EP2476298A1 - Agencement de circuits présentant une capacité électrique prédéterminée, ainsi que procédé et appareil pour sa fabrication - Google Patents

Agencement de circuits présentant une capacité électrique prédéterminée, ainsi que procédé et appareil pour sa fabrication

Info

Publication number
EP2476298A1
EP2476298A1 EP10747863A EP10747863A EP2476298A1 EP 2476298 A1 EP2476298 A1 EP 2476298A1 EP 10747863 A EP10747863 A EP 10747863A EP 10747863 A EP10747863 A EP 10747863A EP 2476298 A1 EP2476298 A1 EP 2476298A1
Authority
EP
European Patent Office
Prior art keywords
conductor strip
laying
substrate
conductor
laid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10747863A
Other languages
German (de)
English (en)
Inventor
Manfred Michalk
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Smartrac IP BV
Original Assignee
Smartrac IP BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smartrac IP BV filed Critical Smartrac IP BV
Publication of EP2476298A1 publication Critical patent/EP2476298A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/06—Coil winding
    • H01F41/071—Winding coils of special form
    • H01F41/074—Winding flat coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
    • H01Q9/26—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength
    • H01Q9/27—Spiral antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09245—Crossing layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means

Definitions

  • the invention relates to a method for producing a circuit arrangement having a predetermined electrical capacitance according to the features of the preamble of claim 1, a circuit arrangement having a predetermined electrical capacitance according to the features of the preamble of claim 11 and an apparatus for producing a circuit arrangement having a predetermined electrical capacitance according to the features of the preamble of claim 13.
  • An apparatus for producing an antenna for wire transponders of electrically conductive material comprises laying means for laying the wire on a substrate, which is placed on holding means.
  • the laying means and the substrate are mutually movable.
  • the holding means are movable parallel to at least two axes of a Cartesian coordinate system.
  • the substrate with respect to the device comprising the at least one roller, the pressing means and the separating means is movable along at least one direction substantially parallel to an axis of a Cartesian coordinate system.
  • the circuit arrangement comprises a substrate with at least one electronic component. On and / or in the substrate, at least one metallic, electrically conductive conductor band is arranged in a circuit pattern, wherein terminals of the electronic component are electrically connected to contacting regions of the conductor band. Furthermore, this document discloses a method of forming a circuit pattern on a substrate. In this case, at least one conductor strip is applied to at least one surface side of the substrate, which at least on one of the substrate
  • a fusible insulating varnish wherein the insulating varnish is heated by thermal energy or by ultrasound and at least partially melted and the conductor strip is pressed onto the substrate.
  • the device comprises a conductor belt spool and a cylindrical or conical installation tool, which at least over part of its length a conductor strip leading inner bore and an annular, in and
  • transponder chip module is introduced into a recess of a substrate. End regions of an antenna wire are held in position on connecting regions of the chip module by means of an adhesive.
  • the adhesive is transparent to allow laser irradiation to connect the antenna wire to the terminal regions by means of an electrically conductive adhesive or a solder material.
  • the transponder security card has a cover over the chip module and the antenna. The recess for the chip module and a channel for the antenna wire are formed on the substrate by ablation of substrate material by means of laser.
  • the transponder system has a transponder which is inserted into a metallic housing, for example a clock, and which, in addition to the transponder chip and the antenna coil, has a capacitor connected in parallel with the coil for setting a predetermined value
  • Resonant frequency has.
  • this transponder only part of the capacitor is formed on the transponder element. The other part, that is the respective one
  • Counter electrode of the capacitor in question is formed by a metallic surface of the transponder element supporting metallic housing.
  • a method for laying a wire on a substrate in a transition section between a first portion and a second portion, in particular for producing an antenna for a transponder unit is known.
  • a laying device and a wire arrangement are known from this document.
  • the wire is thus laid along a curved curve having a concave curvature between the end point of the first section and the starting point of the second section, viewed from a connection s between the end point of the first section and the starting point of the second section. that the wire is first removed from a storage device for the wire, starting from the end point of the first section.
  • the end of the wire is in this case moved in a direction which encloses an angle with a size preferably smaller than 180 ° with the connection s straight.
  • the leg of the angle of the extraction direction is on the side of the connecting line, on which the curved curve is arranged. During the movement of the wire end of this is not connected to the substrate. Overall, the wire is taken from a length which is greater than or equal to the length of the connection s straight. The end of the removed wire becomes
  • an electronic data carrier is described. Electrically conductive structures are fixed by laser transmission on a transparent substrate for the laser radiation. On the side of the substrate opposite the laser radiation source, an electrically conductive complex is supplied and brought into contact with the substrate surface.
  • the electrically conductive complex may be a transfer material with an electrically conductive coating from which the conductive structures are separated, or a thermoplastic coated wire or thread which is completely fixed on the substrate surface, or an electrically conductive paste.
  • the transponder module in particular for an electronic label, comprises a layer consisting of an insulating material, which is the only one
  • Carrier substrate is provided.
  • An antenna device is formed on a first main surface of the carrier substrate.
  • an unhoused circuit chip is arranged such that a first main surface of the circuit chip in Is substantially flush with the first main surface of the first carrier substrate.
  • Antenna device are provided.
  • the invention is based on the object to provide an improved method for producing a circuit arrangement having a predetermined electrical capacitance, a circuit arrangement produced by means of the method with a predetermined electrical capacitance and an apparatus for producing the circuit arrangement and for carrying out the method.
  • the object is achieved according to fiction by a method for producing a circuit arrangement having a predetermined electrical capacitance with the features of claim 1, a circuit arrangement having a predetermined electrical capacitance with the features of claim 11 and an apparatus for producing a circuit arrangement having a predetermined electrical capacitance with the characteristics of
  • a circuit arrangement having a predetermined electrical capacitance comprises a substrate having at least one metallic, electrically conductive conductor strip.
  • At least one first conductor strip section is arranged on the substrate and at least one second conductor strip section is arranged at least in regions on the first conductor strip section, wherein an electrically insulating layer which forms a dielectric is arranged between the conductor strip sections.
  • the conductor strip has a width of 100 ⁇ to 1000 ⁇ and a thickness of 5 ⁇ to 40 ⁇ , preferably a thickness of 10 ⁇ to 40 ⁇ and the
  • Conductor strip sections are targeted and defined partially or almost completely superimposed and connected to each other materially.
