EP3391293A1 - Method for fabricating a device comprising a radiofrequency electronic module and an indicator - Google Patents

Method for fabricating a device comprising a radiofrequency electronic module and an indicator

Info

Publication number
EP3391293A1
EP3391293A1 EP16760005.5A EP16760005A EP3391293A1 EP 3391293 A1 EP3391293 A1 EP 3391293A1 EP 16760005 A EP16760005 A EP 16760005A EP 3391293 A1 EP3391293 A1 EP 3391293A1
Authority
EP
European Patent Office
Prior art keywords
antenna
module
chip
indicator
radio frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP16760005.5A
Other languages
German (de)
French (fr)
Inventor
Stéphane OTTOBON
Laurent Audouard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales DIS France SA
Original Assignee
Gemalto SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemalto SA filed Critical Gemalto SA
Publication of EP3391293A1 publication Critical patent/EP3391293A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07794—Antenna details the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement

Definitions

  • the present invention relates to a method of manufacturing a radiofrequency communication device comprising an integrated circuit chip and a particularly bright indicator, such as a light emitting diode.
  • the indicator targeted by the invention is preferably a light indicator including a light emitting diode but may include any other indicator, (sound, vibrator %)
  • the invention relates to non-contact IC chip radio frequency transponder devices such as contactless chip media, contactless smart cards, electronic identification tags, electronic passports, antenna devices. .
  • the invention relates in particular to electronic travel documents without contact (electronic passports and electronic visas).
  • the antenna with a capacitor generally form a resonant circuit.
  • the resonant circuit may be passive or active and be connected to a radio frequency integrated circuit chip for communicating data with a radio frequency reader.
  • Radio frequency chip transponders are used in various economic domains such as banking (electronic purse), communication, transport, identity (e-passport, card-ID). In the field of identity in particular, it is known to perform the identification of a person by radio frequency communication with a contactless electronic object RFID-type contact.
  • the patent application EP1861813 describes a method of manufacturing an electronic module comprising at least one integrated circuit chip connected to conductive tracks of an insulating support and at least one light emitting diode connecting or intended to be connected to an antenna.
  • the method comprises a step of coating at least the integrated circuit and the light emitting diode (LED) with an insulating and translucent resin.
  • Such devices above including a smart card module and LED diode illuminates when the card is in an electromagnetic field.
  • the chip radio frequency and the led are fed by the antenna of the radiofrequency card.
  • radiofrequency smart card does not always work according to economical and flexible manufacturing methods in the implementation.
  • the object of the invention is to propose radiofrequency chip and indicator chip structures which function correctly and which are preferably easy to manufacture.
  • the invention proposes various configurations of easy-to-manufacture radiofrequency chip devices having two separate antennas, a first for the radiofrequency chip and a second for the LED diode.
  • the various components are distributed so as to facilitate the manufacture of the final device while maintaining sufficient communication performance.
  • this proposal results from a deduction of the inventors observing that the additional LED to the radio frequency transponder circuit, causes the frequency of resonance of the map. As a result, the frequency tuning being shifted, the chip can not function properly to communicate with a radio frequency reader.
  • this added LED uses part of the energy recovered by the antenna and intended for the integrated circuit; The consequence is that the power supply of the integrated circuit is reduced and can reduce the operating distance of the contactless card or even prevent its operation.
  • the invention makes it possible in particular to keep standard antennas already calibrated for each chip. It eliminates the negative influence of a change in the electrical characteristics of the LED especially in case of change of supplier and LED model.
  • the subject of the invention is a radiofrequency electronic module comprising an insulating substrate, first and second electrical connection pads on the substrate, a radio frequency chip connecting said first connection pads, a light indicator connecting said second pads of connection. ;
  • the module is characterized in that the first and second ranges connect or configured to interconnect respective first and second antennas separate from each other, said first ranges being electrically isolated from the second ranges. According to other characteristics of the different modes of the module:
  • the first and second antennas are external to the module
  • the first antenna relating to the radiofrequency chip, is carried by the module and the antenna relating to the indicator is external to the module;
  • the second antenna relating to the indicator is carried by the module and the antenna relating to the radiofrequency chip is external to the module;
  • the invention also relates to a radiofrequency communication device comprising a body, at least a first and / or second radiofrequency antenna (s) in the body and an electronic module disposed in or on the body, the module being in accordance with the modes above.
  • the invention also relates to a device manufacturing method comprising a radiofrequency electronic module above.
  • the method comprises:
  • the method comprises the production of the first radiofrequency antenna, relative to said chip, so as to extend into the body and to have accessible interconnection ends, then the realization of the second antenna, relative to the indicator, on the module and connecting the second connection pads relative to the indicator, then the electrical connection of the chip to said first antenna during attachment of the module to the body, by electrical connection of the first connection pads to the interconnection ends of the first antenna;
  • the method comprises the steps of producing the second radiofrequency antenna, relative to the indicator, so as to extend into the body and to have interconnect ends accessible from the outside; realization of the first antenna, relating to the chip, on the module, by connecting the first connection pads, then electrical connection of the indicator to said second antenna during the fixing of the module to the body, by electrical connection of said second pads connecting to the interconnection ends of the second antenna.
  • the antenna of the indicator in the body can, if necessary, be used as amplifying antenna (with a capacity associated with the antenna of the indicator) of the radio frequency transponder on the module to compensate for the reduced dimensions of the transponder antenna.
  • radiofrequency of the order of 11 x 8 mm 2 to 15 x 15 mm 2 .
  • the invention provides for adding in the body of the device a third amplifying antenna connected to a capacitor in addition to that connected to the indicator.
  • Figures 1 - 3 illustrate steps of providing a device constituting or comprising a radiofrequency integrated circuit chip module, according to a first embodiment of the invention
  • FIGS. 4 to 5 illustrate steps for producing a device constituting or comprising a radiofrequency integrated circuit chip module, according to a second embodiment of the invention
  • FIGS. 6 and 7 illustrate steps for producing a device constituting or comprising a radiofrequency integrated circuit chip module, according to a third embodiment of the invention
  • FIGS. 8-9 illustrate a use of a device constituting or comprising a radiofrequency integrated circuit chip module according to the invention, FIG. 9 being an enlarged view extracted from FIG. 8.
  • the method realizes a radiofrequency integrated circuit chip module 1A;
  • This module can constitute or understand the device of the invention.
  • this radio frequency electronic module can advantageously be implemented as a smart card integrated circuit module. It comprises here an insulating substrate 2 such as a dielectric film extracted in particular from a coil or ribbon for continuous manufacture (real to real technology). However, it can be done differently on an insulating sheet.
  • the module comprises (FIG 1) also first 3, 4 and second pads 5, 6 of electrical connection to the substrate 2. These pads 5, 6 are electrically conductive and can be made by any known method including etching, depositing conductive material, material jet, plasma deposition, vacuum spraying;
  • the module also comprises (FIG 2) a radiofrequency chip 7 connecting the first connection pads 3, 4.
  • the electrical connection can be of any kind, in particular by soldered wire as here or alternatively with the flip-chip and glue.
  • the module also includes (Fig. 1) an indicator 8 of activity (light, sound, vibrator ).
  • the indicator is of the luminous type for example in the form of a component or LED diode 10. It connects the second connection pads 5, 6 here by conductive silver glue or solder, but any other connection as for the chip above is possible ,
  • the indicator indicates that the device is in an electromagnetic field of a radiofrequency device (RF) contactless reader.
  • the indicator may also indicate that the device emits itself in particular because it is of the active type with its own source of energy and generates its own activity, such as an electromagnetic field for reading or transferring. data to another radio frequency transponder or make a reminder of expiry, an alarm function ...
