EP3386648A1 - Acoustic transducer arrangement having annular connecting regions and method for producing an acoustic transducer arrangement having annular connecting regions - Google Patents
Acoustic transducer arrangement having annular connecting regions and method for producing an acoustic transducer arrangement having annular connecting regionsInfo
- Publication number
- EP3386648A1 EP3386648A1 EP16781792.3A EP16781792A EP3386648A1 EP 3386648 A1 EP3386648 A1 EP 3386648A1 EP 16781792 A EP16781792 A EP 16781792A EP 3386648 A1 EP3386648 A1 EP 3386648A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- plate carrier
- sound transducer
- transducer assembly
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title description 5
- 239000000463 material Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 238000013016 damping Methods 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 39
- 238000005452 bending Methods 0.000 description 13
- 239000012528 membrane Substances 0.000 description 4
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 229920006255 plastic film Polymers 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000003534 oscillatory effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/004—Mounting transducers, e.g. provided with mechanical moving or orienting device
Definitions
- the invention relates to a sound transducer assembly according to the preamble of claim 1 and a method for producing such
- Document DE 39 20 872 A1 discloses a method for the production of ultrasound layer transducers in which the piezoceramic and thermoplastic plastic material of the layer converter are connected to one another by heat bonding. To generate the heat necessary for bonding, heat loss is produced in the piezoceramic by applying electrical signals.
- Document DE 10 2004 047 814 A1 describes a focusing micromachined ultrasound transducer array which is clinically focusing
- the sound transducer arrangement comprises a perforated plate carrier with a plurality of through openings, a plurality of piezo elements and a terminating layer.
- Each piezoelectric element has a first electrode and a second electrode. The first electrode faces the second electrode. Within a passage opening, a piezoelectric element is arranged in each case.
- Finishing layer is disposed above the perforated plate carrier and the piezoelectric elements, wherein the second electrodes of the piezoelectric elements with the
- the terminating layer and the perforated plate carrier have first connecting regions, which are arranged concentrically around the through-openings, the first connecting regions each having a larger diameter than the through-openings and the first connecting regions being of annular design.
- the top layer and the hole plate carrier on second connection areas, which are arranged concentrically around the through holes.
- the second connection regions have a larger diameter than the first connection regions.
- Connection areas are designed annular.
- first connection regions each have a weld seam.
- each first connection region comprises a weld seam.
- Finishing layer and the perforated plate carrier is particularly stable and robust and has a high quality.
- the finishing layer is integrally formed.
- the finishing layer has a plurality of sections, wherein in each case one section of the finishing layer is provided with one each
- Piezoelectric element is electrically connected.
- the portion that is electrically connected to the piezoelectric element acts as a membrane of the bending transducer element.
- the second connection areas have a
- the top layer and the bottom layer are identical to each other.
- Connecting region connects an edge region of the terminating layer with an edge region of the perforated plate carrier.
- connection region as a seal of the entire sound transducer arrangement with respect to z.
- the third connection region has a weld seam.
- Acoustic transducer assembly comprising a perforated plate carrier, a plurality
- a plurality of piezoelectric elements and a terminating layer comprises the connecting of second electrodes of the piezoelectric elements with the finishing layer. Furthermore, the method comprises contacting first electrodes of the piezoelements by means of wire bonding, wherein the first electrodes are arranged opposite to the second electrodes and the joining of the terminating layer and the perforated plate carrier by means of a weld. In addition, the method includes partially filling the through openings with a damping material.
- the advantage here is that the transducer assembly can be cost-optimized and easily manufactured.
- Figure lb is a plan view of the invention
- Figure 2 shows a second embodiment of the invention
- Figure 3 shows a process for the preparation of the inventive
- FIG. 1 shows a sectional view in the xz plane of the first embodiment of a sound transducer arrangement 100.
- the sound transducer arrangement 100 shows, by way of example, three sound transducer elements or flexural transducer elements 115, which are arranged parallel to one another.
- a bending transducer element 115 in this case comprises a piezoelement 104, a membrane 114 which uses a Finishing layer 103 is formed, a hole plate carrier 101 and
- the acoustic transducer assembly 100 includes a
- Punch plate carrier 101 which has a plurality of through holes 111 and holes.
- the perforated plate carrier 101 has an upper side and a
- the passage openings 111 are arranged concentrically to the piezoelements 104, wherein each passage opening 111 in each case accommodates a piezoelement 104 which is introduced from the upper side into the passage opening 111 or terminates flush with the upper side.
