WO2017191373A1 - Electronic module of small size for a chip card - Google Patents

Electronic module of small size for a chip card Download PDF

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Publication number
WO2017191373A1
WO2017191373A1 PCT/FR2016/000083 FR2016000083W WO2017191373A1 WO 2017191373 A1 WO2017191373 A1 WO 2017191373A1 FR 2016000083 W FR2016000083 W FR 2016000083W WO 2017191373 A1 WO2017191373 A1 WO 2017191373A1
Authority
WO
WIPO (PCT)
Prior art keywords
module
antenna
contacts
electronic module
chip
Prior art date
Application number
PCT/FR2016/000083
Other languages
French (fr)
Inventor
Bernard Calvas
Didier LIVRATI
Stephan DANLER-BAUMGARTNER
Original Assignee
Smart Packaging Solutions (S.P.S.)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smart Packaging Solutions (S.P.S.) filed Critical Smart Packaging Solutions (S.P.S.)
Priority to PCT/FR2016/000083 priority Critical patent/WO2017191373A1/en
Publication of WO2017191373A1 publication Critical patent/WO2017191373A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G06K19/0726—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs the arrangement including a circuit for tuning the resonance frequency of an antenna on the record carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07775—Antenna details the antenna being on-chip
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07794—Antenna details the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit

Definitions

  • the invention relates to an electronic module for a smart card having a dual contact and non-contact mode of operation, as well as a smart card integrating such a module.
  • smart cards use a contact and contactless communication mode.
  • these smart cards comprise a microelectronic module provided with contacts, said module having in addition a radiofrequency communication interface connected to the terminals of an antenna which is itself carried out either in the card body or on the module microelectronics itself.
  • This antenna can possibly be coupled with an amplification antenna (called "booster") located on the card body.
  • an electronic module comprising a microelectronic chip, a standard connection terminal block according to the ISO 7816 standard provided with contacts intended to be brought into contact with the corresponding terminals of a contact chip card reader, and two contact pads located on the rear panel for connection to the antenna.
  • plastic card including an antenna
  • This structure has often posed a series of problems in achieving the mechanical connection between the antenna and the module, leading to loss of reliability or manufacturing efficiency.
  • These problems have been solved by the realization a first antenna on the electronic module itself, and the realization of a larger antenna, called ID1, on the card body, so that between the microelectronic module and the antenna IDl it does not there is more mechanical connection, but only an electromagnetic connection.
  • ISO contacts may constitute a shielding capable of affecting the electromagnetic connection between the antenna of the module and the antenna of the card body.
  • 1932104 Bl consisted in making the antenna of the module in an area located substantially outside the area covered by the ISO contacts of the module, for example at the periphery of the microelectronic module.
  • the known microelectronic modules are most often in the format 11.8 mm x 13 mm, and they have up to eight contacts on the exposed metal face, as well as an antenna at the periphery of the module, having a high inductance.
  • the metallized films used in the manufacture of these modules are expensive, and the market is moving more and more towards a terminal block format of smaller contacts, 11 mm x 8.3 mm, and having only six contact.
  • the reduction of the size of the module implies that the total surface of the standardized metal contacts of the terminal block approaches the total surface of the terminal block, so that the antenna of the module must be smaller in size and made under the zone. contacts and no longer at the periphery of the contacts.
  • the metal surface of the contacts has a significant shielding effect with respect to the electromagnetic flux of the module antenna, which has the effect of increasing the resonance frequency of the module.
  • the reduction in the area of the module available for the turns of the antenna results in a reduction of the inductance L of the antenna, and consequently, for the same capacitance chip C, it also causes an increase in the resonant frequency F 0 beyond the target value.
  • This causes, all other things being equal, a reduction in communication performance between the smart card and a remote reader, for example a reduction in the range of communication.
  • an electronic module with a dual communication interface comprising an antenna whose turns and their spacing are at the micrometer scale, and holes made in the contacts.
  • the turns and holes are at the micrometer scale and are therefore very difficult and expensive to achieve at the industrial level.
  • the turns are located outside the area defined for contacts by the ISO 7816 standard, which proves that it is a "large" module, in the format 11.8 mm x 13 mm and not not a small module in the format 11 mm x 8.3 mm.
  • a general object of the invention is therefore to provide an electronic module for a smart card, provided with a double contact communication interface and without contact, which has no aforementioned drawbacks.
  • Another aim of the invention is to propose an electronic module of reduced size, in particular in the 11 mm ⁇ 8.3 mm format, with a dual contact and non-contact communication interface whose design makes it possible to obtain the desired resonance frequency despite the reduction of the size of the antenna compared to that of the larger modules and despite the effect of electromagnetic shielding due to the covering of the antenna by the module contacts.
  • Another object of the invention is to propose an electronic module for a dual-purpose dual-contact, contact-free smart card, enabling the objectives of improving the circulation of the electromagnetic flux passing through the module and maintaining a constant flow to be reconciled. sufficient communication range.
  • Another object of the invention is to propose an electronic module for a dual-contact, non-contact dual-function smart card that can easily be substituted for single-contact modules of the same size, that is to say that their integration into card bodies must be able to be done without modifications Substantial processes and industrial equipment. Summary of the invention
  • the electronic module in order to overcome the fact that the contacts occupy the bulk of the surface of the module and create an electromagnetic shielding effect with respect to the antenna of the module located under the contacts, comprises means for counteracting this shielding effect and for facilitating the flow of the electromagnetic field of the module antenna.
  • the invention provides several means, taken alone or in combination.
  • the invention has in particular for its first object an electronic module with a dual contact and contactless communication interface, having on a first face of its substrate an electrical contact terminal block allowing operation by contact with the corresponding contacts of a chip card reader and having on a second face of its substrate on the one hand an antenna located under the zone of the electrical contacts of the terminal block, and on the other hand a microelectronic chip connected to the antenna so that the module behaves as a resonant circuit having a given resonance frequency F 0 , characterized in that it furthermore comprises, in isolation or in combination, first means capable of reducing the electromagnetic shielding effect of the terminal block contacts with respect to the electromagnetic flux of the antenna, and which is in the form of openings arranged in a central zone of the terminal block located between said contacts, and second means adapted to reduce said resonance frequency F 0 and is in the form of at least one passive element arranged under the chip and connected to the module antenna.
  • Said first means making it possible to reduce the shielding effect therefore have the effect of increasing the electromagnetic permeability of the module, which is reduced in particular on the small modules (8.3 ⁇ 11 mm) whose contacts occupy the essential of the surface of the module.
  • This increase in permeability also has the second effect of reducing the resonance frequency of the module.
  • said first means are in the form of openings or recesses.
  • through-passages in at least one of the terminal block contacts and / or in a central zone of the terminal block located between the contacts, these openings being dimensioned and designed to facilitate the passage of the electromagnetic flux of the antenna through said openings.
  • these openings are in the form of a honeycomb network.
  • said openings have a diameter of about 0.4 millimeters.
  • the proportion of the surface of said openings relative to the metal surface of the terminal block is ideally between 30% and 70%.
  • said second means which make it possible to directly reduce the resonant frequency of the module with respect to a similar module from the electrical point of view (in particular from the point of view of the size and location of the antenna) are presented in the form of at least one passive element arranged below the reception area of the chip and electrically connected to the antenna.
  • This passive element is then calculated so that the resonance frequency of the module decreases, to compensate for the increase in this frequency which is also due to the reduction in the size of the antenna compared to that of a standard module having a larger antenna having turns disposed around the area of the contacts.
  • the passive element selected is therefore chosen and dimensioned so as to adjust the resonant frequency Fo of the entire module to a target value, particularly close to the frequency of 13.56 MHz corresponding to the ISO 14443 standard.
  • said passive element is a capacitive element connected in parallel to the inductance formed by the turns of the antenna, and this capacitive element can in particular be made in the form of two inter-digit metal combs arranged between the host range of the chip and the substrate of the module.
  • This structure makes it possible to maximize the metal zones opposite, and thus to produce a capacity of sufficient value.
  • said passive element is an inductive element L 'connected in series with the inductor L of the antenna and made in the form of a secondary antenna disposed between the reception range of the chip and the substrate of the module.