  • RF radiofrequency device
  • the first 3, 4 and second pads 5, 6 connect or configured to interconnect respectively a first 11 and second 12 separate antennas from each other; the first pads 3, 4 are electrically isolated from the second pads 5, 6.
  • the second antenna 12, relating to the indicator 8, is made on the module 1A;
  • the second antenna 12 also connects the second 5, 6 connection pads relative to the indicator.
  • the second antenna 12 relating to the radio frequency chip 7 is carried by the module 1A.
  • the antenna 12 is preferably made at the same time as the conductive pads 3, 4 on the substrate 2 and according to the same technology, in particular by etching copper or the like.
  • the module is here a double face, it preferably comprises a terminal block 27 of contact connectors 28 on the face opposite to that carrying the components 7, 8.
  • Plots 3A, 4A are placed here in the example as the chip that is to say substantially in the center of the antenna (and correspond to radio frequency (RF) pads LA, LB a contactless chip or here a hybrid contact and contactless chip).
  • RF radio frequency
  • the chip 7 also comprises here connections through perforations 3B, 4B of the substrate 2 to connect the terminal block 27 of external contacts 28, 29.
  • connection pads 3 and 4 are intended to electrically connect the antenna 11 which is relative to the chip 7 and which is external to the module 1C, as illustrated in Figure 2 described below.
  • this antenna 11 may be arranged on the module, in particular on the face carrying the terminal block, different from the face carrying the antenna 12.
  • the antenna 12 connected to the indicator 8 and according to the intrinsic electrical characteristics of the component may advantageously constitute a range amplifying antenna in addition to its function as an indicator for the radio frequency transponder comprising the RF chip and the antenna 11.
  • the capacitance value of the LED can be supplemented by an additional capacitance (in particular surface-mounted component type CMS or plates).
  • a capacitor is connected in parallel or in series with the indicator component in order to frequency tuning this amplifying antenna combined with an indicator such as an LED diode.
  • this amplifying antenna inductance 12, capacity in the form of LED 8
  • FIG. 3 illustrates this antenna 11 relating to the chip 7.
  • the first radiofrequency antenna 11 is made to extend into the body (or support or sheet or inlay) 13A and to have ends 23, 24 accessible interconnection.
  • this antenna 11 is preferably made by inlaying wire on a support 2A here in the form of a plastic sheet (PET, PVC, PC) but can be made with the same methods used for the antenna 12.
  • sheet 2A here constitutes an insert (or inlay) intended to be inserted in (or assembled with) other sheets.
  • the resulting assembly is intended to constitute in the example an insert or a smart card body or a sheet or a blanket such as a passport.
  • an electrical connection of the chip 7 to said first antenna 11 is carried out (FIG. 3).
  • This operation can be done during the fixing or transfer of the module 1A to the body or inlay 13A or sheet 2A, by electrical connection of the first connection pads 3, 4 to the interconnection ends 23, 24 (or antenna terminals). of the first antenna 11.
  • it is preferred to laminate sheets on the antenna then to machine a module receiving cavity C and to reveal the antenna terminals 23, 34 (and make them accessible) in the cavity and, if appropriate, to abrade the terminals.
  • DC conductive glue is then deposited with known DC removal means (syringe, nozzle, etc.) on the terminals 23, 24 of the first antenna 11 before the module is postponed and connected.
  • the module 2 can be carried forward and connected directly to a sheet 2A carrying the antenna 1 having the terminals accessible on the surface (without the cavity below). above) .
  • Cover / decoration sheets can be made and assembled to this support sheet 2A to cover the antenna and the module.
  • FIGS. 4 and 5 a second mode of implementation is illustrated.
  • the method performs as previously a radiofrequency integrated circuit chip module 1B;
  • the same references represent the same or similar elements.
  • this second embodiment implements the step of producing the first 11 and second 12 radiofrequency antennas so as to extend in the body 13A, 13B, 13C and to present each of the ends 23, 24, 25, 26 accessible interconnect; It also implements the step of electrical connection of the first 3, 4 and seconds 5, 6 connection pads of the electronic module to the corresponding ends 23, 24, 25, 26 of interconnection of their respective antenna 11, 12.
  • the module 1B in advance of the report and connection to the antennas, is made substantially like the module 1A of Figures 1 and 2, with the difference that it does not include the antenna 12 on it or at his level. It does not include tracks for redirecting the tracks 3, 4.
  • the indicator 8 directly links its tracks 5 and 6 and the chip 7 directly connects the corresponding tracks 3, 4.
  • the film 2 can be here a single face if the chip is only radiofrequency.
  • the chip here is a hybrid chip and has connections F (passing through perforations 4B of the dielectric film 2), to a contact terminal 27 located on the face opposite to that carrying the components 7, 8.
  • the module therefore simply has at least two independent components electrically isolated from each other (RF chip, LED diode) and each respectively connected to a pair of interconnect pads (3, 4 or 5, 6) which is specific to them and is isolated from the other pair of beaches.
  • This module is particularly easy to manufacture according to the smart card technology.
  • the first 11 and second 12 radio frequency antennas are made with the same methods as those used in FIG. 3 and with substantially the same configurations except that the antenna 12 for the indicator here an LED, is carried out inside the antenna 11 of the chip.
  • the respective ends 23, 24, 25, 26 of the antennas 11, 12 are accessible as in FIG. 3, either at the surface of a sheet 2A, or in a cavity C made in sheets covering the antennas or bodies, for example overmoulded device.
  • the module 1B is then transferred to the sheet or to the two-stage cavity C to electrically connect its first 3, 4 and second 5, 6 connection pads respectively to the ends of the corresponding interconnection 23, 24 and 25, 26 or otherwise after a deposit of conductive flexible bumps on the tracks 23, 24, 25, 26 of the module.
  • FIGS. 6 and 7 a third mode of implementation is illustrated.
  • this third mode provides for producing the first antenna 11, relating to the chip, on the module 1C, by connecting the first connection areas 3, 4, relating to the chip.
  • the method realizes, as in FIGS. 1 and 2, a radiofrequency integrated circuit chip module 1C;
  • the same references represent the same or similar elements.
  • the same technologies are used.
  • the module 1C has substantially the same configuration as the module 1A except that the components are switched.
  • the chip 7 takes the place of the indicator component 8.
  • the RF chip 7 is, however, always central, in particular to better connect the terminal block 27 of possible contacts. It connects the antenna 11 made on the module.
  • the indicator 8 in the form of LED diode this time includes its ranges 5, 6 located outside the antenna 11 on a first face; The indicator 8 connects the tracks 5, 6 by redirection tracks P8 passing through a face opposite to the first face (or alternatively by an insulating bridge on the antenna tracks).
  • this third mode provides (FIG 7) to make the second radiofrequency antenna 12, relative to the indicator 8, so as to extend in the body, insert or sheet 13C (similar 13A) to and have ends
  • the invention provides an electrical connection of the indicator 8 to said second antenna 12 during the attachment of the module to the body 13C, by electrical connection of said second ranges. 5, 6 connecting to the interconnection ends 25, 26 of the second antenna 12.
  • the device 13A, 13B, 13C obtained in the form of a radio frequency smart card, by any one of the three modes, is represented in use in front of a radiofrequency reader (L).
  • the reader emits an electromagnetic field (CH) opposite and near the card.
  • the card comprises a module 1A, 1B, 1C according to one of the embodiments reported in a cavity C of a card body 2A.
  • the module comprises a contact terminal 27 with contact pads 28 flush on the surface of the main face of the card body.
  • the module has at least one opening between the contacts or on one contact.
  • the range 29 corresponding to the mass range GND has an opening representing a company logo or pattern.
  • the opening 30 is outside the contact areas standardized by ISO 7816.
  • the substrate 2 comprises in all or at least in an area facing the LED indicator, a substantially translucent or transparent portion so as to let the light.
  • the antenna 12 of the light indicator 8 receives the energy of the reader in the form of electromagnetic field CH and causes a visible light emission on the main face of the card, through the contact terminal of the module.

Abstract

The invention relates to a method of fabricating a device comprising a radiofrequency electronic module (1A, 1B, 1C) comprising: - an insulating substrate (2), - first (3, 4) and second (5, 6) electrical connection lands on the substrate (2), a radiofrequency chip (7) connecting said first connection lands (3, 4), - a luminous indicator (8) connecting said second connection lands (5, 6). The invention is distinguished in that the first (3, 4) and second (5, 6) lands are connected or configured to connect respectively a first (11) and second (12) mutually distinct antennas, said first lands (3, 4) being electrically insulated from the second lands (5, 6). The invention also relates to the corresponding module and device.