- the piezo elements 104 have a smaller diameter than the passage openings 111. In other words, the piezo element 104 is located within the passage opening 111 or the hole.
- Each piezo element 104 has a first electrode 105 and a second electrode 106.
- the first electrode 105 is connected by means of a wire connection, for example, with an amplifier circuit and acts as a signal line or
- the second electrode 106 is electrically conductively connected by means of an adhesive layer 107 to the terminating layer 103.
- the termination layer 103 is connected to an electrical ground, for example the amplifier circuit ground. That is, the second electrode 105 is grounded, thereby performing EMC shielding.
- the piezo elements 104 can be electrically conductively connected via two wire connections to the electrical ground and the amplifier circuit.
- the second electrode 106 is contacted over the edge of the piezoelectric element 104, so that on the side of the first electrode 105 there are two separate electrode regions, which can be contacted separately from one another.
- the piezoelements 104 can be connected to the terminating layer 103 with an electrically nonconductive adhesive layer.
- Each bending transducer element 115 has a first connecting region 108 which adjusts or ensures the edge clamping of the bending transducer element 115 or the membrane 114.
- the term first connection region 108 is understood here to mean the regions in which a mechanical connection takes place between the end layer 103 and the perforated plate carrier 101.
- the first connection regions 103 are concentric about the passage openings 111 arranged and have a larger diameter than the
- the first connection regions 108 are annular and include welds. This means the welds are circular and self-contained.
- the welds divide the top layer 103 provided with piezo elements 104 into areas with defined vibration mechanical edge restraints. These oscillatory regions above the passage openings 111 form the vibration membrane of the individual bending transducer elements.
- the welds have a diameter of 0.1 mm to 1.0 mm, preferably 0.25 mm - 0.5 mm, and a lateral distance of 0.1 mm - 1.0 mm to the through holes 111 on.
- second connection regions 109 are arranged concentrically.
- the second connection regions 109 have a lateral distance from the first connection regions 108.
- the second connection portions 109 also include welds.
- connection regions 109 there may be further concentrically arranged connection regions, which likewise have weld seams. This serves for improved decoupling between two sound transducer elements.
- Punch plate carrier 101 a third connection portion 110 is provided.
- the term edge region is understood here to mean an area with a lateral distance to the outer edge of the outer layer of 0.1 mm-1 mm.
- the piezoelectric elements 104 have a thickness of 100 ⁇ - 750 ⁇ , of 150 ⁇ - 500 ⁇ .
- the perforated plate carrier 101 has a thickness of 0.5 mm - 15 mm, preferably 1 mm - 10 mm.
- the final layer 103 has a thickness of 50 ⁇ - 750 ⁇ on.
- Finishing layer 103 is overpaintable and protects the sound transducer assembly 100 from moisture, liquids and mechanical effects.
- a plastic film may be arranged on the finishing layer 103.
- the Plastic film is preferably with an epoxy resin adhesive on the
- the epoxy adhesive also acts as a tolerance compensation for the realization of particularly flat surfaces.
- the epoxy adhesive can be scrape.
- the plastic film comprises, for example, polyimide or a composite material of metal and plastic or carbon fiber fabric and resin.
- the end layer 103 comprises metal, e.g. As stainless steel, steel or an aluminum alloy. That means that
- Finishing layer 103 is completely electrically conductive.
- end layer 103 plastic z. B. PES, PVDF, glass fiber composites or
- Carbon fiber composites wherein the side of the end layer 103, which is connected to the perforated plate support 101, a metal layer.
- the damping material is preferably silicone-containing.
- the basic shape of the piezo elements 104, the bending transducer elements 115 and the passage openings 111 are arbitrary. Preferably, they have regular shapes, z. Square, rectangular, polygonal, circular or elliptical. In a sound transducer assembly 100, the basic shapes of the piezo elements 104, flexural transducer elements 115, and through holes 111 may be the same or different.
- the acoustic transducer assemblies 100 may have a number of 2 - 250
- FIG. 1b shows a plan view of the first embodiment of the sound transducer arrangement 100 according to the invention.
- three bending transducer elements 115 are shown, which are arranged parallel to one another or in a line to one another.
- the rectangular end layer 103 is shown, which are the three
- connection region 108 which adjusts the edge stress of the respective bending transducer
- second connection region 109 which acts as a decoupling between the bending transducers and the third connection area 110, for example
- FIG. 2 shows a sectional illustration in the xz-plane of the second embodiment of FIG.
- the end layer 203 has a plurality of subregions, wherein in each case a subregion is arranged on a passage opening and closes or closes it. That is, the end layer comprises a plurality of individual parts, each of which functions as a diaphragm 214, since they are arranged above the piezoelectric elements 204.