  • the conductor strip sections may be part of a conductor strip or of a plurality of conductor strips, wherein two or more conductor strip sections may be arranged partially or completely one above the other.
  • the circuit arrangement can have a plurality of these conductor strip sections arranged one above the other next to one another.
  • circuits with resonant circuit coils can be produced, wherein an inductance of the coil can be reduced by increasing the electrical capacitance. This allows for smaller coil areas, a better one
  • the coil Due to the shorter conductor strip length due to the smaller turns, the coil has a lower internal resistance, resulting in a better coil quality results.
  • circuit arrangements with coils with a resonance frequency of 13.56 MHz for so-called dual interface cards can be produced simply and inexpensively. These dual interface cards enable data transmission via direct contact as well as via radio transmission. Furthermore, it is also possible, for example, to produce circuit arrangements with low-frequency coils.
  • the substrate is for example paper, synthetic paper, thermoplastic film or wood.
  • the substrate may have a flat planar surface or a spherical surface.
  • the substrate may also be metal, for example an already laid conductor strip.
  • the substrate may for example also be a printed circuit board or a conductor foil, for example with printed, etched, laser cut or milled conductor tracks or conductor surfaces, which may form the lower conductor strip arranged directly on the substrate, on which further conductor strip sections are arranged at least in regions.
  • These printed circuit boards or printed circuit foils can for example also have an insulating or adhesive coating.
  • the substrate may also be formed from textile materials.
  • a material of the conductor band is preferably copper or copper bronze, preferably in a soft material state, and may, for example, a
  • the electrically insulating layer is formed in an advantageous embodiment of a fusible enamel or adhesive, wherein the adhesive is thermoplastic, thermally reactive, UV-reactive and / or pressure-reactive.
  • the electrically insulating layer is formed from a core lacquer and a meltable baked enamel thereon, wherein a softening temperature of the core lacquer is significantly higher than a softening temperature of the baked enamel, or the electrically insulating layer is made of a core lacquer disposed on a surface of the conductor strip and an adhesive disposed thereon, wherein the adhesive is thermoplastic, thermally reactive, UV-reactive and / or pressure-reactive.
  • the baked enamel and / or the thermoplastic adhesive preferably has a softening temperature of 110 ° C. to 200 ° C.
  • the conductor strip sections are connected to one another in a material-locking manner and to the substrate.
  • a thickness of the enamel and / or the adhesive is preferably between 1 ⁇ and 5 ⁇ .
  • a thickness of the core lacquer, which does not soften when laying the conductor strip sections for the purpose of forming the electrical capacitance, is preferably between 2 ⁇ m and 4 ⁇ m.
  • the conductor strip sections are arranged elevated on the substrate, for example by removing a substrate material next to the conductor strip sections. In this way, for example, a circuit arrangement with a compact free-carrying coil can be produced.
  • the conductor strip sections form a coil with at least two turns or with a plurality of turns.
  • individual or all turns of the coil can be arranged only partially, almost completely or completely one above the other and fixed to each other.
  • a resonant circuit with the predetermined electrical capacitance, a predetermined inductance and a by the mutually insulated and stacked conductor strip portions of the coil
  • Conductor strip portion is at least partially laid on the first conductor strip portion, wherein between the conductor strip portions an electrically insulating layer is arranged, which forms a dielectric.
  • conductor strip is laid, which has a width of 100 ⁇ to 1000 ⁇ and a thickness of 5 ⁇ to 40 ⁇ , preferably a thickness of 10 ⁇ to 40 ⁇ , wherein the conductor strip sections targeted and defined partially or almost completely superimposed and bonded together become.
  • the conductor strip portions may be part of a conductor strip or a plurality of conductor strips, wherein two or more conductor strip portions partially or completely can be arranged one above the other.
  • a circuit arrangement with a plurality of these stacked conductor strip sections can be produced side by side.
  • the conductor strip sections may, for example, intersect at different angles.
  • circuit arrangements with a coil or with a plurality of coils can be produced, which at least two windings or a
  • electrical capacitors are produced in a simple and cost-effective manner by a specific and defined superimposition of conductor strip, partially or almost completely, which on the one hand strongly change coil conductors as parasitic capacitors and on the other hand serve as coupling capacitors in a more complex circuit, for example, whereby circuit components are capacitively coupled become.
  • Characteristic impedance can be produced.
  • circuit arrangements are produced with resonant circuit coils, wherein an inductance of the coil can be reduced by increasing the electrical capacitance. This allows for smaller coil areas, better layout design of the circuitry and fewer turns of the coil. This results in higher productivity.
  • circuit arrangements with coils having a resonant frequency of 13.56 MHz for so-called dual interface cards are produced simply and inexpensively. These dual interface cards allow data transfer via a direct contact as well as via a radio transmission. Furthermore, for example, circuits with low frequency coils are produced.
  • the substrate used in the method is, for example, paper, synthetic paper, thermoplastic film, or wood having a flat flat surface or a spherical surface.
  • the substrate may also be metal, for example an already laid conductor strip.
  • the substrate can also be, for example, a printed circuit board or a printed circuit foil, for example with printed, etched, laser cut or milled conductor tracks or conductor surfaces, which form the lower conductor strip, which is laid first and directly on the substrate and on which further conductor strip sections are laid at least in regions.
  • These printed circuit boards or printed circuit foils can for example also have an insulating or adhesive coating.
  • the substrate may also be formed from textile materials.
  • ladder tape is particularly well suited for laying, which is preferably made of copper or copper bronze with a soft material state.
  • the conductor strip used can, if necessary, for example, have a coating of silver or solder.
  • the electrically insulating layer is expediently applied on at least one surface side of at least one conductor strip section and / or on a region of the substrate to be covered with the second conductor strip section prior to laying the conductor strip.
  • a fusible enamel or an adhesive is applied to a surface of the conductor strip, wherein the adhesive is thermoplastic, thermally reactive, UV-reactive and / or pressure-reactive.
  • the electrically insulating layer is formed by applying a core varnish and a meltable baked enamel on a surface of the conductor strip, wherein a softening temperature of the core varnish is significantly higher than a softening temperature of the baked enamel, or the electrically insulating layer by applying a core varnish and an adhesive is formed on a surface of the conductor strip, wherein the adhesive is thermoplastic, thermally reactive, UV-reactive and / or pressure-reactive. If core lacquer and / or enamel is used, this is preferably not applied to this immediately before laying the conductor strip. Even if adhesive is used as the insulating layer, it does not have to be applied to it just before the conductor strip is laid. Especially when using
  • UV-reactive and / or pressure-sensitive adhesive this is not absolutely necessary, since this is only excited by UV irradiation or by applying pressure reaction.
  • Thermoplastic and / or thermally reactive adhesive may need to be cooled until the conductor tape is laid, d. H.
