EP3386650B1 - Acoustic transducer arrangement having two parallel connecting elements and method for producing an acoustic transducer arrangement having two parallel connecting elements - Google Patents

Acoustic transducer arrangement having two parallel connecting elements and method for producing an acoustic transducer arrangement having two parallel connecting elements Download PDF

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Publication number
EP3386650B1
EP3386650B1 EP16788685.2A EP16788685A EP3386650B1 EP 3386650 B1 EP3386650 B1 EP 3386650B1 EP 16788685 A EP16788685 A EP 16788685A EP 3386650 B1 EP3386650 B1 EP 3386650B1
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EP
European Patent Office
Prior art keywords
transducer arrangement
sound transducer
termination layer
webs
layer
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EP16788685.2A
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German (de)
French (fr)
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EP3386650A1 (en
Inventor
Bernd SCHEUFELE
Andre Gerlach
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Robert Bosch GmbH
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Robert Bosch GmbH
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/004—Mounting transducers, e.g. provided with mechanical moving or orienting device
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K9/00—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers
    • G10K9/18—Details, e.g. bulbs, pumps, pistons, switches or casings
    • G10K9/22—Mountings; Casings

Definitions

  • the invention relates to a sound transducer arrangement according to the preamble of claim 1 and a method for producing such a sound transducer arrangement.
  • the document DE 39 20 872 A1 discloses a method for the production of ultrasonic layer transducers in which the piezoceramic and thermoplastic plastic material of the layer transducer are connected to one another by hot glueing. To generate the heat required for bonding, heat loss is produced in the piezoceramic by applying electrical signals
  • the font DE102008007042 A1 discloses a mounting structure for a sensor device with an ultrasonic transducer.
  • the disadvantage here is that the individual ultrasonic transducers are exposed to external influences, both mechanical and electrical.
  • the sound transducer arrangement comprises a perforated plate carrier with several through openings, several piezo elements and a cover layer.
  • Each piezo element has a first electrode and a second electrode. The first electrode is opposite the second electrode.
  • a piezo element is arranged within each passage opening.
  • the closing layer is arranged above the perforated plate carrier and the piezo elements, the second electrodes of the piezo elements being connected to the closing layer in an electrically conductive manner.
  • the perforated plate carrier has laterally between two through openings at least two webs arranged parallel to one another and spaced apart from one another.
  • the final layer has first connection areas with the webs that directly adjoin the through opening.
  • the advantage here is that successive bending transducers are decoupled from one another.
  • the terminating layer has a second connection area in each case with the web which follows the web directly adjoining the through opening.
  • the advantage here is that the decoupling between the individual bending transducers is more efficient.
  • the first connection area comprises a weld seam or an adhesive layer.
  • the second connection layer comprises a weld seam or adhesive layer.
  • the closing layer is formed in one piece.
  • the advantage here is that the assembly of bending transducer elements is completely protected from external influences.
  • the end layer has two slits each, which are arranged symmetrically with respect to a piezo element, the ends of the slits being connected to the first connection areas.
  • the slots are rectangular.
  • the slots are arcuate.
  • the method according to the invention for producing a sound transducer arrangement with a plurality of through openings and at least two parallel webs, a plurality of piezo elements and a cover layer which has a plurality of slots comprises the connection of second electrodes of the piezo elements to the connection layer. Furthermore, the method comprises the contacting of first electrodes of the piezo elements by means of wire bonding, the first electrodes being arranged opposite the second electrodes. Furthermore, the method comprises connecting the slot ends of the closing layer to the webs of the perforated plate carrier that directly adjoin the through openings, in particular by means of weld seams, and partially filling the through openings with a damping material.
  • a plastic film is glued onto the top layer.
  • the advantage here is that the transducer arrangement is sealed.
  • Figure 1 shows a sectional illustration in the xz plane of a sound transducer arrangement 100.
  • the sound transducer arrangement 100 shows, by way of example, three sound transducer elements or bending transducer elements 115, which are arranged parallel to one another and spaced apart.
  • a bending transducer element 115 comprises a piezo element 104, a membrane 114 which is formed with the aid of a closing layer 103, a perforated plate carrier 101 and damping material.
  • the perforated plate carrier 101 comprises a plurality of through openings 111 or holes and has an upper side and a lower side, which are arranged opposite one another. On the upper side, webs 102 are arranged, which are arranged parallel to one another.
  • These webs 102 are at a minimum distance from one another, the minimum distance corresponding to the size of the through opening 111. This means that the webs 102 directly adjoin the through openings 111.
  • the piezo elements 104 are arranged within the through openings 111, each through opening 111 receiving a piezo element 104 which is introduced into the through opening 111 from the top or is flush with the top.
  • the piezo elements 104 have smaller dimensions than the through openings 111.
  • the terminating layer 103 has slots which are arranged parallel to one another at a distance from one another and are connected by the first connecting regions 108. This means that if the slots are rectangular, the membrane is rectangular. In the case of arcuate slots, the membrane is designed to be undulating.
