EP2698590B1 - Structure de tuyauterie d'un dispositif de refroidissement, méthode de fabrication de celle-ci et méthode d'accouplement de tuyaux - Google Patents
Structure de tuyauterie d'un dispositif de refroidissement, méthode de fabrication de celle-ci et méthode d'accouplement de tuyaux Download PDFInfo
- Publication number
- EP2698590B1 EP2698590B1 EP12770839.4A EP12770839A EP2698590B1 EP 2698590 B1 EP2698590 B1 EP 2698590B1 EP 12770839 A EP12770839 A EP 12770839A EP 2698590 B1 EP2698590 B1 EP 2698590B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- tubular part
- cooling device
- piping structure
- refrigerant
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001816 cooling Methods 0.000 title claims description 110
- 238000004519 manufacturing process Methods 0.000 title description 2
- 238000010168 coupling process Methods 0.000 title 1
- 239000003507 refrigerant Substances 0.000 claims description 46
- 238000000034 method Methods 0.000 claims description 43
- 239000000463 material Substances 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 239000007769 metal material Substances 0.000 claims description 23
- 230000008569 process Effects 0.000 claims description 17
- 238000009833 condensation Methods 0.000 claims description 14
- 230000005494 condensation Effects 0.000 claims description 14
- 239000011368 organic material Substances 0.000 claims description 14
- 230000003746 surface roughness Effects 0.000 claims description 12
- 238000000137 annealing Methods 0.000 claims description 7
- 238000005452 bending Methods 0.000 claims description 5
- 238000005096 rolling process Methods 0.000 claims description 4
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 239000007791 liquid phase Substances 0.000 description 5
- 239000012808 vapor phase Substances 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 210000002445 nipple Anatomy 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229920005549 butyl rubber Polymers 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
- F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F19/00—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
- F28F19/02—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings
- F28F19/04—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings of rubber; of plastics material; of varnish
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/003—Multiple wall conduits, e.g. for leak detection
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/02—Flexible elements
Definitions
- the present invention relates to piping structures of cooling devices for semiconductor devices and electronic devices and the like, in particular, to a piping structure of a cooling device using an ebullient cooling system in which the heat transportation and heat radiation are performed by a cycle of vaporization and condensation of a refrigerant, a method for making the same, and a method for connecting pipes.
- the cooling device using an ebullient cooling system in which the heat transportation and heat radiation are performed by a cycle of vaporization and condensation of a refrigerant, is expected as a cooling device for the semiconductor devices and the electronic devices because it does not require any driving unit such as a pump.
- the ebullient cooling device described in patent literature 1 includes an evaporator absorbing the heat from a heating element by the evaporation action of working fluids such as pure water and ethanol, and a condenser releasing heat by the condensation action of working fluids.
- the ebullient cooling device includes flow conduits circulating the working fluids between the evaporator and the condenser, and is configured so that the flow conduits can be bent at a number of points. It is said that the configuration enables the flow conduits to act as a spring and to absorb the force applied to the evaporator and the condenser.
- a low-boiling organic refrigerant is often used as the refrigerant in the ebullient cooling device in order to improve the cooling performance within a range of the operation temperature for a semiconductor device and an electronic device. It is possible to obtain a flexible pipe by using an organic material such as resin and rubber. If a pipe made of an organic material is used, however, there has been a problem that the internal pressure increases due to a chemical reaction with the organic refrigerant, and consequently, the cooling performance is degraded owing to the boiling point elevation of the refrigerant.
- Patent literature 2 describes a technology to solve such problems.
- An ebullient cooling device described in patent literature 2 includes an evaporator container accommodating a refrigerant liquid, a condenser condensing the vaporized refrigerant, and a single pipe connecting the evaporator container to the condenser, through which a gas-liquid flows in a mixed phase.
- the pipe has a structure in accordance with the preamble of claim 1 and in which a thin film of a corrosion-resistant and permeation-resistant material such as aluminum and stainless steel is evaporated onto the inner wall of the pipe made of a resin. It is said that the structure enables the pipe to have enough rigidity to maintain its shape against the atmospheric pressure and thus the installation location of the evaporator container and the condenser can be freely decided.
- Document EP 1 857 722 A1 describes a metal pipe which has a plurality of ridges that have different heights, extend in the axial direction, and are arranged in the circumferential direction at its inner circumferential surface. If the Reynolds number changes and the streak structure and the scale of a hairpin vortex change, the streak and the hairpin vortex each match any one of the ridges. Therefore, the fluid friction can be reduced in a wide Reynolds number range.
- the pipe in the related ebullient cooling device has a structure in which a metal film is evaporated onto the inner surface of the pipe.
- the vapor of the refrigerant however, is condensed again and liquefied in the middle of the pipe due to the surface roughness of the metal film evaporated on the resin.