  • the ladder belt must be stored refrigerated until use.
  • the adhesive can also be used in conjunction with the non-meltable or only at very high temperatures core paint, d. H. it is the core lacquer applied to the conductor strip and used instead of the enamel of the adhesive.
  • the adhesive can also be applied to it only immediately prior to the laying of the conductor strip, advantageously in liquid form.
  • an order of the adhesive on the conductor strip is controllable depending on the respective requirements, so that the adhesive can be applied in a different thickness and not on the entire conductor strip, but only partially applied, thereby material and cost savings feasible and a thickness of the insulating layer, which forms the dielectric, can be optimally adapted to the respective requirements in order to achieve the predetermined electrical capacitance.
  • the electrically insulating layer is immediately prior to laying and / or during the laying of the second conductor strip portion on the first
  • Conductor band section heated by thermal energy, ultrasound, UV irradiation and / or pressure, at least partially melted and / or reaction excited.
  • the conductor strip sections are firmly bonded to one another and / or to the substrate.
  • the baked enamel or the adhesive is inactive, so that the conductor strip transported, for example, rolled up before laying and can be unrolled during installation of a conductor strip coil, without being glued.
  • the second conductor strip portion is pressed with a predetermined force on the first conductor strip portion, in order in this way a thickness of between Adjust this arranged insulating layer and firmly connect the conductor strip sections together.
  • the predetermined electrical capacitance is adjustable.
  • a routed conductor strip area is cooled immediately after laying.
  • the conductor strip sections are immediately firmly connected to each other immediately after laying, so that the conductor strip can be laid very quickly and in a variety of patterns on the substrate without slipping the already laid ladder sections again.
  • the conductor strip can be laid very accurately, whereby the predetermined electrical capacitance of the circuit arrangement very accurately, d. H. can be adjusted with very low tolerances.
  • the conductor strip is laid by means of a laying tool, wherein the laying tool is moved relative to the substrate and / or the substrate relative to the laying tool.
  • This allows a very fast and very precise laying of the conductor strip.
  • the laying of the conductor strip can be done in this way in the x-direction and y-direction on a two-dimensional substrate and on a three-dimensional, for example, curved or angled substrate in the z-direction of a Cartesian coordinate system.
  • the conductor strip by means of a
  • the ultrasound is preferably directed perpendicular to a surface of the substrate.
  • the conductor strip or the baked enamel or the adhesive can be heated and the conductor strip sections pressed against each other and to the substrate, so that the conductor strip sections are firmly bonded to each other and / or to the substrate, wherein the thickness of the insulating layer between the conductor strips can be adjusted according to the requirements to achieve the predetermined electrical capacity.
  • the conductor strip is heated and laid by means of a heated pressure roller as a laying tool, so that also by means of
  • the conductor strip is preferably guided along the latter at least over half the circumference of the pressure roller before laying.
  • a substrate material in the region of the conductor strip is at least partially removed after the laying of the conductor strip, thereby to produce, for example, a compact, freely supporting coil on the substrate.
  • the conductor strip sections are laid one above the other such that they form a coil with at least two turns, wherein a resonant circuit with the predetermined electrical capacitance, a predetermined inductance and a predetermined resonant frequency is formed by the mutually insulated and stacked conductor strip portions of the coil.
  • the electrical capacitance is determined during the laying and / or after the laying, so that the predetermined electrical capacity is reliably achieved and at a finished
  • Circuit arrangement can be ensured. Particularly advantageous is the electrical capacity during installation constantly monitored.
  • laying parameters are predetermined before laying as a function of the predetermined electrical capacitance to be achieved and / or controlled and / or regulated during laying as a function of the predetermined electrical capacitance to be achieved.
  • laying parameters are preferably a laying direction, a laying speed, a length of the laid ladder tape, a period and / or intensity of UV irradiation, a period of time and / or a height of a heating temperature of the heating by means of thermal energy and / or by means of ultrasound and / or a duration and / or a level of pressure predetermined, controlled and / or regulated.
  • the laying of the conductor strip sections is adaptable such that the predetermined electrical capacitance of the circuit arrangement is achieved.
  • the laying of the conductor strip sections can be adapted immediately and completed at the given predetermined electrical capacity.
  • the conductor strip is laid in such a way that the predetermined capacity is undershot within a predetermined tolerance range and then by heating by means of thermal energy and / or ultrasound and pressure on at least one of the areas in which at least two conductor strip sections are laid one above the other, a thickness of the electrically insulating layer between the conductor strip sections by at least partially melting and pressing out of the enamel or the adhesive between the conductor strip sections reduced so far that the predetermined capacity is reached.
  • the predetermined electrical capacity can be produced very accurately or with only very small tolerances.
  • Extension of this area is increased by broadening the conductor strip sections so far that the predetermined capacity is reached.
  • the conductor strip is laid in such a way that the predetermined electrical capacitance is exceeded within a predetermined tolerance range and that a plurality of conductor strip sections arranged one above the other are formed next to one another on the substrate and then by cutting the conductor strip a predetermined number of superimposed
  • a device for producing a circuit arrangement having a predetermined electrical capacitance comprises a laying tool, a conductor strip coil and substrate positioning means, wherein at least one first conductor strip section can be laid on the substrate and at least one second conductor strip section can be laid on the first conductor strip section at least in regions such that a conductor strip section can be laid between the conductor strip sections electrically insulating layer is arranged, which forms a dielectric.
  • a metallic, electrically conductive conductor strip can be laid which has a width of 100 ⁇ m to 1000 ⁇ m and a thickness of 5 ⁇ m to 40 ⁇ m, preferably a thickness of 10 ⁇ m to 40 ⁇ m, wherein the conductor strip sections are specifically and partially or almost completely stacked can be connected to one another in a cohesive and cohesive manner, and the laying tool is movable relative to the substrate and / or the substrate relative to the laying tool by means of the substrate positioning means, wherein the laying tool is always aligned perpendicular to a respective substrate portion to be occupied with conductor strip.
  • this laying tool can be produced in a simple and cost-effective manner very quickly and accurately the circuit arrangement with the predetermined electrical capacity, as by means of the device conductor strip sections are superimposed, wherein between these conductor strip sections an electrically insulating layer is arranged.
  • capacitors with the conductor strip sections as capacitor electrode surfaces and the insulating layer as a dielectric can be produced, wherein the dielectric has a predetermined thickness.
