EP2926412A1 - Attache de contact - Google Patents

Attache de contact

Info

Publication number
EP2926412A1
EP2926412A1 EP13786166.2A EP13786166A EP2926412A1 EP 2926412 A1 EP2926412 A1 EP 2926412A1 EP 13786166 A EP13786166 A EP 13786166A EP 2926412 A1 EP2926412 A1 EP 2926412A1
Authority
EP
European Patent Office
Prior art keywords
contact
tab
components
connector
lug
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP13786166.2A
Other languages
German (de)
English (en)
Other versions
EP2926412B1 (fr
Inventor
Frank Tatzel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rosenberger Hochfrequenztechnik GmbH and Co KG
Original Assignee
Rosenberger Hochfrequenztechnik GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rosenberger Hochfrequenztechnik GmbH and Co KG filed Critical Rosenberger Hochfrequenztechnik GmbH and Co KG
Publication of EP2926412A1 publication Critical patent/EP2926412A1/fr
Application granted granted Critical
Publication of EP2926412B1 publication Critical patent/EP2926412B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/01—Connections using shape memory materials, e.g. shape memory metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/04—Pins or blades for co-operation with sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/10—Sockets for co-operation with pins or blades
    • H01R13/11—Resilient sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/193—Means for increasing contact pressure at the end of engagement of coupling part, e.g. zero insertion force or no friction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials

Definitions

  • the invention relates to a Kohtaktlasche for electrically conductive connection of at least two components, wherein the contact tab is intended to abut on at least one of the components with a contact pressure which is exerted by an elastic deformation of the contact tab. Furthermore, the invention relates to a system with one or more such contact tabs, in particular in an embodiment as a connector system.
  • the currents can either represent signals for information transmission (for example measured values, analog or digital) or serve as supply energy.
  • Such technical systems are generally modular in construction, with the signals or electrical supply energy being transferred from one module to the other module. To ensure proper functioning of the systems, this transmission must take place with the least possible loss.
  • the contact resistance at the contact points In order to transmit high supply currents, the contact resistance at the contact points must be kept as low as possible. A decisive factor for the height of the contact resistance is the contact force prevailing at the contact point. If this is too low, the contact resistance becomes very large, which leads to an unwanted thermal load on the contact point. In the known systems an attempt is made to avoid this by the highest possible spring force of the contact tabs. It does not matter whether the contact tabs are deflected radially (plug-socket contact) or axially (as leaf springs). However, this high spring preload also causes a correspondingly higher insertion force during the coupling process, which can be detrimental, especially when several parallel to be plugged connections and is not user-friendly.
  • the present invention seeks to provide a connector that is characterized by low insertion forces with good transmission capability.
  • a generic contact lug for electrically conductive connection of at least two components, wherein the contact lug is provided to abut on at least one of the component with a contact pressure exerted by an elastic deformation of the contact lug, characterized in that the contact lug at least partially so is formed of a bimetal, that an increase in the temperature of the bimetal leads to an increase in the contact pressure.
  • a corresponding system according to the invention comprises (at least) a contact tab according to the invention and at least two components to be electrically connected by means of the contact tab.
  • the term "bimetal” is understood as meaning a preferably electrically conductive, elastically deformable component comprising at least two layers which consist of materials having different thermal expansion coefficients have conductive properties.
  • the system according to the invention comprises a plug connection with at least two connectors or is designed as such, wherein the at least one contact tab is furthermore preferably part of one of the plug connectors.
  • a plug with low insertion force can be achieved for the connector, wherein after heating of the bimetal of the contact plates or a sufficiently high contact pressure in the contact points between the contact tabs and the at least two components can be realized.
  • the contact tab forms at least a part of a socket of one of the plug connectors, which is for receiving a pin-shaped portion of another of the connectors is provided.
  • the elastic deformation of the contact tab can then take place in the radial direction.
  • a contact pressure of the contact tab in the radial direction against a jacket of the pin-shaped part of the other connector can be formed by a plurality of contact tabs according to the invention in an annular arrangement.
  • the contact tab may provide that it has a first contact region (for contacting a first of the components) and a second contact region (for contacting a second of the components) and a curved or angled profile between the contact regions. A deformation may then be associated with a movement of the two contact areas towards each other.
  • Such a contact tab is particularly suitable for the electrically conductive connection of opposite contact points of the components to be connected, as is often the case with the electrically conductive connection of two or more circuit boards.
  • the contact tab is already elastically deformed when plugging the connector, said elastic deformation can be chosen as low as possible.
  • the system according to the invention can comprise means for temperature control (of the bimetal) of the contact lugs.
  • the contact tab when plugging in the plug connection or during positioning of the components does not yet contact a mating contact element.
  • a largely force-free insertion or positioning can be achieved, wherein the contact pressure is generated exclusively by the subsequent, heating-related deformation of the contact tab.
  • a targeted cooling of the contact tab can be achieved by the means for temperature control, whereby the contact pressure is reduced again. This may be relevant in particular for a release of the electrically conductive connection between the two components.
  • FIG. 1 shows a first embodiment of a system according to the invention in the non-inserted state in a perspective view
  • FIG. 2 the system of Figure 1 in the inserted state.
  • 3 shows a partial longitudinal section through part of the system according to FIG. 2;
  • FIG. 4 shows the system according to FIG. 3 after a heating of the contact tabs;
  • FIG. 5 shows a component with a plurality of contact straps attached thereto of a second embodiment of a system according to the invention in a perspective view
  • FIG. 6 shows a cross section through the component and a contact tab of the system according to FIG. 5;
  • FIG. 7 shows the system according to FIG. 5 with a second component
  • FIG. 8 shows a cross section through the system according to FIG. 7;
  • FIG. 9 shows the system according to FIG. 8 after a heating of the contact lugs
  • FIG. Figs. 1 to 4 show a first embodiment of a connector system according to the invention.
  • the first connector 1 is designed as a coupler and for this purpose comprises a socket-shaped receiving portion 3, in which a pin-shaped contact element 4 of a second connector 5 of the connector system can be inserted.
  • the bush-shaped receiving area 3 is formed by a plurality of ring-shaped contact plates 6, which are formed according to the invention at least partially made of a bimetal.
  • the first connector 1 may for this purpose preferably as Stamped bending component to be formed.
  • the solidly formed in the present embodiment second connector 5 includes in addition to the pin-shaped contact element 4 is still a base body 8, with which this is integrally formed. At a cable-side end of the second connector 5 whose base body 8 is connected in a known manner with a cable 2 electrically conductive.
  • Fig. 1 shows the connector system in the unplugged state, while the inserted state in Figs. 2 to 4 is shown.
  • 3 shows the state directly after plugging in the connector system.
  • the contact tabs 6 already contact the pin-shaped contact element 4 of the second connector 5 with their arcuate inwardly directed contact areas 9 on the outside, but are not yet elastically deformed relevant. This can be done with only a small insertion forces plugging.
  • a transmission of electricity through the connector system is already possible, this due to the low contact pressure in the contact points, a relatively large contact resistance, which leads to electrical power loss and thus to a heating of the connector system, in particular in the region of the contact points 9.
  • This heating leads to a deformation of the contact plates 6 due to a different thermal expansion of the two layers 10, 1 1 of the bimetal from which the first connector 1 is formed. Since the material of the outer layer 10 has a higher coefficient of thermal expansion (in particular coefficient of linear expansion) than the material of the inner layer 1 1, the thermally induced deformation of the contact plates 6 would cause a radially inwardly directed movement of the contact regions 9. However, this movement is prevented by contacting the contact areas 9 with the pin-shaped contact element 4. As a result, by the different thermal expansion coefficients of the bimetal, the contact pressure in the Contact points increased. The increased reaction forces and the unequal stresses in the two layers 10, 1 1 can simultaneously cause buckling of the contact tabs 6, as shown in FIG. 4.
  • FIGS. 5 to 9 show a second embodiment of a system according to the invention. This comprises two components, which may in particular be two printed circuit boards 12, 13. These are electrically connected via a plurality of contact tabs 14 according to the invention.
  • the leaf spring-like contact tabs 14 comprise two planar sections, which are connected via a curved portion.
  • a first of the planar sections forms on its outside, in each case, a contact region 15 by means of which the associated contact tab is firmly connected (for example soldered) to a contact point of a first 12 of the printed circuit boards.
  • an outwardly facing bulge is provided, the surface of which is provided as a contact region 15 for contacting an associated contact point of the second printed circuit board 13.
  • the contact tabs 14 are formed from a two-layered bimetal, wherein the layer with the larger thermal expansion coefficient is respectively arranged on the side which does not form the contact regions 15.
  • the two circuit board 12, 13 are positioned by an arbitrary, not shown device at a defined distance from each other, as shown in FIGS. 7 and 8.
  • the distance between them is so small that an elastic deformation of the arranged between the circuit boards 12, 13 contact tabs 14 is given (see Fig. 6 and 8).
  • the elastic deformation of the contact tabs 14 is relatively low. This ensures that the counterpressure generated by the contact tabs 14 when positioning the printed circuit boards 12, 13 is relatively low.
  • the printed circuit boards 12, 13 are connected not only via the number of five contact tabs 14, but up to several hundred contact tabs 14, as may be the case, for example, in known semiconductor test devices.
  • a low contact pressure in the contact points can lead to poor transmission of signals and in particular high-frequency signals between the circuit boards 12, 13.
  • the contact pressure of the individual contact tabs 14 between the bulge of the respective second planar portion and the associated contact points of the second printed circuit board 13 is reinforced in operation by a thermally induced deformation of the bimetal of the individual contact tabs 14. This is illustrated in FIG. 9, wherein the deformation of the contact lugs 14 is essentially limited to a chamfering of the second planar section, but at the same time the contact pressure in the contact point is correspondingly increased by an unequal distribution of stress.
  • the temperature increase by which the increased contact pressure is achieved in the present embodiment is essentially not achieved by a self-heating due to a relatively high contact resistance, as is the case with the connector system according to FIGS. 1 to 4. Rather, the heating is effected by the operation of a device, for example a semiconductor test device, into which the illustrated system according to the invention is integrated. In this operation, of the plurality of electrical components of the device, a relevant amount of waste heat is generated, which can lead to the heating. This is especially true if the system shown is integrated into a housing of the device, so that the heat dissipation is limited.
  • the device may also include means for temperature control, by the example, the removal of waste heat from the housing can be controlled.

