EP2680073B1 - Method of manufacturing an organic light-emitting diode display panel - Google Patents

Method of manufacturing an organic light-emitting diode display panel Download PDF

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Publication number
EP2680073B1
EP2680073B1 EP12837620.9A EP12837620A EP2680073B1 EP 2680073 B1 EP2680073 B1 EP 2680073B1 EP 12837620 A EP12837620 A EP 12837620A EP 2680073 B1 EP2680073 B1 EP 2680073B1
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Prior art keywords
layer
photoresist
lines
pixel defining
organic light
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EP12837620.9A
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German (de)
English (en)
French (fr)
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EP2680073A4 (en
EP2680073A1 (en
Inventor
Haijing Chen
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • Embodiments of the present invention relate to a method for manufacturing an organic light emitting diode display panel.
  • An organic light-emitting diode (OLED) display panel is generally formed with a stacked structure of a glass substrate, an indium tin oxide (ITO) anode, an organic light emitting layer (emitting material layer), a cathode and so on.
  • the organic light emitting layer is sandwiched between the ITO anode, which is thin and transparent, and the metal cathode.
  • ITO indium tin oxide
  • organic light emitting layer organic light emitting layer
  • the organic material in the organic light emitting layer will be excited to emit light.
  • Active matrix organic light-emitting diode (AMOLED) display panels are a kind of OLED display panels. Compared to conventional liquid crystal display panels, AMOLED panels have characteristics of faster response speed, higher contrast, wider viewing angle, etc., and have wide application prospective.
  • a conventional manufacturing process for an OLED display panel may broadly include the following two steps:
  • the organic electroluminescent layers are sandwiched between the anodes and the cathodes to form a sandwich structure.
  • the pixel defining layer acts to define the size of pixels and the anodes, and to ensure insulation between the anodes and the cathodes.
  • FIG. 1 is a structurally schematic view showing an active-region pixel prior to fabrication of a pixel defining layer in prior art.
  • 101a ⁇ 101b denote scan lines
  • 102a ⁇ 102b denote data lines
  • 105a denotes a driving power line
  • 109 denotes a switch transistor
  • 110 denotes a driving transistor
  • 103a denotes an active area, which is formed of a semiconductor material, such as monocrystalline silicon, polysilicon, indium gallium zinc oxide (IGZO), etc.
  • 104a denotes a connecting line for connecting the switch transistor 109 and the driving transistor 110
  • 106a denotes a transparent electrode.
  • FIG. 2 is a structurally schematic view further showing the pixel defining layer.
  • the region 107a in FIG. 2 is the pixel defining layer within one pixel
  • a region DA in the pixel defining layer is the region for display in the corresponding pixel.
  • the material for forming the pixel defining layer is usually photoresist.
  • the pattern of the pixel defining layer is generally formed by using a photolithography process in prior art, and the mask plate used for patterning is generally a mask plate specifically designed for the pixel defining layer. Meanwhile, during photolithography, one positioning process is required for precise positioning of the mask plate so as to form the pixel defining layer accurately.
  • US 2011/062458 A1 discloses a light emitting panel including: a light blocking section formed above a substrate, the light blocking section including an opening; a first electrode formed above the opening of the light blocking section; a dividing wall including an opening so that at least a portion of the first electrode is exposed, the opening corresponding to a shape of the opening of the light blocking section; a second electrode formed above the first electrode; and a carrier transport layer composed of at least one layer formed between the first electrode and the second electrode.
  • US 2006/125381 A1 discloses method of fabricating an OLED display, in which a first electrode overlaps a scan line, a common power supply line and/or a data line, wherein a pixel defining layer is etched by backside exposure.
  • US 2002/140343 A1 discloses a method for manufacturing a display device including a light-transmitting substrate and, above the light-transmitting substrate, a plurality of light-emitting elements arrayed in a plane, driving elements connected to the light-emitting elements, a bank layer disposed in the boundary areas between the plurality of light-emitting elements, and wires connected to the driving elements, wherein in the method: the wires are formed by patterning a light-shielding, conductive layer on the light-transmitting substrate so as to have a shape in plan view corresponding to the shape of the bank layer in plan view; then, the wires, acting as a mask, are exposed from the rear surface of the substrate to form the bank layer by self-aligning above the wires; and, then, the light-emitting elements are formed in the areas surrounded by the bank layer.
  • JP 2010 056025 A discloses a light-emitting panel including a shading film formed on the upper face of a substrate, an interlayer insulating film to cover the shading film, a pixel electrode and pixel transistors formed on the upper face of the interlayer insulating film, a protection insulating film which is formed so as to cover the outer circumference portion of a plurality of pixel electrodes and the pixel transistors, a light-emitting functional layer formed on the upper part of the pixel electrode, and a barrier rib which is formed at the upper part of the protection insulating film and demarcates a forming region of the light-emitting functional layer.
