EP3190156A4 - Composition de silicone durcissable, silicone thermofusible durcissable, et dispositif optique - Google Patents
Composition de silicone durcissable, silicone thermofusible durcissable, et dispositif optique Download PDFInfo
- Publication number
- EP3190156A4 EP3190156A4 EP15838940.3A EP15838940A EP3190156A4 EP 3190156 A4 EP3190156 A4 EP 3190156A4 EP 15838940 A EP15838940 A EP 15838940A EP 3190156 A4 EP3190156 A4 EP 3190156A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- curable
- silicone
- optical device
- melt
- hot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001296 polysiloxane Polymers 0.000 title 2
- 239000012943 hotmelt Substances 0.000 title 1
- 230000003287 optical effect Effects 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/44—Block-or graft-polymers containing polysiloxane sequences containing only polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014177557 | 2014-09-01 | ||
PCT/JP2015/004292 WO2016035285A1 (fr) | 2014-09-01 | 2015-08-26 | Composition de silicone durcissable, silicone thermofusible durcissable, et dispositif optique |
Publications (3)
Publication Number | Publication Date |
---|---|
EP3190156A1 EP3190156A1 (fr) | 2017-07-12 |
EP3190156A4 true EP3190156A4 (fr) | 2018-03-28 |
EP3190156B1 EP3190156B1 (fr) | 2019-03-20 |
Family
ID=55439371
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP15838940.3A Active EP3190156B1 (fr) | 2014-09-01 | 2015-08-26 | Composition de silicone durcissable, silicone thermofusible durcissable, et dispositif optique |
Country Status (7)
Country | Link |
---|---|
US (1) | US10208164B2 (fr) |
EP (1) | EP3190156B1 (fr) |
JP (1) | JP6607644B2 (fr) |
KR (1) | KR102419245B1 (fr) |
CN (1) | CN106604970B (fr) |
TW (1) | TWI661007B (fr) |
WO (1) | WO2016035285A1 (fr) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10100156B2 (en) * | 2014-03-12 | 2018-10-16 | The Yokohama Rubber Co., Ltd. | Curable resin composition |
US20180105692A1 (en) * | 2015-02-25 | 2018-04-19 | Dow Corning Toray Co., Ltd. | Curable granular silicone composition and method for manufacturing thereof |
EP3365391A4 (fr) * | 2015-10-19 | 2019-06-12 | Dow Corning Toray Co., Ltd. | Composition de silicone à l'état fondu durcissable par un rayonnement d'énergie active, produit durci de celle-ci, et procédé de production de film |
WO2018084012A1 (fr) * | 2016-11-02 | 2018-05-11 | 東レ・ダウコーニング株式会社 | Récipient destiné à être rempli de silicone thermofusible réactive et procédé de fabrication de silicone thermofusible réactive |
CN107501942B (zh) * | 2017-08-29 | 2020-10-02 | 北京康美特科技股份有限公司 | 可模塑成型的有机硅树脂、组合物及其半导体发光元件 |
JP7298613B2 (ja) * | 2018-07-11 | 2023-06-27 | 株式会社レゾナック | 半導体装置の製造方法、熱硬化性樹脂組成物及びダイシング・ダイボンディング一体型フィルム |
US11981776B2 (en) | 2018-10-18 | 2024-05-14 | Dow Toray Co., Ltd. | Curable silicone composition and cured product thereof, layered product and production method therefor, and optical device or optical display |
EP3950845A4 (fr) * | 2019-03-29 | 2023-01-25 | Dow Toray Co., Ltd. | Composition de silicone durcissable, produit durci à base de celle-ci et son procédé de production |
CN112409950B (zh) | 2019-08-23 | 2022-06-28 | 光宝光电(常州)有限公司 | 增黏剂、有机硅封装胶组合物及有机硅封装胶 |
KR20220123030A (ko) * | 2019-12-27 | 2022-09-05 | 다우 도레이 캄파니 리미티드 | 적층체 및 이것으로 이루어진 전자 부품 |
