EP3190339A1 - Verfahren zur bereitstellung eines gehäuses für beleuchtungsvorrichtungen und entsprechendes gehäuse - Google Patents

Verfahren zur bereitstellung eines gehäuses für beleuchtungsvorrichtungen und entsprechendes gehäuse Download PDF

Info

Publication number: EP3190339A1
Authority: EP; European Patent Office
Prior art keywords: vat; planar element; bottom wall; thermally; electrically conductive
Prior art date: 2016-01-11
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP16207382.9A

Other languages

English (en)

French (fr)

Other versions

EP3190339B1 (de

EP3190339A8 (de

Inventor

Alessio SAGLIOCCO

Fabrizio Cacchione

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Osram GmbH

Osram SpA

Original Assignee

Osram GmbH

Osram SpA

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2016-01-11

Filing date

2016-12-29

Publication date

2017-07-12

2016-12-29 Application filed by Osram GmbH, Osram SpA filed Critical Osram GmbH

2017-07-12 Publication of EP3190339A1 publication Critical patent/EP3190339A1/de

2017-10-18 Publication of EP3190339A8 publication Critical patent/EP3190339A8/de

2018-10-31 Application granted granted Critical

2018-10-31 Publication of EP3190339B1 publication Critical patent/EP3190339B1/de

Status Active legal-status Critical Current

2036-12-29 Anticipated expiration legal-status Critical

Links

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239000012777 electrically insulating material Substances 0.000 claims abstract description 6
239000000463 material Substances 0.000 claims description 17
230000008878 coupling Effects 0.000 claims description 15
238000010168 coupling process Methods 0.000 claims description 15
238000005859 coupling reaction Methods 0.000 claims description 15
238000005516 engineering process Methods 0.000 claims description 5
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 4
239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 4
239000000956 alloy Substances 0.000 claims description 4
229910045601 alloy Inorganic materials 0.000 claims description 4
239000010949 copper Substances 0.000 claims description 4
229910052802 copper Inorganic materials 0.000 claims description 4
239000004417 polycarbonate Substances 0.000 claims description 4
238000010292 electrical insulation Methods 0.000 claims description 3
229910001369 Brass Inorganic materials 0.000 claims description 2
FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
239000004952 Polyamide Substances 0.000 claims description 2
XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 claims description 2
239000004411 aluminium Substances 0.000 claims description 2
229910052782 aluminium Inorganic materials 0.000 claims description 2
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
239000010951 brass Substances 0.000 claims description 2
229920001940 conductive polymer Polymers 0.000 claims description 2
239000000945 filler Substances 0.000 claims description 2
239000011521 glass Substances 0.000 claims description 2
229910052749 magnesium Inorganic materials 0.000 claims description 2
239000011777 magnesium Substances 0.000 claims description 2
239000007769 metal material Substances 0.000 claims description 2
239000012994 photoredox catalyst Substances 0.000 claims description 2
229920002647 polyamide Polymers 0.000 claims description 2
229920000515 polycarbonate Polymers 0.000 claims description 2
229920000069 polyphenylene sulfide Polymers 0.000 claims 2
238000005452 bending Methods 0.000 claims 1
238000004519 manufacturing process Methods 0.000 description 6
230000015572 biosynthetic process Effects 0.000 description 4
238000005755 formation reaction Methods 0.000 description 4
239000004033 plastic Substances 0.000 description 4
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230000002093 peripheral effect Effects 0.000 description 1
238000000926 separation method Methods 0.000 description 1
239000000126 substance Substances 0.000 description 1

Images

Classifications

- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
- F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm

Definitions

the description relates to lighting devices.
One or more embodiments may refer to lighting devices employing, as light radiation sources, electrically-powered sources such as solid-state light radiation sources, e.g. LED sources.
One or more embodiments aim at satisfying such need.
said object may be achieved thanks to a method having the features specifically set forth in the claims that follow.
One or more embodiments may also concern a corresponding housing.
One or more embodiments as exemplified herein refer to the manufacturing of a housing for lighting devices, generally denoted as 10 in Figure 6 .
housing 10 may be adapted to accommodate therein an electrically-powered light radiation source L, shown in dashed lines in Figure 6 only.
One or more embodiments may envisage a solid-state light radiation source, such as a LED source.
Source L (which in itself may be a part of one or more embodiments) may be of any known kind and may include, for example, a single source (one LED) or multiple sources, such as a LED array.
Figures 1 to 5 may be seen as ideally representative of subsequent steps of a method according to one or more embodiments, in order to manufacture a housing such as housing 10 visible in Figure 6 .
Figure 1 refers to the manufacturing of a planar element 12 of a material (e.g. a metal material such as copper) having both thermal and electrical conduction features.
a material e.g. a metal material such as copper
planar element 12 may be manufactured, for example, from a metal sheet.
planar element 12 may be manufactured via known technologies used for socalled lead frames of integrated electrical circuits.
one or more embodiments may envisage the use of different manufacturing technologies, e.g. 3D printing.
planar element 12 may include a first and a second portion, respectively denoted as 12a and 12b.
the first portion 12a may comprise a pattern of electrically conductive lines, adapted to enable e.g. the power supply (and optionally the performance of control functions) of the light radiation source L.
the second portion 12b may include the presence of one or more planar portions ("lands") adapted to perform a thermal dissipation action of the heat produced by source L in operation.
source S may be provided (as known in itself, so as not to require a specific description herein) both with electrical contact pads, adapted to establish the electrical contact with electrically conductive lines 12a, and with one or more thermal dissipation pads, adapted to be brought into contact with the thermally dissipative formations (planar portions 12b) so as to achieve a heat transfer function towards said portions.
Figure 2 shows the possibility, in one or more embodiments, of coupling planar element 12 with a (first) body 14 having a general vat-like configuration, e.g. the shape of a cup, with a core or bottom wall 140 and a peripheral or shell wall 142.
a (first) body 14 having a general vat-like configuration, e.g. the shape of a cup, with a core or bottom wall 140 and a peripheral or shell wall 142.
the coupling of element 12 with vat-like body 14 may be achieved by comoulding vat-like body 14 with element 12, according to a procedure to be described in the following.
vat-like body 14 may be formed of a material (e.g. a plastic material) having thermally conductive (and therefore dissipative) properties, combined with electrically insulating properties.
a material e.g. a plastic material having thermally conductive (and therefore dissipative) properties, combined with electrically insulating properties.
the material of body 14 may be selected out of polycarbonate - PC, acrylonitrile-butadiene-styrene - ABS, polyamide - PA, polybutylenterephtalate - PBT, poly-paraphenylene sulfide - PPS, optionally with a filler such as glass material.