  • the overall inductance to be considered for the calculation of the resonance frequency is then the sum of the inductances L + L ', when the turns of the main antenna and the secondary antenna are wound in the same direction. This increased inductance makes it possible to adjust the resonant frequency downward with respect to a module without complementary inductance L '.
  • the module comprises another passive element, of resistive type, the role of which is to improve the quality factor of the module. It is in particular a passive element connected in series with the inductor L of the antenna and made in the form of a resistive coil disposed between the reception range of the chip and the substrate of the module.
  • the reduction of the resonance frequency towards a target value and the compensation of the shielding effect may require the simultaneous implementation of openings arranged in the metal zone of the contacts and a or several passive elements that may directly affect the resonant frequency of the module.
  • the invention also relates to a smart card comprising an improved electronic module and miniaturized according to the above characteristics.
  • FIGS. 1A, 2A, 3A and 4A illustrate a plan view of the contact face of four alternative embodiments of an electronic module with a dual communication interface according to the invention
  • FIGS. 1B, 2B, 3B and 4B respectively illustrate plan views of the lower face of the module, without the electronic chip, respectively corresponding to the embodiments of FIGS. 1A, 2A, 3A and 4A;
  • Figures 1C, 2C, 3C and 4C respectively show plan views similar to Figures IB, 2B, 3B and 4C, but with the chip and its coating in place;
  • Figures 1D, 2D, 3D and 4D illustrate sectional views respectively according to the cutting planes ⁇ - ⁇ ', B-B', DC and DD 'electronic modules according to Figures 1C, 2C 3C and 4C;
  • FIGS. 1E, 2E, 3E and 4E illustrate the equivalent electrical diagrams of the electronic modules respectively according to FIGS. 1C, 2C, 3C and 4C. detailed description
  • FIG. 1A is a plan view of the upper face of an electronic module 1 for a smart card with mixed contact and non-contact operation.
  • the upper face of the module is the one that remains visible when the module is mounted in the receiving cavity of a smart card.
  • the metal contacts C1, C2, C3, C5, C6, C7 are the six contacts of a small module (11 x 8.3 mm), whereas the larger conventional modules (11.8 x 13 mm) ) usually have up to eight contacts.
  • the module 1 comprises an antenna 2 typically composed of several turns made by etching the metal film of the module.
  • This figure also shows the mark 3 which defines the reception area of the microelectronic chip, as well as the mark 4 which delimits the position and the size of a drop of coating resin of the chip, known per se. .
  • markers facilitate the introduction of the chip and the coating resin drop by automated equipment equipped with image recognition means.
  • the antenna turns outside the area of the contacts are located at the periphery of the module, on the face opposite the face of the contacts Cl ... C7 and below these contacts.
  • This structure has the consequence that the contacts C1 ... C7 have a shielding effect with regard to the electromagnetic field of the antenna, which has repercussions on the communication performance of the module, and notably causes a reduction of the range. and the quality of communication with the ID1 antenna of the smart card, or with the antenna of a smart card reader.
  • the size of the antenna and therefore its inductance is also reduced relative to the inductance of the corresponding antenna of a large module.
  • This reduction of the inductance has the effect of increasing the resonant frequency of the module and therefore of moving away from the target resonant frequency of the communication protocol between smart card and reader.
  • an embodiment of the invention provides for arranging in the central zone contacts (which in fact corresponds to an extension of the contact C5), a series of openings 8 or through recesses in the metal layer of the contacts.
  • these openings 8 are arranged only in the central zone of the module so as not to affect the useful area of the contacts, but if necessary, openings can also be made on the contacts themselves as long as they do not fall into areas that the standard requires to be solid metal.
  • the openings 8 are circular, or hexagonal, which creates in the center of the module a grid 9 which has the appearance of a honeycomb structure, the mechanical strength of which is known to be known. is high.
  • the openings 8 make it possible to facilitate the circulation of the electromagnetic flux of the module and to reduce the shielding effect due to the contacts.
  • An internal via 5 a so-called “strap” connection 6 and an external via 7 are provided, in known manner, for connecting the distal end of the antenna 2, to the stud corresponding connection of the chip.
  • FIG. 1C shows the lower face of the module after the chip has been returned to its reception zone, and protection with the aid of a drop of resin therein.
  • Metal wires 12 make it possible to connect the contact pads of the chip, to the ends of the antenna 2, or to the appropriate contacts Ci.
  • the figure in section 1D corresponds to the cutting plane AA 'and shows in particular the chip 10 bonded to the substrate 13 with the aid of a glue layer 14. It also shows (a metal grid 9 and the openings 8 which allow to reduce the shielding effect of the module contacts with respect to the antenna 2.
  • FIG. 1E shows the equivalent electrical diagram of the complete module, with, on the one hand, the impedance Z p of the chip constituted by a resistor R in parallel with a capacitance C, and on the other hand the inductance L of the antenna 2.
  • FIGS. 2A to 2E the same elements as in FIG. 1 are assigned the same reference numbers.
  • FIGS. 2A to 2E the upper face of FIG. module (Figure 2A) is identical to that of Figure 1A, with openings 8 arranged in the metal area between the contacts.
  • a passive element C is positioned on the reception zone of the chip, as represented in FIG. 2D.
  • This is a capacity, C made in particular using two metal combs 15,16 inter digités, whose fingers facing form a capacity.
  • This capacitor C is connected in parallel with the inductor antenna 2 L, as shown in Figure 2E.
  • the addition of the capacitor C makes it possible to increase the LC factor, and consequently to adjust the resonant frequency of the module downward, with respect to a module without this capacitance.
  • the upper face of the module (FIG. 3A) is identical to those of FIGS. 1A and 2A, with openings 8, except that it furthermore comprises two vias 18,19 and a strap 20 which allow to connect in the antenna circuit another passive element L 'which is in fact a secondary antenna.
  • this secondary antenna L ' has turns placed in the zone of reception of the chip 10, replacing the capacitance C of FIG. 2D.
  • FIGS. 4A to 4E the upper face of the module (FIG. 4A) is identical to those of FIGS. 1A and 2A, with openings 8 in the inter-contact metal zone.
  • a resistive-type passive element R ' is connected in series with the antenna 2 of inductance L.
  • This element R' is in particular embodied in the form of a metal coil and disposed in the zone of FIG. receiving the chip 10, replacing the capacitance C of FIG. 2D or the inductance L 'of FIG. 3D.
  • this element R 'does not affect directly the resonance frequency of the module.
  • it makes it possible to improve the factor of quality of the module, which expresses in the form Q Lw / R.
  • the invention responds to the goals set and makes it possible to compensate for the effects of electromagnetic shielding of certain smart card modules with dual contact and non-contact operation. It is all the more useful that the module is small and requires that the turns of the antenna are located opposite the metal contacts, for lack of space to arrange the turns of the antenna around the terminal block of the module or between terminal block contacts.
  • the invention By varying the size and density of the openings made in the metal zones and the values of the passive elements integrated in the antenna circuit, it is possible thanks to the invention to adjust the resonant frequency of the module for the bring to a target value determined by the communication protocol with the reader, and adjust the quality factor Q.

Abstract

The invention relates to an electronic module (1) having a dual, contact and contactless, communication interface, having, on a first face of its substrate (13), an electrical contact terminal block (C1, C2, C3, C5, C6, C7) allowing operation by contact with the corresponding contacts of a chip card reader and having, on a second face of its substrate (13), both an antenna (2) located below the zone of the electrical contacts of the terminal block and a microelectronic chip (10) that is connected to the antenna (2) such that the module behaves like a resonant circuit having a certain given resonant frequency F0, characterized in that it also includes, either alone or in combination, first means (8) that are capable of decreasing the electromagnetic shielding effect of the terminal block contacts with respect to the electromagnetic flux of the antenna, and taking the form of openings (8) made in a central zone of the terminal block, which zone is located between said contacts, and second means (L'; C') that are capable of decreasing said resonant frequency F0 and taking the form of at least one passive element (C'; L') formed below the chip (10) and connected to the antenna (2) of the module.

