EP3243217A4 - Boîtier de semi-conducteur et son procédé de fabrication - Google Patents

Boîtier de semi-conducteur et son procédé de fabrication Download PDF

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Publication number
EP3243217A4
EP3243217A4 EP16735133.7A EP16735133A EP3243217A4 EP 3243217 A4 EP3243217 A4 EP 3243217A4 EP 16735133 A EP16735133 A EP 16735133A EP 3243217 A4 EP3243217 A4 EP 3243217A4
Authority
EP
European Patent Office
Prior art keywords
manufacturing
same
semiconductor package
package
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP16735133.7A
Other languages
German (de)
English (en)
Other versions
EP3243217A1 (fr
Inventor
O-Hyun Beak
Keon Kuk
Young-Chul Ko
Woon-Bae Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Priority claimed from PCT/KR2016/000013 external-priority patent/WO2016111512A1/fr
Publication of EP3243217A1 publication Critical patent/EP3243217A1/fr
Publication of EP3243217A4 publication Critical patent/EP3243217A4/fr
Pending legal-status Critical Current

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    • H01L23/293—Organic, e.g. plastic
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    • H01L24/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
    • H01L24/92—Specific sequence of method steps
    • H—ELECTRICITY
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    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
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    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
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    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
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    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/14—Integrated circuits
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    • H01L2924/145—Read-only memory [ROM]
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/1533—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
    • H01L2924/15331—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate being a ball array, e.g. BGA

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  • Engineering & Computer Science (AREA)
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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
EP16735133.7A 2015-01-09 2016-01-04 Boîtier de semi-conducteur et son procédé de fabrication Pending EP3243217A4 (fr)

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KR1020150088717A KR102474242B1 (ko) 2015-01-09 2015-06-22 반도체 패키지 및 그 제조 방법
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Publication number Priority date Publication date Assignee Title
TWI632844B (zh) * 2017-03-13 2018-08-11 景碩科技股份有限公司 Anti-electromagnetic interference shielding device and manufacturing method thereof
KR102028027B1 (ko) * 2017-03-14 2019-10-04 (주)잉크테크 반도체 칩의 전자파 차폐막 형성 장치 및 방법
KR102609138B1 (ko) * 2019-04-29 2023-12-05 삼성전기주식회사 인쇄회로기판 어셈블리
CN110267431B (zh) * 2019-06-18 2021-11-09 青岛歌尔微电子研究院有限公司 一种电路单元封装结构
TWI744869B (zh) * 2020-04-20 2021-11-01 力成科技股份有限公司 封裝結構及其製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120120613A1 (en) * 2009-07-17 2012-05-17 Panasonic Corporation Electronic module and production method therefor

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6900383B2 (en) * 2001-03-19 2005-05-31 Hewlett-Packard Development Company, L.P. Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces
JP2002334954A (ja) * 2001-05-08 2002-11-22 Tdk Corp 電子装置およびその製造方法ならびに電子部品保護用キャップおよびその製造方法
CN1802883A (zh) * 2003-07-03 2006-07-12 株式会社日立制作所 组件装置及其制造方法
JP4645233B2 (ja) * 2005-03-03 2011-03-09 パナソニック株式会社 弾性表面波装置
JP2008258478A (ja) * 2007-04-06 2008-10-23 Murata Mfg Co Ltd 電子部品装置およびその製造方法
US8198176B2 (en) * 2007-10-09 2012-06-12 Hitachi Chemical Company, Ltd. Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device
US8212340B2 (en) * 2009-07-13 2012-07-03 Advanced Semiconductor Engineering, Inc. Chip package and manufacturing method thereof
US8268677B1 (en) * 2011-03-08 2012-09-18 Stats Chippac, Ltd. Semiconductor device and method of forming shielding layer over semiconductor die mounted to TSV interposer
WO2012120659A1 (fr) * 2011-03-09 2012-09-13 国立大学法人東京大学 Procédé de fabrication d'un dispositif à semi-conducteur
US8872312B2 (en) * 2011-09-30 2014-10-28 Taiwan Semiconductor Manufacturing Company, Ltd. EMI package and method for making same
KR101798571B1 (ko) * 2012-02-16 2017-11-16 삼성전자주식회사 반도체 패키지
TWI459521B (zh) * 2012-03-08 2014-11-01 矽品精密工業股份有限公司 半導體封裝件及其製法
KR101935502B1 (ko) * 2012-08-30 2019-04-03 에스케이하이닉스 주식회사 반도체 칩 및 이를 갖는 반도체 패키지
US9173331B2 (en) * 2012-11-20 2015-10-27 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Variable thickness EMI shield with variable cooling channel size
TWI528524B (zh) * 2012-12-18 2016-04-01 欣興電子股份有限公司 內埋式電子元件封裝結構
KR102110984B1 (ko) * 2013-03-04 2020-05-14 삼성전자주식회사 적층형 반도체 패키지
CN203437643U (zh) * 2013-04-12 2014-02-19 机械科学研究总院江苏分院 一种金属件三维激光打印成形设备
CN103327741B (zh) * 2013-07-04 2016-03-02 江俊逢 一种基于3d打印的封装基板及其制造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120120613A1 (en) * 2009-07-17 2012-05-17 Panasonic Corporation Electronic module and production method therefor

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KR20160086246A (ko) 2016-07-19
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TW201637156A (zh) 2016-10-16
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