  • Each piezo element 104 has a first electrode 105 and a second electrode 106.
  • the first electrode 105 is connected, for example, to an amplifier circuit by means of a wire connection 112 and functions as a signal line or signal contact.
  • the second electrode 106 is electrically conductively connected to the closing layer 103 by means of an adhesive layer 107.
  • the termination layer 103 is connected to an electrical ground, for example the amplifier circuit ground. This means that the second electrode 105 is grounded, as a result of which EMC shielding takes place.
  • the piezo elements 104 can be connected in an electrically conductive manner to the electrical ground and the amplifier circuit via two wire connections.
  • the second electrode 106 is recontacted over the edge of the piezo element 104, so that on the side of the first electrode 105 there are two electrode areas that are separate from one another and can be contacted separately from one another.
  • the piezo elements 104 can be connected to the closing layer 103 with an electrically non-conductive adhesive layer.
  • Each flexural transducer element 115 has a first connecting region 108 which sets or ensures the edge restraint of the flexural transducer element 115 or of the membrane 114.
  • the term first connection area 108 is understood to mean the areas in which there is a mechanical connection between the closing layer 103 and the webs 102 of the perforated plate carrier 101, which directly adjoins the through opening 111.
  • the first connecting areas 103 are arranged at a distance from the through openings 111 in parallel. This means that the lateral distance between the first connection regions 108 is greater than the dimensions of the through opening 111.
  • further webs 117 are arranged laterally spaced apart, ie at least one further web 117. That means, the further webs 117 run parallel to webs 102. webs 102 and further webs 117 are separated by recesses 116 in the top of perforated plate carrier 101.
  • the recesses 116 are at a distance of 0.1 mm-1 mm from the weld seams of the first connection regions 108.
  • the lateral distance between the webs 102 and the further webs is 0.1 mm-2 mm.
  • the depth of the recesses 116 is at least 0.1 mm. Areas of the closing layer 103 that are capable of local oscillation are produced by the cutouts 116, so that the membranes 114 can absorb and dissipate oscillation energy.
  • second connection areas 109 are arranged laterally spaced apart. The distance is formed by the recess 116 between the webs 102 and 117.
  • the second connection areas 109 are arranged on the further webs 117 and also include weld seams.
  • further connection areas can be present around the second connection areas 109, which likewise have weld seams.
  • the number of connection areas corresponds to the number of webs which run parallel to the through openings 111. In other words, a plurality of webs 117 and a plurality of recesses 116 are alternately arranged laterally next to one another around the through openings 111. This serves to improve the decoupling between two sound transducer elements.
  • the recesses 102 can optionally be filled, for example, with a silicone-containing damping material.
  • the piezo elements 104 have a thickness of 100 ⁇ m-750 ⁇ m, and 150 ⁇ m-500 ⁇ m.
  • the perforated plate carrier 101 has a thickness of 0.5 mm-15 mm, preferably 1 mm-10 mm.
  • FIG. 2 shows a plan view of the first embodiment of the closing layer 203.
  • Three bending transducer elements are shown by way of example, which are arranged parallel or in a line to one another.
  • the rectangular closing layer 203 is shown, which covers the three piezo elements 204.
  • the first connection area 208 which is the edge tension of the sets the respective bending transducer and the second connection area 209, which serves as a decoupling between the bending transducers, is shown.
  • Slits 213 are arranged at right angles to the first connecting regions 208.
  • the slots 213 are mechanically connected to the first connection areas. This means that the slots 213 and the first connecting areas 208 form the membrane of the respective bending transducer element.
  • the piezo elements are designed to be rectangular or square.
  • FIG. 6 shows a top view of the second embodiment of the final layer 303.
  • FIG. 6 shows a top view of the second embodiment of the final layer 303.
  • FIG. 3 that have the same characteristics as in Figure 2 represent, have identical trailing positions of the reference numerals such as Figure 2 on.
  • the slots are arcuate and the piezo elements 304 are round.
  • Figure 4 shows the method for producing a sound transducer arrangement which has a perforated plate carrier with a plurality of through openings at least two parallel webs, a plurality of piezo elements and a cover layer.
  • the method 400 starts with a step 410, in which second electrodes of the piezo elements are connected to the final layer.
  • first electrodes of the piezo elements are electrically connected or contacted by means of wire bonding.
  • the first electrode is opposite the second electrode.
  • the slot ends of the closing layer and the webs which directly adjoin the through openings are connected by means of first connection areas, for example with weld seams.
  • the through openings are at least partially filled with a damping material, in particular from the side which is arranged facing away from the closing layer, ie the rear side of the perforated plate carrier.
  • a plastic film is glued to the top layer.
  • the sound transducer arrangement 100 is used in motor vehicles, moving or stationary machines, such as robots, driverless transport systems, logistics systems in warehouses, vacuum cleaners, lawnmowers. Of Furthermore, the sound transducer arrangement 100 can be used in e-bikes, electric wheelchairs and in aids to support physically handicapped people.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)

Description

Stand der TechnikState of the art

Die Erfindung betrifft eine Schallwandleranordnung nach dem Oberbegriff des Anspruchs 1 und ein Verfahren zur Herstellung einer solchen Schallwandleranordnung.The invention relates to a sound transducer arrangement according to the preamble of claim 1 and a method for producing such a sound transducer arrangement.

