DE102006017718A1 - Leuchte - Google Patents

Leuchte Download PDF

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Publication number
DE102006017718A1
DE102006017718A1 DE102006017718A DE102006017718A DE102006017718A1 DE 102006017718 A1 DE102006017718 A1 DE 102006017718A1 DE 102006017718 A DE102006017718 A DE 102006017718A DE 102006017718 A DE102006017718 A DE 102006017718A DE 102006017718 A1 DE102006017718 A1 DE 102006017718A1
Authority
DE
Germany
Prior art keywords
housing
electro
current supply
directly onto
vehicle uses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102006017718A
Other languages
English (en)
Inventor
Joachim Czabanski
Erik Rega
Peter Kreutmayr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KROMBERG & SCHUBERT KG, DE
Original Assignee
Kromberg and Schubert GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kromberg and Schubert GmbH and Co KG filed Critical Kromberg and Schubert GmbH and Co KG
Priority to DE102006017718A priority Critical patent/DE102006017718A1/de
Priority to DE202006020926U priority patent/DE202006020926U1/de
Publication of DE102006017718A1 publication Critical patent/DE102006017718A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14—Light emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Arrangements Of Lighting Devices For Vehicle Interiors, Mounting And Supporting Thereof, Circuits Therefore (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

Die Erfindung betrifft eine Leuchte 10, 20, 30, 40, 50, 60 mit einem Gehäuse 2, mit mindestens einem elektrooptischen Wandler 3, 5, 7, 9 und Leiterbahnen 3.1, 3.2, 5.1, 5.2 für die Stromversorgung des elektrooptischen Wandlers 3, 5, 7, 9. Der mindestens eine elektrooptische Wandler 3, 5, 7, 9 und die zu dem elektrooptischen Wandler 3, 5, 7, 9 führenden Leiterbahnen 3.1, 3.2, 5.1, 5.2 sind auf das Gehäuse 2 aufgebracht.
DE102006017718A 2005-10-27 2006-04-15 Leuchte Ceased DE102006017718A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE102006017718A DE102006017718A1 (de) 2005-10-27 2006-04-15 Leuchte
DE202006020926U DE202006020926U1 (de) 2005-10-27 2006-04-15 Leuchte

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005051413 2005-10-27
DE102006017718A DE102006017718A1 (de) 2005-10-27 2006-04-15 Leuchte

Publications (1)

Publication Number Publication Date
DE102006017718A1 true DE102006017718A1 (de) 2007-05-16

Family

ID=37982778

Family Applications (2)

Application Number Title Priority Date Filing Date
DE202006020926U Expired - Lifetime DE202006020926U1 (de) 2005-10-27 2006-04-15 Leuchte
DE102006017718A Ceased DE102006017718A1 (de) 2005-10-27 2006-04-15 Leuchte

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE202006020926U Expired - Lifetime DE202006020926U1 (de) 2005-10-27 2006-04-15 Leuchte

Country Status (1)

Country Link
DE (2) DE202006020926U1 (de)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007041817A1 (de) * 2007-09-03 2009-03-05 Osram Gesellschaft mit beschränkter Haftung Leuchtmodul und Verfahren zu dessen Herstellung
DE102007040596A1 (de) * 2007-08-27 2009-03-05 Epsys Paul Voinea E.K. Beleuchtungsmittel mit Wärmespreizung durch Wärmeleitbeschichtung
EP2072893A1 (de) * 2007-12-17 2009-06-24 Tang Shih Chuan Leuchtdiodenlampe (LED) mit Kühlsitz
DE102009050700A1 (de) * 2009-10-26 2011-05-05 Technomid Gmbh LED-Leuchte sowie System
DE102010044312A1 (de) * 2010-09-03 2012-03-08 Tyco Electronics Amp Gmbh Leuchte zur Verwendung in feuchten oder nassen Umgebungen mit Leuchtmittelträger
DE102011085655A1 (de) * 2011-11-03 2013-05-08 Osram Gmbh Beleuchtungseinrichtung mit Halbleiterlichtquellen
DE102012107668A1 (de) * 2012-08-21 2014-03-20 Epcos Ag Bauelementanordnung
DE102012218059A1 (de) * 2012-10-02 2014-04-03 Osram Gmbh LED-Leuchte und Verfahren zum Herstellen einer LED-Leuchte
ITUB20169901A1 (it) * 2016-01-11 2017-07-11 Osram Gmbh Procedimento per realizzare un involucro per dispositivi di illuminazione ed involucro corrispondente
US9920887B2 (en) 2012-05-29 2018-03-20 Philips Lighting Holding B.V. Internal envelope infrastructure for electrical devices
FR3069048A1 (fr) * 2017-07-17 2019-01-18 Valeo Vision Belgique Dispositif lumineux pour vehicule automobile
WO2020011667A1 (de) * 2018-07-13 2020-01-16 Elektrobit Automotive Gmbh Leiterplattenbauteil und verfahren zum fluiddichten verbinden des leiterplattenbauteils mit einer leiterplatte
DE102021102554A1 (de) 2021-02-04 2022-08-04 Zumtobel Lighting Gmbh Leuchtengehäuse zur aufnahme einer leuchtenkomponente