- the related ebullient cooling device using such pipes therefore, has a problem that the amount of heat transports by the refrigerant decreases.
- the objective of the present invention is to provide a piping structure of a cooling device, a method for making the same, and a method for connecting pipes which solve the problem mentioned above that in a piping structure of a cooling device using an ebullient cooling system, the cooling performance of the cooling device is degraded if the pipe is provided with flexibility.
- the piping structure of the cooling device of the present invention it is possible to obtain a piping structure of a cooling device which does not cause deterioration in the cooling performance of the cooling device even if the pipe is provided with flexibility.
- FIGS. 1A and 1B show configurations of a piping structure of cooling device 10 in accordance with the first exemplary embodiment of the present invention.
- FIG. 1A is a plan view and FIG. 1B is a cross-sectional view in a plane perpendicular to the axial direction of the piping structure (a cross-sectional view taken along the line A-A of FIG. 1A ).
- the piping structure of cooling device 10 in accordance with the present exemplary embodiment includes a first tubular part 11 with a hollow portion through which a refrigerant used in the cooling device flows.
- the first tubular part 11 is made of metal materials, and the surface roughness of the inner surface of the first tubular part 11 is less than or equal to the size of a condensation nucleus for the refrigerant.
- the condensation nucleus means a spot which acts as a base point when a vapor liquefies. If the vapor touches the base points, the liquefaction is accelerated there. It is possible to use aluminum materials and the like as the first tubular part 11, for example.
- By setting the center line average roughness of a surface equal to or more than 0.1 micrometers and less than or equal to 10 micrometers, preferably less than or equal to 1 micrometer, it is possible to prevent the inner surface of the first tubular part 11 from acting as a condensation nucleus of the refrigerant.
- a plate-like metal plate material made of a metal material such as aluminum is prepared.
- the metal plate material can be produced by a conventional rolling process.
- the metal plate material is bent into a tube by using a cylindrical jig such as a roll, for example, and both ends are joined by means of a weld process and the like.
- a cylindrical jig such as a roll
- both ends are joined by means of a weld process and the like.
- the first tubular part 11 made of a metal material is completed. It is also acceptable to perform the annealing process subsequently.
- the annealing process can be performed under conditions normally used for the metal material to be used.
- the thickness of the first tubular part which is determined by the plate thickness of the metal plate material, equal to or more than 0.4 mm and less than or equal to 1 mm. This is because it becomes difficult to weld the ends and to maintain the bending strength and the internal pressure capacity of the first tubular part if the plate thickness of the metal plate material becomes thinner than 0.4 mm. On the other hand, it is also because the flexibility of the piping structure of cooling device 10 decreases if the thickness of the first tubular part is more than 1 mm.
- FIGS. 2A and 2B show configurations of a piping structure of cooling device 100 according to the second exemplary embodiment of the present invention.
- FIG. 2A is a plan view and FIG. 2B is a cross-sectional view in a plane perpendicular to the axial direction of the piping structure (a cross-sectional view taken along the line A-A of FIG. 2A ).
- the piping structure of cooling device 100 in accordance with the present exemplary embodiment includes a first tubular part 110 with a hollow portion through which a refrigerant used in the cooling device flows, and a second tubular part 120 with which the first tubular part 110 is covered.
- the first tubular part 110 is made of metal materials, and the surface roughness of the inner surface of the first tubular part 110 is less than or equal to the size of a condensation nucleus for the refrigerant.
- the condensation nucleus means a spot which acts as a base point when a vapor liquefies. If the vapor touches the base points, the liquefaction is accelerated there. It is possible to use aluminum materials and the like as the first tubular part 110, for example.
- center line average roughness of a surface equal to or more than 0.1 micrometers and less than or equal to 10 micrometers, preferably less than or equal to 1 micrometer, it is possible to prevent the inner surface of the first tubular part 110 from acting as a condensation nucleus of the refrigerant.
- the second tubular part is made of organic materials such as resin and rubber, and it is possible to use polyethylene materials and butyl rubber materials, for example.
- the piping structure of cooling device 100 is configured in which the first tubular part 110 touching the refrigerant is made of metal materials and the surface roughness of the inner surface is less than or equal to the size of a condensation nucleus for the refrigerant. Accordingly, it is possible to prevent the piping structure of cooling device 100 from reacting chemically with the refrigerant, and prevent the vapor of the refrigerant from condensing again. Additionally, since the piping structure of cooling device 100 includes a multi-layered structure in which the first tubular part 110 is covered with the second tubular part 120 made of organic materials, it is possible to maintain the mechanical strength of the piping structure of cooling device 100 with maintenance of its flexibility. As a result, according to the present exemplary embodiment, it is possible to obtain a piping structure of a cooling device which does not cause deterioration in the cooling performance of the cooling device even if the pipe is provided with flexibility.