  • the laying tool is movable relative to the substrate and / or the substrate by means of the substrate positioning means relative to the laying tool, a very fast and very accurate laying of the conductor strip is made possible.
  • the conductor strip can be laid in this way in the x-direction and y-direction on a two-dimensional substrate and on a three-dimensional, for example, curved or angled substrate in the z-direction of a Cartesian coordinate system, the laying tool always perpendicular to a respective conductor strip to be occupied Substrate portion is aligned.
  • the conductor strip twisting sok the feed tool of the device for producing the circuit arrangement can be fed.
  • the laying tool is cylindrical or conical in shape and has at least over part of its length an inner bore guiding the conductor band and an annular effective surface, which merges into inner and outer radii and is perpendicular to its longitudinal axis.
  • the laying tool comprises an ultrasonic sonotrode and a converter.
  • the ultrasound is preferably directed perpendicular to a surface of the substrate.
  • this laying tool is the conductor strip or a baked enamel or an adhesive, which arranged the electrically insulating layer between one another
  • Conductor strip sections forms can be heated and the conductor strip portions pressed against each other and to the substrate, so that the conductor strip portions are cohesively fixed to each other and / or attached to the substrate, wherein a thickness of the insulating layer between the conductor strip portions is adjustable according to the requirements to the predetermined electric capacity to reach.
  • the conductor belt bobbin is preferably mounted rotatably about a horizontal axis of rotation rotatably mounted in a coil receiving, which is rotatably mounted about a vertical axis of rotation, wherein the coil recording by means of a tracking device during changes in direction during installation of the conductor strip on the substrate is nachcard such that the conductor strip tangentially from the conductor belt coil can be unwound.
  • the laying tool is a pressure roller.
  • This pressure roller is preferably heatable to heat the baked enamel or the adhesive to press the conductor strip portions together and / or to the substrate.
  • the conductor strip sections are coherently secured to one another and / or can be connected to the substrate, wherein a thickness of the insulating layer between the conductor strips can be adjusted in accordance with the requirements in order to achieve the predetermined electrical capacitance.
  • the pressure roller has a guide groove for guiding the conductor strip whose depth is at most as large as a thickness of the conductor strip and which at least as wide is like a width of ladder tape.
  • a guide groove for guiding the conductor strip whose depth is at most as large as a thickness of the conductor strip and which at least as wide is like a width of ladder tape.
  • the conductor strip coil is movable together with the laying tool to ensure a twist-free feeding of the conductor strip and a twist-free laying.
  • Laderband entrysvornchtung arranged, which advantageously comprises a spring-mounted and / or horizontally movable deflection roller.
  • the conductor strip is preferably deflectable in such a way that it can be guided along it at least over half the circumference of the pressure roller before laying. If the pulley is not spring-mounted, but horizontally movable, so before the laying of the conductor strip a degree of wrap of the pressure roller is adjustable. As a result, optimum heating of the conductor strip or the baked enamel or the adhesive can be ensured.
  • the Leiterband In a further preferred embodiment, the Hughesband Equipment Settung above and below the spring-mounted pulley per a vertically fixed pulley, wherein the spring-mounted pulley is deflected by a spring force maximally from a vertical axis of the two fixed pulleys.
  • the conductor strip is optimally fed to the laying tool, free of twisting and in particular prestressed, so that it can be laid cleanly and bears firmly against the laying tool.
  • the device comprises means for applying an adhesive to the conductor strip prior to laying.
  • the adhesive in the particular required thickness, distribution and quality is only one side and thickness-controlled applied immediately before laying on the conductor strip.
  • the conductor strip without adhesive, if necessary, but already provided with a core lacquer layer easy to store and, for example, unrolled from a conductor belt reel. An adhesion of the conductor strip before laying is thus excluded.
  • the device comprises a UV irradiation device for UV irradiation of the conductor strip immediately before laying. In this way, conductor strip can be processed, which is coated with a UV-reactive adhesive, which is responsive only by UV irradiation immediately prior to laying the conductor strip. For a UV-reactive adhesive coated on both sides
  • the UV irradiation device is preferably aligned or controllable so that only the UV-reactive adhesive is responsive to reaction on a future underside of the conductor strip.
  • the UV-reactive adhesive is already clearly applied before laying the conductor strip on this, without the conductor strip, for example, rolled up on a conductor tape coil, glued.
  • Thermoplastic and / or thermally reactive adhesive may need to be cooled until the conductor tape is laid, d. H.
  • the ladder belt must be stored refrigerated until use.
  • the glue can also be used in
  • the device comprises a cooling device for supplying cooling air to the laid conductor strip.
  • a cooling device for supplying cooling air to the laid conductor strip.
  • the conductor strip can be cooled immediately after laying.
  • the conductor strip portions are immediately firmly bonded together immediately after laying, so that the conductor strip can be laid very quickly and in a variety of patterns on the substrate without the already laid
  • the conductor strip can be laid very precisely, as a result of which the predetermined electrical capacitance of the circuit arrangement is very exact, ie. H. adjustable with very small tolerances.
  • 1a shows a first embodiment of enamel-insulated conductor strip in cross section
  • FIG. 1b shows a second embodiment of enamel-insulated conductor strip in FIG.
  • 3a shows a second embodiment of a laid ladder tape in plan view
  • FIG. 3b shows a sectional view along the section line IIIb-IIIb from FIG. 3a
  • FIG. 3c shows a detail view of FIG. 3b
  • FIG. 4 shows a third embodiment of a laid conductor strip in cross section
  • 5a shows a fourth embodiment of a laid ladder tape in plan view
  • 5b shows a fifth embodiment of a laid ladder tape in plan view
  • FIG. 6 shows two laid conductor strips in plan view
  • FIG. 7a shows a sixth embodiment of a laid ladder tape in plan view
  • FIG. 7b shows a sectional view along the section line VIIb-VIIb from FIG. 7a
  • FIG. 8b shows a sectional view along the section line VHIb-VIIIb from FIG. 8a, FIG.
  • FIG. 8c shows a detail view of FIG. 8b
  • FIG. 9 shows a circuit arrangement in plan view
  • FIG. 10 a shows a first device for producing a circuit arrangement in a first side view
  • FIG. 10b shows a first device for producing a circuit arrangement in a second side view
  • FIG. 11 shows a second embodiment of a device for producing a
  • FIG. 12 shows a third embodiment of a device for producing a
  • Figure 13 is a sectional view of a pressure roller.
  • circuit arrangement 1 shown, for example, in FIG. 2 with a predetermined electrical capacitance
  • a method and a device 2 shown for example in Figure 10a for their preparation explained in more detail.
  • the circuit arrangement 1 comprises at least one metallic electrically conductive conductor strip L, which is shown in cross section in FIGS. 1a and 1b and is arranged on a substrate S shown in FIG.
  • the conductor strip L in FIG. 1 a is coated on all sides with a core lacquer KL having a thickness of 2 ⁇ m and then coated with a baked enamel B of thickness 2 ⁇ m.
  • a baked enamel B instead of the baked enamel B, as shown in Figure lb, also a
  • Coating with an adhesive K possible, for example with a thermoplastic, thermally reactive, UV-reactive and / or pressure-sensitive adhesive K.