Description

Procédé de fabrication d'un dispositif comprenant un module électronique radiofréquence et un indicateur Method of manufacturing a device comprising a radio frequency electronic module and an indicator
Domaine de l'invention. Field of the invention
La présente invention concerne un procédé de fabrication d'un dispositif de communication radiofréquence comportant une puce de circuit intégré et un indicateur notamment lumineux, tel une diode électroluminescente. The present invention relates to a method of manufacturing a radiofrequency communication device comprising an integrated circuit chip and a particularly bright indicator, such as a light emitting diode.
Elle s'applique particulièrement à l'indication d'activité dans des dispositifs électroniques tels que des cartes à puce avec ou sans contact ou des clés USB (Universal Sériai Bus) . L'indicateur visé par l'invention est de préférence un indicateur lumineux notamment une diode électroluminescente mais peut comprendre tout autre indicateur, (sonore, vibreur...) It is particularly applicable to the indication of activity in electronic devices such as smart cards with or without contact or USB keys (Universal Serial Bus). The indicator targeted by the invention is preferably a light indicator including a light emitting diode but may include any other indicator, (sound, vibrator ...)
Plus particulièrement, l'invention concerne des dispositifs transpondeurs radiofréquences à puce de circuit intégré sans contact tels que des supports à puce sans-contact, des cartes à puce sans contact, des étiquettes électroniques d' identification, des passeports électroniques, des dispositifs à antenne. L' invention vise notamment des documents de voyage électroniques sans-contact (passeports électroniques et visas électroniques) . More particularly, the invention relates to non-contact IC chip radio frequency transponder devices such as contactless chip media, contactless smart cards, electronic identification tags, electronic passports, antenna devices. . The invention relates in particular to electronic travel documents without contact (electronic passports and electronic visas).
Ces dispositifs visés par l'invention peuvent être conformes aux spécifications de 1 ' ICAO (acronyme de l'expression anglo-saxonne "International Civil Aviation Organization") , l'IS07816 et/ou la norme ISO/IEC 14443. Dans de tels dispositifs transpondeurs, l'antenne avec un condensateur (interne et/ou externe à une puce de circuit intégré) , forment généralement un circuit résonant. Le circuit résonant peut être passif ou actif et être relié à une puce de circuit intégré radiofréquence pour communiquer des données avec un lecteur radiofréquence . These devices subject to the invention may comply with the specifications of the ICAO (acronym for the International Civil Aviation Organization), the IS07816 and / or the ISO / IEC 14443 standard. In such transponder devices, the antenna with a capacitor (internal and / or external to an integrated circuit chip), generally form a resonant circuit. The resonant circuit may be passive or active and be connected to a radio frequency integrated circuit chip for communicating data with a radio frequency reader.
Les transpondeurs à puce radiofréquence sont utilisés dans différents domaines économiques tels que le bancaire (porte-monnaie électronique) , la communication, le transport, l'identité (e-passeport , ID-carte) . Dans le domaine de l'identité notamment, il est connu d'effectuer l'identification d'une personne par communication radiofréquence avec un objet électronique portable sans contact de type RFID. Radio frequency chip transponders are used in various economic domains such as banking (electronic purse), communication, transport, identity (e-passport, card-ID). In the field of identity in particular, it is known to perform the identification of a person by radio frequency communication with a contactless electronic object RFID-type contact.
Art antérieur. La demande de brevet EP1861813 décrit un procédé de fabrication d'un module électronique comportant au moins une puce de circuit intégré connectée à des pistes conductrices d'un support isolant et au moins une diode électroluminescente reliant ou destinée à être reliée à une antenne. Le procédé comprend une étape d'enrobage d' au moins le circuit intégré et la diode électroluminescente (LED) par une résine isolante et translucide . Problème technique. Prior art. The patent application EP1861813 describes a method of manufacturing an electronic module comprising at least one integrated circuit chip connected to conductive tracks of an insulating support and at least one light emitting diode connecting or intended to be connected to an antenna. The method comprises a step of coating at least the integrated circuit and the light emitting diode (LED) with an insulating and translucent resin. Technical problem.
De tels dispositifs ci-dessus comprenant un module de carte à puce et diode LED s'illumine lorsque la carte est dans un champ électromagnétique. La puce radiofréquence et la led sont alimentées par l'antenne de la carte radiofréquence . Such devices above including a smart card module and LED diode illuminates when the card is in an electromagnetic field. The chip radio frequency and the led are fed by the antenna of the radiofrequency card.
Il a été constaté que la carte à puce radiofréquence ne fonctionne pas toujours selon des méthodes de fabrication économiques et souples dans la mise en œuvre . It has been found that the radiofrequency smart card does not always work according to economical and flexible manufacturing methods in the implementation.
L'invention a pour objectif de proposer des structures de dispositifs à puce radiofréquence et indicateur qui fonctionnent correctement et qui soient de préférence aisées à fabriquer. The object of the invention is to propose radiofrequency chip and indicator chip structures which function correctly and which are preferably easy to manufacture.
Résumé de l'invention Summary of the invention
Contrairement à la pratique générale de l'homme de l'art consistant à brancher la diode sur la même antenne que la puce radiofréquence, l'invention propose différentes configurations de dispositifs à puce radiofréquence faciles à fabriquer présentant deux antennes distinctes, une première pour la puce radiofréquence et une seconde pour la diode LED. Contrary to the general practice of one skilled in the art of connecting the diode on the same antenna as the radio frequency chip, the invention proposes various configurations of easy-to-manufacture radiofrequency chip devices having two separate antennas, a first for the radiofrequency chip and a second for the LED diode.
Les différents éléments constitutifs sont répartis de manière à faciliter la fabrication du dispositif final tout en conservant des performances suffisantes de communication . The various components are distributed so as to facilitate the manufacture of the final device while maintaining sufficient communication performance.
Les différents assemblages proposés permettent tous d'avoir des antennes distinctes. The different assemblies proposed all allow to have separate antennas.
En effet, cette proposition résulte d'une déduction des inventeurs observant que la LED supplémentaire au circuit transpondeur radiofréquence, fait chuter la fréquence de résonnance de la carte. En conséquence, l'accord en fréquence étant décalé, la puce ne peut fonctionner correctement pour communiquer avec un lecteur radiofréquence . Les inventeurs ont remarqué aussi que cette LED ajoutée utilise une partie de l'énergie récupérée par l'antenne et destinée au circuit intégré ; La conséquence est que l'alimentation du circuit intégré est amoindrie et peut faire diminuer la distance de fonctionnement de la carte sans contact ou aller même jusqu'à empêcher son fonctionnement. Indeed, this proposal results from a deduction of the inventors observing that the additional LED to the radio frequency transponder circuit, causes the frequency of resonance of the map. As a result, the frequency tuning being shifted, the chip can not function properly to communicate with a radio frequency reader. The inventors have also noticed that this added LED uses part of the energy recovered by the antenna and intended for the integrated circuit; The consequence is that the power supply of the integrated circuit is reduced and can reduce the operating distance of the contactless card or even prevent its operation.