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19746893B4 (de) 1997-10-23 2005-09-01 Siemens Ag Optoelektronisches Bauelement mit Wärmesenke im Sockelteil und Verfahren zur Herstellung
DE10308917A1 (de) 2003-02-28 2004-09-16 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil mit metallisiertem Reflektor
DE10344230A1 (de) 2003-09-24 2005-05-04 Klaus Baulmann Niedervolt-LED-Leuchtmittel

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007040596A1 (de) * 2007-08-27 2009-03-05 Epsys Paul Voinea E.K. Beleuchtungsmittel mit Wärmespreizung durch Wärmeleitbeschichtung
DE102009007650A1 (de) 2007-08-27 2010-08-12 Epsys Paul Voinea E.K. Beleuchtungsmittel mit Wärmespreizung durch Wärmeleitbeschichtung und Anpassung an das Stromversorgungsnetz und Herstellungsverfahren hierfür
DE102007040596B4 (de) * 2007-08-27 2011-01-13 Epsys Paul Voinea E.K. Beleuchtungsmittel mit Wärmespreizung durch Wärmeleitbeschichtung
US8186849B2 (en) 2007-09-03 2012-05-29 Osram Ag Luminous module and method for producing it
DE102007041817A1 (de) * 2007-09-03 2009-03-05 Osram Gesellschaft mit beschränkter Haftung Leuchtmodul und Verfahren zu dessen Herstellung
DE102007041817B4 (de) * 2007-09-03 2017-12-21 Osram Gmbh Leuchtmodul
EP2072893A1 (de) * 2007-12-17 2009-06-24 Tang Shih Chuan Leuchtdiodenlampe (LED) mit Kühlsitz
DE102009050700A1 (de) * 2009-10-26 2011-05-05 Technomid Gmbh LED-Leuchte sowie System
DE102009050700B4 (de) * 2009-10-26 2013-09-05 Technomid Gmbh LED-Leuchte sowie System
DE102010044312B4 (de) * 2010-09-03 2012-07-12 Tyco Electronics Amp Gmbh Leuchte zur Verwendung in feuchten oder nassen Umgebungen mit Leuchtmittelträger
DE102010044312A1 (de) * 2010-09-03 2012-03-08 Tyco Electronics Amp Gmbh Leuchte zur Verwendung in feuchten oder nassen Umgebungen mit Leuchtmittelträger
DE102011085655A1 (de) * 2011-11-03 2013-05-08 Osram Gmbh Beleuchtungseinrichtung mit Halbleiterlichtquellen
US9920887B2 (en) 2012-05-29 2018-03-20 Philips Lighting Holding B.V. Internal envelope infrastructure for electrical devices
DE102012107668A1 (de) * 2012-08-21 2014-03-20 Epcos Ag Bauelementanordnung
US10278285B2 (en) 2012-08-21 2019-04-30 Epcos Ag Electric component assembly
DE102012218059A1 (de) * 2012-10-02 2014-04-03 Osram Gmbh LED-Leuchte und Verfahren zum Herstellen einer LED-Leuchte
EP3190339A1 (de) * 2016-01-11 2017-07-12 OSRAM GmbH Verfahren zur bereitstellung eines gehäuses für beleuchtungsvorrichtungen und entsprechendes gehäuse
ITUB20169901A1 (it) * 2016-01-11 2017-07-11 Osram Gmbh Procedimento per realizzare un involucro per dispositivi di illuminazione ed involucro corrispondente
FR3069048A1 (fr) * 2017-07-17 2019-01-18 Valeo Vision Belgique Dispositif lumineux pour vehicule automobile
EP3431861A1 (de) * 2017-07-17 2019-01-23 Valeo Vision Belgique Leuchtmodul für kraftfahrzeug
US10488030B2 (en) 2017-07-17 2019-11-26 Valeo Vision Belgique Light device for a motor vehicle
WO2020011667A1 (de) * 2018-07-13 2020-01-16 Elektrobit Automotive Gmbh Leiterplattenbauteil und verfahren zum fluiddichten verbinden des leiterplattenbauteils mit einer leiterplatte
DE102021102554A1 (de) 2021-02-04 2022-08-04 Zumtobel Lighting Gmbh Leuchtengehäuse zur aufnahme einer leuchtenkomponente

Also Published As

Publication number Publication date
DE202006020926U1 (de) 2011-02-10

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