EP3194878A1 - Procédé pour produire un échangeur de chaleur - Google Patents

Procédé pour produire un échangeur de chaleur

Info

Publication number
EP3194878A1
EP3194878A1 EP15759471.4A EP15759471A EP3194878A1 EP 3194878 A1 EP3194878 A1 EP 3194878A1 EP 15759471 A EP15759471 A EP 15759471A EP 3194878 A1 EP3194878 A1 EP 3194878A1
Authority
EP
European Patent Office
Prior art keywords
elements
adhesive film
heat exchanger
tube
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15759471.4A
Other languages
German (de)
English (en)
Inventor
Thomas Schiehlen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mahle International GmbH
Original Assignee
Mahle International GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mahle International GmbH filed Critical Mahle International GmbH
Publication of EP3194878A1 publication Critical patent/EP3194878A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/0031Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/126Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element consisting of zig-zag shaped fins
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02Header boxes; End plates
    • F28F9/0219Arrangements for sealing end plates into casing or header box; Header box sub-elements
    • F28F9/0224Header boxes formed by sealing end plates into covers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02Header boxes; End plates
    • F28F9/04Arrangements for sealing elements into header boxes or end plates
    • F28F9/16Arrangements for sealing elements into header boxes or end plates by permanent joints, e.g. by rolling
    • F28F9/162Arrangements for sealing elements into header boxes or end plates by permanent joints, e.g. by rolling by using bonding or sealing substances, e.g. adhesives
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00Fastening; Joining
    • F28F2275/02Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • F28F2275/025Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives

