (de) * | 2010-12-08 | 2012-06-14 | Robert Bosch Gmbh | Steuermodul und Verfahren zu seiner Herstellung |
DE102012204630A1 (de) * | 2012-03-22 | 2013-09-26 | Robert Bosch Gmbh | Verfahren zur thermoplastischen Umspritzung und thermoplastische Umspritzung |
DE102012207601B4 (de) * | 2012-05-08 | 2022-08-04 | Vitesco Technologies GmbH | Steuergerät, insbesondere für ein Kraftfahrzeug, sowie Verfahren zum Herstellen eines Steuergeräts |
JP5528641B1 (ja) * | 2012-10-03 | 2014-06-25 | 新電元工業株式会社 | 電子機器 |
DE102012222199B4 (de) * | 2012-12-04 | 2023-01-26 | Robert Bosch Gmbh | Flaches Getriebesteuermodul; Kraftfahrzeug mit einem Getriebesteuermodul und Verfahren zum Zusammenbau eines Getriebesteuermoduls |
CN104919586A (zh) * | 2013-01-16 | 2015-09-16 | 株式会社村田制作所 | 模块及其制造方法 |
JP6227937B2 (ja) * | 2013-08-30 | 2017-11-08 | 株式会社ケーヒン | 車両用電子制御装置 |
DE102014205139A1 (de) * | 2014-03-19 | 2015-09-24 | Robert Bosch Gmbh | Elektronisches Steuermodul und Verfahren zu seiner Herstellung |
US9484281B2 (en) * | 2014-08-14 | 2016-11-01 | Qualcomm Incorporated | Systems and methods for thermal dissipation |
DE102015205054A1 (de) | 2015-03-20 | 2016-09-22 | Robert Bosch Gmbh | Elektronikmodul mit Alphastrahlenschutz für eine Getriebesteuereinheit sowie Getriebesteuereinheit |
-
2016
- 2016-12-02 DE DE102016224083.8A patent/DE102016224083A1/de not_active Withdrawn
-
2017
- 2017-09-05 US US16/464,868 patent/US11122700B2/en active Active
- 2017-09-05 EP EP17764542.1A patent/EP3549414B1/de active Active
- 2017-09-05 KR KR1020197015686A patent/KR102383265B1/ko active IP Right Grant
- 2017-09-05 CN CN201780074549.7A patent/CN109997420B/zh active Active
- 2017-09-05 WO PCT/EP2017/072188 patent/WO2018099620A1/de unknown
Also Published As
Publication number | Publication date |
---|---|
KR102383265B1 (ko) | 2022-04-07 |
KR20190089169A (ko) | 2019-07-30 |
EP3549414B1 (de) | 2020-08-12 |
US11122700B2 (en) | 2021-09-14 |
CN109997420B (zh) | 2020-12-29 |
DE102016224083A1 (de) | 2018-06-07 |
US20190320539A1 (en) | 2019-10-17 |
CN109997420A (zh) | 2019-07-09 |
WO2018099620A1 (de) | 2018-06-07 |
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