Description

Module électronique de taille réduite pour carte à puce  Electronic module of reduced size for smart card
L'invention concerne un module électronique pour une carte à puce ayant un mode de fonctionnement dual à contact et sans contact, ainsi qu'une carte à puce intégrant un tel module. Etat de la technique The invention relates to an electronic module for a smart card having a dual contact and non-contact mode of operation, as well as a smart card integrating such a module. State of the art
Il existe déjà dans l'état de la technique, plusieurs types de cartes à puce, à fonctionnement par contact avec les contacts d'un lecteur, ou à fonctionnement mixte avec contact et sans contact, ou encore à fonctionnement seulement sans contact, c'est-à-dire uniquement à l'aide d'une communication radiofréquence avec un lecteur de carte à puce.  Already existing in the state of the art, several types of smart cards, operating by contact with the contacts of a reader, or with mixed operation with contact and without contact, or even operating only contactless, it that is to say only using a radio frequency communication with a smart card reader.
Un nombre croissant de cartes à puce utilise un mode de communication mixte à contact et sans contact. A cet effet, ces cartes à puce comportent un module microélectronique pourvu de contacts, ledit module ayant en outre une interface de communication radiofréquence connectée aux bornes d'une antenne qui est elle- même réalisée soit dans le corps de carte, soit sur le module microélectronique lui- même. Cette antenne pouvant éventuellement être couplée avec une antenne d'amplification (dite « booster ») située sur le corps de carte.  An increasing number of smart cards use a contact and contactless communication mode. For this purpose, these smart cards comprise a microelectronic module provided with contacts, said module having in addition a radiofrequency communication interface connected to the terminals of an antenna which is itself carried out either in the card body or on the module microelectronics itself. This antenna can possibly be coupled with an amplification antenna (called "booster") located on the card body.
La plupart des cartes à double interface de communication conformes à l'état de la technique sont constituées :  Most dual communication interface cards according to the state of the art consist of:
- d'un module électronique comportant une puce microélectronique, un bornier de connexion normalisé selon la norme ISO 7816 pourvu de contacts destinés à être mis en contact avec les bornes correspondantes d'un lecteur de carte à puce à contact, et deux plots de contact situés en face arrière permettant la connexion à l'antenne.  an electronic module comprising a microelectronic chip, a standard connection terminal block according to the ISO 7816 standard provided with contacts intended to be brought into contact with the corresponding terminals of a contact chip card reader, and two contact pads located on the rear panel for connection to the antenna.
- d'une carte en matière plastique, comportant une antenne  - a plastic card, including an antenna
- d'un matériau électriquement conducteur permettant la connexion entre le module électronique et l'antenne.  - An electrically conductive material for the connection between the electronic module and the antenna.
Cette structure a souvent posé une série de problèmes de réalisation de la connexion mécanique entre l'antenne et le module, induisant des pertes de fiabilité ou de rendement de fabrication. Ces problèmes ont été résolus par la réalisation d'une première antenne sur le module électronique lui-même, et la réalisation d'une antenne de plus grande taille, dite IDl, sur le corps de carte, de sorte qu'entre le module microélectronique et l'antenne IDl il n'y ait plus de connexion mécanique, mais seulement une liaison électromagnétique. This structure has often posed a series of problems in achieving the mechanical connection between the antenna and the module, leading to loss of reliability or manufacturing efficiency. These problems have been solved by the realization a first antenna on the electronic module itself, and the realization of a larger antenna, called ID1, on the card body, so that between the microelectronic module and the antenna IDl it does not there is more mechanical connection, but only an electromagnetic connection.
Cependant, la performance de communication d'une antenne disposée sur le module électronique est gênée par la présence des contacts selon la norme ISO 7816, dits « contacts ISO », qui peuvent constituer un blindage susceptible d'affecter la liaison électromagnétique entre l'antenne du module et l'antenne du corps de carte.  However, the communication performance of an antenna disposed on the electronic module is hampered by the presence of contacts according to ISO 7816, known as "ISO contacts", which may constitute a shielding capable of affecting the electromagnetic connection between the antenna of the module and the antenna of the card body.
Afin de minimiser ce problème, une solution décrite dans le brevet EP In order to minimize this problem, a solution described in the EP patent
1932104 Bl a consisté à réaliser l'antenne du module dans une zone située sensiblement en-dehors de la zone couverte par les contacts ISO du module, par exemple en périphérie du module microélectronique. 1932104 Bl consisted in making the antenna of the module in an area located substantially outside the area covered by the ISO contacts of the module, for example at the periphery of the microelectronic module.
Cependant, les modules microélectroniques connus sont la plupart du temps au format 11.8 mm x 13 mm, et ils possèdent jusqu'à huit contacts sur la face métallique apparente, ainsi qu'une antenne en périphérie du module, présentant une inductance élevée. La fréquence de résonance du module s'écrit alors Fo = l/2m/tC, où L désigne l'inductance de l'antenne et C la capacité de la puce, ces valeurs étant choisies pour que la fréquence de résonance F0 soit proche de la fréquence de porteuse normalisée de 13,56 Mhz. However, the known microelectronic modules are most often in the format 11.8 mm x 13 mm, and they have up to eight contacts on the exposed metal face, as well as an antenna at the periphery of the module, having a high inductance. The resonance frequency of the module is then written Fo = 1 / 2m / tC, where L denotes the inductance of the antenna and C the capacitance of the chip, these values being chosen so that the resonant frequency F 0 is close the standardized carrier frequency of 13.56 MHz.
Or les films métallisés utilisés dans la fabrication de ces modules sont coûteux, et le marché s'oriente de plus en plus vers un format de bornier de contacts de dimensions plus réduites, de 11 mm x 8,3 mm, et ne comportant que six contacts. En outre, la réduction de la taille du module implique que la surface totale des contacts métalliques normalisés du bornier se rapproche de la surface totale du bornier, de sorte que l'antenne du module doive être de plus petite taille, et réalisée sous la zone des contacts et non plus en périphérie des contacts. Dans cette configuration, la surface métallique des contacts a un effet de blindage non négligeable à l'égard du flux électromagnétique de l'antenne du module, ce qui a pour effet de faire augmenter la fréquence de résonance du module. En outre, la réduction de la surface du module disponible pour les spires de l'antenne entraîne une réduction de l'inductance L de l'antenne, et par conséquent, pour une même puce de capacité C, elle entraine également une augmentation de la fréquence de résonance F0 au-delà de la valeur cible. Ceci entraine à son tour, toutes autres choses étant égales par ailleurs, une réduction des performances de communication entre la carte à puce et un lecteur distant, par exemple une réduction de la portée de communication. However, the metallized films used in the manufacture of these modules are expensive, and the market is moving more and more towards a terminal block format of smaller contacts, 11 mm x 8.3 mm, and having only six contact. In addition, the reduction of the size of the module implies that the total surface of the standardized metal contacts of the terminal block approaches the total surface of the terminal block, so that the antenna of the module must be smaller in size and made under the zone. contacts and no longer at the periphery of the contacts. In this configuration, the metal surface of the contacts has a significant shielding effect with respect to the electromagnetic flux of the module antenna, which has the effect of increasing the resonance frequency of the module. In addition, the reduction in the area of the module available for the turns of the antenna results in a reduction of the inductance L of the antenna, and consequently, for the same capacitance chip C, it also causes an increase in the resonant frequency F 0 beyond the target value. This in turn causes, all other things being equal, a reduction in communication performance between the smart card and a remote reader, for example a reduction in the range of communication.
On connaît par ailleurs de par le document WO 2014/016332 un module électronique à double interface de communication, comportant une antenne dont les spires et leur écartement sont à l'échelle micrométrique, et des trous réalisés dans les contacts. Les spires et les trous sont à l'échelle micrométrique et sont donc très difficiles et coûteux à réaliser à l'échelon industriel. En outre, les spires sont situées à l'extérieur de la zone définie pour les contacts par la norme ISO 7816, ce qui prouve qu'il s'agit d'un « grand » module, au format 11.8 mm x 13 mm et non pas un petit module au format 11 mm x 8,3 mm. Buts de l'invention  Also known from WO 2014/016332 an electronic module with a dual communication interface, comprising an antenna whose turns and their spacing are at the micrometer scale, and holes made in the contacts. The turns and holes are at the micrometer scale and are therefore very difficult and expensive to achieve at the industrial level. In addition, the turns are located outside the area defined for contacts by the ISO 7816 standard, which proves that it is a "large" module, in the format 11.8 mm x 13 mm and not not a small module in the format 11 mm x 8.3 mm. Goals of the invention
Un but général de l'invention est par conséquent de proposer un module électronique pour carte à puce, pourvu d'une double interface de communication à contact et sans contact, qui soit dépourvu des inconvénients précités.  A general object of the invention is therefore to provide an electronic module for a smart card, provided with a double contact communication interface and without contact, which has no aforementioned drawbacks.
Un autre but de l'invention est de proposer un module électronique de taille réduite, notamment au format 11 mm x 8,3 mm à double interface de communication à contact et sans contact dont la conception permette d'obtenir la fréquence de résonance visée malgré la diminution de la taille de l'antenne par rapport à celle des modules de plus grande taille et malgré l'effet de blindage électromagnétique dû au recouvrement de l'antenne par les contacts du module.  Another aim of the invention is to propose an electronic module of reduced size, in particular in the 11 mm × 8.3 mm format, with a dual contact and non-contact communication interface whose design makes it possible to obtain the desired resonance frequency despite the reduction of the size of the antenna compared to that of the larger modules and despite the effect of electromagnetic shielding due to the covering of the antenna by the module contacts.