- FIGS. 3A and 3B are cross-sectional views to illustrate a method for making the piping structure of cooling device 100 according to the present exemplary embodiment.
- a plate-like metal plate material 140 made of a metal material such as aluminum is prepared.
- the metal plate material 140 is bent into a tube by using a cylindrical jig 150 such as a roll, for example, and both ends 160 are joined by means of a weld process and the like.
- the first tubular part 110 made of a metal material is formed.
- the outer periphery of the first tubular part 110 is covered by ejecting a resin material such as polyethylene from a nozzle 170 and the like, for example.
- a resin material such as polyethylene from a nozzle 170 and the like, for example.
- the second tubular part made of the organic material is formed with which the first tubular part 110 is covered, and the piping structure of cooling device 100 is completed. Since the method for making the piping structure of cooling device 100 according to the present exemplary embodiment is composed of the simple processes, it is possible to manufacture the piping structure of cooling device 100 massively and cheaply according to the present method for making.
- the surface roughness of the inner surface of the first tubular part 110 made of the metal plate material 140 is desirable to set the surface roughness of the inner surface of the first tubular part 110 made of the metal plate material 140 equal to or more than 0.1 micrometers and less than or equal to 10 micrometers, preferably less than or equal to 1 micrometer. This can be achieved by producing the metal plate material 140 by means of a conventional rolling process. By setting the surface roughness within the range, it is possible to prevent the inner surface of the first tubular part 110 from acting as a condensation nucleus of the refrigerant. It is desirable to set the thickness of the first tubular part, which is determined by the plate thickness of the metal plate material 140, equal to or more than 0.4 mm and less than or equal to 1 mm.
- FIG. 4 is a cross-sectional view showing a configuration of an ebullient cooling device 200 in accordance with the present exemplary embodiment.
- the ebullient cooling device 200 includes an evaporator 220 storing a refrigerant 210, and a condenser 230 condensing and liquefying a vapor-state refrigerant vaporized in the evaporator 220 and radiating heat.
- a heat-generating part 240 of an object to be cooled such as a semiconductor device is disposed so as to thermally contact with one surface of the evaporator 220.
- the evaporator 220 is connected to the condenser 230 by using the piping structure of cooling device 100 according to the second exemplary embodiment.
- the piping structure of cooling device 100 includes a first connection 131 connected to the evaporator 210 and a second connection 132 connected to the condenser 230.
- FIG. 4 shows a case where the piping structure of cooling device 100 is used for a vapor-phase pipe 251 through which a vapor-phase refrigerant flows from the evaporator 220 toward the condenser 230 and for a liquid-phase pipe 252 through which a liquid-phase refrigerant flows from the condenser 230 toward the evaporator 220.
- a pipe 250 The bending strength of the vapor-phase pipe 251 and the liquid-phase pipe 252 (hereafter, referred to as "a pipe 250" simply) is maintained by means of the second tubular part 120 made of organic materials having the flexibility. In the ebullient cooling device 200, therefore, it is possible to decide freely the disposition of the evaporator 220 and the condenser 230 with maintenance of the mechanical strength of the pipe connecting the evaporator 220 to the condenser 230.
- the ebullient cooling device 200 of the present exemplary embodiment is configured in which the evaporator 220 is connected to the condenser 230 by using the pipe 250 including the first tubular part 110 made of metal materials as the inner layer and the second tubular part 120 made of organic materials having the flexibility as the outer layer.
- the pipe 250 including the first tubular part 110 made of metal materials as the inner layer and the second tubular part 120 made of organic materials having the flexibility as the outer layer.
- the evaporator 220 is configured to include a first connective projection 221 connected to the first connection 131 of the piping structure of cooling device 100 and the condenser 230 is configured to include a second connective projection 231 connected to the second connection 132. It is also acceptable that at least one of the first connective projection 221 and the second connective projection 231 is made of the same material as the metal material of which the first tubular part 131 is made. In this case, since the electrical potential difference does not arise between the same type of metals, it is possible to prevent the corrosion based on the electrochemical action (electrical corrosion) even though a conductive refrigerant such as water is used.
- a semiconductor device, an electronic device and the like are designed so as to operate at temperature in the range from several tens of degrees Celsius to about 100 degrees Celsius.
- a material with small surface tension and a low boiling point as the refrigerant used in the ebullient cooling device, therefore, it is possible to activate the generation of bubbles in the evaporator and improve the cooling performance.
- organic refrigerants such as hydrofluorocarbon and hydrofluoroether are used as the refrigerant.
- These organic refrigerants react chemically with organic materials such as resin and rubber. Since the chemical reaction generates a reaction gas and the internal pressure in the related ebullient cooling device increases, the boiling point of the refrigerant rises. As a result, the cooling performance in the related ebullient cooling device is degraded by the prolonged use.