  • the conductor strip L in Figure lb is only coated on one side, in the example shown here with the core varnish KL the thickness of 2 ⁇ and on this with the adhesive K.
  • the adhesive K is also a coating with baked enamel B possible d. H. on the
  • Kernlack KL is the baked enamel B arranged.
  • the ladder L in both figures is made of copper.
  • the layer of core varnish KL is formed for example from polyurethane
  • the layer of baked enamel B is formed for example from polyvinyl butyral.
  • FIG. 2 shows a top view of a conductor strip L laid on a substrate S, which forms a nearly rectangular coil with two windings.
  • the conductor strip L is expediently laid in such a way that radii of curves formed by the conductor strip L are greater than a five-fold of a conductor strip width in order to be able to lay and fasten the conductor strip L properly on the substrate S without damaging it.
  • On a rectangular side are the coil turns, ie a first
  • a first coil outlet Sl intersects a coil turn and a second coil outlet S2 at right angles, the upper, second conductor strip sections LA2 likewise each resting on the lower first conductor strip sections LA1.
  • Conductor strip sections LA2 are each fully connected by material connection and fixed to the lower first conductor strip sections LAl. In areas where the
  • Conductor strip sections LAl, LA2 are superimposed, d. H.
  • a laying speed was reduced in the process for producing the circuit arrangement 1 with a predetermined capacity, for example as a laying parameter, in order to be able to connect the conductor strip sections LA1, LA2 to one another.
  • connection of the conductor strip sections LA1, LA2 takes place in the method by at least partial melting of the baked enamel B or of the adhesive K on the conductor strips L and compressing the conductor strips L under the action of force.
  • a UV-reactive adhesive K melting and / or curing of the adhesive K can be supported by a UV irradiation immediately before and / or during the conductor band laying.
  • Figures 3a and 3b show in a plan view and in cross section along the
  • Section line Illa-IIIa a circuit arrangement 1 with a formed by laid conductor strip L rectangular coil in which in the process for producing the circuit arrangement 1, the conductor strip L was laid exactly over each other in four turns, so that four superimposed conductor strip sections LAL, LA2, LA3 , LA4 result. This results in a compact coil.
  • FIG. 3c shows a detailed view of this.
  • the substrate S which is water-soluble in this embodiment, was removed after laying the conductor strip L, so that a cantilevered coil having a high parasitic electrical capacitance and a low electrical resistance was produced.
  • the conductor strip L has in the example shown here a thickness of 20 ⁇ and a Width of 500 ⁇ .
  • the core paint KL has on all sides a thickness of 2 ⁇ and the
  • Circuit arrangement 1 results, wherein the formed coil, for example, forms an antenna.
  • the advantage here is that when a lamination of the circuit arrangement 1 in thermoplastic film, the coil is better pressed into the film and the
  • Coil outlets Sl, S2 are not pressed over a high level. This is one
  • FIGS. 5a and 5b show in plan view a possibility of capacitance correction of the circuit arrangement 1 during the method for the production thereof, in order to achieve the predetermined electrical capacitance or to precisely set parameters of a resonant circuit formed by the coil and the predetermined electrical capacitance.
  • a circuit pattern formed in the manufacture of the circuit arrangement 1 by laying the conductor strip L can be changed by changing a crossing angle of the intersecting
  • Circuit 1 to determine an exact crossing angle.
  • Figure 5b by the oblique crossing angle a surface coverage of the
  • Conductor strip sections LAL, LA2 are formed, resulting in the circuit arrangement 1 shown in Figure 5b, a higher electrical capacitance.
  • Figure 6 a possibility of a capacitive coupling of two circuit steep parts of a circuit arrangement 1 is shown in a plan view. If the circuit parts laid with different conductor strip widths, it is advantageous, first the wider
  • Ladder sections LAl, LA2 produce.
  • the lower wide conductor band Lb, d. H. the first conductor strip sections LA1 can also be part of a printed, etched, laser-cut or milled printed circuit board or conductor foil as a conductor track. On these circuit boards or conductor foils, conductor strips Lb can be laid as a supplement to one or two-layer printed circuit boards.
  • FIGS. 7a and 7b show in plan view and in cross section along the section line VIIb-VIIb a possibility of the capacitance of conductor strip sections LA1, LA2 arranged one above another by deformation D of the conductor strip sections LA1, LA2, d. H. to increase by swaging certain areas or section lengths.
  • a circuit arrangement 1 with a predetermined capacitance and with very small tolerances are to be produced and influencing factors have very large tolerances, for example a thickness of the dielectrically forming electrically insulating layer iS between the conductor strip sections LA1, LA2, a width tolerance of the conductor strip sections LA1, LA2 or tolerances in the laying parameters, for example, a period of time and / or an intensity of UV irradiation of the UV-reactive adhesive K during laying, a period of time and / or a height of a heating temperature of heating the adhesive K or the baked enamel B by means of thermal energy and / or by means of ultrasound during laying and / or a time duration and / or a level of pressure with which the conductor strip sections LA1, LA2 are pressed against each other, so that the predetermined electrical capacitance of the circuit arrangement 1 can not be reliably achieved, then the conductor strip L becomes so v imposes that the capacity value is initially too low.
  • Capacitance value and the preset capacitance to be achieved as many conductor strip sections LA1, LA2, for example, deformed by means of an unheated plunger, not shown, that the predetermined electrical capacity is reached.
  • a required compressive load is, for example, previously determined in experiments.
  • the capacitance value can be determined again so that the predetermined electrical capacitance can be approximated stepwise.
  • the width of the conductor strip sections LA1, LA2 is increased with plastic deformation of the conductor strip L and the electrically insulating layer IS, so that the capacitor areas increase.
  • a thickness of the dielectric-forming electrically insulating layer IS is in this case only slightly reduced.
  • the deformation D is preferably carried out at room temperatures.
  • the pressure stamp is preferably provided with a very flat engraving, for example with a corrugation extending transversely to a laying direction of the conductor strip L.
  • FIGS. 8a to 8c a similar circuit arrangement 1 as in FIG. 7 is shown in plan view or in cross section and in a detailed view. Again, one will
  • Capacity correction after laying the ladder line L shown is done by reducing the thickness of the dielectric-forming electrically insulating layer iS between the conductor strip sections LA1, LA2 arranged on top of each other.
  • two conductor strip sections LA1, LA2 are pressed together under heating by thermal energy and / or ultrasound and pressing out of baked enamel B under pressure, so that the enamel layer between the conductor strip sections LA1, LA2 is reduced to 2 ⁇ m per conductor strip section LA1, LA2.
  • FIG. 1 Another possibility for capacitance correction of the circuit arrangement 1 is shown in FIG.
  • a threaded coil is shown, the extended outlets form a number of intersections with the laid circuit and thereby create additional partial capacities TK.
  • These partial capacities TK can be selectively separated from the circuit arrangement 1 by dicing, for example by means of punching, laser cutting or micro sandblasting, whereby the capacitance value of the circuit arrangement 1 is reduced.
  • the conductor strip L is laid so that initially sets a capacitance value which is higher than the predetermined electrical capacitance. After laying and a capacitance measurement of the circuit 1 is determined from the difference between the measured capacitance value and the predetermined electrical capacitance, a separation point T, at which the conductor strip L is to be cut to separate partial capacitances TK and to reach the predetermined electrical capacity.