JP2022084179A (ja) * | 2020-11-26 | 2022-06-07 | デュポン・東レ・スペシャルティ・マテリアル株式会社 | ホットメルト性シリコーン組成物、封止剤、ホットメルト接着剤、及び光半導体装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3996195A (en) * | 1974-11-15 | 1976-12-07 | Shinetsu Chemical Company | Curable organosilicon compositions |
WO2007099863A1 (fr) * | 2006-03-01 | 2007-09-07 | Dow Corning Toray Co., Ltd. | Composition de resine de silicone durcissable et corps durci a partir de celle-ci |
WO2014002918A1 (fr) * | 2012-06-29 | 2014-01-03 | Dow Corning Toray Co., Ltd. | Composition de silicone réactive, article thermoplastique réactif, produit durci et dispositif semi-conducteur optique |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2614453B2 (ja) | 1987-07-23 | 1997-05-28 | 東レ・ダウコーニング・シリコーン株式会社 | オルガノポリシロキサン系ホットメルト接着剤 |
US7595113B2 (en) | 2002-11-29 | 2009-09-29 | Shin-Etsu Chemical Co., Ltd. | LED devices and silicone resin composition therefor |
JP2004186168A (ja) | 2002-11-29 | 2004-07-02 | Shin Etsu Chem Co Ltd | 発光ダイオード素子用シリコーン樹脂組成物 |
JP5202822B2 (ja) * | 2006-06-23 | 2013-06-05 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
KR101397616B1 (ko) | 2006-08-28 | 2014-05-26 | 다우 코닝 코포레이션 | 광학 장치들과 실리콘 조성물들 및 광학 장치들을 제조하는공정들 |
KR101380062B1 (ko) | 2007-04-10 | 2014-04-01 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 형광체 함유 접착성 실리콘 조성물, 상기 조성물로 이루어지는 조성물 시트, 및 상기 시트를 사용하는 발광장치의 제조 방법 |
JP5972511B2 (ja) | 2008-03-31 | 2016-08-17 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物およびその硬化物 |
JP2011099075A (ja) | 2009-11-09 | 2011-05-19 | Nitto Denko Corp | 熱可塑性シリコーン樹脂用組成物 |
JP5712920B2 (ja) | 2010-02-19 | 2015-05-07 | 東レ株式会社 | 蛍光体含有シリコーン硬化物、その製造方法、蛍光体含有シリコーン組成物、その組成物前駆体、シート状成型物、ledパッケージ、発光装置およびled実装基板の製造方法 |
JP2011219597A (ja) | 2010-04-08 | 2011-11-04 | Nitto Denko Corp | シリコーン樹脂シート |
JP5992666B2 (ja) * | 2011-06-16 | 2016-09-14 | 東レ・ダウコーニング株式会社 | 架橋性シリコーン組成物及びその架橋物 |
-
2015
- 2015-08-26 US US15/506,834 patent/US10208164B2/en active Active
- 2015-08-26 JP JP2016546297A patent/JP6607644B2/ja active Active
- 2015-08-26 KR KR1020177008961A patent/KR102419245B1/ko active IP Right Grant
- 2015-08-26 EP EP15838940.3A patent/EP3190156B1/fr active Active
- 2015-08-26 CN CN201580046950.0A patent/CN106604970B/zh active Active
- 2015-08-26 WO PCT/JP2015/004292 patent/WO2016035285A1/fr active Application Filing
- 2015-09-01 TW TW104128856A patent/TWI661007B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3996195A (en) * | 1974-11-15 | 1976-12-07 | Shinetsu Chemical Company | Curable organosilicon compositions |
WO2007099863A1 (fr) * | 2006-03-01 | 2007-09-07 | Dow Corning Toray Co., Ltd. | Composition de resine de silicone durcissable et corps durci a partir de celle-ci |
WO2014002918A1 (fr) * | 2012-06-29 | 2014-01-03 | Dow Corning Toray Co., Ltd. | Composition de silicone réactive, article thermoplastique réactif, produit durci et dispositif semi-conducteur optique |
Non-Patent Citations (1)
Title |
---|
See also references of WO2016035285A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO2016035285A1 (fr) | 2016-03-10 |
US10208164B2 (en) | 2019-02-19 |
EP3190156A1 (fr) | 2017-07-12 |
TW201614010A (en) | 2016-04-16 |
EP3190156B1 (fr) | 2019-03-20 |
KR20170090404A (ko) | 2017-08-07 |
KR102419245B1 (ko) | 2022-07-11 |
JPWO2016035285A1 (ja) | 2017-07-20 |
TWI661007B (zh) | 2019-06-01 |
CN106604970A (zh) | 2017-04-26 |
US20170253700A1 (en) | 2017-09-07 |
JP6607644B2 (ja) | 2019-11-20 |
CN106604970B (zh) | 2023-01-20 |
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