L' invention permet notamment de conserver des antennes standards déjà calibrées pour chaque puce. Elle permet de s'affranchir de l'influence négative d'un changement de caractéristiques électriques de la LED notamment en cas de changement de fournisseur et de modèle de LED. The invention makes it possible in particular to keep standard antennas already calibrated for each chip. It eliminates the negative influence of a change in the electrical characteristics of the LED especially in case of change of supplier and LED model.
Elle permet de découpler la fonctionnalité de la puce de celle de la LED. Ainsi, si la LED vient à ne plus fonctionner cela n'affecte plus le fonctionnement de la puce radiofréquence . It allows to decouple the functionality of the chip from that of the LED. Thus, if the LED comes to stop working it does not affect the operation of the radio frequency chip.
A cet effet, l'invention a pour objet un module électronique radiofréquence comportant un substrat isolant, des premières et secondes plages de connexion électriques sur le substrat, une puce radiofréquence connectant lesdites premières plages de connexion, un indicateur lumineux connectant lesdites secondes plages de connexion ; For this purpose, the subject of the invention is a radiofrequency electronic module comprising an insulating substrate, first and second electrical connection pads on the substrate, a radio frequency chip connecting said first connection pads, a light indicator connecting said second pads of connection. ;
Le module est caractérisé en ce que les premières et secondes plages connectent ou configurées pour interconnecter respectivement une première et seconde antennes distinctes l'une de l'autre, lesdites premières plages étant isolées électriquement des secondes plages. Selon d'autres caractéristiques des différents modes du module : The module is characterized in that the first and second ranges connect or configured to interconnect respective first and second antennas separate from each other, said first ranges being electrically isolated from the second ranges. According to other characteristics of the different modes of the module:
Les première et seconde antennes sont externes au module ;  The first and second antennas are external to the module;
La première antenne, relative à la puce radiofréquence, est portée par le module et l'antenne relative à l'indicateur est externe au module ;  The first antenna, relating to the radiofrequency chip, is carried by the module and the antenna relating to the indicator is external to the module;
- La seconde antenne relative à l'indicateur est portée par le module et l'antenne relative à la puce radiofréquence est externe au module ;  The second antenna relating to the indicator is carried by the module and the antenna relating to the radiofrequency chip is external to the module;
L'invention concerne aussi un dispositif de communication radiofréquence comprenant un corps, au moins une première et/ou seconde antenne (s) radiofréquence ( s ) dans le corps et un module électronique disposé dans ou sur le corps, le module étant conforme aux modes ci-dessus. L'invention a également pour objet un procédé de fabrication dispositif comprenant un module électronique radiofréquence ci-dessus. The invention also relates to a radiofrequency communication device comprising a body, at least a first and / or second radiofrequency antenna (s) in the body and an electronic module disposed in or on the body, the module being in accordance with the modes above. The invention also relates to a device manufacturing method comprising a radiofrequency electronic module above.
Selon d'autres étapes, le procédé comprend : According to other steps, the method comprises:
- la réalisation des première et seconde antennes radiofréquences de manière à s'étendre dans le corps et à présenter chacune des extrémités d' interconnexion accessibles de l'extérieur, puis la connexion électrique des premières et secondes plages de connexion du module électronique aux extrémités correspondantes d' interconnexion de leur antenne respective ; - Realizing the first and second radio frequency antennas so as to extend into the body and present each of the interconnection ends accessible from the outside, and then the electrical connection of the first and second connection pads of the electronic module to the corresponding ends. interconnection of their respective antenna;
- Alternativement, le procédé comprend la réalisation de la première antenne radiofréquence, relative à ladite puce, de manière à s'étendre dans le corps et à présenter des extrémités d'interconnexion accessibles, puis la réalisation de la seconde antenne, relative à l'indicateur, sur le module et en reliant les secondes plages de connexion relatives à l'indicateur, puis la connexion électrique de la puce à ladite première antenne au cours de la fixation du module au corps, par connexion électrique des premières plages de connexion aux extrémités d' interconnexion de la première antenne ; Alternatively, the method comprises the production of the first radiofrequency antenna, relative to said chip, so as to extend into the body and to have accessible interconnection ends, then the realization of the second antenna, relative to the indicator, on the module and connecting the second connection pads relative to the indicator, then the electrical connection of the chip to said first antenna during attachment of the module to the body, by electrical connection of the first connection pads to the interconnection ends of the first antenna;
Alternativement, le procédé comprend les étapes de réalisation de la seconde antenne radiofréquence, relative à l'indicateur, de manière à s'étendre dans le corps et à présenter des extrémités d' interconnexion accessibles de l'extérieur ; réalisation de la première antenne, relative à la puce, sur le module, en reliant les premières plages de connexion, puis connexion électrique de l'indicateur à ladite seconde antenne au cours de la fixation du module au corps, par connexion électrique desdites secondes plages de connexion aux extrémités d'interconnexion de la seconde antenne. Alternatively, the method comprises the steps of producing the second radiofrequency antenna, relative to the indicator, so as to extend into the body and to have interconnect ends accessible from the outside; realization of the first antenna, relating to the chip, on the module, by connecting the first connection pads, then electrical connection of the indicator to said second antenna during the fixing of the module to the body, by electrical connection of said second pads connecting to the interconnection ends of the second antenna.
L'antenne de l'indicateur dans le corps peut le cas échéant servir d'antenne amplificatrice (avec une capacité associée à l'antenne de l'indicateur) du transpondeur radiofréquence sur le module pour compenser les dimensions réduites de l'antenne de transpondeur radiofréquence (de l'ordre de 11 x 8 mm2 à 15 x 15 mm2) . Si nécessaire, l'invention prévoit d'ajouter dans le corps du dispositif une troisième antenne amplificatrice reliée à une capacité en plus de celle reliée à 1 ' indicateur . The antenna of the indicator in the body can, if necessary, be used as amplifying antenna (with a capacity associated with the antenna of the indicator) of the radio frequency transponder on the module to compensate for the reduced dimensions of the transponder antenna. radiofrequency (of the order of 11 x 8 mm 2 to 15 x 15 mm 2 ). If necessary, the invention provides for adding in the body of the device a third amplifying antenna connected to a capacitor in addition to that connected to the indicator.
Description des figures : - Les figures 1 - 3 illustrent des étapes de réalisation d'un dispositif constituant ou comprenant un module à puce de circuit intégré radiofréquence, selon un premier mode de mise en œuvre l'invention ; Description of the figures: - Figures 1 - 3 illustrate steps of providing a device constituting or comprising a radiofrequency integrated circuit chip module, according to a first embodiment of the invention;
- Les figures 4 - 5 illustrent des étapes de réalisation d'un dispositif constituant ou comprenant un module à puce de circuit intégré radiofréquence, selon un second mode de mise en œuvre l'invention ;  FIGS. 4 to 5 illustrate steps for producing a device constituting or comprising a radiofrequency integrated circuit chip module, according to a second embodiment of the invention;
- Les figures 6 - 7 illustrent des étapes de réalisation d'un dispositif constituant ou comprenant un module à puce de circuit intégré radiofréquence, selon un troisième mode de mise en œuvre l'invention ; FIGS. 6 and 7 illustrate steps for producing a device constituting or comprising a radiofrequency integrated circuit chip module, according to a third embodiment of the invention;