  • the partial capacitances TK can be separated stepwise, for example, and then the respective capacitance value of the circuit arrangement 1 can be compared, so as to adjust stepwise the predetermined electrical capacitance of the circuit arrangement 1.
  • a resonance frequency which results from a module capacity of a module 3 integrated in the circuit arrangement 1, for example a semiconductor chip, from the parasitic capacitance of the coil and from a coil inductance, can be set very precisely.
  • the coil formed by laying the conductor strip L is in the example shown on a substrate S made of plastic, such as polyvinyl chloride, laid.
  • the module 3 is a semiconductor chip whose terminals are welded to the conductor strip L, for example by thermocompression welding.
  • Essential for the laying of conductor strips L is that the conductor strip L is supplied without twisting a laying tool 4 of the device 2 for producing the circuit arrangement 1.
  • This is given by a suspension shown in FIGS. 10a and 10b, device 5 for a conductor belt bobbin 6, in which a bobbin receptacle 7, which horizontally receives the conductor belt bobbin 6, is rotatably mounted about a vertical axis.
  • a tracking device not shown, the coil holder 7 and thus the conductor belt coil 6 is rotated in a horizontal, that corresponding to the
  • FIGS. 10a and 10b show two situations with different directions of movement. Especially when laying coil-like or concentric Circuit patterns is a tracking of the coil receptacle 7 and the conductor strip coil 6 urgently required to move the conductor strip L twisting sok. Only schematically indicated are substrate positioning 8.
  • the conductor strip L can be laid on the substrate S by the laying tool 4 relative to the substrate S and / or the substrate S by means of the substrate positioning means 8 is movable relative to the laying tool 4.
  • the illustrated laying tool 4 is cylindrical or conically shaped and has at least over part of its length a conductor strip L leading inner bore 9 and an annular, merging in inner and outer radius, perpendicular to its longitudinal axis arranged effective surface 10.
  • the conductor strip L can be passed through the laying tool 4 in a manner free of twisting and can be laid and fastened optimally to the substrate S or to already laid conductor strip L.
  • the laying tool 4 comprises an ultrasonic sonotrode and a
  • the ultrasound is preferably directed perpendicular to a surface of the substrate S.
  • the laying tool 4 is always aligned perpendicular to a respective conductor strip L to be occupied substrate portion.
  • the conductor strip L or the baked enamel B or the adhesive K which forms the electrically insulating layer iS between stacked conductor strip sections LA1, LA2, can be heated, and the conductor strip sections LA1, LA2 can be pressed against one another and against the substrate S, so that the conductor strip sections LA1, LA2 can be firmly fastened to one another and / or to the substrate S, wherein a thickness of the insulating layer IS between the conductor strip sections LA1, LA2 can be adjusted according to the requirements in order to achieve the predetermined electrical capacitance.
  • FIG. 11 shows a further embodiment of the device 2 for producing the circuit arrangement 1, which comprises a conductor strip guiding device 11.
  • the ladder belt guide device 11 is formed from two mutually in Porterbandablaufraum fixed pulleys 12 and a deflectable via a spring support 13 horizontally to a maximum and adjustable position, on the
  • an embossing device not shown in detail may be arranged, which already in the not yet
  • FIG. 12 shows a schematic side view of a further embodiment of the invention
  • the conductor strip L which is still uncoated, can be unrolled during the laying of the conductor strip coil 6.
  • the device 2 shown here comprises means 15 for applying the adhesive K to the conductor strip L before laying.
  • the conductor strip L for example, with a liquid reactive adhesive K coated on one side.
  • the adhesive K can be applied, for example, from a light-tight cooled cartridge via a gap, via micro-nozzles or via an application roller to the conductive strip L guided past.
  • the conductor strip L for example, already coated with the adhesive K and stored, for example, deep-frozen until laying.
  • the conductor strip L is coated with the adhesive K, on which a non-stick coating is arranged. When the conductor strip L is being unwound, this non-stick coating can be removed from the conductor strip coil 6 by the adhesive K.
  • the conductor strip L is guided over the spring-mounted and / or horizontally movable deflection roller 14. If the guide roller 14 is not spring-mounted, but horizontally movable, so before the laying of the conductor strip L is an extent of wrap a subsequent heated pressure roller adjustable, which represents the laying tool 4 in this embodiment. As a result, depending on an adhesive type and the laying speed, optimum heating of the conductor strip L or of the baking lacquer B or of the adhesive K to initiate an adhesive reaction is always ensured.
  • UV irradiation device 16 for UV irradiation of the conductor strip L immediately before laying include to accelerate a setting reaction of the adhesive K.
  • the device 2 further comprises a cooling device 17 for cooling air supply to the routed conductor strip L.
  • a cooling device 17 for cooling air supply to the routed conductor strip L.
  • the conductor strip L On the device 2 acts a force F perpendicular to the substrate S, so that the conductor strip L unwound in the process for the preparation of the circuit 1 of the conductor strip coil 6, optionally coated with adhesive K, guided along the trained as a pressure roller laying tool 4 and thereby heated optionally, wherein the adhesive K is optionally excited by UV irradiation. Thereafter, the conductor strip L by means of the laying tool 4, d. H. by means of the pressure roller, pressed by the force on the device 2 on the substrate S or on the already laid conductor strip L, wherein the adhesive K or the enamel B with the substrate S or the already laid conductor strip L materially connects. As a result, the conductor strip L is fixedly arranged on the substrate S or on the already laid conductor strip L.
  • the laying tool 4 designed as a pressure roller has on the circumference a guide groove 18 designed as a small groove-like depression for guiding the conductor strip L.
  • a depth of the guide groove 18 is preferably half the thickness of the not yet coated with adhesive K conductor strip L, for example, 20 ⁇ .
  • the guide groove 18 serves to guide the conductor strip L in radii of the circuit pattern, whereby the required conductor change L to be laid is forced to change direction.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention concerne un agencement de circuits (1) présentant une capacité électrique prédéterminée, comprenant un substrat (S) pourvu d'au moins un ruban métallique électriquement conducteur (L, Lb, Ls). Selon l'invention, au moins un premier segment de ruban conducteur (LA1) est disposé sur le substrat (S) et au moins un deuxième segment de ruban conducteur (LA2, LA3, LA4) est disposé au moins par endroits sur le premier segment de ruban conducteur (LA1). Une couche électriquement isolante est disposée entre les segments de ruban conducteur (LA1, LA2, LA3, LA4) pour former un diélectrique. L'invention concerne en outre un procédé et un appareil (2) pour la fabrication d'un agencement de circuits (1) présentant une capacité électrique prédéterminée.
EP10747863A 2009-09-11 2010-09-01 Agencement de circuits présentant une capacité électrique prédéterminée, ainsi que procédé et appareil pour sa fabrication Withdrawn EP2476298A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009041359A DE102009041359A1 (de) 2009-09-11 2009-09-11 Schaltungsanordnung mit einer vorgegebenen elektrischen Kapazität
PCT/EP2010/062785 WO2011029757A1 (fr) 2009-09-11 2010-09-01 Agencement de circuits présentant une capacité électrique prédéterminée, ainsi que procédé et appareil pour sa fabrication