the coupling between element 12 and vat-like body 14 may be implemented so that the lines 12a of element 12 extend on the bottom wall 140 of body 14 (optionally with bent end portions 120a, as will be better detailed in the following), while portions 12b of the thermally conductive pattern extend in a position corresponding to one or more windows 1400 provided in bottom wall 140 of body 14 (see Figure 4 ).
portions of the thermally conductive pattern 12b extend in a position corresponding to window(s) 1400 of bottom wall 140, it is meant that such portions 12b face window(s) 1400, so that they are accessible from the bottom wall 140 of body 14 from the outside of body 14 itself.
portions 12b may be provided with rims, such as e.g. the rim denoted as 120b, which are connected (e.g. as a consequence of co-molding) with the material of bottom wall 140 of body 14.
electrically conductive lines 12a may have end portions 120a which, e.g. during the coupling operation of element 12 to body 14, are bent (e.g. outwardly of body 14 itself) so as to form, as visible in Figure 4 , a connector 144 which protrudes from bottom wall 140 outwardly of body 14.
reference A denotes the area wherein, during the coupling step (e.g. while body 14 is being co-molded onto element 12) ends 120a of electrically conductive lines 12a are bent inwardly of connector 144.
FIG. 2 The same schematic representation of Figure 2 shows that, in this or in a subsequent step, electrically conductive lines 12a and thermally conductive patterns 12b may be separated from each other (e.g. via a cutting operation) e.g. in the locations denoted as B in Figure 2 .
conductive lines 12a may be electrically insulated from thermally conductive portions 12b, optionally with a mutual electrical separation of the various lines 12a (ground line, "hot” line, etc.) which must be connected to source L.
the material of element 12 may be one material (e.g. a metal) which may be both electrically and thermally conductive.
Figure 5 (which again must be considered as a schematic representation having an essentially illustrative purpose) exemplifies possible connections of vat-like body 14 with a further body 16 adapted to complete housing 10.
body 16 may be provided with fins 160, so that it is adapted to act as a heatsink.
body 16 may include a thermally conductive (e.g. plastic) material, e.g. having a higher thermal conductivity than the material of body 14), in combination with electrical conductivity features.
a thermally conductive (e.g. plastic) material e.g. having a higher thermal conductivity than the material of body 14
an electrically conductive material for body 16 does not originate undesired short-circuits of the electrically conductive lines 12a: as a matter of fact, as shown (in an intentionally schematic representation) in Figure 5 , the electrically conductive lines 12a may be separated, and therefore insulated, from body 16 by the bottom wall 140 of body 14 (of which Figure 5 only shows the outer dimensions in dashed lines), which includes an electrically insulating material and therefore is adapted to perform a function of electrical insulation.
the coupling of body 16 to body 14 may again be achieved via overmolding, so as to originate a fixation of the (e.g. plastic) material which may correspond to a sort of chemical gluing.
the material of body 16 may be selected out of aluminium and alloys thereof, magnesium and alloys thereof, copper, brass, thermo-conductive polymers of various nature.
thermally conductive portions 12b are in contact (practically along the whole extension thereof, with the possible exception of the rims, such as rim 120b visible in Figure 4 ) with body 16.
the coupling between bodies 14 and 16 may be made firmer by providing e.g. hook formations such as complementary hook formations, e.g. form-fitting teeth/cavities generally denoted as 1420 in various annexed Figures.
hook formations such as complementary hook formations, e.g. form-fitting teeth/cavities generally denoted as 1420 in various annexed Figures.
body 16 may include e.g. a cavity 144a, adapted to accommodate connector 144 therein, which in turn may be provided e.g. with hook formations such as one or more teeth 144a.