Les figures 8-9 illustrent une utilisation d'un dispositif constituant ou comprenant un module à puce de circuit intégré radiofréquence selon l'invention, la figure 9 étant une vue agrandie extraite de la figure 8.  FIGS. 8-9 illustrate a use of a device constituting or comprising a radiofrequency integrated circuit chip module according to the invention, FIG. 9 being an enlarged view extracted from FIG. 8.
Description . Description.
Aux figures 1 à 3, selon une première étape d'un premier mode préféré de mise en œuvre / réalisation, le procédé réalise un module 1A à puce de circuit intégré radiofréquence ; Ce module peut constituer ou comprendre le dispositif de l'invention. In FIGS. 1 to 3, according to a first step of a first preferred implementation / embodiment, the method realizes a radiofrequency integrated circuit chip module 1A; This module can constitute or understand the device of the invention.
Dans l'exemple, ce module électronique radiofréquence peut être réalisé avantageusement comme un module à circuit intégré de carte à puce. Il comprend ici un substrat isolant 2 tel un film diélectrique extrait notamment d'une bobine ou ruban pour une fabrication en continu (technologie réel to réel) . Il peut toutefois être réalisé autrement sur une feuille isolante. Le module comprend (fig. 1) également des premières 3, 4 et secondes plages 5, 6 de connexion électriques sur le substrat 2. Ces plages 5, 6 sont conductrices électriquement et peuvent être réalisées par toute méthode connue notamment par gravure, dépôt de matière conductrice, jet de matière, dépôt plasma, pulvérisation sous vide ; In the example, this radio frequency electronic module can advantageously be implemented as a smart card integrated circuit module. It comprises here an insulating substrate 2 such as a dielectric film extracted in particular from a coil or ribbon for continuous manufacture (real to real technology). However, it can be done differently on an insulating sheet. The module comprises (FIG 1) also first 3, 4 and second pads 5, 6 of electrical connection to the substrate 2. These pads 5, 6 are electrically conductive and can be made by any known method including etching, depositing conductive material, material jet, plasma deposition, vacuum spraying;
Le module comprend également (fig. 2) une puce radiofréquence 7 connectant les premières plages de connexion 3, 4. La connexion électrique peut être de toute nature notamment par fil soudé comme ici ou alternativement avec la puce retournée (flip-chip) et colle conductrice anisotropique, Ou encore puce avec bossages saillants (stud bump) associé à une colle isolante, brasure ; le report et connexion de la puce RF s'effectue ici comme pour un module de carte à puce. The module also comprises (FIG 2) a radiofrequency chip 7 connecting the first connection pads 3, 4. The electrical connection can be of any kind, in particular by soldered wire as here or alternatively with the flip-chip and glue. anisotropic conductor, or chip with protruding bosses (stud bump) associated with an insulating glue, solder; the transfer and connection of the RF chip is carried out here as for a smart card module.
Le module comprend également (fig. 1) un indicateur 8 d'activité (lumineux, sonore, vibreur...). Ici l'indicateur est de type lumineux par exemple sous forme de composant ou diode LED 10. Il connecte les secondes plages 5, 6 de connexion ici par colle argent conductrice ou brasure, mais toute autre connexion comme pour la puce ci-dessus est possible, The module also includes (Fig. 1) an indicator 8 of activity (light, sound, vibrator ...). Here the indicator is of the luminous type for example in the form of a component or LED diode 10. It connects the second connection pads 5, 6 here by conductive silver glue or solder, but any other connection as for the chip above is possible ,
L' indicateur indique que le dispositif est dans un champ électromagnétique d'un lecteur (L) sans-contact de dispositif radiofréquence . L'indicateur peut indiquer aussi que le dispositif émet de lui-même notamment parce qu'il est de type actif avec sa propre source d'énergie et génère sa propre activité, tel un champ électromagnétique pour lire ou transférer des données à un autre transpondeur radiofréquence ou effectuer un rappel d'échéance, une fonction réveil... The indicator indicates that the device is in an electromagnetic field of a radiofrequency device (RF) contactless reader. The indicator may also indicate that the device emits itself in particular because it is of the active type with its own source of energy and generates its own activity, such as an electromagnetic field for reading or transferring. data to another radio frequency transponder or make a reminder of expiry, an alarm function ...
Selon une caractéristique générale, les premières 3, 4 et secondes plages 5, 6 connectent ou configurées pour interconnecter respectivement une première 11 et seconde 12 antennes distinctes l'une de l'autre ; les premières plages 3, 4 sont isolées électriquement des secondes plages 5, 6. According to a general characteristic, the first 3, 4 and second pads 5, 6 connect or configured to interconnect respectively a first 11 and second 12 separate antennas from each other; the first pads 3, 4 are electrically isolated from the second pads 5, 6.
Selon une caractéristique du mode préféré, la seconde antenne 12, relative à l'indicateur 8, est réalisée sur le module 1A ; La seconde antenne 12 relie également les secondes 5, 6 plages de connexion relatives à 1 ' indicateur . According to a characteristic of the preferred mode, the second antenna 12, relating to the indicator 8, is made on the module 1A; The second antenna 12 also connects the second 5, 6 connection pads relative to the indicator.
Dans l'exemple préféré, (fig.l) la seconde antenne 12 relative à la puce radiofréquence 7 est portée par le module 1A. L'antenne 12 est réalisée de préférence en même temps que les plages conductrices 3, 4 sur le substrat 2 et selon la même technologie notamment par gravure de cuivre ou autre. Le module est ici un double face, il comporte de préférence un bornier 27 de connecteurs à contacts 28 sur la face opposée à celle portant les composants 7, 8. In the preferred example, (FIG. 1) the second antenna 12 relating to the radio frequency chip 7 is carried by the module 1A. The antenna 12 is preferably made at the same time as the conductive pads 3, 4 on the substrate 2 and according to the same technology, in particular by etching copper or the like. The module is here a double face, it preferably comprises a terminal block 27 of contact connectors 28 on the face opposite to that carrying the components 7, 8.
Il peut comporter des pistes de redirection (non représentée) pour interconnecter des plots 3A, 4A de connexion de la puce 7 aux plages de connexion 3, 4 situées à l'extérieur de l'antenne. Les plots 3A, 4A sont placés ici dans l'exemple comme la puce c'est à dire sensiblement au centre de l'antenne (et correspondent aux plots radiofréquences (RF) LA, LB d'une puce sans-contact ou ici une puce hybride contact et sans-contact) . It may comprise redirection tracks (not shown) for interconnecting pads 3A, 4A for connecting the chip 7 to the connection pads 3, 4 located outside the antenna. Plots 3A, 4A are placed here in the example as the chip that is to say substantially in the center of the antenna (and correspond to radio frequency (RF) pads LA, LB a contactless chip or here a hybrid contact and contactless chip).
La puce 7 comprend également ici des connexions à travers des perforations 3B, 4B du substrat 2 pour relier le bornier 27 de contacts externes 28, 29. The chip 7 also comprises here connections through perforations 3B, 4B of the substrate 2 to connect the terminal block 27 of external contacts 28, 29.
Les plages de connexion 3 et 4 sont destinées à connecter électriquement l'antenne 11 qui est relative à la puce 7 et qui est externe au module 1C, comme illustré sur la figure 2 décrite ci-après. The connection pads 3 and 4 are intended to electrically connect the antenna 11 which is relative to the chip 7 and which is external to the module 1C, as illustrated in Figure 2 described below.
Toutefois selon un mode non illustré, cette antenne 11 peut être disposée sur le module notamment sur la face portant le bornier, différente de la face portant 1 ' antenne 12. However, according to a mode that is not illustrated, this antenna 11 may be arranged on the module, in particular on the face carrying the terminal block, different from the face carrying the antenna 12.