- the ebullient cooling device 200 of the present exemplary embodiment uses the piping structure of cooling device 100 including the first tubular part 110 made of metal materials as the vapor-phase pipe 251 and the liquid-phase pipe 252. As a result, the reaction between the refrigerant and the pipe is suppressed, and accordingly, it is possible to prevent the cooling performance from degrading and ensure long-term reliability of the ebullient cooling device.
- FIGS. 5A and 5B are cross-sectional views to illustrate a method for connecting pipes in the cooling device according to the present exemplary embodiment.
- the pipe 250 is fitted in the first connective projection 221 or the second connective projection 231 (hereafter, referred to as "a connective projection 260" simply).
- the pipe 250 includes the piping structure of cooling device 100 according to the second exemplary embodiment, as mentioned above. That is to say, the pipe 250 includes the first tubular part 110 made of metal materials with a hollow portion through which the refrigerant used in the cooling device flows, and the second tubular part 120 made of organic materials with which the first tubular part 110 is covered.
- a pressure is applied from the outer periphery of the second tubular part 120 toward the center.
- a clamping tool such as a clamp 270 in order to apply the pressure.
- the pressure enables the metal material composing the first tubular part 110 to deform and the metal material to be attached firmly to the connective projection 260 by a simple process.
- the connective projection 260 can be configured to be a nipple shape, as shown in FIGS. 5A and 5B .
- the first tubular part 110 made of metal materials, which composes the inner layer of the pipe 250 has a small wall thickness, it undergoes plastic deformation due to the stress concentration at the convex portions of the nipple shape, and is attached firmly to the connective projection 260.
- the pipe 250 according to the present exemplary embodiment includes, as the outer layer, the second tubular part 120 made of organic materials such as resin and rubber, it is possible to maintain the mechanical strength as a pipe even if the metal material of the inner layer is deformed.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Claims (13)
- Structure de tuyauterie (10, 100) pour un dispositif de refroidissement, comprenant :une première partie tubulaire (11, 110) avec une portion creuse à travers laquelle un fluide frigorigène utilisé dans le dispositif de refroidissement est apte à s'écouler ;dans laquelle la première partie tubulaire (11, 110) est constituée de matériaux de métal, caractérisée en ce que la rugosité de surface de la surface interne de la première partie tubulaire (11, 110) est égale ou supérieure à 0,1 micromètre et inférieure à 1 micromètre si bien que la rugosité de surface de la surface interne de la première partie tubulaire (11, 110) est inférieure ou égale à la taille d'un noyau de condensation pour le fluide frigorigène.
- Structure de tuyauterie (10, 100) pour un dispositif de refroidissement selon la revendication 1,
dans laquelle la première partie tubulaire (11, 110) est formée par intermédiaire d'un processus de recuit. - Structure de tuyauterie (10, 100) pour un dispositif de refroidissement selon l'une quelconque des revendications 1 et 2,
dans laquelle l'épaisseur de la première partie tubulaire (11, 110) est égale ou supérieure à 0,4 mm et inférieure ou égale à 1 mm. - Structure de tuyauterie (10, 100) pour un dispositif de refroidissement selon l'une quelconque des revendications 1, 2 et 3, comprenant :la première partie tubulaire (11, 110) ; etune seconde partie tubulaire (120) de laquelle la première partie tubulaire (11, 110) est recouverte,dans laquelle la seconde partie tubulaire (120) est constituée de matériaux organiques.
- Structure de tuyauterie (10, 100) pour un dispositif de refroidissement selon l'une quelconque des revendications 1, 2, 3 et 4, comprenant en outre :un premier raccord raccordé à un évaporateur stockant un fluide frigorigène ; etun second raccord raccordé à un condenseur condensant et liquéfiant un fluide frigorigène à l'état de vapeur vaporisé dans l'évaporateur et rayonnant de la chaleur.
- Dispositif de refroidissement, comprenant :un évaporateur stockant un fluide frigorigène ;un condenseur condensant et liquéfiant un fluide frigorigène à l'état de vapeur vaporisé dans l'évaporateur et rayonnant de la chaleur ; etun tuyau raccordant l'évaporateur au condenseur,dans lequel le tuyau comprend la structure de tuyauterie pour un dispositif de refroidissement (10, 100) selon l'une quelconque des revendications 1, 2, 3, 4, et 5.