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connector Housings Or Holding Contact Members (AREA)

Abstract

L'invention concerne une attache de contact (6 ; 14) destinée à la connexion électroconductrice d'au moins deux sous-ensembles (7, 8 ; 12, 13). L'attache de contact (6 ; 14) est prévue pour être appliquée sur au moins un des sous-ensembles (7, 8 ; 12, 13) avec une pression de contact qui est exercée par une déformation élastique de l'attache de contact (6 ; 14). L'attache de contact (6 ; 14) est réalisée au moins en partie d'un bimétal de manière telle qu'une élévation de la température de ce bimétal entraîne une élévation de la pression de contact.
EP13786166.2A 2012-12-03 2013-10-29 Attache de contact Active EP2926412B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE202012011584U DE202012011584U1 (de) 2012-12-03 2012-12-03 Kontaktlasche
PCT/EP2013/003256 WO2014086445A1 (fr) 2012-12-03 2013-10-29 Attache de contact

Publications (2)

Publication Number Publication Date
EP2926412A1 true EP2926412A1 (fr) 2015-10-07
EP2926412B1 EP2926412B1 (fr) 2019-05-08

Family

ID=47740528

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13786166.2A Active EP2926412B1 (fr) 2012-12-03 2013-10-29 Attache de contact

Country Status (10)

Country Link
US (1) US9647362B2 (fr)
EP (1) EP2926412B1 (fr)
JP (1) JP6318166B2 (fr)
KR (1) KR102004737B1 (fr)
CN (2) CN112186370B (fr)
CA (1) CA2891791C (fr)
DE (1) DE202012011584U1 (fr)
HK (1) HK1208961A1 (fr)
TW (1) TWM474273U (fr)
WO (1) WO2014086445A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202012011584U1 (de) * 2012-12-03 2013-01-21 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Kontaktlasche
DE102014114416A1 (de) * 2014-10-04 2016-04-07 Eugen Forschner Gmbh Kontaktierungsvorrichtung und Verfahren zur Herstellung eines elektrischen Kontakts
JP7107170B2 (ja) * 2018-10-31 2022-07-27 トヨタ自動車株式会社 給電用の端子構造
WO2021069068A1 (fr) * 2019-10-09 2021-04-15 Wickeder Westfalenstahl Gmbh Élément de compensation thermique, ensemble comportant un élément de compensation thermique et procédé de fabrication d'élément de compensation thermique
DE202022103285U1 (de) 2022-06-10 2023-10-06 Sick Ag Elektrisches Leiterplattensystem

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Also Published As

Publication number Publication date
KR102004737B1 (ko) 2019-07-29
US9647362B2 (en) 2017-05-09
EP2926412B1 (fr) 2019-05-08
DE202012011584U1 (de) 2013-01-21
JP2015535653A (ja) 2015-12-14
CN104871370A (zh) 2015-08-26
WO2014086445A1 (fr) 2014-06-12
KR20150092134A (ko) 2015-08-12
CN112186370A (zh) 2021-01-05
HK1208961A1 (en) 2016-03-18
CN112186370B (zh) 2022-06-03
JP6318166B2 (ja) 2018-04-25
US20150303602A1 (en) 2015-10-22
CA2891791C (fr) 2018-12-04
CA2891791A1 (fr) 2014-06-12
TWM474273U (zh) 2014-03-11

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