D'une manière générale pour tous les modes, l'antenne 12 reliée à l'indicateur 8 et selon les caractéristiques électriques intrinsèque du composant, peut constituer avantageusement une antenne amplificatrice de portée en plus de sa fonction d' indicateur pour le transpondeur radiofréquence comprenant la puce RF et l'antenne 11. Le cas échéant, la valeur de capacité de la LED peut être compléter par une capacité supplémentaire (notamment composant monté en surface type CMS ou plaques) . Alternativement, une capacité est branchée en parallèle ou en série du composant de l'indicateur pour accorder en fréquence cette antenne amplificatrice combinée à un indicateur tel une diode LED. De préférence, cette antenne amplificatrice (inductance 12, capacité sous forme de LED 8) peut être plus large (en surface couverte à l'intérieur de la spirale d'antenne) que l'antenne du transpondeur à puce RF ; L'antenne peut être placée en périphérie du bornier. In general, for all the modes, the antenna 12 connected to the indicator 8 and according to the intrinsic electrical characteristics of the component, may advantageously constitute a range amplifying antenna in addition to its function as an indicator for the radio frequency transponder comprising the RF chip and the antenna 11. If necessary, the capacitance value of the LED can be supplemented by an additional capacitance (in particular surface-mounted component type CMS or plates). Alternatively, a capacitor is connected in parallel or in series with the indicator component in order to frequency tuning this amplifying antenna combined with an indicator such as an LED diode. Preferably, this amplifying antenna (inductance 12, capacity in the form of LED 8) may be wider (in the area covered inside the antenna spiral) than the antenna of the RF chip transponder; The antenna can be placed on the periphery of the terminal block.
A la figure 3, est illustrée cette antenne 11 relative à la puce 7. La première antenne 11 radiofréquence est réalisée, de manière à s'étendre dans le corps (ou support ou feuille ou inlay) 13A et à présenter des extrémités 23, 24 d'interconnexion accessibles. FIG. 3 illustrates this antenna 11 relating to the chip 7. The first radiofrequency antenna 11 is made to extend into the body (or support or sheet or inlay) 13A and to have ends 23, 24 accessible interconnection.
Dans l'exemple, cette antenne 11 est de préférence réalisée par incrustation de fil sur un support 2A ici en forme de feuille de plastique (PET, PVC, PC) mais peut être réalisée avec les mêmes méthodes utilisées pour l'antenne 12. La feuille 2A constitue ici un insert (ou inlay) destinée à être insérée dans (ou assemblée avec) d'autres feuilles. In the example, this antenna 11 is preferably made by inlaying wire on a support 2A here in the form of a plastic sheet (PET, PVC, PC) but can be made with the same methods used for the antenna 12. sheet 2A here constitutes an insert (or inlay) intended to be inserted in (or assembled with) other sheets.
L'assemblage résultant est destiné à constituer dans l'exemple un insert ou un corps de carte à puce ou une feuille ou une couverture de feuillet tel un passeport. Selon une caractéristique du premier mode, on procède (figure 3) à une connexion électrique de la puce 7 à ladite première antenne 11. The resulting assembly is intended to constitute in the example an insert or a smart card body or a sheet or a blanket such as a passport. According to a characteristic of the first mode, an electrical connection of the chip 7 to said first antenna 11 is carried out (FIG. 3).
Cette opération peut se faire au cours de la fixation ou report du module 1A au corps ou inlay 13A ou feuille 2A, par connexion électrique des premières plages 3, 4 de connexion aux extrémités d'interconnexion 23, 24 (ou bornes d'antenne) de la première antenne 11. Dans l'exemple, on préfère laminer des feuilles sur l'antenne, puis usiner une cavité C de réception de module et pour révéler les bornes 23, 34 d'antenne (et les rendre accessibles) dans la cavité et le cas échéant abraser les bornes. On dépose ensuite de la colle conductrice CC avec des moyens CC connues de dépose (seringue, buse..) sur les bornes 23, 24 de la première antenne 11 avant de reporter et connecter le module. Dans le cas, où le module ne comporte pas de bornier (la puce étant uniquement radiofréquence) , le module 2 peut être reporté et connecté directement sur une feuille 2A portant l'antenne 1 ayant les bornes accessibles en surface (sans la cavité ci-dessus) . Des feuilles de couverture / décoration peuvent être apportées et assemblées à cette feuille support 2A pour recouvrir l'antenne et le module. This operation can be done during the fixing or transfer of the module 1A to the body or inlay 13A or sheet 2A, by electrical connection of the first connection pads 3, 4 to the interconnection ends 23, 24 (or antenna terminals). of the first antenna 11. In the example, it is preferred to laminate sheets on the antenna, then to machine a module receiving cavity C and to reveal the antenna terminals 23, 34 (and make them accessible) in the cavity and, if appropriate, to abrade the terminals. DC conductive glue is then deposited with known DC removal means (syringe, nozzle, etc.) on the terminals 23, 24 of the first antenna 11 before the module is postponed and connected. In the case where the module does not include a terminal block (the chip being only radiofrequency), the module 2 can be carried forward and connected directly to a sheet 2A carrying the antenna 1 having the terminals accessible on the surface (without the cavity below). above) . Cover / decoration sheets can be made and assembled to this support sheet 2A to cover the antenna and the module.
Aux figures 4 et 5, on illustre un second mode de mise en œuvre / réalisation. Le procédé réalise comme précédemment un module 1B à puce de circuit intégré radiofréquence ; Les mêmes références représentent les mêmes éléments ou similaires. Selon une caractéristique, (fig. 5) ce second mode met en œuvre l'étape de réalisation des première 11 et seconde 12 antennes radiofréquences de manière à s'étendre dans le corps 13A, 13B, 13C et à présenter chacune des extrémités 23, 24, 25, 26 d'interconnexion accessibles ; Il met en œuvre aussi l'étape de connexion électrique des premières 3, 4 et secondes 5, 6 plages de connexion du module électronique aux extrémités correspondantes 23, 24, 25, 26 d'interconnexion de leur antenne respective 11, 12. Dans l'exemple, (fig. 4) au préalable du report et connexion aux antennes, le module 1B est réalisé sensiblement comme le module 1A des figures 1 et 2, à la différence qu'il ne comporte pas l'antenne 12 sur lui ou à son niveau. Il ne comporte pas de pistes de redirection des plages 3, 4. L'indicateur 8 relie directement ses plages 5 et 6 et la puce 7 relie directement les plages correspondantes 3, 4. In FIGS. 4 and 5, a second mode of implementation is illustrated. The method performs as previously a radiofrequency integrated circuit chip module 1B; The same references represent the same or similar elements. According to one characteristic (FIG 5) this second embodiment implements the step of producing the first 11 and second 12 radiofrequency antennas so as to extend in the body 13A, 13B, 13C and to present each of the ends 23, 24, 25, 26 accessible interconnect; It also implements the step of electrical connection of the first 3, 4 and seconds 5, 6 connection pads of the electronic module to the corresponding ends 23, 24, 25, 26 of interconnection of their respective antenna 11, 12. In the example, (FIG 4) in advance of the report and connection to the antennas, the module 1B is made substantially like the module 1A of Figures 1 and 2, with the difference that it does not include the antenna 12 on it or at his level. It does not include tracks for redirecting the tracks 3, 4. The indicator 8 directly links its tracks 5 and 6 and the chip 7 directly connects the corresponding tracks 3, 4.
Le film 2 peut être ici un simple face si la puce est uniquement radiofréquence . Toutefois, la puce est ici une puce hybride et comporte des connexions F (passant à travers des perforations 4B du film diélectrique 2), à un bornier de contacts 27 situé sur la face opposée à celle portant les composants 7, 8. The film 2 can be here a single face if the chip is only radiofrequency. However, the chip here is a hybrid chip and has connections F (passing through perforations 4B of the dielectric film 2), to a contact terminal 27 located on the face opposite to that carrying the components 7, 8.