Das Dokument DE 39 20 872 A1 offenbart ein Verfahren zur Herstellung von Ultraschall-Schichtwandlern, bei denen die Piezokeramik und thermoplastisches Kunststoffmaterial des Schichtwandlers durch Heißverkleben miteinander verbunden werden. Zur Erzeugung der für das Verkleben notwendigen Wärme wird in der Piezokeramik Verlustwärme durch Anlegen elektrischer Signale produziertThe document DE 39 20 872 A1 discloses a method for the production of ultrasonic layer transducers in which the piezoceramic and thermoplastic plastic material of the layer transducer are connected to one another by hot glueing. To generate the heat required for bonding, heat loss is produced in the piezoceramic by applying electrical signals

Die Schrift DE102008007042 A1 offenbart einen Montageaufbau für eine Sensorvorrichtung mit einem Ultraschallwandler.The font DE102008007042 A1 discloses a mounting structure for a sensor device with an ultrasonic transducer.

In der Schrift DE 10 2004 047 814 A1 wird ein fokussierendes mikrobearbeitetes Ultraschalltransducerarray beschrieben, das als fokussierende klinisch verwendbare Ultraschallsonde verwendet werden kann. Lateral nebeneinander ausgebildete Wandlerzellen werden bereichsweise elektrisch miteinander verdrahtet, um die angestrebte Fokussierung der Ultraschallwandlung zu erreichen.In scripture DE 10 2004 047 814 A1 describes a focusing micromachined ultrasound transducer array that can be used as a focusing clinically useful ultrasound probe. Transducer cells formed laterally next to one another are electrically wired to one another in some areas in order to achieve the desired focusing of the ultrasonic conversion.

Nachteilig ist hierbei, dass die einzelnen Ultraschallwandler äußeren Einflüssen, sowohl mechanischer als auch elektrischer Art, ausgesetzt sind.The disadvantage here is that the individual ultrasonic transducers are exposed to external influences, both mechanical and electrical.

Offenbarung der ErfindungDisclosure of the invention

Die Schallwandleranordnung umfasst einen Lochplattenträger mit mehreren Durchgangsöffnungen, mehrere Piezoelemente und eine Abschlussschicht. Jedes Piezoelement weist dabei eine erste Elektrode und eine zweite Elektrode auf. Die erste Elektrode liegt der zweiten Elektrode gegenüber. Innerhalb einer Durchgangsöffnung ist jeweils ein Piezoelement angeordnet. Die Abschlussschicht ist oberhalb des Lochplattenträgers und der Piezoelemente angeordnet, wobei die zweiten Elektroden der Piezoelemente mit der Abschlussschicht elektrisch leitend verbunden sind. Erfindungsgemäß weist der Lochplattenträger lateral zwischen zwei Durchgangsöffnungen mindestens zwei parallel zueinander beabstandet angeordnete Stege auf. Die Abschlussschicht weist jeweils mit den Stegen, die unmittelbar an die Durchgangsöffnung angrenzen, erste Verbindungsbereiche auf.The sound transducer arrangement comprises a perforated plate carrier with several through openings, several piezo elements and a cover layer. Each piezo element has a first electrode and a second electrode. The first electrode is opposite the second electrode. A piezo element is arranged within each passage opening. The closing layer is arranged above the perforated plate carrier and the piezo elements, the second electrodes of the piezo elements being connected to the closing layer in an electrically conductive manner. According to the invention, the perforated plate carrier has laterally between two through openings at least two webs arranged parallel to one another and spaced apart from one another. The final layer has first connection areas with the webs that directly adjoin the through opening.

Der Vorteil ist hierbei, dass aufeinanderfolgende Biegewandler voneinander entkoppelt sind.The advantage here is that successive bending transducers are decoupled from one another.

In einer Weiterbildung weist die Abschlusssschicht jeweils mit dem Steg, der auf den unmittelbar an die Durchgangsöffnung angrenzenden Steg folgt, einen zweiten Verbindungsbereich auf.In a further development, the terminating layer has a second connection area in each case with the web which follows the web directly adjoining the through opening.

Vorteilhaft ist hierbei, dass die Entkopplung zwischen den einzelnen Biegewandlern effizienter ist.The advantage here is that the decoupling between the individual bending transducers is more efficient.

In einer weiteren Ausgestaltung umfasst der erste Verbindungsbereich eine Schweißnaht oder eine Klebeschicht.In a further embodiment, the first connection area comprises a weld seam or an adhesive layer.

In einer Weiterbildung umfasst die zweite Verbindungsschicht eine Schweißnaht oder Klebeschicht.In a further development, the second connection layer comprises a weld seam or adhesive layer.