- Dispositif de refroidissement selon la revendication 6,
dans lequel l'évaporateur comprend une première saillie de raccordement raccordée au tuyau ;
le condenseur comprend une seconde saillie de raccordement raccordée au tuyau ; et
au moins l'une de la première saillie de raccordement et de la seconde saillie de raccordement est constituée du même matériau qu'un matériau de métal duquel la première partie tubulaire est constituée. - Procédé de réalisation d'une structure de tuyauterie pour un dispositif de refroidissement, comprenant les étapes :d'application d'un processus de laminage à un matériau de métal composant une portion creuse à travers laquelle un fluide frigorigène utilisé dans un dispositif de refroidissement s'écoule ;de formation d'un matériau de plaque de métal de type plaque avec une rugosité de surface égale ou supérieure à 0,1 micromètre et inférieure à 1 micromètre si bien que la rugosité de surface est inférieure ou égale à la taille d'un noyau de condensation pour le fluide frigorigène par le processus de laminage ; etde cintrage du matériau de plaque de métal en un tube et de jonction des deux extrémités.
- Procédé de réalisation d'une structure de tuyauterie pour un dispositif de refroidissement selon la revendication 8, comprenant en outre :l'exécution d'un processus de recuit ultérieurement au procédé de jonction.
- Procédé de réalisation d'une structure de tuyauterie pour un dispositif de refroidissement selon la revendication 8, comprenant en outre :la formation d'une première partie tubulaire constituée de matériaux de métal par le processus de jonction ; etle recouvrement de la périphérie externe de la première partie tubulaire en éjectant un matériau organique et en formant une seconde partie tubulaire constituée du matériau organique.
- Procédé de raccordement de tuyaux, comprenant les étapes :de montage, dans une saillie de raccordement, d'un tuyau comprenant une première partie tubulaire, la première partie tubulaire ayant une portion creuse à travers laquelle un fluide frigorigène utilisé dans un dispositif de refroidissement est apte à s'écouler, constituée d'un matériau de métal, et une rugosité de surface de sa surface interne étant égale ou supérieure à 0,1 micromètre et inférieure à 1 micromètre si bien que la rugosité de surface de ladite surface interne est inférieure ou égale à la taille d'un noyau de condensation pour le fluide frigorigène,d'application d'une pression à partir de la périphérie externe du tuyau vers le centre ; etde déformation du matériau de métal composant la première partie tubulaire par la pression et de fixation solide du matériau de métal à la saillie de raccordement.
- Procédé de raccordement de tuyaux selon la revendication 11,
dans lequel la première partie tubulaire est formée par l'intermédiaire d'un processus de recuit. - Procédé de raccordement de tuyaux selon la revendication 11,
dans lequel le tuyau comprend une seconde partie tubulaire, qui est constituée de matériaux organiques, de laquelle la première partie tubulaire est recouverte ; et
la pression est appliquée à partir de la périphérie externe de la seconde partie tubulaire vers le centre.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011089347 | 2011-04-13 | ||
PCT/JP2012/060197 WO2012141320A1 (fr) | 2011-04-13 | 2012-04-10 | Structure de tuyauterie d'un dispositif de refroidissement, méthode de fabrication de celle-ci et méthode d'accouplement de tuyaux |
Publications (3)
Publication Number | Publication Date |
---|---|
EP2698590A1 EP2698590A1 (fr) | 2014-02-19 |
EP2698590A4 EP2698590A4 (fr) | 2014-11-19 |
EP2698590B1 true EP2698590B1 (fr) | 2016-11-30 |
Family
ID=47009478
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP12770839.4A Active EP2698590B1 (fr) | 2011-04-13 | 2012-04-10 | Structure de tuyauterie d'un dispositif de refroidissement, méthode de fabrication de celle-ci et méthode d'accouplement de tuyaux |
Country Status (5)
Country | Link |
---|---|
US (1) | US20140027100A1 (fr) |
EP (1) | EP2698590B1 (fr) |
JP (1) | JP6156142B2 (fr) |
CN (1) | CN103459969A (fr) |
WO (1) | WO2012141320A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200049580A (ko) * | 2018-10-29 | 2020-05-08 | 가부시키가이샤 고베 세이코쇼 | 저온 액화 가스 기화기, 냉각 시스템 및 기화기에 있어서의 착빙 억제 방법 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012242009A (ja) * | 2011-05-20 | 2012-12-10 | Nec Corp | 接続管、その製造方法、及びそれを用いた冷却装置 |
JP6269478B2 (ja) * | 2012-03-22 | 2018-01-31 | 日本電気株式会社 | 電子基板の冷却構造及びそれを用いた電子装置 |
RU2508516C1 (ru) * | 2012-12-06 | 2014-02-27 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Казанский государственный энергетический университет" (ФГБОУ ВПО "КГЭУ") | Теплообменная труба |