Landscapes

Engineering & Computer Science (AREA)
General Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Microelectronics & Electronic Packaging (AREA)
Optics & Photonics (AREA)
Manufacturing & Machinery (AREA)
Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

EP16207382.9A 2016-01-11 2016-12-29 Verfahren zur bereitstellung eines gehäuses für beleuchtungsvorrichtungen und entsprechendes gehäuse Active EP3190339B1 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
ITUB2016A009901A ITUB20169901A1 (it)	2016-01-11	2016-01-11	Procedimento per realizzare un involucro per dispositivi di illuminazione ed involucro corrispondente

Publications (3)

Publication Number	Publication Date
EP3190339A1 true EP3190339A1 (de)	2017-07-12
EP3190339A8 EP3190339A8 (de)	2017-10-18
EP3190339B1 EP3190339B1 (de)	2018-10-31

Family

ID=55861077

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP16207382.9A Active EP3190339B1 (de)	2016-01-11	2016-12-29	Verfahren zur bereitstellung eines gehäuses für beleuchtungsvorrichtungen und entsprechendes gehäuse

Country Status (2)

Country	Link
EP (1)	EP3190339B1 (de)
IT (1)	ITUB20169901A1 (de)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP1469707A2 (de)	2003-04-14	2004-10-20	Integral Technologies, Inc.	Auf der Grundlage von leitfähigem und auf Harz basierendem Material hergestellte Leuchtschaltung
DE102006017718A1 (de) *	2005-10-27	2007-05-16	Kromberg & Schubert Gmbh & Co	Leuchte
US20070121326A1 (en)	2005-11-29	2007-05-31	Gelcore, Llc	LED lighting assemblies with thermal overmolding
US20090135997A1 (en)	2006-03-27	2009-05-28	Hologic, Inc.	Breast Compression For Digital Mammography, Tomosynthesis And Other Modalities
US20090277684A1 (en)	2005-12-23	2009-11-12	Teikoku Tsushin Kogyo Co., Ltd.	Mounting structure and method for mounting electronic component onto circuit board
EP2312204A1 (de)	2009-10-16	2011-04-20	Automotive Lighting Italia S.p.A.	LED Fahrzeugleuchte, insbesondere Kraftfahrzeugleuchte
US20110095690A1 (en)	2009-10-22	2011-04-28	Thermal Solution Resources, Llc	Overmolded LED Light Assembly and Method of Manufacture
WO2011155851A1 (en) *	2010-06-07	2011-12-15	Velu Pannirselvam A L	Led lamp and method of manufacturing the same
EP2432038A1 (de)	2010-09-17	2012-03-21	Liang Meng Plastic Share Co. Ltd.	Lichtemissionsdiodenpaketstruktur
EP2827687A1 (de)	2013-07-15	2015-01-21	OSRAM GmbH	Stützstruktur für Beleuchtungsvorrichtungen, entsprechende Vorrichtung und Verfahren

2016
- 2016-01-11 IT ITUB2016A009901A patent/ITUB20169901A1/it unknown
- 2016-12-29 EP EP16207382.9A patent/EP3190339B1/de active Active

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP1469707A2 (de)	2003-04-14	2004-10-20	Integral Technologies, Inc.	Auf der Grundlage von leitfähigem und auf Harz basierendem Material hergestellte Leuchtschaltung
DE102006017718A1 (de) *	2005-10-27	2007-05-16	Kromberg & Schubert Gmbh & Co	Leuchte
US20070121326A1 (en)	2005-11-29	2007-05-31	Gelcore, Llc	LED lighting assemblies with thermal overmolding
US20090277684A1 (en)	2005-12-23	2009-11-12	Teikoku Tsushin Kogyo Co., Ltd.	Mounting structure and method for mounting electronic component onto circuit board
US20090135997A1 (en)	2006-03-27	2009-05-28	Hologic, Inc.	Breast Compression For Digital Mammography, Tomosynthesis And Other Modalities
EP2312204A1 (de)	2009-10-16	2011-04-20	Automotive Lighting Italia S.p.A.	LED Fahrzeugleuchte, insbesondere Kraftfahrzeugleuchte
US20110095690A1 (en)	2009-10-22	2011-04-28	Thermal Solution Resources, Llc	Overmolded LED Light Assembly and Method of Manufacture
WO2011155851A1 (en) *	2010-06-07	2011-12-15	Velu Pannirselvam A L	Led lamp and method of manufacturing the same
EP2432038A1 (de)	2010-09-17	2012-03-21	Liang Meng Plastic Share Co. Ltd.	Lichtemissionsdiodenpaketstruktur
EP2827687A1 (de)	2013-07-15	2015-01-21	OSRAM GmbH	Stützstruktur für Beleuchtungsvorrichtungen, entsprechende Vorrichtung und Verfahren

Also Published As

Publication number	Publication date
EP3190339B1 (de)	2018-10-31
ITUB20169901A1 (it)	2017-07-11
EP3190339A8 (de)	2017-10-18

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2017-10-18	RAP1	Party data changed (applicant data changed or rights of an application transferred)	Owner name: OSRAM GMBH Owner name: OSRAM S.P.A. - SOCIETA' RIUNITE OSRAM EDISON CLERI
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