Definitions

  • the invention relates to a method for producing a heat exchanger. Moreover, the invention relates to a heat exchanger.
  • Heat exchangers are used to transfer heat between different fluids.
  • heat exchangers of different types are known in the prior art.
  • heat exchangers in tube-fin construction, shell and tube heat exchangers or heat exchangers in stacking disc design. These heat exchangers have in common that they are flowed through by fluids and / or flow around and thus creates a heat transfer between the fluids involved. These known heat exchangers are used inter alia as intercooler, coolant radiator, oil cooler or as a radiator, etc. Heat exchangers are made of metallic and / or non-metallic materials which, for example, by means of soldering, welding, form-locking siger connection or bonding methods are interconnected.
  • soldering welding or gluing
  • elements which are joined together by soldering, welding or gluing, include, for example, tubes, plate elements, fin elements, tube sheets and cover elements, for connecting individual elements by means of a soldering process, either after the joining of the elements, a solder material can be applied or it can already a solder coated elements are used. Under the action of heat, the solder material is melted and by the subsequent solidification of the solder material, a permanent connection is produced,
  • DE 10 2005 048 452 A1 discloses a heat exchanger in stacking disk construction, wherein the heat exchanger consists of a plurality of disk elements, which are stacked on each other.
  • the disk stack is completed at the top and bottom by a base plate.
  • the individual disk elements are soldered together and form within the disk stack flow channels, which are flowed through by one or more fluids.
  • individual elements can also be connected to one another by adhesive methods.
  • DE 10 2008 01 9 556 A1 discloses a component acting as a heat exchanger, which component is produced from a stack of cohesively bonded plates.
  • a method for producing the component is disclosed. The individual elements are acted upon for connection with a polymeric adhesive. Then they are pressed together until the adhesive has hardened.
  • DE 102 28 697 A1 discloses a method for connecting a pipe made of metal with circumferential ribs of a non-ferrous MetafI as part of a heat exchanger. The ribs are connected to the tube by gluing.
  • a disadvantage of the devices and methods of the prior art in particular, that for the fixation of the elements against each other for soldering and welding consuming frames must be made, which are each designed for a special heat exchanger. Furthermore, the racks must withstand the high temperatures during soldering or welding. The soldering operations for a heat exchanger often last several tens of minutes to several hours and are also very energy-intensive. In addition, the solder materials used are very expensive. In addition, before applying the soldering material, a cleaning of the surface is necessary. Following the soldering process, it may also be necessary to clean the heat exchanger in order to remove excess solder material.
  • Soldering and welding processes are also not suitable for bonding any materials, which greatly limits the choice of materials for the elements of the heat exchanger and the possible combinations of materials.
  • adhesives When using adhesives is disadvantageous that the adhesives must be applied consuming on the elements to be bonded, which can be done for example by spraying and / or spraying.
  • the adhesive surfaces thus produced are either unevenly applied to the adhesive or it is applied a very large amount of the adhesive, since the layer thicknesses of the adhesives are partially above 2mm. As a result, the required curing time is increased, making the production more complex and cost intensive.
  • An embodiment of the invention relates to a method for producing a heat exchanger with a connection between two elements of a heat transfer, wherein the two elements are connected to each other at least one contact surface, wherein at least one of the elements is acted upon in the region of the respective contact surface with an adhesive film in which the two elements are brought into abutment with the application of a compressive force and an adhesive bond between the elements is produced by the adhesive film.
  • an adhesive film it is particularly advantageous to use an adhesive film, as this is easy to handle and in a simple manner to the respective element or the contact surface between the elements is adaptable.
  • the adhesive film can be applied manually or automatically to one of the elements. It may also be advantageous if the adhesive film is already applied to the starting material of the elements and the elements are subsequently produced using molding methods such as embossing, cutting or stamping.
  • an adhesive bond is advantageously produced by the adhesive film, which replaces the usual solder joint.
  • the otherwise used solder material is thus replaced in this process by the adhesive film.
  • the adhesive film can also be applied to impure surfaces, which may be exposed to fats, oils or dirt particles, for example. This can otherwise prevent the use of soldering drive usual step of cleaning and degreasing the surfaces of the elements may be omitted.
  • An adhesive film is furthermore particularly advantageous because it is particularly easy to produce very uniform and easily reproducible layer thicknesses. This is advantageous in particular with regard to an automated manufacturing process in the context of mass production.
  • the adhesive film is touch-dry, wherein the adhesive effect of the adhesive film is activated and / or becomes highly viscous by the application of a compressive force and / or by the heating of the adhesive film.
  • a touch-dry or in technical language tack tack-free adhesive film is particularly advantageous because the handling of the adhesive film is much easier. No special precautions must be taken against touching the adhesive film on the elements during the process.
  • the adhesive effect of the adhesive film is activated only by the application of a compressive force and / or by the heating and / or highly viscous, so that the adhesive effect is generated only during the process. This also facilitates the positioning of the elements relative to one another, since unintentional sticking is avoided.
  • the adhesive film has a layer thickness between 10pm and 250pm.