In einer weiteren Ausgestaltung ist die Abschlussschicht einstückig ausgebildet.In a further embodiment, the closing layer is formed in one piece.

Der Vorteil ist hierbei, dass der Verbund von Biegewandlerelementen komplett vor äußeren Einflüssen geschützt wird.The advantage here is that the assembly of bending transducer elements is completely protected from external influences.

In einer Weiterbildung weist die Abschlussschicht jeweils zwei Schlitze auf, die symmetrisch zu einem Piezoelement beabstandet angeordnet sind, wobei die Schlitzenden mit den ersten Verbindungsbereichen verbunden sind.In a further development, the end layer has two slits each, which are arranged symmetrically with respect to a piezo element, the ends of the slits being connected to the first connection areas.

In einer weiteren Ausgestaltung sind die Schlitze rechteckförmig.In a further embodiment, the slots are rectangular.

Der Vorteil ist hierbei, dass eckige Piezoelemente verwendet werden können.The advantage here is that angular piezo elements can be used.

In einer Weiterbildung sind die Schlitze bogenförmig ausgestaltet.In a further development, the slots are arcuate.

Vorteilhaft ist hierbei, dass runde Piezoelemente verwendet werden können.It is advantageous here that round piezo elements can be used.

Das erfindungsgemäße Verfahren zur Herstellung einer Schallwandleranordnung mit mehreren Durchgangsöffnungen und mindestens zwei parallelen Stegen, mehreren Piezoelementen und einer Abschlussschicht, die mehrere Schlitze aufweist, umfasst das Verbinden von zweiten Elektroden der Piezoelemente mit der Anschlussschicht. Des Weiteren umfasst das Verfahren das Kontaktieren von ersten Elektroden der Piezoelemente mittels Drahtbonden, wobei die ersten Elektroden den zweiten Elektroden gegenüberliegend angeordnet sind. Weiterhin umfasst das Verfahren das Verbinden der Schlitzenden der Abschlussschicht mit den Stegen des Lochplattenträgers, die unmittelbar an die Durchgangsöffnungen angrenzen, insbesondere mittels Schweißnähten und das teilweise Verfüllen der Durchgangsöffnungen mit einem Dämpfungsmaterial.The method according to the invention for producing a sound transducer arrangement with a plurality of through openings and at least two parallel webs, a plurality of piezo elements and a cover layer which has a plurality of slots comprises the connection of second electrodes of the piezo elements to the connection layer. Furthermore, the method comprises the contacting of first electrodes of the piezo elements by means of wire bonding, the first electrodes being arranged opposite the second electrodes. Furthermore, the method comprises connecting the slot ends of the closing layer to the webs of the perforated plate carrier that directly adjoin the through openings, in particular by means of weld seams, and partially filling the through openings with a damping material.

In einer weiteren Ausgestaltung wird eine Kunststofffolie auf die Abschlussschicht geklebt.In a further embodiment, a plastic film is glued onto the top layer.

Der Vorteil ist hierbei, dass die Schallwandleranordnung abgedichtet ist.The advantage here is that the transducer arrangement is sealed.

Weitere Vorteile ergeben sich aus der nachfolgenden Beschreibung von Ausführungsbeispielen bzw. aus den abhängigen Patentansprüchen.Further advantages emerge from the following description of exemplary embodiments or from the dependent claims.

Kurze Beschreibung der ZeichnungenBrief description of the drawings

Die vorliegende Erfindung wird nachfolgend anhand bevorzugter Ausführungsformen und beigefügter Zeichnungen erläutert. Es zeigen:

Figur 1
eine erfindungsgemäße Schallwandleranordnung,
Figur 2
eine Draufsicht auf eine erste Ausgestaltung der Abschlussschicht,
Figur 3
eine Draufsicht auf eine zweite Ausgestaltung der Abschlussschicht und
Figur 4
ein Verfahren zur Herstellung der erfindungsgemäßen Schallwandleranordnung.
The present invention is explained below with reference to preferred embodiments and attached drawings. Show it:
Figure 1
a transducer arrangement according to the invention,
Figure 2
a top view of a first configuration of the final layer,
Figure 3
a plan view of a second embodiment of the final layer and
Figure 4
a method for producing the sound transducer arrangement according to the invention.