Un autre but de l'invention est de proposer un module électronique pour carte à puce duale à fonctionnement mixte à contact et sans contact, permettant de concilier les objectifs d'amélioration de la circulation du flux électromagnétique traversant le module et de maintien d'une portée de communication suffisante.  Another object of the invention is to propose an electronic module for a dual-purpose dual-contact, contact-free smart card, enabling the objectives of improving the circulation of the electromagnetic flux passing through the module and maintaining a constant flow to be reconciled. sufficient communication range.
Un autre but de l'invention est de proposer un module électronique pour carte à puce duale à fonctionnement mixte à contact et sans contact pouvant se substituer facilement aux modules à contacts seuls de même taille, c'est-à-dire que leur intégration dans les corps de carte doit pouvoir se faire sans modifications substantielles des processus et des équipements industriels. Résumé de l'invention Another object of the invention is to propose an electronic module for a dual-contact, non-contact dual-function smart card that can easily be substituted for single-contact modules of the same size, that is to say that their integration into card bodies must be able to be done without modifications Substantial processes and industrial equipment. Summary of the invention
Selon l'invention, le module électronique, afin de pallier au fait que les contacts occupent l'essentiel de la surface du module et créent un effet de blindage électromagnétique à l'égard de l'antenne du module située sous les contacts, comporte des moyens pour contrecarrer cet effet de blindage et pour faciliter la circulation du champ électromagnétique de l'antenne du module.  According to the invention, the electronic module, in order to overcome the fact that the contacts occupy the bulk of the surface of the module and create an electromagnetic shielding effect with respect to the antenna of the module located under the contacts, comprises means for counteracting this shielding effect and for facilitating the flow of the electromagnetic field of the module antenna.
L'invention prévoit plusieurs moyens, pris isolément ou en combinaison.  The invention provides several means, taken alone or in combination.
Ainsi, l'invention a en particulier pour premier objet un module électronique à double interface de communication à contact et sans contact, présentant sur une première face de son substrat un bornier de contacts électriques permettant un fonctionnement par contact avec les contacts correspondants d'un lecteur de carte à puce et présentant sur une seconde face de son substrat d'une part une antenne située sous la zone des contacts électriques du bornier, et d'autre part une puce microélectronique connectée à l'antenne de sorte que le module se comporte comme un circuit résonant ayant une certaine fréquence de résonance donnée F0, caractérisé en ce qu'il comporte en outre, isolément ou en combinaison, des premiers moyens aptes à réduire l'effet de blindage électromagnétique des contacts du bornier à l'égard du flux électromagnétique de l'antenne, et se présentant sous la forme d'ouvertures aménagées dans une zone centrale du bornier située entre lesdits contacts, et des seconds moyens aptes à réduire ladite fréquence de résonance F0 et se présentant sous la forme d'au moins un élément passif aménagé sous la puce et connecté à l'antenne du module. Thus, the invention has in particular for its first object an electronic module with a dual contact and contactless communication interface, having on a first face of its substrate an electrical contact terminal block allowing operation by contact with the corresponding contacts of a chip card reader and having on a second face of its substrate on the one hand an antenna located under the zone of the electrical contacts of the terminal block, and on the other hand a microelectronic chip connected to the antenna so that the module behaves as a resonant circuit having a given resonance frequency F 0 , characterized in that it furthermore comprises, in isolation or in combination, first means capable of reducing the electromagnetic shielding effect of the terminal block contacts with respect to the electromagnetic flux of the antenna, and which is in the form of openings arranged in a central zone of the terminal block located between said contacts, and second means adapted to reduce said resonance frequency F 0 and is in the form of at least one passive element arranged under the chip and connected to the module antenna.
Lesdits premiers moyens permettant de réduire l'effet de blindage ont donc pour effet d'augmenter la perméabilité électromagnétique du module, qui est réduite en particulier sur les modules de petite taille (8,3 x 11 mm) dont les contacts occupent l'essentiel de la surface du module. Cette augmentation de la perméabilité a également comme second effet la réduction de la fréquence de résonance du module.  Said first means making it possible to reduce the shielding effect therefore have the effect of increasing the electromagnetic permeability of the module, which is reduced in particular on the small modules (8.3 × 11 mm) whose contacts occupy the essential of the surface of the module. This increase in permeability also has the second effect of reducing the resonance frequency of the module.
Selon un premier mode de réalisation avantageux de l'invention, lesdits premiers moyens se présentent sous la forme d'ouvertures ou d'évidements traversants aménagés dans au moins l'un des contacts du bornier et/ou dans une zone centrale du bornier située entre les contacts, ces ouvertures étant dimensionnés et conçues pour faciliter le passage du flux électromagnétique de l'antenne à travers lesdites ouvertures. According to a first advantageous embodiment of the invention, said first means are in the form of openings or recesses. through-passages in at least one of the terminal block contacts and / or in a central zone of the terminal block located between the contacts, these openings being dimensioned and designed to facilitate the passage of the electromagnetic flux of the antenna through said openings.
Dans un mode de réalisation particulièrement avantageux qui permet en outre d'assurer une cohésion mécanique optimale du module, ces ouvertures se présentent sous la forme d'un réseau en nid d'abeille.  In a particularly advantageous embodiment which also makes it possible to ensure optimal mechanical cohesion of the module, these openings are in the form of a honeycomb network.
Dans un mode de réalisation avantageux, lesdites ouvertures ont un diamètre d'environ 0,4 millimètre. Par ailleurs, la proportion de la surface desdites ouvertures par rapport à la surface métallique du bornier est idéalement comprise entre 30 % et 70 %.  In an advantageous embodiment, said openings have a diameter of about 0.4 millimeters. Moreover, the proportion of the surface of said openings relative to the metal surface of the terminal block is ideally between 30% and 70%.
Selon l'invention, lesdits seconds moyens qui permettent de réduire directement la fréquence de résonance du module par rapport à un module similaire du point de vue électrique (notamment du point de vue de la taille et de la localisation de l'antenne) se présentent sous la forme d'au moins un élément passif aménagé sous la plage d'accueil de la puce et électriquement connecté à l'antenne. Cet élément passif est alors calculé de manière que la fréquence de résonance du module diminue, pour compenser l'augmentation de cette fréquence qui est due par ailleurs à la réduction de la taille de l'antenne par rapport à celle d'un module standard ayant une antenne de plus grande taille ayant des spires disposées autour de la zone des contacts. L'élément passif retenu est donc choisi et dimensionné de manière à ajuster la fréquence de résonance Fo de l'ensemble du module vers une valeur cible, notamment proche de la fréquence de 13,56 Mhz correspondant à la norme ISO 14443. According to the invention, said second means which make it possible to directly reduce the resonant frequency of the module with respect to a similar module from the electrical point of view (in particular from the point of view of the size and location of the antenna) are presented in the form of at least one passive element arranged below the reception area of the chip and electrically connected to the antenna. This passive element is then calculated so that the resonance frequency of the module decreases, to compensate for the increase in this frequency which is also due to the reduction in the size of the antenna compared to that of a standard module having a larger antenna having turns disposed around the area of the contacts. The passive element selected is therefore chosen and dimensioned so as to adjust the resonant frequency Fo of the entire module to a target value, particularly close to the frequency of 13.56 MHz corresponding to the ISO 14443 standard.
Plusieurs types d'éléments passifs peuvent être utilisés par l'invention.  Several types of passive elements may be used by the invention.
Selon un premier mode de réalisation avantageux, ledit élément passif est un élément capacitif connecté en parallèle à l'inductance constituée par les spires de l'antenne, et cet élément capacitif peut notamment être réalisé sous la forme de deux peignes métalliques inter digités disposés entre la plage d'accueil de la puce et le substrat du module. Cette structure permet de maximiser les zones métalliques en regard, et donc de produire une capacité de valeur suffisante. Selon un autre mode de réalisation, ledit élément passif est un élément inductif L' connecté en série avec l'inductance L de l'antenne et réalisé sous la forme d'une antenne secondaire disposée entre la plage d'accueil de la puce et le substrat du module. L'inductance globale à considérer pour le calcul de la fréquence de résonance est alors la somme des inductances L + L', lorsque les spires de l'antenne principale et de l'antenne secondaire sont enroulées dans le même sens. Cette inductance augmentée permet d'ajuster la fréquence de résonance à la baisse par rapport à un module sans inductance complémentaire L'. According to a first advantageous embodiment, said passive element is a capacitive element connected in parallel to the inductance formed by the turns of the antenna, and this capacitive element can in particular be made in the form of two inter-digit metal combs arranged between the host range of the chip and the substrate of the module. This structure makes it possible to maximize the metal zones opposite, and thus to produce a capacity of sufficient value. According to another embodiment, said passive element is an inductive element L 'connected in series with the inductor L of the antenna and made in the form of a secondary antenna disposed between the reception range of the chip and the substrate of the module. The overall inductance to be considered for the calculation of the resonance frequency is then the sum of the inductances L + L ', when the turns of the main antenna and the secondary antenna are wound in the same direction. This increased inductance makes it possible to adjust the resonant frequency downward with respect to a module without complementary inductance L '.