  • a particularly thin adhesive film is particularly advantageous because the amount of material used can be kept very low. In particular, in comparison to conventional adhesive methods in which the adhesive is applied by means of a nozzle in beads, so a significantly reduced adhesive use can be achieved.
  • the particularly thin layer thicknesses can be produced in particular by filler-free adhesives.
  • the adhesive layer between the two elements is particularly thin and is preferably a few nanometers to about 250pm.
  • Very thin layer thicknesses of the adhesive are also advantageous in order to produce very short curing times for the adhesive bonds.
  • the curing time may preferably be in a range of 1 minute to 20 minutes, Particularly preferred are curing times of less than 5 minutes to ensure the highest possibleificatesempempo.
  • the adhesive film is laminated on one of the elements and / or inserted into a recess in one of the elements.
  • the adhesive film can advantageously be adhesively bonded to one of the elements with the aid of a further adhesive or can simply be applied to this. By applying the pressure force and / or by heating, an adhesive bond with both elements is finally produced.
  • the adhesive film is applied to one of the elements over the whole area in the area of the contact surface or that the adhesive film is applied to one of the elements in a tailor-made manner tailored to the respective contact surface.
  • the adhesive film can be applied over the whole area to a region of an element or tailored specifically to the contact surface.
  • Elements with voluminous adhesive film can be produced particularly easily in a scale suitable for mass production.
  • Specially tailored adhesive films can further reduce material usage.
  • a compressive force of 0.005 N / mm 2 and 1 SN / mm 2 is applied to the elements brought into contact with each other for connection. It is particularly advantageous if the pressure force is applied in a heated state. By heating the adhesive film is already softened, whereby a dipping of the elements in the adhesive layer is made possible.
  • the method comprises the following steps:
  • pellet film is softened by the heating, wherein the pellet film of at least one of the elements is at least partially displaced, whereby the layer thickness between the elements after heating is lower than before heating.
  • the method is particularly oriented to the already known method for soldering heat exchangers. In contrast to soldering but no solder material is applied, but only a Kiebstofffolie, which melts at much lower temperatures than the solder material. All connections between the elements of a heat exchanger, which have hitherto been produced by soldering, can also be produced by the proposed adhesive method.
  • An embodiment of the invention relates to a heat exchanger with at least two elements, wherein the heat exchanger is produced by a method already described, wherein the elements through pipes and / or tube sheets and / or plate elements and / or cover elements and / or pipe sockets and / or
  • Rib elements are formed.
  • the adhesive film acts as a complete replacement for a solder used in soldering.
  • the adhesive film can advantageously also be applied to strongly differently shaped elements, so that there are practically no geometric restrictions for the elements to be connected by means of the adhesive film.
  • the adhesive film is formed from an adhesive which consists of at least one component or only one component and can be filled or is free of filler.
  • Suitable fillers are thermally conductive flakes or particles.
  • materials such as boron nitride, aluminum, copper, steel, Mesung, graphite, etc. are used.
  • a filler-free adhesive is particularly advantageous in order to produce the smallest possible layer thickness of the adhesive film.
  • the heat exchanger has at least one flow channel, which can be traversed by a fluid, wherein the flow channel is sealed against the environment by the arranged between the individual elements of the heat transfer adhesive film fluid-tight.
  • flow channels can be generated in a simple manner, which are sealed at their interfaces to other elements of the heat exchanger by the adhesive bond produced.
  • the flow channel itself can be sealed by the adhesive bond, for example, by the flow channel is first generated by the bonding of two elements.
  • the seal against the environment can be done, for example, at the junction between a pipe and a tube sheet, at the junction between two plate elements or the junction between a tube sheet and a collection box forming a lid member.
  • the heat exchanger has at least one tube ", wherein the tube is acted on at least one of its outwardly directed end portions with an adhesive film, wherein the area acted upon by the adhesive film is inserted into a recess of a tube sheet and the adhesive film, the contact surface is at least partially covered between the tube and the tubesheet and forms a fluid-tight seal between the tube and the tubesheet.
  • the tubes may be formed of a metallic material with a high thermal conductivity, while the tubesheet is formed, for example, from a plastic, which has particularly good properties in terms of the absorption of resulting forces.
  • adhesive films compounds can be produced with a high density. Due to the particularly low layer thickness of the adhesive film, the elements can be mounted similar to the solder-plated elements in a soldering process.
  • the heat exchanger is formed from a plurality of stacked plate elements, wherein the plate elements are abutting each other at its edge region and in the contact area an adhesive film between the individual plate elements is arranged and forms a fluid-tight seal between the plate elements.
  • a heat exchanger in stacked disk design can be produced in a simple manner by the use of adhesive films.
  • the plate elements have an adhesive film, in particular in their contact area relative to one another.
  • the heat exchanger has a collecting box, wherein the collecting box is formed from a tube plate and a lid member inserted into a receiving area of the tube plate, wherein in the receiving area of the tube plate an adhesive film is arranged, which the contact surface between the lid member and the tube sheet at least partially covered and forms a fluid-tight seal between the cover member and the tube sheet.