Figur 1 zeigt eine Schnittdarstellung in der xz-Ebene einer Schallwandleranordnung 100. Die Schallwandleranordnung 100 zeigt beispielhaft drei Schallwandlerelemente bzw. Biegewandlerelemente 115, die parallel zueinander beabstandet angeordnet sind. Ein Biegewandlerelement 115 umfasst dabei ein Piezoelement 104, eine Membran 114 die mit Hilfe einer Abschlussschicht 103 gebildet wird, einen Lochplattenträger 101 und Dämpfungsmaterial. Der Lochplattenträger 101 umfasst mehrere Duchgangsöffnungen 111 bzw. Löcher und weist eine Oberseite und eine Unterseite auf, die gegenüberliegend angeordnet sind. Auf der Oberseite sind Stege 102 angeordnet, die parallel zueinander angeordnet sind. Diese Stege 102 weisen einen Mindestabstand zueinander auf, wobei der Mindestabstand der Größe der Durchgangsöffnung 111 entspricht. Das bedeutet die Stege 102 grenzen unmittelbar an die Durchgangsöffnungen 111 an. Die Piezoelemente 104 sind innerhalb der Durchgangsöffnungen 111 angeordnet, wobei jede Durchgangsöffnung 111 jeweils ein Piezoelement 104 aufnimmt, das von der Oberseite in die Durchgangsöffnung 111 eingebracht ist bzw. mit der Oberseite bündig abschließt. Die Piezoelemente 104 weisen kleinere Abmessungen auf als die Durchgangsöffnungen 111. Figure 1 shows a sectional illustration in the xz plane of a sound transducer arrangement 100. The sound transducer arrangement 100 shows, by way of example, three sound transducer elements or bending transducer elements 115, which are arranged parallel to one another and spaced apart. A bending transducer element 115 comprises a piezo element 104, a membrane 114 which is formed with the aid of a closing layer 103, a perforated plate carrier 101 and damping material. The perforated plate carrier 101 comprises a plurality of through openings 111 or holes and has an upper side and a lower side, which are arranged opposite one another. On the upper side, webs 102 are arranged, which are arranged parallel to one another. These webs 102 are at a minimum distance from one another, the minimum distance corresponding to the size of the through opening 111. This means that the webs 102 directly adjoin the through openings 111. The piezo elements 104 are arranged within the through openings 111, each through opening 111 receiving a piezo element 104 which is introduced into the through opening 111 from the top or is flush with the top. The piezo elements 104 have smaller dimensions than the through openings 111.

Die Abschlussschicht 103 weist Schlitze auf, die parallel beabstandet zueinander angeordnet sind und durch die ersten Verbindungsbereiche 108 verbunden werden. Das bedeutet, bei rechteckigen Schlitzen ist die Membran rechteckig. Bei bogenförmigen Schlitzen ist die Membran wellenförmig ausgestaltet.The terminating layer 103 has slots which are arranged parallel to one another at a distance from one another and are connected by the first connecting regions 108. This means that if the slots are rectangular, the membrane is rectangular. In the case of arcuate slots, the membrane is designed to be undulating.

Jedes Piezoelement 104 weist eine erste Elektrode 105 und eine zweite Elektrode 106 auf. Die erste Elektrode 105 ist mittels einer Drahtverbindung 112 beispielsweise mit einer Verstärkerschaltung verbunden und fungiert als Signalleitung bzw. Signalkontakt. Die zweite Elektrode 106 ist mittels einer Klebeschicht 107 mit der Abschlussschicht 103 elektrisch leitend verbunden. Die Abschlussschicht 103 ist mit einer elektrischen Masse, beispielsweise der Verstärkerschaltungmasse, verbunden. Das bedeutet die zweite Elektrode 105 ist geerdet, wodurch eine EMV-Schirmung erfolgt.Each piezo element 104 has a first electrode 105 and a second electrode 106. The first electrode 105 is connected, for example, to an amplifier circuit by means of a wire connection 112 and functions as a signal line or signal contact. The second electrode 106 is electrically conductively connected to the closing layer 103 by means of an adhesive layer 107. The termination layer 103 is connected to an electrical ground, for example the amplifier circuit ground. This means that the second electrode 105 is grounded, as a result of which EMC shielding takes place.

Alternativ können die Piezoelemente 104 über zwei Drahtverbindungen mit der elektrischen Masse und der Verstärkerschaltung elektrisch leitend verbunden werden. Dazu wird die zweite Elektrode 106 über den Rand des Piezoelements 104 umkontaktiert, sodass sich auf der Seite der ersten Elektrode 105 zwei voneinander getrennte Elektrodenbereiche befinden, die getrennt voneinander kontaktierbar sind. Die Piezoelemente 104 können hierbei mit einer elektrisch nicht leitfähigen Klebeschicht mit der Abschlussschicht 103 verbunden werden.Alternatively, the piezo elements 104 can be connected in an electrically conductive manner to the electrical ground and the amplifier circuit via two wire connections. For this purpose, the second electrode 106 is recontacted over the edge of the piezo element 104, so that on the side of the first electrode 105 there are two electrode areas that are separate from one another and can be contacted separately from one another. The piezo elements 104 can be connected to the closing layer 103 with an electrically non-conductive adhesive layer.