  • the shading film has an identical shape in a plan view as at least either of the protection insulating film or the barrier rib.
  • an organic light emitting diode display panel comprising:
  • the pixel defining layer comprises a first pixel defining layer formed of the photoresist in the photoresist remaining region, and further comprises a second pixel defining layer.
  • a hydrophilic material layer is formed on the transparent substrate with a material which is transparent and has hydrophilicity.
  • the photoresist layer comprises a hydrophobic material and is coated on the hydrophilic material layer.
  • the hydrophilic material layer exposed outside the photoresist remaining region is further removed, and a second pixel defining layer constituted by the remaining hydrophilic material layer is obtained.
  • the material for the second pixel defining layer is silicon nitride
  • the material for the first pixel defining layer is polyimide
  • the first electrodes are anodes
  • the second electrode is a cathode
  • an organic light emitting diode display panel can be provided, which is manufactured by the above method.
  • the organic light emitting diode display panel and the method for manufacturing the same provided by embodiments of the invention, in a photolithograph process for forming the pixel defining layer, the scan lines , the data lines and the driving power lines, the driving transistors, the switch transistors and the connecting lines between the driving transistors and the switch transistors which are opaque function as a mask plate, so that a specific mask plate is no longer required and moreover a mask positioning process in prior art is also saved.
  • the producing flow is largely simplified, production costs are decreased and yield of products is increased.
  • fabrication of a pixel defining layer is carried out after fabrication of an active array and anodes of pixels is completed and before an organic light emitting layer is formed.
  • the active array comprises switch transistors functioning as switch elements of pixels, driving transistors for driving OLEDs, connecting lines between the-switch transistors and the driving transistors, scan lines, data lines, driving lines, etc.
  • a specifically designed mask plate is generally used for patterning of the pixel defining layer.
  • embodiments of the invention do not need a specialized pixel-defining-layer mask plate.
  • Fabrication of the active array has already been completed prior to fabrication of the pixel defining layer, and the scan lines, the data lines, the driving power lines, etc. have already been formed on a substrate.
  • Such a structure is, for example, the structure as shown in FIG. 1 .
  • the scan lines and the data lines are disposed so as to cross each other, for example, the scan lines and the data lines may be disposed perpendicular to each other; the data lines and the driving power lines are usually parallel to each other, and the scan lines and the data lines (or the driving power lines), perpendicular to each other, separate each pixel from each other.
  • the data lines, the scan lines, the driving power lines, the switch transistors, the driving transistors and the connecting lines between the switch transistors and the driving transistors function as a mask plate for the pixel defining layer, with which the pixel defining layer is patterned, so that a specific mask plate and a positioning process are no longer required.
  • a method for manufacturing a pixel defining layer of an organic light emitting diode display panel comprises the following steps.
  • Step 31 a photoresist layer is coated on a transparent substrate with an active array formed thereon, the active array comprising driving power lines, data lines, scan lines, and a plurality of pixel units which are defined by crossing of the scan lines and the data lines, the pixel units comprising first electrodes which are transparent, wherein the scan lines, the data lines and the driving power lines are opaque.
  • the photoresist is coated on the surface of the active array on the transparent substrate to cover the active array.
  • a substrate such as a glass substrate, a quartz substrate, a plastic substrate or the like, can be used for the transparent substrate.
  • the scan lines are opaque; and the driving power lines and the data lines are both opaque; alternatively, in an example, not forming part of the present invention, only one of them is transparent.
  • the driving power lines are opaque while the data lines are transparent; or, the data lines are opaque while the driving power lines are transparent.
  • the driving power line 105 is closer to the transparent electrode 106a compared to the data line 102b, and thus the driving power line 105 is preferably opaque.
  • the above scan lines/driving power lines/data lines which are opaque, can be formed with a lighttight conductive material, such as Mo, Al, Ti, or the like.
  • a plurality of pixel units can be defined by such crossing.
  • scan lines and data lines which are perpendicular to each other and are both opaque, cross each other and define a plurality of pixel units.
  • each of the pixel units specifically includes a first electrode (for example an ITO anode) 106a which is transparent, and a switch transistor 109, a driving transistor 110 and may include other transistor device(s).
  • a first electrode for example an ITO anode
  • a switch transistor 109, a driving transistor 110 may include other transistor device(s).
  • the specific connection relationship between the switch transistor, the driving transistor, the scan line, the data line and the driving power line is not limited, and may be a known structure (for example the structure shown in FIG. 1 ) or a structure that will be developed in future, therefore its details being omitted here.