US20160377356A1 (en) * | 2015-06-25 | 2016-12-29 | Asia Vital Components Co., Ltd. | Flexible and transformable water-cooling device |
Family Cites Families (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1944094A (en) * | 1927-06-01 | 1934-01-16 | Laura S Stevenson | Method of making tubes and pipes |
US2508465A (en) * | 1944-03-18 | 1950-05-23 | Westinghouse Electric Corp | Lined metal tube and method of manufacture |
US3847353A (en) * | 1973-11-14 | 1974-11-12 | J Wynne | Spray device for coating the outside of pipe |
US3988427A (en) * | 1974-05-22 | 1976-10-26 | Ethyl Corporation | Flame reaction process for producing hydrogen bromide |
DE2919188C2 (de) * | 1979-05-12 | 1986-10-30 | Süddeutsche Kühlerfabrik Julius Fr. Behr GmbH & Co KG, 7000 Stuttgart | Verfahren zur Behandlung einer Oberfläche einer metallischen Wand für die Übertragung von Wärme und dessen Anwendung |
US4589275A (en) * | 1982-04-16 | 1986-05-20 | The Kendall Company | Pipe coating |
JPS6076793U (ja) * | 1983-10-31 | 1985-05-29 | 昭和アルミニウム株式会社 | 耐酸被覆層を備えたヒ−トパイプ用金属管 |
JP3071441B2 (ja) * | 1990-02-03 | 2000-07-31 | 臼井国際産業株式会社 | 多重巻鋼管とその製造方法及びそれに用いる帯材 |
US5070937A (en) * | 1991-02-21 | 1991-12-10 | American Standard Inc. | Internally enhanced heat transfer tube |
TW302063U (en) * | 1992-09-24 | 1997-04-01 | Honda Motor Co Ltd | Pipe joint |
JPH06224337A (ja) | 1993-01-22 | 1994-08-12 | Yaskawa Electric Corp | 沸騰冷却装置 |
US5388329A (en) * | 1993-07-16 | 1995-02-14 | Olin Corporation | Method of manufacturing a heating exchange tube |
JPH11300411A (ja) * | 1994-04-14 | 1999-11-02 | Sumitomo Metal Ind Ltd | Baタイプクリーンパイプおよびその製造方法 |
JPH08261671A (ja) * | 1995-03-23 | 1996-10-11 | Mitsubishi Shindoh Co Ltd | ヒートシンクおよびヒートシンクを備えた電子装置 |
DE19516830A1 (de) * | 1995-05-08 | 1996-11-14 | Veritas Gummiwerke Ag | Preßwerkzeuge und Verfahren zum Verbinden von rohrförmigen Elementen |
JPH0949693A (ja) * | 1995-08-04 | 1997-02-18 | Fujikura Ltd | ヒートパイプ用コンテナの製造方法 |
JP2000258080A (ja) * | 1999-03-05 | 2000-09-22 | Maruyasu Industries Co Ltd | ヒートパイプ及びその製造方法 |
US6393226B1 (en) * | 2000-10-04 | 2002-05-21 | Nexpress Solutions Llc | Intermediate transfer member having a stiffening layer and method of using |
US6971442B2 (en) * | 2001-06-29 | 2005-12-06 | Intel Corporation | Method and apparatus for dissipating heat from an electronic device |
JP2003214750A (ja) * | 2002-01-23 | 2003-07-30 | Twinbird Corp | サーモサイフォン |
DE10221515C1 (de) * | 2002-05-14 | 2003-11-13 | Hydro Aluminium Deutschland | Verfahren zur Herstellung eines Aluminiumrohres |
JP4032954B2 (ja) * | 2002-07-05 | 2008-01-16 | ソニー株式会社 | 冷却装置、電子機器装置、音響装置及び冷却装置の製造方法 |
US6910620B2 (en) * | 2002-10-15 | 2005-06-28 | General Electric Company | Method for providing turbulation on the inner surface of holes in an article, and related articles |
US20050121177A1 (en) * | 2003-12-03 | 2005-06-09 | Chiung-Chuan Wang | Radiation tube structure |
JP2005257989A (ja) * | 2004-03-11 | 2005-09-22 | Nitto Kogyo Co Ltd | 定着用回転体 |
JP4234635B2 (ja) * | 2004-04-28 | 2009-03-04 | 株式会社東芝 | 電子機器 |
CN1707785A (zh) * | 2004-06-11 | 2005-12-14 | 鸿富锦精密工业(深圳)有限公司 | 液冷散热装置 |
US7922065B2 (en) * | 2004-08-02 | 2011-04-12 | Ati Properties, Inc. | Corrosion resistant fluid conducting parts, methods of making corrosion resistant fluid conducting parts and equipment and parts replacement methods utilizing corrosion resistant fluid conducting parts |
US20060042274A1 (en) * | 2004-08-27 | 2006-03-02 | Manole Dan M | Refrigeration system and a method for reducing the charge of refrigerant there in |
JP2006125718A (ja) | 2004-10-28 | 2006-05-18 | Sony Corp | 熱輸送装置及び電子機器 |
US7204298B2 (en) * | 2004-11-24 | 2007-04-17 | Lucent Technologies Inc. | Techniques for microchannel cooling |
WO2006088138A1 (fr) * | 2005-02-17 | 2006-08-24 | Sumitomo Metal Industries, Ltd. | Tuyau metallique et procede pour sa fabrication |
EP1889936B1 (fr) * | 2005-06-09 | 2019-03-13 | JFE Steel Corporation | Tôle d'acier inoxydable ferritique pour tuyauteries de soufflets |
TWI285081B (en) * | 2005-08-10 | 2007-08-01 | Cooler Master Co Ltd | Heat-dissipation structure and method thereof |
US7562444B2 (en) * | 2005-09-08 | 2009-07-21 | Delphi Technologies, Inc. | Method for manufacturing a CPU cooling assembly |
US20080101023A1 (en) * | 2006-11-01 | 2008-05-01 | Hsia-Yuan Hsu | Negative pressure pump device |
US20080104840A1 (en) * | 2006-11-03 | 2008-05-08 | Qnx Cooling Systems Inc. | Heat transfer unit extrusion process |
JP2008202880A (ja) * | 2007-02-21 | 2008-09-04 | Nomura Unison Co Ltd | 冷却システム |