Jedes Biegewandlerelement 115 weist einen ersten Verbindungsbereich 108 auf, der die Randeinspannung des Biegewandlerelements 115 bzw. der Membran 114 einstellt bzw. sicherstellt. Unter dem Begriff erster Verbindungsbereich 108 werden dabei die Bereiche verstanden, in denen eine mechanische Verbindung zwischen der Abschlussschicht 103 und den Stegen 102 des Lochplattenträgers 101 erfolgt, der unmittelbar an die Durchgangsöffnung 111 angrenzt. Die ersten Verbindungsbereiche 103 sind dabei parallel beabstandet zu den Durchgangsöffnungen 111 angeordnet. Das bedeutet der laterale Abstand der ersten Verbindungsbereiche 108 zueinander ist größer als die Abmaße der Durchgangsöffnung 111.Each flexural transducer element 115 has a first connecting region 108 which sets or ensures the edge restraint of the flexural transducer element 115 or of the membrane 114. The term first connection area 108 is understood to mean the areas in which there is a mechanical connection between the closing layer 103 and the webs 102 of the perforated plate carrier 101, which directly adjoins the through opening 111. The first connecting areas 103 are arranged at a distance from the through openings 111 in parallel. This means that the lateral distance between the first connection regions 108 is greater than the dimensions of the through opening 111.

In einem lateralen Abstand zu den Stegen 102 sind lateral beabstandet weitere Stege 117 angeordnet, d. h. mindestens ein weiterer Steg 117. Das bedeutet, die weiteren Stege 117 verlaufen parallel zu den Stegen 102. Die Stege 102 und die weiteren Stege 117 sind durch Aussparungen 116 in der Oberseite des Lochplattenträgers 101 getrennt. Die Aussparungen 116 weisen einen Abstand von 0,1 mm - 1 mm zu den Schweißnähten der ersten Verbindungsbereiche 108 auf. Der laterale Abstand zwischen den Stegen 102 und den weiteren Stegen beträgt 0,1 mm - 2 mm. Die Tiefe der Aussparungen 116 umfasst mindestens 0,1 mm. Durch die Aussparungen 116 werden lokal schwingungsfähige Bereiche der Abschlussschicht 103 erzeugt, sodass die Membranen 114 Schwingungsenergie aufnehmen und dissipieren können.At a lateral distance from the webs 102, further webs 117 are arranged laterally spaced apart, ie at least one further web 117. That means, the further webs 117 run parallel to webs 102. webs 102 and further webs 117 are separated by recesses 116 in the top of perforated plate carrier 101. The recesses 116 are at a distance of 0.1 mm-1 mm from the weld seams of the first connection regions 108. The lateral distance between the webs 102 and the further webs is 0.1 mm-2 mm. The depth of the recesses 116 is at least 0.1 mm. Areas of the closing layer 103 that are capable of local oscillation are produced by the cutouts 116, so that the membranes 114 can absorb and dissipate oscillation energy.

Neben den ersten Verbindungsbereichen 108 sind lateral beabstandet zweite Verbindungsbereiche 109 angeordnet. Der Abstand wird durch die Aussparung 116 zwischen den Stegen 102 und 117 gebildet. Die zweiten Verbindungsbereiche 109 sind auf den weiteren Stegen 117 angeordnet und umfassen ebenfalls Schweißnähte. Optional können um die zweiten Verbindungsbereiche 109 weitere Verbindungsbereiche vorhanden sein, die ebenfalls Schweißnähte aufweisen. Die Anzahl der Verbindungsbereiche entspricht dabei der Anzahl der Stege, die parallel zu den Durchgangsöffnungen 111 verlaufen. Mit anderen Worten es sind um die Durchgangsöffnungen 111 abwechselnd mehrere Stege 117 und mehrere Aussparungen 116 lateral nebeneinander angeordnet. Dies dient zu einer verbesserten Entkopplung zwischen zwei Schallwandlerelementen.In addition to the first connection areas 108, second connection areas 109 are arranged laterally spaced apart. The distance is formed by the recess 116 between the webs 102 and 117. The second connection areas 109 are arranged on the further webs 117 and also include weld seams. Optionally, further connection areas can be present around the second connection areas 109, which likewise have weld seams. The number of connection areas corresponds to the number of webs which run parallel to the through openings 111. In other words, a plurality of webs 117 and a plurality of recesses 116 are alternately arranged laterally next to one another around the through openings 111. This serves to improve the decoupling between two sound transducer elements.

Optional können die Aussparungen 102 beispielsweise mit einem silikonhaltigen Dämpfungsmaterial verfüllt sein.The recesses 102 can optionally be filled, for example, with a silicone-containing damping material.

Die Piezoelemente 104 weisen eine Dicke von 100 µm - 750 µm auf, von 150 µm - 500 µm. Der Lochplattenträger 101 weist eine Dicke von 0,5 mm - 15 mm auf, vorzugsweise von 1 mm - 10 mm.The piezo elements 104 have a thickness of 100 μm-750 μm, and 150 μm-500 μm. The perforated plate carrier 101 has a thickness of 0.5 mm-15 mm, preferably 1 mm-10 mm.