Selon un autre aspect de l'invention, le module comporte un autre élément passif, de type résistif, dont le rôle consiste à améliorer le facteur de qualité du module. Il s'agit notamment d'un élément passif connecté en série avec l'inductance L de l'antenne et réalisé sous la forme d'un serpentin résistif disposé entre la plage d'accueil de la puce et le substrat du module.  According to another aspect of the invention, the module comprises another passive element, of resistive type, the role of which is to improve the quality factor of the module. It is in particular a passive element connected in series with the inductor L of the antenna and made in the form of a resistive coil disposed between the reception range of the chip and the substrate of the module.
Bien entendu, en tant que de besoin, la réduction de la fréquence de résonance vers une valeur cible et la compensation de l'effet de blindage peuvent nécessiter la mise en uvre simultanée d'ouvertures aménagées dans la zone métallique des contacts et d'un ou de plusieurs éléments passifs susceptibles d'affecter directement la fréquence de résonance du module.  Of course, as necessary, the reduction of the resonance frequency towards a target value and the compensation of the shielding effect may require the simultaneous implementation of openings arranged in the metal zone of the contacts and a or several passive elements that may directly affect the resonant frequency of the module.
L'invention a également pour objet une carte à puce comprenant un module électronique perfectionné et miniaturisé selon les caractéristiques ci-dessus.  The invention also relates to a smart card comprising an improved electronic module and miniaturized according to the above characteristics.
D'autres caractéristiques et avantages de l'invention apparaîtront à la lecture de la description détaillée et des dessins annexés dans lesquels :  Other features and advantages of the invention will appear on reading the detailed description and the accompanying drawings in which:
- les figures 1A, 2A, 3A et 4A illustrent une vue en plan de la face contact de quatre variantes de réalisation d'un module électronique à double interface de communication selon l'invention;  FIGS. 1A, 2A, 3A and 4A illustrate a plan view of the contact face of four alternative embodiments of an electronic module with a dual communication interface according to the invention;
- les figures 1B, 2B, 3B et 4B illustrent respectivement des vues en plan de la face inférieure du module, sans la puce électronique, correspondant respectivement aux modes de réalisation des figures 1A, 2A,3A et 4A ;  FIGS. 1B, 2B, 3B and 4B respectively illustrate plan views of the lower face of the module, without the electronic chip, respectively corresponding to the embodiments of FIGS. 1A, 2A, 3A and 4A;
- les figures 1C, 2C, 3C et 4C illustrent respectivement des vues en plan similaires aux figures IB, 2B, 3B et 4C, mais avec la puce et son enrobage en place ;  - Figures 1C, 2C, 3C and 4C respectively show plan views similar to Figures IB, 2B, 3B and 4C, but with the chip and its coating in place;
- les figures 1D, 2D, 3D et 4D illustrent des vues en coupe respectivement selon les plans de coupe Α-Α', B-B', C-C et D-D' des modules électroniques selon les figures 1C, 2C 3C et 4C ; - Figures 1D, 2D, 3D and 4D illustrate sectional views respectively according to the cutting planes Α-Α ', B-B', DC and DD 'electronic modules according to Figures 1C, 2C 3C and 4C;
- les figures 1E, 2E, 3E et 4E illustrent les schémas équivalents électriques des modules électroniques respectivement selon les figures 1C, 2C, 3C et 4C. Description détaillée  FIGS. 1E, 2E, 3E and 4E illustrate the equivalent electrical diagrams of the electronic modules respectively according to FIGS. 1C, 2C, 3C and 4C. detailed description
Les figures 1A à 1E illustrent un premier mode de réalisation de l'invention. La figure 1A est une vue en plan de la face supérieure d'un module électronique 1 pour carte à puce à fonctionnement mixte à contact et sans contact. La face supérieure du module est celle qui reste visible lorsque le module est monté dans la cavité de réception d'une carte à puce. Les contacts métalliques Cl, C2, C3, C5, C6, C7 sont les six contacts d'un module de petite taille (11 x 8,3 mm), sachant que les modules classiques de plus grande taille (11,8 x 13 mm) comportent en général jusqu'à huit contacts.  Figures 1A to 1E illustrate a first embodiment of the invention. FIG. 1A is a plan view of the upper face of an electronic module 1 for a smart card with mixed contact and non-contact operation. The upper face of the module is the one that remains visible when the module is mounted in the receiving cavity of a smart card. The metal contacts C1, C2, C3, C5, C6, C7 are the six contacts of a small module (11 x 8.3 mm), whereas the larger conventional modules (11.8 x 13 mm) ) usually have up to eight contacts.
Gomme cela est visible sur la figure 1B qui montre la face inférieure du module (sans la puce et sans l'enrobage de protection de la puce), le module 1 comporte une antenne 2 typiquement composée de plusieurs spires réalisées par gravure du film métallique du module. On a également représenté dans cette figure le repère 3 qui délimite la zone d'accueil de la puce microélectronique, ainsi que le repère 4 qui délimite la position et la taille d'une goutte de résine d'enrobage de la puce, connue en soi. Ces repères facilitent la mise en place de la puce et de la goutte de résine d'enrobage par des équipements automatisés équipés de moyens de reconnaissance d'image.  As can be seen in FIG. 1B, which shows the lower face of the module (without the chip and without the protective coating of the chip), the module 1 comprises an antenna 2 typically composed of several turns made by etching the metal film of the module. This figure also shows the mark 3 which defines the reception area of the microelectronic chip, as well as the mark 4 which delimits the position and the size of a drop of coating resin of the chip, known per se. . These markers facilitate the introduction of the chip and the coating resin drop by automated equipment equipped with image recognition means.
Compte tenu de l'absence d'espace à l'extérieur de la zone des contacts Cl ... C7, il n'est pas possible comme dans le cas de certains modules de plus grande taille, comme celui décrit dans le document WO 2014/016332, de disposer les spires d'antennes à l'extérieur de la zone des contacts. Les spires de l'antenne 2 sont donc situées en périphérie du module, sur la face opposée à la face des contacts Cl ... C7 et en dessous de ces contacts. Cette structure a pour conséquence que les contacts Cl ... C7 ont un effet de blindage à l'égard du champ électromagnétique de l'antenne, qui a des répercussions sur la performance de communication du module, et provoque notamment une réduction de la portée et de la qualité de communication avec l'antenne ID1 de la carte à puce, ou avec l'antenne d'un lecteur de carte à puce. Given the lack of space outside the area of the contacts Cl ... C7, it is not possible as in the case of certain modules of larger size, like that described in the document WO 2014 / 016332, to arrange the antenna turns outside the area of the contacts. The turns of the antenna 2 are located at the periphery of the module, on the face opposite the face of the contacts Cl ... C7 and below these contacts. This structure has the consequence that the contacts C1 ... C7 have a shielding effect with regard to the electromagnetic field of the antenna, which has repercussions on the communication performance of the module, and notably causes a reduction of the range. and the quality of communication with the ID1 antenna of the smart card, or with the antenna of a smart card reader.
Par ailleurs, s'agissant d'un module de taille réduite, la taille de l'antenne et donc son inductance se trouve également réduite par rapport à l'inductance de l'antenne correspondante d'un module de grande taille. Cette réduction de l'inductance a pour effet d'augmenter la fréquence de résonance du module et donc de l'écarter de la fréquence de résonance cible du protocole de communication entre carte à puce et lecteur.  Moreover, in the case of a module of reduced size, the size of the antenna and therefore its inductance is also reduced relative to the inductance of the corresponding antenna of a large module. This reduction of the inductance has the effect of increasing the resonant frequency of the module and therefore of moving away from the target resonant frequency of the communication protocol between smart card and reader.
Si le module de petite taille représenté en figure 1 doit fonctionner aussi bien et à la même fréquence qu'un module connu de grande taille, il est donc nécessaire d'apporter des modifications au module.  If the small-sized module shown in FIG. 1 is to function as well and at the same frequency as a known large module, it is necessary to make modifications to the module.
A cet effet, comme représenté en figure 1A, un mode de réalisation de l'invention prévoit d'aménager dans la zone centrale des contacts (qui en fait correspond à un prolongement du contact C5), une série d'ouvertures 8 ou d'évidements traversants dans la couche métallique des contacts. De préférence ces ouvertures 8 sont aménagées uniquement dans la zone centrale du module afin de ne pas affecter la zone utile des contacts, mais si nécessaire, des ouvertures peuvent aussi être réalisées sur les contacts eux-mêmes tant qu'elles ne tombent pas dans des zones que la norme exige d'être en métal plein.  For this purpose, as shown in FIG. 1A, an embodiment of the invention provides for arranging in the central zone contacts (which in fact corresponds to an extension of the contact C5), a series of openings 8 or through recesses in the metal layer of the contacts. Preferably these openings 8 are arranged only in the central zone of the module so as not to affect the useful area of the contacts, but if necessary, openings can also be made on the contacts themselves as long as they do not fall into areas that the standard requires to be solid metal.
Dans un mode de réalisation avantageux/ les ouvertures 8 sont circulaires, ou encore hexagonales, ce qui crée au centre du module une grille 9 qui a 5 l'apparence d'une structure en nid d'abeille, dont on sait que la résistance mécanique est élevée. Les ouvertures 8 permettent de faciliter la circulation du flux électromagnétique du module et de réduire l'effet de blindage dû aux contacts.  In an advantageous embodiment, the openings 8 are circular, or hexagonal, which creates in the center of the module a grid 9 which has the appearance of a honeycomb structure, the mechanical strength of which is known to be known. is high. The openings 8 make it possible to facilitate the circulation of the electromagnetic flux of the module and to reduce the shielding effect due to the contacts.