JP4878317B2 (ja) * | 2007-03-22 | 2012-02-15 | 株式会社コベルコ マテリアル銅管 | 銅または銅合金からなる銅管 |
US20080229580A1 (en) * | 2007-03-23 | 2008-09-25 | Russell Charles Anderson | Method of manufacturing a brazed micro-channel cold plate heat exchanger assembly |
WO2009038490A1 (fr) * | 2007-09-17 | 2009-03-26 | Vadim Anatolievich Pomytkin | Diffuseur thermique pour refroidisseurs de caloduc et refroidisseurs d'eau |
US20090090489A1 (en) * | 2007-10-05 | 2009-04-09 | Asia Vital Components Co., Ltd. | Water-cooling heat-dissipating module of electronic apparatus |
US8351835B2 (en) * | 2007-11-05 | 2013-01-08 | K. K. Endo Seisakusho | Tube and method for manufacturing the same |
JP4819071B2 (ja) * | 2008-02-06 | 2011-11-16 | 本田技研工業株式会社 | 電気車両及び車両用dc/dcコンバータの冷却方法 |
US8418517B2 (en) * | 2008-02-19 | 2013-04-16 | Showa Denko K.K. | Method of manufacturing a pipe coupling component |
US8748008B2 (en) * | 2008-06-12 | 2014-06-10 | Exxonmobil Research And Engineering Company | High performance coatings and surfaces to mitigate corrosion and fouling in fired heater tubes |
JP2010181057A (ja) * | 2009-02-04 | 2010-08-19 | Mitsubishi Electric Corp | 封止管及び薄肉管の封止方法 |
US20100296249A1 (en) * | 2009-05-19 | 2010-11-25 | Beijing AVC Technology Research Center Co., Ltd. | Micro passage cold plate device for a liquid cooling radiator |
JP5210997B2 (ja) * | 2009-08-28 | 2013-06-12 | 株式会社日立製作所 | 冷却システム、及び、それを用いる電子装置 |
DE102009045882A1 (de) * | 2009-10-21 | 2011-04-28 | Evonik Degussa Gmbh | Erdwärmesonde für eine geotherme Wärmepumpe |
TWI506238B (zh) * | 2009-12-29 | 2015-11-01 | Foxconn Tech Co Ltd | 微型液體冷卻裝置 |
DE102010004960A1 (de) * | 2010-01-20 | 2011-07-21 | J. Eberspächer GmbH & Co. KG, 73730 | Rohrkörper und Abgasanlage |
US20130206368A1 (en) * | 2010-10-19 | 2013-08-15 | Nec Corporation | Cooling device and method for producing the same |
JPWO2012060461A1 (ja) * | 2010-11-02 | 2014-05-12 | 日本電気株式会社 | 冷却装置及びその製造方法 |
-
2012
- 2012-04-10 WO PCT/JP2012/060197 patent/WO2012141320A1/fr active Application Filing
- 2012-04-10 JP JP2013509998A patent/JP6156142B2/ja active Active
- 2012-04-10 CN CN2012800177405A patent/CN103459969A/zh active Pending
- 2012-04-10 US US14/110,671 patent/US20140027100A1/en not_active Abandoned
- 2012-04-10 EP EP12770839.4A patent/EP2698590B1/fr active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200049580A (ko) * | 2018-10-29 | 2020-05-08 | 가부시키가이샤 고베 세이코쇼 | 저온 액화 가스 기화기, 냉각 시스템 및 기화기에 있어서의 착빙 억제 방법 |
Also Published As
Publication number | Publication date |
---|---|
JP6156142B2 (ja) | 2017-07-05 |
US20140027100A1 (en) | 2014-01-30 |
CN103459969A (zh) | 2013-12-18 |
EP2698590A1 (fr) | 2014-02-19 |
WO2012141320A1 (fr) | 2012-10-18 |
EP2698590A4 (fr) | 2014-11-19 |
JPWO2012141320A1 (ja) | 2014-07-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2698590B1 (fr) | Structure de tuyauterie d'un dispositif de refroidissement, méthode de fabrication de celle-ci et méthode d'accouplement de tuyaux | |
US11789505B2 (en) | Loop heat pipe | |
US7891413B2 (en) | Heat pipe | |
US8391007B2 (en) | Heat spreader, electronic apparatus, and heat spreader manufacturing method | |
CN101738117B (zh) | 传热装置、电子设备和传热装置制造方法 | |
US9074825B2 (en) | Heatsink apparatus and electronic device having the same | |
US8400770B2 (en) | Heat spreader, electronic apparatus, and heat spreader manufacturing method | |
US7520315B2 (en) | Heat pipe with capillary wick | |
US20110174464A1 (en) | Flat heat pipe and method for manufacturing the same | |
CN109253642B (zh) | 环路热管及其制造方法 | |
CN109724438B (zh) | 环路式热管 | |
US20110005724A1 (en) | Heat transport device manufacturing method and heat transport device | |
JP2018194197A (ja) | ヒートパイプ及び電子機器 | |
JP5183744B2 (ja) | 配管装置および流体搬送装置 | |
US20110047796A1 (en) | Method for manufacturing heat pipe with artery pipe | |
US9062920B2 (en) | Heat pipe with sealed vesicle | |
US20130219954A1 (en) | Cooling device and method for producing the same | |
EP2851948B1 (fr) | Structure permettant de raccorder un appareil de refroidissement, appareil de refroidissement et procédé permettant de raccorder un appareil de refroidissement | |
WO2008100007A1 (fr) | Caloduc plat et procédé de fabrication correspondant | |
US9689622B2 (en) | Heat transfer device | |
JP2012242009A (ja) | 接続管、その製造方法、及びそれを用いた冷却装置 | |
EP2801781B1 (fr) | Système de refroidissement | |
EP3910275B1 (fr) | Caloduc de type boucle | |
TWI821783B (zh) | 熱導板及散熱器 | |