Figur 2 zeigt eine Draufsicht auf die erste Ausführung der Abschlussschicht 203. Es sind beispielhaft drei Biegewandlerelemente gezeigt, die parallel bzw. in einer Linie zueinander angeordnet sind. In der Draufsicht ist die rechteckige Abschlussschicht 203 gezeigt, die die drei Piezoelemente 204 überdeckt. Des Weiteren sind der erste Verbindungsbereich 208, der die Randspannung des jeweiligen Biegewandlers einstellt und der zweite Verbindungsbereich 209, der als Entkopplung zwischen den Biegewandlern dient, dargestellt. Rechtwinklig zu den ersten Verbindungsbereichen 208 sind Schlitze 213 angeordnet. Dabei sind die Schlitze 213 mit den ersten Verbindungsbereichen mechanisch verbunden. Das bedeutet die Schlitze 213 und die ersten Verbindungsbereiche 208 formen die Membran des jeweiligen Biegewandlerelements. Die Piezoelemente sind rechteckig oder quadratisch ausgestaltet. Figure 2 shows a plan view of the first embodiment of the closing layer 203. Three bending transducer elements are shown by way of example, which are arranged parallel or in a line to one another. In the top view, the rectangular closing layer 203 is shown, which covers the three piezo elements 204. Furthermore, the first connection area 208, which is the edge tension of the sets the respective bending transducer and the second connection area 209, which serves as a decoupling between the bending transducers, is shown. Slits 213 are arranged at right angles to the first connecting regions 208. The slots 213 are mechanically connected to the first connection areas. This means that the slots 213 and the first connecting areas 208 form the membrane of the respective bending transducer element. The piezo elements are designed to be rectangular or square.

Figur 3 zeigt eine Draufsicht auf die zweite Ausführung der Abschlussschicht 303. Merkmale der Figur 3, die die gleichen Merkmale wie in Figur 2 darstellen, weisen identische hintere Stellen der Bezugszeichen wie Figur 2 auf. In Figur 3 sind die Schlitze bogenförmig ausgestaltet und die Piezoelemente 304 sind rund. Figure 3 FIG. 6 shows a top view of the second embodiment of the final layer 303. Features of FIG Figure 3 that have the same characteristics as in Figure 2 represent, have identical trailing positions of the reference numerals such as Figure 2 on. In Figure 3 the slots are arcuate and the piezo elements 304 are round.

Figur 4 zeigt das Verfahren zur Herstellung einer Schallwandleranordnung, die einen Lochplattenträger mit mehreren Durchgangsöffnungen mindestens zwei parallelen Stegen, mehreren Piezoelementen und einer Abschlussschicht aufweist. Das Verfahren 400 startet mit einem Schritt 410, in dem zweite Elektroden der Piezoelemente mit der Abschlussschicht verbunden werden. In einem folgenden Schritt 420 werden erste Elektroden der Piezoelemente mittels Drahtbonden elektrisch verbunden bzw. kontaktiert. Dabei liegt die erste Elektrode der zweiten Elektrode gegenüber. In einem folgenden Schritt 430 werden die Schlitzenden der Abschlussschicht und die Stege, die unmittelbar an die Durchgangsöffnungen angrenzen, mittels ersten Verbindungsbereichen verbunden, beispielsweise mit Schweißnähten. In einem folgenden Schritt 440 werden die Durchgangsöffnungen mindestens teilweise mit einem Dämpfungsmaterial verfüllt, insbesondere von der Seite, die von der Abschlussschicht abgewandt angeordnet ist, d. h. der Rückseite des Lochplattenträgers. Figure 4 shows the method for producing a sound transducer arrangement which has a perforated plate carrier with a plurality of through openings at least two parallel webs, a plurality of piezo elements and a cover layer. The method 400 starts with a step 410, in which second electrodes of the piezo elements are connected to the final layer. In a subsequent step 420, first electrodes of the piezo elements are electrically connected or contacted by means of wire bonding. The first electrode is opposite the second electrode. In a subsequent step 430, the slot ends of the closing layer and the webs which directly adjoin the through openings are connected by means of first connection areas, for example with weld seams. In a subsequent step 440, the through openings are at least partially filled with a damping material, in particular from the side which is arranged facing away from the closing layer, ie the rear side of the perforated plate carrier.

In einem Ausführungsbeispiel wird eine Kunststofffolie auf die Abschlussschicht geklebt.In one embodiment, a plastic film is glued to the top layer.

Die Schallwandleranordnung 100 findet in Kraftfahrzeugen, bewegten oder stehenden Maschinen, wie Robotern, fahrerlose Transportsysteme, Logistiksystemen in Lagern, Staubsaugern, Rasenmähern Anwendung. Des Weiteren kann die Schallwandleranordnung 100 in E-Bikes, elektrischen Rollstühlen und in Hilfsmitteln zur Unterstützung körperlich eingeschränker Personen eingesetzt werden.The sound transducer arrangement 100 is used in motor vehicles, moving or stationary machines, such as robots, driverless transport systems, logistics systems in warehouses, vacuum cleaners, lawnmowers. Of Furthermore, the sound transducer arrangement 100 can be used in e-bikes, electric wheelchairs and in aids to support physically handicapped people.