- FIG. 3 shows the method 300 for producing a sound transducer arrangement, which has a perforated plate carrier with a plurality of through openings, a plurality of piezo elements and a terminating layer.
- the method 300 starts with a step 310, in which second electrodes of the piezo elements are connected to the terminating layer.
- second electrodes of the piezo elements are connected to the terminating layer.
- first electrodes of the piezoelectric elements are electrically connected or contacted by wire bonding. In this case, the first electrode of the second electrode is located
- step 330 the terminating layer and the perforated plate carrier are connected by means of first connecting regions,
- the passage openings are at least partially filled with a damping material.
- the transducer assemblies 100 and 200 find in motor vehicles, moving or stationary machines, such as robots, driverless
- acoustic transducer assemblies 100 and 200 may be used in e-bikes, electric wheelchairs and assistive devices to assist physically disabled persons.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015224770.8A DE102015224770A1 (en) | 2015-12-10 | 2015-12-10 | Sound transducer arrangement with annular first connecting regions and method for producing a sound transducer arrangement with annular first connecting regions |
PCT/EP2016/074684 WO2017097474A1 (en) | 2015-12-10 | 2016-10-14 | Acoustic transducer arrangement having annular connecting regions and method for producing an acoustic transducer arrangement having annular connecting regions |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3386648A1 true EP3386648A1 (en) | 2018-10-17 |
Family
ID=57136890
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP16781792.3A Withdrawn EP3386648A1 (en) | 2015-12-10 | 2016-10-14 | Acoustic transducer arrangement having annular connecting regions and method for producing an acoustic transducer arrangement having annular connecting regions |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP3386648A1 (en) |
CN (1) | CN108367316A (en) |
DE (1) | DE102015224770A1 (en) |
WO (1) | WO2017097474A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116840350B (en) * | 2023-05-12 | 2024-07-23 | 南通大学 | Flexible array for monitoring circumferential crack acoustic emission of pipeline girth weld and preparation method |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4754440A (en) * | 1985-12-27 | 1988-06-28 | Aisin Seiki Kabushikikaisha | Ultrasonic transducer |
DE3920872A1 (en) | 1989-06-26 | 1991-01-03 | Siemens Ag | Hot bonding thermoplastic material to piezoelectric material - in transducer mfr., by surface fusing thermoplastic material |
US20050075572A1 (en) | 2003-10-01 | 2005-04-07 | Mills David M. | Focusing micromachined ultrasonic transducer arrays and related methods of manufacture |
JP2008191007A (en) * | 2007-02-05 | 2008-08-21 | Denso Corp | Structure for mounting sensor device |
KR101545271B1 (en) * | 2008-12-19 | 2015-08-19 | 삼성전자주식회사 | Piezoelectric acoustic transducer and method for fabricating the same |
US7954387B1 (en) * | 2010-08-18 | 2011-06-07 | General Electric Company | Ultrasonic transducer device |
DE102011079646A1 (en) * | 2011-07-22 | 2013-02-07 | Robert Bosch Gmbh | Ultrasonic sensor device for detecting and / or transmitting ultrasound |
EP2610432B8 (en) * | 2011-12-26 | 2016-08-03 | Services Pétroliers Schlumberger | Downhole ultrasonic transducer and method of making same |
US9142751B2 (en) * | 2012-10-10 | 2015-09-22 | Industrial Sonomechanics, Llc | Efficient cooling of piezoelectric transducers |
CN108055418A (en) * | 2012-12-20 | 2018-05-18 | 三菱电机株式会社 | Image read-out |
CN103230866A (en) * | 2013-04-11 | 2013-08-07 | 镇江畅信超声电子有限公司 | Ultrasonic transducer and manufacturing process thereof |
-
2015
- 2015-12-10 DE DE102015224770.8A patent/DE102015224770A1/en not_active Withdrawn
-
2016
- 2016-10-14 WO PCT/EP2016/074684 patent/WO2017097474A1/en unknown
- 2016-10-14 EP EP16781792.3A patent/EP3386648A1/en not_active Withdrawn
- 2016-10-14 CN CN201680072527.2A patent/CN108367316A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2017097474A1 (en) | 2017-06-15 |
DE102015224770A1 (en) | 2017-06-14 |
CN108367316A (en) | 2018-08-03 |
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Effective date: 20180710 |
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Owner name: ROBERT BOSCH GMBH |
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18D | Application deemed to be withdrawn |
Effective date: 20210501 |