  • Step 32 from the side of the transparent substrate opposed to the photoresist layer, exposure is performed on the photoresist layer, wherein the scan lines ,data lines, driving power lines, switch transistors, driving transistors and connecting lines between the driving transistors and the switch transistors are used as a mask plate to prevent exposure of the photoresist in correspondence with them, so that a photoresist remaining region can be formed with the photoresist layer.
  • the exposure is conducted from the side of the transparent substrate without the coated photoresist, and thereby the corresponding photoresist is sheltered by utilizing the opaque characteristic of the data lines the scan lines, the driving power lines , the switch transistors, the driving transistors and the connecting lines between the switch transistors and the driving transistors so as to avoid it from being exposed.
  • the photoresist that has not been exposed forms the photoresist remaining region, and the remaining region will be retained after development.
  • Step 33 a development treatment is conducted on the photoresist layer, so that the photoresist outside the photoresist remaining region is removed and the photoresist in the photoresist remaining region is retained to form the pixel defining layer.
  • the part of the photoresist which is not sheltered during exposure will be removed and the photoresist layer in the photoresist remaining region will be retained, so that the retained photoresist forms a specific structure of the pixel defining layer.
  • the scan lines the data lines , the driving power lines, the driving transistors, the switch transistors and the connecting lines between the driving transistors and the switch transistors which are opaque are used as a mask plate, so that a specific mask plate is no longer required and moreover a mask positioning process in prior art can be reduced.
  • the producing flow can be greatly simplified, production costs are decreased, and yield of products is increased.
  • the pixel defining layer may be in a one-layered structure.
  • the pixel defining layer is a two-layered structure.
  • different hydrophilic materials may be used, and the material close to the first electrode, which is transparent, is transparent.
  • a method for manufacturing a pixel defining layer of an organic light emitting diode display panel according the invention includes the following steps.
  • Step 41 with a material which is transparent and has hydrophilicity, a hydrophilic material layer is formed on a transparent substrate with an active array formed thereon.
  • the active array comprises driving power lines, data lines, scan lines, and a plurality of pixel units which are defined by crossing of the scan lines and the data lines
  • the pixel units comprises first electrodes which are transparent, switch transistors, driving transistors and connecting lines between the switch transistors and the driving transistors, wherein the scan lines , the data lines, the driving power lines the driving transistors, the switch transistors and the connecting lines between the switch transistors and the driving transistors are opaque.
  • Silicon nitride may be specifically used for the hydrophilic material layer, and therefore the hydrophilic material layer can be obtained by covering a layer of silicon nitride on the surface of the active array of the transparent substrate by way of chemical deposition.
  • Step 42 a photoresist layer is coated on the hydrophilic material layer.
  • Step 43 from the side of the transparent substrate opposed to the photoresist layer, exposure is performed on the photoresist layer, wherein the scan lines, the data lines, the driving power lines, the switch transistors, the driving transistors and the connecting lines between the driving transistors and the switch transistors are used as a mask plate to prevent exposure of the photoresist in correspondence with them, so that a photoresist remaining region is formed by the photoresist layer.
  • Step 44 a development treatment is conducted on the photoresist layer, so that the photoresist outside the photoresist remaining region is removed and the photoresist in the photoresist remaining region is retained to form a first pixel defining layer.
  • Step 45 the hydrophilic material layer outside the photoresist remaining region is removed, and a second pixel defining layer constituted by the remaining hydrophilic material layer is obtained.
  • this step is performed by using wet etching or dry etching with the formed first pixel defining layer as an etching mask.
  • the resulted pixel defining layer through the above treatments has a two-layered structure, which comprises the first pixel defining layer formed by the photoresist in the photoresist remaining region and further comprises the second pixel defining layer constituted by the remaining hydrophilic material layer, where the first pixel defining layer is located over the second pixel defining layer.
  • Silicon nitride can be used as the material for the second pixel defining layer in the underlying layer, and polyimide can be used as the material for the first pixel defining layer in the upper layer. Silicon nitride is hydrophilic while polyimide is hydrophobic. This structure will be helpful to form a desired thickness distribution for a hole transportation layer, a hole injection layer or a light emitting layer of an organic light emitting device in subsequent procedures.
  • an exposure and development treatment is performed in such a way as the above steps 44 ⁇ 45, and then etching, stripping-off and other process(es) are performed on materials, thereby completing patterning of the double-layered pixel defining layer.
  • the pixel defining layer is patterned with the lighttight metal lines and devices in FIG. 1 .