Le module dispose donc simplement, au moins de deux composants indépendants isolés électriquement l'un de l'autre (puce RF, diode LED) et reliés chacun respectivement à une paire de plages d' interconnexion (3, 4 ou 5, 6) qui leur est spécifique et qui est isolée de l'autre paire de plages. Ce module est particulièrement aisé à fabriqué selon la technologie carte à puce. The module therefore simply has at least two independent components electrically isolated from each other (RF chip, LED diode) and each respectively connected to a pair of interconnect pads (3, 4 or 5, 6) which is specific to them and is isolated from the other pair of beaches. This module is particularly easy to manufacture according to the smart card technology.
Ensuite, de retour à la figure 5, dans l'exemple, on réalise les première 11 et seconde 12 antennes radiofréquences avec les mêmes méthodes que celles utilisées à la figure 3 et avec sensiblement les mêmes configurations sauf que l'antenne 12 pour l'indicateur ici une diode LED, est réalisée à l'intérieur de l'antenne 11 de la puce. Les extrémités respectives 23, 24, 25, 26 des antennes 11, 12 sont accessibles comme à la figure 3, soit en surface d'une feuille 2A, soit dans une cavité C réalisée dans des feuilles recouvrant les antennes ou corps par exemple surmoulé du dispositif. Then, returning to FIG. 5, in the example, the first 11 and second 12 radio frequency antennas are made with the same methods as those used in FIG. 3 and with substantially the same configurations except that the antenna 12 for the indicator here an LED, is carried out inside the antenna 11 of the chip. The respective ends 23, 24, 25, 26 of the antennas 11, 12 are accessible as in FIG. 3, either at the surface of a sheet 2A, or in a cavity C made in sheets covering the antennas or bodies, for example overmoulded device.
Après un dépôt de colle conductrice CC comme précédemment sur chaque plages, le module 1B est ensuite reporté sur la feuille ou dans la cavité C à deux étages pour connecter électriquement ses premières 3, 4 et secondes 5, 6 plages de connexion respectivement aux extrémités d'interconnexion correspondantes 23, 24 et 25, 26 ou autrement après un dépôt de plots (bumps) flexibles conducteurs sur les plages 23, 24, 25, 26 du module. After a DC conductive glue deposit as previously in each range, the module 1B is then transferred to the sheet or to the two-stage cavity C to electrically connect its first 3, 4 and second 5, 6 connection pads respectively to the ends of the corresponding interconnection 23, 24 and 25, 26 or otherwise after a deposit of conductive flexible bumps on the tracks 23, 24, 25, 26 of the module.
Aux figures 6 et 7, on illustre un troisième mode de mise en œuvre / réalisation. In FIGS. 6 and 7, a third mode of implementation is illustrated.
Selon une caractéristique, ce troisième mode prévoit de réaliser la première antenne 11, relative à la puce, sur le module 1C, en reliant les premières plages 3, 4 de connexion, relatives à la puce.  According to one characteristic, this third mode provides for producing the first antenna 11, relating to the chip, on the module 1C, by connecting the first connection areas 3, 4, relating to the chip.
Dans l'exemple, le procédé réalise comme aux figure 1, 2 un module 1C à puce de circuit intégré radiofréquence ; Les mêmes références représentent les mêmes éléments ou similaires. Les mêmes technologies son utilisées. Le module 1C a sensiblement la même configuration que le module 1A sauf que les composants sont permutés. La puce 7 prend la place du composant indicateur 8. In the example, the method realizes, as in FIGS. 1 and 2, a radiofrequency integrated circuit chip module 1C; The same references represent the same or similar elements. The same technologies are used. The module 1C has substantially the same configuration as the module 1A except that the components are switched. The chip 7 takes the place of the indicator component 8.
La puce RF 7 est cependant toujours centrale notamment pour mieux connecter le bornier 27 de contacts éventuel. Elle connecte l'antenne 11 réalisée sur le module. L' indicateur 8 sous forme de diode LED comprend cette fois ses plages 5, 6 situé à l'extérieur de l'antenne 11 sur une première face ; L' indicateur 8 relie les plages 5, 6 par des pistes de redirection P8 passant par une face opposée à la première face (ou alternativement par un pont isolant sur les pistes d'antenne) . The RF chip 7 is, however, always central, in particular to better connect the terminal block 27 of possible contacts. It connects the antenna 11 made on the module. The indicator 8 in the form of LED diode this time includes its ranges 5, 6 located outside the antenna 11 on a first face; The indicator 8 connects the tracks 5, 6 by redirection tracks P8 passing through a face opposite to the first face (or alternatively by an insulating bridge on the antenna tracks).
Ainsi, ce troisième mode prévoit (fig. 7) de réaliser la seconde antenne 12 radiofréquence, relative à l'indicateur 8, de manière à s'étendre dans le corps, insert ou feuille 13C (similaire 13A) à et à présenter des extrémités d'interconnexion 25, 26 accessibles, Selon une caractéristique de ce troisième mode, l'invention prévoit une connexion électrique de l'indicateur 8 à ladite seconde antenne 12 au cours de la fixation du module au corps 13C, par connexion électrique desdites secondes plages 5, 6 de connexion aux extrémités d'interconnexion 25, 26 de la seconde antenne 12. Thus, this third mode provides (FIG 7) to make the second radiofrequency antenna 12, relative to the indicator 8, so as to extend in the body, insert or sheet 13C (similar 13A) to and have ends According to a characteristic of this third embodiment, the invention provides an electrical connection of the indicator 8 to said second antenna 12 during the attachment of the module to the body 13C, by electrical connection of said second ranges. 5, 6 connecting to the interconnection ends 25, 26 of the second antenna 12.
Dans l'exemple, on procède sensiblement comme pour la figure 3, à la différence que ce sont maintenant les plages 25, 26 (accessibles et éventuellement révélées dans une cavité C) qui sont préalablement recouvert de colle conductrice CC . In the example, one proceeds substantially as for Figure 3, with the difference that it is now the beaches 25, 26 (accessible and possibly revealed in a cavity C) which are previously covered with conductive glue CC.
Sur les figures 8 et 9, le dispositif 13A, 13B, 13C obtenu sous forme de carte à puce radiofréquence, par l'un quelconques des trois modes, est représenté en cours d'utilisation devant un lecteur radiofréquence (L) . Le lecteur émet un champ électromagnétique (CH) en regard et à proximité de la carte. In FIGS. 8 and 9, the device 13A, 13B, 13C obtained in the form of a radio frequency smart card, by any one of the three modes, is represented in use in front of a radiofrequency reader (L). The reader emits an electromagnetic field (CH) opposite and near the card.
La carte comporte un module 1A, 1B, 1C conforme à l'un des modes de réalisation reporté dans une cavité C d'un corps 2A de carte.  The card comprises a module 1A, 1B, 1C according to one of the embodiments reported in a cavity C of a card body 2A.
Le module comporte un bornier de contacts 27 avec des plages de contacts 28 affleurant en surface de la face principale du corps de carte.  The module comprises a contact terminal 27 with contact pads 28 flush on the surface of the main face of the card body.
Le module comporte au moins une ouverture entre 31 les contacts ou sur 30 un contact. Par exemple ici la plage 29 correspondant à la plage de masse GND comporte une ouverture représentant un logo d'entreprise ou un motif quelconque .  The module has at least one opening between the contacts or on one contact. For example here the range 29 corresponding to the mass range GND has an opening representing a company logo or pattern.
L'ouverture 30 est en en dehors des zones de contact normalisés par l'ISO 7816.  The opening 30 is outside the contact areas standardized by ISO 7816.
Le substrat 2 comporte en totalité ou au moins dans une zone située en regard de l'indicateur LED, une portion sensiblement translucide ou transparente de manière à laisser passer la lumière.  The substrate 2 comprises in all or at least in an area facing the LED indicator, a substantially translucent or transparent portion so as to let the light.
Ainsi, l'antenne 12 de l'indicateur lumineux 8 reçoit l'énergie du lecteur sous forme de champ électromagnétique CH et provoque une émission de lumière visible sur la face principale de la carte, à travers le bornier de contacts du module. Thus, the antenna 12 of the light indicator 8 receives the energy of the reader in the form of electromagnetic field CH and causes a visible light emission on the main face of the card, through the contact terminal of the module.