Bien entendu, l'homme du métier est à même de dimensionner, par essais ou par calcul, la taille et la densité surfacique des ouvertures pour obtenir l'effet 10 optimal. On pourrait penser à aménager une grande ouverture unique couvrant l'essentiel de la zone centrale située entre les contacts, mais cela nuirait à la stabilité de la puce lors de sa fixation et collage sur le module, et à la fiabilité mécanique du module.  Of course, those skilled in the art are able to dimension, by tests or by calculation, the size and the surface density of the openings to obtain the optimum effect. One could think to develop a large single opening covering most of the central area between the contacts, but it would damage the stability of the chip during its fixing and bonding on the module, and the mechanical reliability of the module.
Un via interne 5, une connexion dite « strap » 6 et un via externe 7 sont prévus, de façon connue, pour connecter l'extrémité distale de l'antenne 2, au plot de connexion correspondant de la puce. An internal via 5, a so-called "strap" connection 6 and an external via 7 are provided, in known manner, for connecting the distal end of the antenna 2, to the stud corresponding connection of the chip.
La figure 1C montre la face inférieure du module après report de la puce dans sa zone d'accueil, et protection à l'aide d'une goutte de résine il. Des fils métalliques 12 permettent de connecter les plots de contact de la puce, aux 20 extrémités de l'antenne 2, ou aux contacts Ci appropriés.  FIG. 1C shows the lower face of the module after the chip has been returned to its reception zone, and protection with the aid of a drop of resin therein. Metal wires 12 make it possible to connect the contact pads of the chip, to the ends of the antenna 2, or to the appropriate contacts Ci.
La figure en coupe 1D correspond au plan de coupe AA' et montre en particulier la puce 10 collée sur le substrat 13 à l'aide d'une couche de colle 14. Elle montre aussi (a grille métallique 9 et les ouvertures 8 qui permettent de réduire l'effet de blindage des contacts du module à l'égard de l'antenne 2.  The figure in section 1D corresponds to the cutting plane AA 'and shows in particular the chip 10 bonded to the substrate 13 with the aid of a glue layer 14. It also shows (a metal grid 9 and the openings 8 which allow to reduce the shielding effect of the module contacts with respect to the antenna 2.
La partie droite de la figure 1E montre le schéma électrique équivalent du module complet, avec d'une part l'impédance Zp de la puce, constituée par une résistance R en parallèle avec une capacité C, et d'autre part l'inductance L de l'antenne 2. The right part of FIG. 1E shows the equivalent electrical diagram of the complete module, with, on the one hand, the impedance Z p of the chip constituted by a resistor R in parallel with a capacitance C, and on the other hand the inductance L of the antenna 2.
Dans les figures subséquentes, qui représentent des variantes de mise en œuvre de l'invention, les mêmes éléments que sur la figure 1 sont affectés des mêmes indices de référence Dans une première variante de réalisation selon les figures 2A à 2E, la face supérieure du module (figure 2A) est identique à celle de la figure 1A, avec des ouvertures 8 aménagées dans la zone métallique entre les contacts. En revanche, comme représenté en figure 2B, un élément passif C est positionné sur la zone d'accueil de la puce, comme représenté en figure 2D. Il s'agit d'une capacité, C réalisée notamment à l'aide de deux peignes métalliques 15,16 inter digités, dont les doigts en regard forment une capacité. Cette capacité C est connectée en parallèle avec l'antenne 2 d'inductance L, comme représenté en figure 2E. L'ajout de la capacité C permet d'augmenter le facteur LC, et par conséquent d'ajuster la fréquence de résonance du module à la baisse, par rapport à un module sans cette capacité.  In the following figures, which represent variant embodiments of the invention, the same elements as in FIG. 1 are assigned the same reference numbers. In a first variant embodiment according to FIGS. 2A to 2E, the upper face of FIG. module (Figure 2A) is identical to that of Figure 1A, with openings 8 arranged in the metal area between the contacts. On the other hand, as represented in FIG. 2B, a passive element C is positioned on the reception zone of the chip, as represented in FIG. 2D. This is a capacity, C made in particular using two metal combs 15,16 inter digités, whose fingers facing form a capacity. This capacitor C is connected in parallel with the inductor antenna 2 L, as shown in Figure 2E. The addition of the capacitor C makes it possible to increase the LC factor, and consequently to adjust the resonant frequency of the module downward, with respect to a module without this capacitance.
Dans une seconde variante de réalisation de l'invention selon les figures 3A à 3E, la face supérieure du module (figure 3A) est identique à celles des figures 1A et 2A, avec des ouvertures 8, à ceci près qu'elle comporte en outre deux vias 18,19 et un strap 20 qui permettent de connecter dans le circuit d'antenne un autre élément passif L' qui est en fait une antenne secondaire. Comme visible sur la figure 3D, cette antenne secondaire L' comporte des spires placées dans la zone d'accueil de la puce 10, en remplacement de la capacité C de la figure 2D. In a second variant embodiment of the invention according to FIGS. 3A to 3E, the upper face of the module (FIG. 3A) is identical to those of FIGS. 1A and 2A, with openings 8, except that it furthermore comprises two vias 18,19 and a strap 20 which allow to connect in the antenna circuit another passive element L 'which is in fact a secondary antenna. As visible in FIG. 3D, this secondary antenna L 'has turns placed in the zone of reception of the chip 10, replacing the capacitance C of FIG. 2D.
Du fait de la mise en série à l'aide du strap 20 des spires de l'antenne principale 2 d'inductance L et des spires de l'antenne secondaire d'inductance L1, on obtient, comme apparent dans le schéma électrique équivalent de la figure 3E, un module dont l'antenne possède une inductance augmentée de valeur L + L', ce qui aura pour effet, toutes autres choses étant égales par ailleurs, d'augmenter le facteur L.C, et par conséquent d'ajuster la fréquence de résonance du module à la baisse, par rapport à un module sans cette antenne secondaire. Due to the series setting by means of the strap 20 of the turns of the main antenna 2 of inductance L and the turns of the secondary antenna of inductance L 1 , one obtains, as apparent in the equivalent electric diagram. of FIG. 3E, a module whose antenna has an increased inductance of value L + L ', which will have the effect, all other things being equal, of increasing the factor LC, and consequently of adjusting the resonance frequency of the module downward, compared to a module without this secondary antenna.
Dans un quatrième mode de réalisation de l'invention selon les figures 4A à 4E, la face supérieure du module (figure 4A) est identique à celles des figures 1A et 2A, avec des ouvertures 8 dans la zone métallique inter contacts. Comme visible sur la figure 4B, un élément passif de type résistif R' est connecté en série avec l'antenne 2 d'inductance L Cet élément R' est notamment réalisé sous la forme d'un serpentin métallique et disposé dans la zone d'accueil de la puce 10, en remplacement de la capacité C de la figure 2D ou de l'inductance L' de la figure 3D. Etant de type résistif, cet élément R' n'influe pas directement sur la fréquence de résonance du module. Par contre, il permet d'améliorer le facteur de qualité du module, qui s'exprime sous forme Q = Lw/R.  In a fourth embodiment of the invention according to FIGS. 4A to 4E, the upper face of the module (FIG. 4A) is identical to those of FIGS. 1A and 2A, with openings 8 in the inter-contact metal zone. As can be seen in FIG. 4B, a resistive-type passive element R 'is connected in series with the antenna 2 of inductance L. This element R' is in particular embodied in the form of a metal coil and disposed in the zone of FIG. receiving the chip 10, replacing the capacitance C of FIG. 2D or the inductance L 'of FIG. 3D. Being of the resistive type, this element R 'does not affect directly the resonance frequency of the module. On the other hand, it makes it possible to improve the factor of quality of the module, which expresses in the form Q = Lw / R.
Il est à noter qu'en plus des modes de réalisation représentés, des variantes de réalisation supplémentaires sont envisageables, faisant appel à un élément passif C, L', R', mais sans utiliser les ouvertures 8 de la zone inter contacts du module. It should be noted that in addition to the embodiments shown, additional alternative embodiments are possible, using a passive element C, L ', R', but without using the openings 8 of the inter-contact area of the module.
Avantages de l'invention Advantages of the invention
L'invention répond aux buts fixés et permet de compenser les effets de blindage électromagnétique de certains modules pour carte à puce à fonctionnement dual à contact et sans contact. Elle est d'autant plus utile que le module est de petite taille et requière que les spires de l'antenne soient situées en regard des contacts métalliques, faute de place pour disposer les spires de l'antenne autour du bornier du module ou entre les contacts du bornier. En jouant sur la taille et la densité des ouvertures aménagées dans les zones métalliques et sur les valeurs des éléments passifs intégrés au circuit de l'antenne, il est possible grâce à l'invention d'ajuster la fréquence de résonance du module pour l'amener vers une valeur cible déterminée par le protocole de communication avec le lecteur, et d'ajuster le facteur de qualité Q. The invention responds to the goals set and makes it possible to compensate for the effects of electromagnetic shielding of certain smart card modules with dual contact and non-contact operation. It is all the more useful that the module is small and requires that the turns of the antenna are located opposite the metal contacts, for lack of space to arrange the turns of the antenna around the terminal block of the module or between terminal block contacts. By varying the size and density of the openings made in the metal zones and the values of the passive elements integrated in the antenna circuit, it is possible thanks to the invention to adjust the resonant frequency of the module for the bring to a target value determined by the communication protocol with the reader, and adjust the quality factor Q.
En outre, les modifications apportées, en particulier les ouvertures dans les zones métalliques, ne modifient que de façon marginale la résistance mécanique du 25 module et n'impactent pas négativement les procédés d'assemblage du module et d'intégration dans une carte à puce.  In addition, the modifications made, in particular the openings in the metal zones, modify only marginally the mechanical strength of the module and do not adversely affect the methods of assembly of the module and integration in a smart card. .