Publications (1)

Publication Number Publication Date
EP2476298A1 true EP2476298A1 (fr) 2012-07-18

Family

ID=43088399

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10747863A Withdrawn EP2476298A1 (fr) 2009-09-11 2010-09-01 Agencement de circuits présentant une capacité électrique prédéterminée, ainsi que procédé et appareil pour sa fabrication

Country Status (6)

Country Link
US (1) US9000305B2 (fr)
EP (1) EP2476298A1 (fr)
JP (1) JP2013504799A (fr)
KR (1) KR20120075466A (fr)
DE (1) DE102009041359A1 (fr)
WO (1) WO2011029757A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9112263B2 (en) * 2010-02-25 2015-08-18 Stmicroelectronics S.R.L. Electronic communications device with antenna and electromagnetic shield
EP2525305A1 (fr) * 2011-05-17 2012-11-21 Gemalto SA Condensateur filaire notamment pour circuit radiofréquence et dispositif le comportant
EP2624670A1 (fr) * 2012-01-31 2013-08-07 Gemalto SA Condensateur filaire notamment pour circuit radiofréquence et dispositif le comportant
WO2012156392A1 (fr) * 2011-05-17 2012-11-22 Gemalto Sa Condensateur filaire notamment pour circuit radiofrequence et dispositif le comportant
WO2017169708A1 (fr) * 2016-03-28 2017-10-05 株式会社村田製作所 Antenne à bobine, dispositif d'alimentation électrique, dispositif de réception de puissance, et système d'alimentation électrique sans fil
CN109314312B (zh) * 2016-06-21 2022-07-08 3M创新有限公司 自支承天线
US11296398B2 (en) * 2016-10-06 2022-04-05 Avery Dennison Retail Information Services Llc Methods for creating RFID tags based on flexible antenna materials
CN219644174U (zh) * 2019-08-08 2023-09-05 株式会社村田制作所 多层基板