Claims

REVENDICATIONS
1. Module électronique radiofréquence (1A, 1B, 1C) comportant : 1. Radio frequency electronic module (1A, 1B, 1C) comprising:
un substrat isolant (2),  an insulating substrate (2),
- des premières (3, 4) et secondes plages (5, 6) de connexion électriques sur le substrat, first (3, 4) and second electrical connection pads (5, 6) on the substrate,
une puce radiofréquence (7) connectant lesdites premières plages de connexion (3, 4),  a radio frequency chip (7) connecting said first connection pads (3, 4),
un indicateur lumineux (8) connectant lesdites secondes plages (5, 6) de connexion,  a light indicator (8) connecting said second connection pads (5, 6),
caractérisé en ce qu'il les premières (3,4) et secondes plages (5, 6) connectent ou configurées pour interconnecter respectivement une première (11) et seconde (12) antennes distinctes l'une de l'autre, lesdites premières plages (3,4) étant isolées électriquement des secondes plages (5, 6) . characterized in that the first (3,4) and second ranges (5, 6) connect or configured to interconnect respectively a first (11) and second (12) separate antennas from each other, said first ranges (3,4) being electrically isolated from the second pads (5, 6).
2. Module électronique radiofréquence (1A, 1B, 1C) selon la revendication 1, caractérisé en ce que lesdites première (11) et seconde (() antennes sont externes au module ( 1B) . 2. Radio frequency electronic module (1A, 1B, 1C) according to claim 1, characterized in that said first (11) and second (() antennas are external to the module (1B).
3. Module électronique radiofréquence (1A, 1B, 1C) selon la revendication 1, caractérisé en ce que ladite première antenne (11) relative à la puce radiofréquence (7) est portée par le module (1C) et l'antenne (12) relative à l'indicateur (8) est externe au module (1C) . 3. radio frequency electronic module (1A, 1B, 1C) according to claim 1, characterized in that said first antenna (11) relative to the radiofrequency chip (7) is carried by the module (1C) and the antenna (12). relating to the indicator (8) is external to the module (1C).
4. Module électronique radiofréquence (1A, 1B, 1C) selon la revendication 1, caractérisé en ce que ladite seconde antenne (12) relative à l'indicateur (8) est portée par le module (1A) et l'antenne relative à la puce radiofréquence (7) est externe au module. Radio frequency electronic module (1A, 1B, 1C) according to claim 1, characterized in that said second antenna (12) relative to the indicator (8) is carried by the module (1A) and the antenna relating to the radiofrequency chip (7) is external to the module.
5. Dispositif de communication radiofréquence (1) comprenant un corps (13A, 13B, 13C) , au moins une première (11) et/ou seconde (12) antenne (s) radiofréquence ( s ) dans le corps et un module électronique (1A, 1B, 1C) disposé dans ou sur le corps (13A, 13B, 13C) , ledit module (1A, 1B, 1C) étant conforme à l'une des revendications précédentes. Radio frequency communication device (1) comprising a body (13A, 13B, 13C), at least a first (11) and / or second (12) radiofrequency antenna (s) in the body and an electronic module ( 1A, 1B, 1C) disposed in or on the body (13A, 13B, 13C), said module (1A, 1B, 1C) being in accordance with one of the preceding claims.
6. Procédé de fabrication d'un dispositif comprenant un module électronique radiofréquence (1A, 1B, 1C) comportant : 6. A method of manufacturing a device comprising a radio frequency electronic module (1A, 1B, 1C) comprising:
un substrat isolant (2),  an insulating substrate (2),
- des premières (3, 4) et secondes (5, 6) plages de connexion électriques sur le substrat (2),  first (3, 4) and second (5, 6) electrical connection pads on the substrate (2),
une puce radiofréquence (7) connectant lesdites premières plages de connexion (3,4),  a radio frequency chip (7) connecting said first connection pads (3,4),
un indicateur lumineux (8) connectant lesdites secondes plages de connexion (5, 6) ,  a light indicator (8) connecting said second connection pads (5, 6),
caractérisé en ce que les premières (3, 4) et secondes (5, 6) plages sont connectées ou configurées pour connecter respectivement une première (11) et seconde (12) antennes distinctes l'une de l'autre, lesdites premières plages (3, 4) étant isolées électriquement des secondes plages (5, 6) . characterized in that the first (3, 4) and second (5, 6) ranges are connected or configured to respectively connect a first (11) and second (12) separate antennae from each other, said first ranges ( 3, 4) being electrically isolated from the second pads (5, 6).
7. Procédé selon la revendication précédente, caractérisé en ce qu' il comprend les étapes : 7. Method according to the preceding claim, characterized in that it comprises the steps:
- réalisation des première (11) et seconde (12) antennes radiofréquences de manière à s'étendre dans le corps (13A, 13B, 13C) et à présenter chacune des extrémités (23, 24, 25, 26) d'interconnexion accessibles, - connexion électrique des premières (3, 4) et secondes (5, 6) plages de connexion du module électronique aux extrémités correspondantes (23, 24, 25, 26) d'interconnexion de leur antenne respective (11, 12). - Realizing the first (11) and second (12) radio frequency antennas so as to extend into the body (13A, 13B, 13C) and to present each of the accessible interconnection ends (23, 24, 25, 26), - Electrical connection of the first (3, 4) and second (5, 6) connection pads of the electronic module to the corresponding ends (23, 24, 25, 26) interconnecting their respective antenna (11, 12).
8. Procédé selon la revendication 6, caractérisé en ce qu' il comprend les étapes : 8. Method according to claim 6, characterized in that it comprises the steps:
réalisation de la première (11) antenne radiofréquence, relative à ladite puce (7), de manière à s'étendre dans le corps (13A) et à présenter des extrémités (23, 24) d'interconnexion accessibles,  producing the first (11) radiofrequency antenna, relative to said chip (7), so as to extend into the body (13A) and to have accessible interconnection ends (23, 24),
réalisation de la seconde antenne (12), relative à l'indicateur (8), sur le module (1A) et en reliant les secondes (5, 6) plages de connexion relatives à 1 ' indicateur,  producing the second antenna (12), relative to the indicator (8), on the module (1A) and connecting the second (5, 6) connection pads relative to the indicator,
- connexion électrique de la puce (7) à ladite première antenne (11) au cours de la fixation du module (1A) au corps (13A), par connexion électrique des premières plages (3, 4) de connexion aux extrémités (23, 24) d'interconnexion de la première antenne (11).  - electrical connection of the chip (7) to said first antenna (11) during attachment of the module (1A) to the body (13A), by electrical connection of the first end connection pads (3, 4) (23, 24) interconnecting the first antenna (11).
9. Procédé selon la revendication 6, caractérisé en ce qu' il comprend les étapes : 9. Method according to claim 6, characterized in that it comprises the steps:
- réalisation de la seconde antenne (12) radiofréquence, relative à l'indicateur (8), de manière à s'étendre dans le corps (13C) et à présenter des extrémités d'interconnexion (25, 26) accessibles,  - Realizing the second radiofrequency antenna (12) relative to the indicator (8) so as to extend into the body (13C) and to have accessible interconnection ends (25, 26).
- réalisation de la première antenne (11), relative à la puce, sur le module (1C), en reliant les premières plages (3, 4) de connexion, relatives à la puce,  - Realization of the first antenna (11), relating to the chip, on the module (1C), by connecting the first connection areas (3, 4), relating to the chip,
connexion électrique de l'indicateur (8) à ladite seconde antenne (12) au cours de la fixation du module au corps (13C), par connexion électrique desdites secondes plages (5, 6) de connexion aux extrémités d'interconnexion (25, 26) de la seconde antenne (12) . electrical connection of the indicator (8) to said second antenna (12) during attachment of the module to the body (13C), by electrical connection of said second connection pads (5, 6) at the interconnection ends (25, 26) of the second antenna (12).
EP16760005.5A 2015-12-15 2016-08-23 Method for fabricating a device comprising a radiofrequency electronic module and an indicator Withdrawn EP3391293A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP15307011.5A EP3182338A1 (en) 2015-12-15 2015-12-15 Method for manufacturing a device including a radiofrequency electronic module and an indicator
PCT/EP2016/069907 WO2017102110A1 (en) 2015-12-15 2016-08-23 Method for fabricating a device comprising a radiofrequency electronic module and an indicator

Publications (1)

Publication Number Publication Date
EP3391293A1 true EP3391293A1 (en) 2018-10-24

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Family Applications (2)

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EP15307011.5A Withdrawn EP3182338A1 (en) 2015-12-15 2015-12-15 Method for manufacturing a device including a radiofrequency electronic module and an indicator
EP16760005.5A Withdrawn EP3391293A1 (en) 2015-12-15 2016-08-23 Method for fabricating a device comprising a radiofrequency electronic module and an indicator

Family Applications Before (1)

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EP15307011.5A Withdrawn EP3182338A1 (en) 2015-12-15 2015-12-15 Method for manufacturing a device including a radiofrequency electronic module and an indicator

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WO (1) WO2017102110A1 (en)

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Publication number Priority date Publication date Assignee Title
EP4033408A1 (en) 2021-01-22 2022-07-27 Thales DIS France SA Electronic module with indication device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2811108B1 (en) * 2000-06-29 2002-09-27 A S K NON-CONTACT PERIPHERAL DISPLAY DEVICE FOR NON-CONTACT PORTABLE OBJECT
FR2883653B1 (en) 2005-03-22 2007-05-25 Gemplus Sa ELECTRONIC MODULE AND CHIP CARD WITH LUMINOUS INDICATOR
FR2938096B1 (en) * 2008-11-03 2010-11-26 Oberthur Technologies ELECTRONIC DEVICE ALLOWING NEAR - FIELD CONTACT - FREE COMMUNICATIONS.

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WO2017102110A1 (en) 2017-06-22

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