EP3031551A4 - Composite copper particles and production method therefor - Google Patents

Composite copper particles and production method therefor Download PDF

Info

Publication number
EP3031551A4
EP3031551A4 EP14834408.8A EP14834408A EP3031551A4 EP 3031551 A4 EP3031551 A4 EP 3031551A4 EP 14834408 A EP14834408 A EP 14834408A EP 3031551 A4 EP3031551 A4 EP 3031551A4
Authority
EP
European Patent Office
Prior art keywords
production method
method therefor
copper particles
composite copper
composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14834408.8A
Other languages
German (de)
French (fr)
Other versions
EP3031551A1 (en
Inventor
Toshihiro Kohira
Nobuhiro Sasaki
Hikaru Minowa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Publication of EP3031551A1 publication Critical patent/EP3031551A1/en
Publication of EP3031551A4 publication Critical patent/EP3031551A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B22F1/068—Flake-like particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/16—Metallic particles coated with a non-metal
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
EP14834408.8A 2013-08-07 2014-08-01 Composite copper particles and production method therefor Withdrawn EP3031551A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013164445A JP2015034309A (en) 2013-08-07 2013-08-07 Composite copper particles and method for manufacturing the same
PCT/JP2014/070346 WO2015019959A1 (en) 2013-08-07 2014-08-01 Composite copper particles and production method therefor

Publications (2)

Publication Number Publication Date
EP3031551A1 EP3031551A1 (en) 2016-06-15
EP3031551A4 true EP3031551A4 (en) 2017-04-26

Family

ID=52461295

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14834408.8A Withdrawn EP3031551A4 (en) 2013-08-07 2014-08-01 Composite copper particles and production method therefor

Country Status (6)

Country Link
EP (1) EP3031551A4 (en)
JP (1) JP2015034309A (en)
KR (1) KR20160040538A (en)
CN (1) CN105451914A (en)
TW (1) TWI556257B (en)
WO (1) WO2015019959A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000345201A (en) * 1999-05-31 2000-12-12 Mitsui Mining & Smelting Co Ltd Composite copper fine powder and its production
US20060137488A1 (en) * 2002-11-22 2006-06-29 Mitsui Mining And Smelting Co., Ltd. Copper flake powder, method for producing copper flake powder, and conductive paste using copper flake powder
WO2006099510A2 (en) * 2005-03-15 2006-09-21 Nanodynamics, Inc. Method for producing ultra-fine metal flakes
JP2011006770A (en) * 2009-06-29 2011-01-13 Mitsui Mining & Smelting Co Ltd Composite copper particle

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0463124A (en) * 1990-06-29 1992-02-28 Kurimoto Ltd Method for binding solid grains with each other
JP4227373B2 (en) 2001-08-07 2009-02-18 三井金属鉱業株式会社 Flake copper powder and copper paste using the flake copper powder
JP4168116B2 (en) * 2002-03-06 2008-10-22 Ｄｏｗａエレクトロニクス株式会社 Foil flake copper powder and conductive paste using the same
JP5080731B2 (en) * 2005-10-03 2012-11-21 三井金属鉱業株式会社 Fine silver particle-attached silver-copper composite powder and method for producing the fine silver particle-attached silver-copper composite powder
JP5067545B2 (en) * 2007-09-20 2012-11-07 国立大学法人宇都宮大学 Coating method and apparatus
KR20110067509A (en) * 2009-12-14 2011-06-22 삼성전기주식회사 Paste compound for termination electrode and multilayer ceramic capacitor comprising the same and manufactuaring method thereof
JP5756694B2 (en) * 2011-07-07 2015-07-29 三井金属鉱業株式会社 Flat metal particles

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000345201A (en) * 1999-05-31 2000-12-12 Mitsui Mining & Smelting Co Ltd Composite copper fine powder and its production
US20060137488A1 (en) * 2002-11-22 2006-06-29 Mitsui Mining And Smelting Co., Ltd. Copper flake powder, method for producing copper flake powder, and conductive paste using copper flake powder
WO2006099510A2 (en) * 2005-03-15 2006-09-21 Nanodynamics, Inc. Method for producing ultra-fine metal flakes
JP2011006770A (en) * 2009-06-29 2011-01-13 Mitsui Mining & Smelting Co Ltd Composite copper particle

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2015019959A1 *

Also Published As

Publication number Publication date
JP2015034309A (en) 2015-02-19
WO2015019959A1 (en) 2015-02-12
TWI556257B (en) 2016-11-01
TW201511035A (en) 2015-03-16
CN105451914A (en) 2016-03-30
EP3031551A1 (en) 2016-06-15
KR20160040538A (en) 2016-04-14

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DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20170327

RIC1 Information provided on ipc code assigned before grant

Ipc: H01B 13/00 20060101ALI20170321BHEP

Ipc: H01B 1/22 20060101ALI20170321BHEP

Ipc: C22C 9/10 20060101ALI20170321BHEP

Ipc: C22C 9/01 20060101ALI20170321BHEP

Ipc: B22F 1/00 20060101AFI20170321BHEP

Ipc: C22C 9/00 20060101ALI20170321BHEP

Ipc: H01B 5/00 20060101ALI20170321BHEP

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