  • the collection box can be produced with the same connection method as the rest of the heat transfer. In this way, individual process steps during production can be saved, making the production easier and less expensive. Nevertheless, a uniform connection quality can be generated at the various connection points. It is also expedient if the heat exchanger has at least one tube which can be flowed through by a first fluid and by a second fluid, wherein at least one rib element is provided on an outwardly directed surface of the tube and / or on an inwardly directed surface of the tube is arranged, which is connected by the adhesive film to the tube.
  • rib elements are also particularly advantageous for rib elements to be connected to the tube inside the tube or to the outer surface of the tube using the adhesive film. This is particularly advantageous to allow for improved heat transfer.
  • the low layer thicknesses of the adhesive film are particularly advantageous in order to produce the highest possible thermal conductivity.
  • the adhesive film is destructible under the action of heat. This is particularly advantageous in order to be able to disassemble the heat exchangers generated after their use in a simple manner and to be able to feed the individual materials used to a recycling cycle.
  • the required temperature level for the destruction of the adhesive layer is preferably clearly above the temperature level, which occurs in regular operation of the heat exchanger. Nevertheless, the required temperature level is well below the temperature level, which is needed to produce a solder joint.
  • Solder joints are produced at temperatures of about 650 ° C.
  • the temperature required for the destruction of the adhesive film is significantly below this temperature level.
  • the melting of the adhesive film can preferably take place in a temperature range from about 100.degree. C. to about 380.degree.
  • the temperature sufficient to destroy the adhesive film is therefore preferably above the melting temperature of the adhesive film and below the usual soldering temperature.
  • the heat exchanger is made of metallic materials and / or of non-metallic materials.
  • the preferably used non-metallic materials include in particular plastics or activated carbon.
  • the metallic materials include, in particular, copper, aluminum, steel and titanium.
  • the adhesive sheet is formed of a thermoplastic material.
  • a thermoplastic material is particularly advantageous because it is very environmentally friendly compared to other adhesives and is easily recyclable.
  • thermoplastic adhesives only minimal minimum storage and processing requirements must be met. For example, no air evacuation must be provided when processing thermoplastic adhesives, since they do not or only to a very small extent outgas.
  • thermoplastic material is also advantageous because it has high media resistance, which increases the life and reliability of the component produced. This is particularly advantageous, in particular with regard to the partially corrosive media in the heat exchangers. It is furthermore particularly advantageous if all connections between the individual elements of the heat exchanger are produced using the adhesive film. This makes uniform processing possible and allows a manufacturing process that is very similar to the ordinary production process of soldered heat exchangers. This makes it easier to adapt an existing production plant to the new technology.
  • soldering process elements can be integrated into the otherwise bonded heat exchanger. Since the soldering temperatures are well above the temperatures for producing an adhesive bond, already soldered elements are not damaged during the gluing process.
  • FIG. 1 is a sectional view through a tube of a heat exchanger and a corrugated fin member, wherein the corrugated fin member is bonded to the outer surface of the tube by means of an adhesive film
  • FIG. 2 is a block diagram for explaining the method of manufacturing a heat exchanger.
  • FIG. 1 shows a sectional view through a heat exchanger 1.
  • the heat exchanger 1 has a tube 2, to which a rib element 3 is connected.
  • the rib element 3 is connected by means of an adhesive layer 4 to the tube 2, wherein the adhesive layer 4 is formed by an adhesive film 4, which is arranged on the outer surface of the tube 2.
  • the adhesive film 4 may be laminated on the tube 2, so be connected with the aid of an adhesive to the tube 2, or simply be placed on the outer surface of the tube 2.
  • the rib element 3 is formed indistinsbeispiei of Figure 1 by a corrugated fin element 3.
  • other fin elements may be provided to increase the outer heat transfer surface area of the tube.
  • FIG. 1 shows only a limited partial view of the heat exchanger 1.
  • the heat exchanger 1 can also have further tubes and rib elements.
  • the tubes can advantageously be added end to end in tube sheets and / or collection boxes.
  • FIG. 1 shows a state in which the rib element 3 rests on the adhesive film 4.
  • the adhesive film 4 is heated, whereby it melts. Since a compressive force acts on the tube 2 and the fin element 3 at the time of heating, part of the adhesive film 4 is displaced by the rib element 3 and / or the tube 2, whereby the layer thickness of the adhesive film 4 is reduced.
  • FIG. 2 shows a block diagram to illustrate the method used to produce a heat exchanger.
  • the adhesive film is applied to at least one of the elements to be bonded together. This can be done by an automated process or manually.
  • the adhesive film can in particular be laminated or inserted into a recess of an element.
  • the elements are brought into abutment with each other. For this purpose, they are positioned relative to each other according to the later desired appearance of the heat exchanger.
  • either only two elements can be positioned against each other or it can be made analogous to the known soldering a complete arrangement of all the heat exchanger block or the heat exchanger forming elements.
  • a compressive force is applied to the relatively arranged elements. This can preferably be done in a device designed for this purpose.
  • the elements and the adhesive film are heated, whereby melting of the adhesive film is achieved.
  • the elements are maintained at a predetermined temperature level for a predetermined period of time to allow for placement of the elements into the layer of adhesive film and ultimately to ensure curing of the adhesive layer.
  • FIG. 1 is exemplary and shows a section of a heat exchanger in tube-fin construction.
  • the exemplary embodiment has no restrictive character, in particular with regard to the applicability of the method to a specific heat exchanger.
  • the block diagram of FIG. 2 is merely exemplary and does not exclude alternative solutions and variations.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