EP3916336A1 (fr) | Caloduc de type boucle |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20131113 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20141020 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: F28F 21/08 20060101ALI20150831BHEP Ipc: F28F 13/02 20060101AFI20150831BHEP Ipc: F28D 15/02 20060101ALI20150831BHEP Ipc: F28F 13/18 20060101ALI20150831BHEP Ipc: F28F 19/04 20060101ALI20150831BHEP Ipc: F28F 1/00 20060101ALI20150831BHEP |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
INTG | Intention to grant announced |
Effective date: 20160613 |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: EP Ref country code: GB Ref legal event code: FG4D |
|
REG | Reference to a national code |
Ref country code: AT Ref legal event code: REF Ref document number: 850199 Country of ref document: AT Kind code of ref document: T Effective date: 20161215 |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R096 Ref document number: 602012026073 Country of ref document: DE |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LV Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161130 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 6 |
|
REG | Reference to a national code |
Ref country code: LT Ref legal event code: MG4D |
|
REG | Reference to a national code |
Ref country code: NL Ref legal event code: MP Effective date: 20161130 |
|
REG | Reference to a national code |
Ref country code: AT Ref legal event code: MK05 Ref document number: 850199 Country of ref document: AT Kind code of ref document: T Effective date: 20161130 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161130 Ref country code: LT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161130 Ref country code: NO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170228 Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170301 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170330 Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161130 Ref country code: AT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161130 Ref country code: HR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161130 Ref country code: RS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161130 Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161130 Ref country code: PL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161130 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161130 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161130 Ref country code: RO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161130 Ref country code: CZ Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161130 Ref country code: EE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161130 Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161130 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SM Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161130 Ref country code: BG Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170228 Ref country code: IT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161130 Ref country code: BE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161130 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R097 Ref document number: 602012026073 Country of ref document: DE |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed |
Effective date: 20170831 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161130 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: MM4A |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MC Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161130 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20170410 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20170430 Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20170430 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 7 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20170410 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20170410 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: HU Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO Effective date: 20120410 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: CY Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20161130 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161130 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: TR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161130 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: AL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161130 Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170330 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20240419 Year of fee payment: 13 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20240418 Year of fee payment: 13 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 20240425 Year of fee payment: 13 |