Claims

REVENDICATIONS
1 - Module électronique (1) à double interface de communication à contact et sans contact, présentant sur une première face de son substrat (13) un bornier de contacts électriques (Cl, C2, C3, C5, C6, C7) permettant un fonctionnement par contact avec les contacts correspondants d'un lecteur de carte à puce et présentant sur une seconde face de son substrat (13) d'une part une antenne (2) située sous la zone des contacts électriques du bornier, et d'autre part une puce microélectronique (10) connectée à l'antenne (2) de sorte que le module se comporte comme un circuit résonant ayant une certaine fréquence de résonance donnée Fo, caractérisé en ce qu'il comporte en outre, isolément ou en combinaison, des premiers moyens (8) aptes à réduire l'effet de blindage électromagnétique des contacts du bornier à l'égard du flux électromagnétique de l'antenne, et se présentant sous la forme d'ouvertures (8) aménagées dans une zone centrale du bornier située entre lesdits contacts, et des seconds moyens (L' ; C) aptes à réduire ladite fréquence de résonance F0 et se présentant sous la forme d'au moins un élément passif (C; L') aménagé sous la puce (10) et connecté à l'antenne (2) du module. 1 - Electronic module (1) with dual contact and contactless communication interface, presenting on a first face of its substrate (13) an electrical contact terminal block (Cl, C2, C3, C5, C6, C7) allowing operation by contact with the corresponding contacts of a smart card reader and having on a second face of its substrate (13) on the one hand an antenna (2) located under the area of the electrical contacts of the terminal block, and on the other hand a microelectronic chip (10) connected to the antenna (2) so that the module behaves like a resonant circuit having a certain given resonance frequency Fo, characterized in that it further comprises, in isolation or in combination, first means (8) capable of reducing the electromagnetic shielding effect of the contacts of the terminal block with regard to the electromagnetic flux of the antenna, and being in the form of openings (8) arranged in a central zone of the terminal block located between said contacts, and second means (L'; C) capable of reducing said resonance frequency F 0 and being in the form of at least one passive element (C; L') arranged under the chip (10) and connected to the antenna (2) of the module.
2 - Module électronique (1) selon la revendication 1, caractérisé en ce que lesdites ouvertures (8) se présentent sous la forme d'un réseau ou grille (9) en nid d'abeille. 2 - Electronic module (1) according to claim 1, characterized in that said openings (8) are in the form of a honeycomb network or grid (9).
3 - Module électronique selon la revendication 2, caractérisé en ce que ledit élément passif (C ; L') est choisi et dimensionné de manière à ajuster la fréquence de résonance F0 de l'ensemble du module vers une valeur cible, notamment une valeur proche de la fréquence de 13,56 Mhz correspondant à la norme ISO 14443. 3 - Electronic module according to claim 2, characterized in that said passive element (C; L') is chosen and dimensioned so as to adjust the resonance frequency F 0 of the entire module towards a target value, in particular a value close to the frequency of 13.56 MHz corresponding to the ISO 14443 standard.
4 - Module électronique (1) selon la revendication 3, caractérisé en ce que ledit élément passif est un élément capacitif (C) connecté en parallèle à l'inductance (L) de l'antenne (2), et réalisé sous la formé de deux peignes métalliques (15,16) inter digités disposés entre la plage d'accueil de la puce (10) et le substrat (13) du module. 4 - Electronic module (1) according to claim 3, characterized in that said passive element is a capacitive element (C) connected in parallel to the inductance (L) of the antenna (2), and produced in the form of two interdigitated metal combs (15,16) arranged between the reception area of the chip (10) and the substrate (13) of the module.
5 - Module électronique (1) selon la revendication 3, caractérisé en ce que ledit élément passif est un élément inductif (Ι_') connecté en série avec l'inductance (L) de l'antenne (2) et réalisé sous la forme d'une antenne secondaire (!_') disposée entre la plage d'accueil de la puce (10) et le substrat (13) du module. 5 - Electronic module (1) according to claim 3, characterized in that said passive element is an inductive element (Ι_') connected in series with the inductance (L) of the antenna (2) and produced in the form of 'a secondary antenna (!_') arranged between the reception area of the chip (10) and the substrate (13) of the module.
6 - Module électronique (1) selon l'une quelconque des revendications précédentes, caractérisé en ce qu'il comporte en outre un moyen pour améliorer le facteur de qualité Q du module, sous la forme d'un élément passif résistif (R1) connecté en série avec l'inductance (L) de l'antenne (2) et réalisé sous la forme d'un serpentin résistif (R') disposé entre la plage d'accueil de la puce (10) et le substrat (13) du module. 6 - Electronic module (1) according to any one of the preceding claims, characterized in that it further comprises a means for improving the quality factor Q of the module, in the form of a resistive passive element (R 1 ) connected in series with the inductance (L) of the antenna (2) and produced in the form of a resistive coil (R') arranged between the reception area of the chip (10) and the substrate (13) of the module.
7 - Module électronique (1) selon l'une quelconque des revendications précédentes, caractérisé en ce qu'il comporte en combinaison un ensemble d'ouvertures (8) selon l'une des revendications 1,2, et au moins un élément passif (R' ; L' ; C) selon l'une des revendications 4 à 6. 7 - Electronic module (1) according to any one of the preceding claims, characterized in that it comprises in combination a set of openings (8) according to one of claims 1,2, and at least one passive element ( R'; L'; C) according to one of claims 4 to 6.
8 - Module électronique (1) selon l'une quelconque des revendications précédentes, caractérisé en ce que lesdites ouvertures (8) ont un diamètre d'environ 0,4 millimètre. 8 - Electronic module (1) according to any one of the preceding claims, characterized in that said openings (8) have a diameter of approximately 0.4 millimeters.
9 - Module électronique (1) selon l'une quelconque des revendications précédentes, caractérisé en ce que la proportion de la surface desdites ouvertures9 - Electronic module (1) according to any one of the preceding claims, characterized in that the proportion of the surface of said openings
(8) par rapport à la surface métallique du bornier est comprise entre 30 % et 70 %. (8) relative to the metal surface of the terminal block is between 30% and 70%.
10 - Carte à puce à double interface de communication à contact et sans contact, caractérisée en ce qu'elle comporte un module électronique (1) selon l'une quelconque des revendications 1 à 9. 10 - Smart card with dual contact and contactless communication interface, characterized in that it comprises an electronic module (1) according to any one of claims 1 to 9.
PCT/FR2016/000083 2016-05-01 2016-05-01 Electronic module of small size for a chip card WO2017191373A1 (en)

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Application Number Priority Date Filing Date Title
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023118684A1 (en) * 2021-12-24 2023-06-29 Wisekey Semiconductors Method for manufacturing contactless module having an antenna coil with finely adjustable inductance
WO2023118685A1 (en) * 2021-12-24 2023-06-29 Wisekey Semiconductors Contactless module with configurable antenna coil

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2541471A1 (en) * 2011-07-01 2013-01-02 Gemalto SA Portable device with recessed electrical contacts
US20130126622A1 (en) * 2011-08-08 2013-05-23 David Finn Offsetting shielding and enhancing coupling in metallized smart cards
DE102011056329A1 (en) * 2011-12-13 2013-06-13 Infineon Technologies Ag Smart card module of smart card e.g. payment card, has chip external coil and chip external capacitor that are arranged to form a module arrangement which produces resonant frequency corresponding to operating frequency

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2541471A1 (en) * 2011-07-01 2013-01-02 Gemalto SA Portable device with recessed electrical contacts
US20130126622A1 (en) * 2011-08-08 2013-05-23 David Finn Offsetting shielding and enhancing coupling in metallized smart cards
DE102011056329A1 (en) * 2011-12-13 2013-06-13 Infineon Technologies Ag Smart card module of smart card e.g. payment card, has chip external coil and chip external capacitor that are arranged to form a module arrangement which produces resonant frequency corresponding to operating frequency

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023118684A1 (en) * 2021-12-24 2023-06-29 Wisekey Semiconductors Method for manufacturing contactless module having an antenna coil with finely adjustable inductance
WO2023118685A1 (en) * 2021-12-24 2023-06-29 Wisekey Semiconductors Contactless module with configurable antenna coil
FR3131411A1 (en) * 2021-12-24 2023-06-30 Wisekey Semiconductors Method of manufacturing a contactless module having a finely adjustable inductance antenna coil
FR3131412A1 (en) * 2021-12-24 2023-06-30 Wisekey Semiconductors Contactless module having a configurable antenna coil

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