L'invention concerne un procédé pour produire un échangeur de chaleur présentant une liaison entre deux éléments (2, 3) d'un échangeur de chaleur (1), les deux éléments (2, 3) pouvant être reliés l'un à l'autre au niveau respectivement d'une surface de contact, au moins un des éléments (2, 3) étant soumis, dans la zone de chaque surface de contact, à l'action d'un film adhésif (4), les deux éléments (2, 3) étant mis en appui mutuel par application d'une force de compression et une liaison par collage étant générée entre les deux éléments, par le film adhésif (4). L'invention concerne également un échangeur de chaleur (1) à cet effet.
EP15759471.4A 2014-09-17 2015-09-08 Procédé pour produire un échangeur de chaleur Withdrawn EP3194878A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014218694.3A DE102014218694A1 (de) 2014-09-17 2014-09-17 Verfahren zur Herstellung eines Wärmeübertragers
PCT/EP2015/070491 WO2016041816A1 (fr) 2014-09-17 2015-09-08 Procédé pour produire un échangeur de chaleur

Publications (1)

Publication Number Publication Date
EP3194878A1 true EP3194878A1 (fr) 2017-07-26

Family

ID=54062755

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15759471.4A Withdrawn EP3194878A1 (fr) 2014-09-17 2015-09-08 Procédé pour produire un échangeur de chaleur

Country Status (6)

Country Link
US (1) US20170160023A1 (fr)
EP (1) EP3194878A1 (fr)
CN (1) CN107076531A (fr)
BR (1) BR112017003805A2 (fr)
DE (1) DE102014218694A1 (fr)
WO (1) WO2016041816A1 (fr)

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JP6768834B2 (ja) * 2016-12-21 2020-10-14 三菱電機株式会社 熱交換器およびその製造方法ならびに冷凍サイクル装置
US11032944B2 (en) * 2017-09-29 2021-06-08 Intel Corporation Crushable heat sink for electronic devices
DE102018208977A1 (de) 2018-06-07 2019-12-12 Mahle International Gmbh Anordnung mit einer Leistungselektronik und einem Kühler

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DE2515378A1 (de) * 1974-04-11 1975-10-23 Ciba Geigy Ag Verfahren zum herstellen von waermeaustauschern
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Also Published As

Publication number Publication date
BR112017003805A2 (pt) 2017-12-19
CN107076531A (zh) 2017-08-18
US20170160023A1 (en) 2017-06-08
DE102014218694A1 (de) 2016-03-17
WO2016041816A1 (fr) 2016-03-24

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