  • the metal lines and devices which are lighttight in FIG. 1 include the scan lines 101 ⁇ 101b, the data lines 102a ⁇ 102b, the driving power lines 105a, the connecting lines 104a as well as the switch transistors 109 and the driving transistors 110 (i.e., they are all made of an opaque, conductive material).
  • the pattern constituted by these metal lines and devices, which are opaque, is collectively denoted by 108 in FIG. 4 .
  • the pattern 108 as shown in FIG. 4 is used as a mask plate, and after coating of the materials for the pixel defining layer, exposure is performed from the backside of the substrate.
  • the photoresist over the part of the pattern 108 in FIG. 4 is not exposed and will be left on the substrate after development, while those parts that lie outside of the pattern 108 are exposed and the photoresist will be removed after development.
  • the pixel defining layer in the same shape as the pattern 108 is formed on the substrate.
  • the whole area of the first electrode which is transparent can be used for display, and accordingly, the pixel unit can be fully utilized.
  • Step 51 an active array is formed on a transparent substrate, the active array comprising driving power lines, data lines, scan lines, and a plurality of pixel units which are defined by crossing of the scan lines and the data lines, and the pixel units comprising first electrodes which are transparent, wherein the scan lines, the data lines and the driving power lines are opaque.
  • the pixel units further include driving transistors, switch transistors and connecting lines between the driving transistors and the switch transistors.
  • the specific connection relationship between the switch transistors, the driving transistors, the scan lines, the data lines and the driving power lines is not limited, and may be a known structure or a structure that will be developed in future, its details being omitted here.
  • material, forming process and so on regarding the transparent substrate, the driving power lines, the data lines, the scan lines, the transistors, etc. may be the same as those stated above, and thus will no longer be detailed here.
  • Step 52 a photoresist layer is coated on the transparent substrate, The photoresist is coated on the surface of the active array so as to cover the active array.
  • Step 53 from the side of the transparent substrate opposed to the photoresist layer, exposure is performed on the photoresist layer, wherein the scan lines, the data lines, the driving power lines, the switch transistors, the driving transistors and the connecting lines between the switch transistors and the driving transistors are used as a mask plate to prevent exposure of the photoresist in correspondence with them, so that a photoresist remaining region is formed by the photoresist layer.
  • Step 54 a development treatment is conducted on the photoresist layer, so that the photoresist outside the photoresist remaining region is removed and the photoresist in the photoresist remaining region is retained to form a pixel defining layer.
  • Step 55 an organic light emitting layer is formed in a pixel region defined by the pixel defining layer.
  • Step 56 a second electrode is formed on the organic light emitting layer.
  • the first electrodes may be anodes, and the second electrode may be a cathode.
  • the first electrodes are made of a transparent, conductive material, and the second electrode can be made of a conductive material which is transparent or opaque.
  • the organic light emitting layer can be formed on the substrate through evaporation with a mask plate, or can be formed by means of ink printing.
  • the organic light emitting layer upon formation of the organic light emitting layer, even if the organic light emitting layer is deposited in other regions than the first electrodes in the pixel region, because only first electrodes (such as anode electrodes) in the pixel region may contact with the organic light emitting material, the other regions will not emit light after energizing despite the fact that the organic light emitting material which does not contact the first electrodes is present in these regions. Therefore, for simplifying the process, in the embodiment, the mask may not be used in the step 55 and the organic light emitting layer can be directly formed on the substrate through evaporation.
  • first electrodes such as anode electrodes
  • an organic light emitting display panel and its pixel defining layer are further provided; the organic light emitting display panel is manufactured by using the method shown in FIG. 5 , and the pixel defining layer is manufactured by using the method shown in FIG. 3 , their details being omitted here.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
EP12837620.9A 2012-05-18 2012-10-17 Method of manufacturing an organic light-emitting diode display panel Active EP2680073B1 (en)

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CN201210157391.9A CN102709243B (zh) 2012-05-18 2012-05-18 有机发光二极管显示面板及其制造方法
PCT/CN2012/083100 WO2013170581A1 (zh) 2012-05-18 2012-10-17 有机发光二极管显示面板及其制造方法

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EP2680073A1 EP2680073A1 (en) 2014-01-01
EP2680073A4 EP2680073A4 (en) 2015-11-18
EP2680073B1 true EP2680073B1 (en) 2020-08-05

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US (1) US9178183B2 (zh)
EP (1) EP2680073B1 (zh)
JP (1) JP6110480B2 (zh)
KR (1) KR101456402B1 (zh)
CN (1) CN102709243B (zh)
WO (1) WO2013170581A1 (zh)

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KR20140025306A (ko) 2014-03-04
US9178183B2 (en) 2015-11-03
EP2680073A4 (en) 2015-11-18
WO2013170581A1 (zh) 2013-11-21
CN102709243A (zh) 2012-10-03
US20140097413A1 (en) 2014-04-10
JP6110480B2 (ja) 2017-04-05
JP2015516663A (ja) 2015-06-11
KR101456402B1 (ko) 2014-10-31
CN102709243B (zh) 2015-04-29
EP2680073A1 (en) 2014-01-01

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