Claims (10)

  1. Sound transducer arrangement (100), comprising
    • a perforated plate carrier (101) with a plurality of passage openings (111),
    • a plurality of piezo elements (104), wherein each piezo element (104) has a first electrode (105) and a second electrode (106), which first electrode (105) is situated opposite the second electrode (106) and one piezo element (104) is arranged within one passage opening (111) in each case, and
    • a termination layer (103), wherein the termination layer (103) is arranged above the perforated plate carrier (101) and the piezo elements (104), wherein the second electrodes (106) of the piezo elements (104) are electrically conductively connected to the termination layer (103),
    characterized in that
    the perforated plate carrier (101) has at least two webs (102, 117), which are arranged at a distance from one another in parallel, laterally between two passage openings (111), and the termination layer (103) has first connecting regions (108) to the webs (102), which directly adjoin the passage opening (111), in each case.
  2. Sound transducer arrangement (100) according to Claim 1, characterized in that the termination layer (103) has a second connecting region (109) to the web (117), which follows the web (102) directly adjoining the passage opening, in each case.
  3. Sound transducer arrangement (100) according to either of the preceding claims, characterized in that the first connecting region (108) comprises a weld seam or an adhesive layer.
  4. Sound transducer arrangement (100) according to either of Claims 2 and 3, characterized in that the second connecting region (109) comprises a weld seam or adhesive layer.
  5. Sound transducer arrangement (100) according to one of the preceding claims, characterized in that the termination layer (103) is formed in one piece.
  6. Sound transducer arrangement (100) according to one of the preceding claims, characterized in that the termination layer (103) has in each case two slots (213, 313) which are arranged at a distance from a piezo element (104) in symmetry, wherein the slot ends are connected to the first connecting region (108).
  7. Sound transducer arrangement according to Claim 6, characterized in that the slots (213, 313) are rectangular.
  8. Sound transducer arrangement according to Claim 6, characterized in that the slots (213, 313) are configured in the shape of an arc.
  9. Method (300) for producing a sound transducer arrangement comprising a perforated plate carrier with a plurality of passage openings and at least two parallel webs, a plurality of piezo elements and a termination layer which has slots, comprising the steps of:
    • connecting (310) two electrodes of the piezo elements to the termination layer,
    • making contact (320) with first electrodes of the piezo elements by means of wire bonding, wherein the first electrodes are arranged opposite the second electrodes,
    • connecting (330) the slot ends of the termination layer and the webs of the perforated plate carrier, which directly adjoin the passage openings, by means of a weld seam and
    • partially filling (340) the passage openings with a damping material.
  10. Method (300) according to Claim 9, characterized in that a plastic film is adhesively bonded to the termination layer.
EP16788685.2A 2015-12-10 2016-10-28 Acoustic transducer arrangement having two parallel connecting elements and method for producing an acoustic transducer arrangement having two parallel connecting elements Active EP3386650B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015224773.2A DE102015224773A1 (en) 2015-12-10 2015-12-10 Sound transducer arrangement with two parallel webs and method for producing a sound transducer arrangement with two parallel webs
PCT/EP2016/076078 WO2017097496A1 (en) 2015-12-10 2016-10-28 Acoustic transducer arrangement having two parallel connecting elements and method for producing an acoustic transducer arrangement having two parallel connecting elements

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EP3386650A1 EP3386650A1 (en) 2018-10-17
EP3386650B1 true EP3386650B1 (en) 2021-04-14

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CN (1) CN108367315B (en)
DE (1) DE102015224773A1 (en)
WO (1) WO2017097496A1 (en)

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DE102022124937A1 (en) 2022-09-28 2024-03-28 Valeo Schalter Und Sensoren Gmbh ULTRASONIC SENSOR FOR A MOTOR VEHICLE, MOTOR VEHICLE AND PRODUCTION METHOD FOR AN ULTRASONIC SENSOR

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4754440A (en) * 1985-12-27 1988-06-28 Aisin Seiki Kabushikikaisha Ultrasonic transducer
DE3920872A1 (en) 1989-06-26 1991-01-03 Siemens Ag Hot bonding thermoplastic material to piezoelectric material - in transducer mfr., by surface fusing thermoplastic material
US20050075572A1 (en) 2003-10-01 2005-04-07 Mills David M. Focusing micromachined ultrasonic transducer arrays and related methods of manufacture
JP2008191007A (en) * 2007-02-05 2008-08-21 Denso Corp Structure for mounting sensor device
DE102014207681A1 (en) * 2014-04-24 2015-10-29 Robert Bosch Gmbh Membrane for an ultrasonic transducer and ultrasonic transducer

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CN108367315A (en) 2018-08-03
CN108367315B (en) 2020-09-25
EP3386650A1 (en) 2018-10-17
DE102015224773A1 (en) 2017-06-14
WO2017097496A1 (en) 2017-06-15

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