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19840220A1 (de) * 1998-09-03 2000-04-20 Fraunhofer Ges Forschung Transpondermodul und Verfahren zur Herstellung desselben
KR100713319B1 (ko) * 1999-05-07 2007-05-04 후루카와 덴키 고교 가부시키가이샤 배선 방법 및 배선 장치
JP2003085516A (ja) 2001-09-07 2003-03-20 Nec Tokin Corp 非接触通信媒体及びその製造方法
JP2003092218A (ja) * 2001-09-18 2003-03-28 Hitachi Cable Ltd 電気・電子機器用コイル及びその製造方法
JP2003304047A (ja) 2002-04-08 2003-10-24 Sumitomo Electric Ind Ltd 薄型配線体および配線形成方法
US20040231885A1 (en) * 2003-03-07 2004-11-25 Borland William J. Printed wiring boards having capacitors and methods of making thereof
DE10347035B4 (de) * 2003-10-09 2013-05-23 Giesecke & Devrient Gmbh Verfahren und Vorrichtung zum Erzeugen elektrisch leitender Strukturen auf einem Substrat für einen elektronischen Datenträger
ITMO20050017A1 (it) 2005-01-28 2006-07-29 Windinglab S R L Apparato e metodo per realizzare un antenna per un dispositivo di identificazione a radiofrequenza.
US20070109720A1 (en) * 2005-10-27 2007-05-17 Kyocera Corporation Dielectric paste, capacitor-embedded glass-ceramic multilayer substrate, electronic component and method of manufacturing capacitor-embedded glass-ceramic multilayer substrate
US20080179404A1 (en) * 2006-09-26 2008-07-31 Advanced Microelectronic And Automation Technology Ltd. Methods and apparatuses to produce inlays with transponders
DE102006053823B4 (de) * 2006-11-14 2009-02-05 Bundesdruckerei Gmbh Verfahren zum Verlegen eines Drahtes
DE102007027539A1 (de) * 2007-06-15 2008-12-18 Giesecke & Devrient Gmbh Transpondersystem
DE102009012255A1 (de) 2009-03-07 2010-09-09 Michalk, Manfred, Dr. Schaltungsanordnung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2011029757A1 *

Also Published As

Publication number Publication date
WO2011029757A1 (fr) 2011-03-17
DE102009041359A1 (de) 2011-03-24
JP2013504799A (ja) 2013-02-07
US9000305B2 (en) 2015-04-07
KR20120075466A (ko) 2012-07-06
US20120286902A1 (en) 2012-11-15

Similar Documents

Publication Publication Date Title
EP2476298A1 (fr) Agencement de circuits présentant une capacité électrique prédéterminée, ainsi que procédé et appareil pour sa fabrication
EP0880754B1 (fr) Procede et dispositif pour la connexion d'un conducteur electrique
DE69027854T2 (de) Resonanzaufkleber sowie Verfahren zur Herstellung
EP2226747B1 (fr) Procédé et dispositif de production d'un motif de câblage sur un substrat
DE19525933C2 (de) Verfahren und Vorrichtung zur Einbettung einer Spule in das Trägersubstrat einer IC-Karte
DE69812039T2 (de) Herstellungsverfahren für eine transponderspule
DE1765981C3 (de) Elektrisch leitfähiges Klebeband
CH648686A5 (de) Kondensator aus gewickelten metallisierten folien und verfahren zu dessen herstellung.
DE2532009A1 (de) Verfahren zur herstellung eines elektrischen bauteiles, bestehend aus mindestens zwei durch eine isolierschicht getrennte bauelemente
EP1173094B1 (fr) Procédé de fabrication d'une électrode neutre
DE202007013680U1 (de) Vorrichtung zur Herstellung einer Chipkarte
EP1352551B1 (fr) Procede et dispositif pour placer des fils conducteurs sur ou dans une couche de support
DE10035638A1 (de) Verfahren zum Herstellen eines elektrisch leitenden Musters auf einem Substrat
WO2006094989A1 (fr) Procede pour etablir une liaison electrique et mecanique entre des pastilles de puce et des pastilles d'antenne et transpondeur
DE102006037093B3 (de) Fügeverfahren und Vorrichtung zum Verlegen von dünnem Draht
DE102007037167A1 (de) Einlagige Flachspule auf Substrat
DE19916180C2 (de) Verfahren zur Herstellung von elektrisch isolierten Leiterkreuzungen
DE19920399C1 (de) Verfahren und Vorrichtung zur Herstellung von Leiterdrähten auf oder in einer elektrisch isolierenden Schicht
WO1998008191A1 (fr) Procede de fabrication d'une connexion electrique et mecanique d'un module de carte a puce place dans une cavite du porte-carte
DE102006053823B4 (de) Verfahren zum Verlegen eines Drahtes
WO2013056818A1 (fr) Mise en contact d'une antenne
WO1997042727A1 (fr) Procede de fabrication de structures composites a couches multiples avec des connexions electroconductrices
DE10109030C2 (de) Kontaktloser Transponder
WO2004006173A2 (fr) Procede pour etablir des connexions electroconductrices sur des cartes a puce
DE102007030650A1 (de) Verfahren und Vorrichtung zur Herstellung einer Chipkarte

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20120224

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

DAX Request for extension of the european patent (deleted)
17Q First examination report despatched

Effective date: 20130405

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20141216