EP2370348A4 - Fabrication of conductive nanostructures on a flexible substrate - Google Patents

Fabrication of conductive nanostructures on a flexible substrate

Info

Publication number
EP2370348A4
EP2370348A4 EP09836644.6A EP09836644A EP2370348A4 EP 2370348 A4 EP2370348 A4 EP 2370348A4 EP 09836644 A EP09836644 A EP 09836644A EP 2370348 A4 EP2370348 A4 EP 2370348A4
Authority
EP
European Patent Office
Prior art keywords
fabrication
flexible substrate
conductive nanostructures
nanostructures
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09836644.6A
Other languages
German (de)
French (fr)
Other versions
EP2370348A2 (en
Inventor
Ding Wang
Jerome C Porque
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of EP2370348A2 publication Critical patent/EP2370348A2/en
Publication of EP2370348A4 publication Critical patent/EP2370348A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00Electroforming
    • C25D1/006Nanostructures, e.g. using aluminium anodic oxidation templates [AAO]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82BNANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B3/00Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82BNANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B1/00Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00Nanooptics, e.g. quantum optics or photonic crystals
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00Electroforming
    • C25D1/0033D structures, e.g. superposed patterned layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • C25D5/028Electroplating of selected surface areas one side electroplating, e.g. substrate conveyed in a bath with inhibited background plating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B2207/00Coding scheme for general features or characteristics of optical elements and systems of subclass G02B, but not including elements and systems which would be classified in G02B6/00 and subgroups
    • G02B2207/101Nanooptics
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/30Polarising elements
    • G02B5/3025Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state
EP09836644.6A 2008-12-17 2009-12-02 Fabrication of conductive nanostructures on a flexible substrate Withdrawn EP2370348A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13827208P 2008-12-17 2008-12-17
PCT/US2009/066302 WO2010077529A2 (en) 2008-12-17 2009-12-02 Fabrication of conductive nanostructures on a flexible substrate

Publications (2)

Publication Number Publication Date
EP2370348A2 EP2370348A2 (en) 2011-10-05
EP2370348A4 true EP2370348A4 (en) 2016-12-21

Family

ID=42310474

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09836644.6A Withdrawn EP2370348A4 (en) 2008-12-17 2009-12-02 Fabrication of conductive nanostructures on a flexible substrate

Country Status (5)

Country Link
US (1) US20110240476A1 (en)
EP (1) EP2370348A4 (en)
KR (1) KR20110099039A (en)
CN (1) CN102300802A (en)
WO (1) WO2010077529A2 (en)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2823456T3 (en) * 2009-06-25 2021-05-07 Univ North Carolina Chapel Hill Method and System for Using Powered Surface Bonded Posts to Assess the Rheology of Biological Fluids
JP5735785B2 (en) * 2010-11-30 2015-06-17 豊田鉄工株式会社 Electronic component cooling device and method of manufacturing the same
US9227383B2 (en) * 2011-12-23 2016-01-05 Hong Kong Baptist University Highly flexible near-infrared metamaterials
JP5850574B2 (en) * 2012-09-20 2016-02-03 株式会社シンク・ラボラトリー Continuous pattern plating transfer system and method of manufacturing continuous pattern plating transfer
US9952149B2 (en) 2012-11-30 2018-04-24 The University Of North Carolina At Chapel Hill Methods, systems, and computer readable media for determining physical properties of a specimen in a portable point of care diagnostic device
US10040018B2 (en) 2013-01-09 2018-08-07 Imagine Tf, Llc Fluid filters and methods of use
EP2754524B1 (en) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Method of and apparatus for laser based processing of flat substrates being wafer or glass element using a laser beam line
EP2781296B1 (en) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Device and method for cutting out contours from flat substrates using a laser
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US10442719B2 (en) * 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9861920B1 (en) 2015-05-01 2018-01-09 Imagine Tf, Llc Three dimensional nanometer filters and methods of use
US10730047B2 (en) 2014-06-24 2020-08-04 Imagine Tf, Llc Micro-channel fluid filters and methods of use
US9815144B2 (en) 2014-07-08 2017-11-14 Corning Incorporated Methods and apparatuses for laser processing materials
CN107073642B (en) 2014-07-14 2020-07-28 康宁股份有限公司 System and method for processing transparent materials using laser beam focal lines with adjustable length and diameter
US10124275B2 (en) 2014-09-05 2018-11-13 Imagine Tf, Llc Microstructure separation filters
TWI561462B (en) * 2014-10-07 2016-12-11 Iner Aec Executive Yuan A method for forming dendritic silver with periodic structure as light-trapping layer
US10758849B2 (en) 2015-02-18 2020-09-01 Imagine Tf, Llc Three dimensional filter devices and apparatuses
HUE055461T2 (en) 2015-03-24 2021-11-29 Corning Inc Laser cutting and processing of display glass compositions
US10118842B2 (en) 2015-07-09 2018-11-06 Imagine Tf, Llc Deionizing fluid filter devices and methods of use
WO2017011296A1 (en) 2015-07-10 2017-01-19 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
US10479046B2 (en) 2015-08-19 2019-11-19 Imagine Tf, Llc Absorbent microstructure arrays and methods of use
US10900135B2 (en) * 2016-02-09 2021-01-26 Weinberg Medical Physics, Inc. Method and apparatus for manufacturing particles
KR102427513B1 (en) * 2016-09-16 2022-08-01 쓰리엠 이노베이티브 프로퍼티즈 캄파니 Method of making nanostructured cylindrical rolls
KR102078294B1 (en) 2016-09-30 2020-02-17 코닝 인코포레이티드 Apparatus and method for laser machining transparent workpieces using non-axisymmetric beam spots
KR102428350B1 (en) 2016-10-24 2022-08-02 코닝 인코포레이티드 Substrate processing station for laser-based machining of sheet-like glass substrates
EP3781398A2 (en) 2018-04-17 2021-02-24 3M Innovative Properties Company Conductive films

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1527216A2 (en) * 2002-06-28 2005-05-04 Infineon Technologies AG Method for producing galvanically deposited antennae for rfid labels using an adhesive that is selectively applied
WO2008081904A1 (en) * 2006-12-27 2008-07-10 Hitachi Chemical Co., Ltd. Engraved plate and base material having conductor layer pattern using the engraved plate

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1003078A3 (en) * 1998-11-17 2001-11-07 Corning Incorporated Replicating a nanoscale pattern
US6422528B1 (en) * 2001-01-17 2002-07-23 Sandia National Laboratories Sacrificial plastic mold with electroplatable base
JP2004193497A (en) * 2002-12-13 2004-07-08 Nec Electronics Corp Chip-size package and manufacturing method thereof
US9040090B2 (en) * 2003-12-19 2015-05-26 The University Of North Carolina At Chapel Hill Isolated and fixed micro and nano structures and methods thereof
KR100631017B1 (en) * 2004-04-30 2006-10-04 엘지.필립스 엘시디 주식회사 A method for forming pattern using printing method
KR100606441B1 (en) * 2004-04-30 2006-08-01 엘지.필립스 엘시디 주식회사 Method for fabricating cliche and method for forming pattern using the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1527216A2 (en) * 2002-06-28 2005-05-04 Infineon Technologies AG Method for producing galvanically deposited antennae for rfid labels using an adhesive that is selectively applied
WO2008081904A1 (en) * 2006-12-27 2008-07-10 Hitachi Chemical Co., Ltd. Engraved plate and base material having conductor layer pattern using the engraved plate
US20100021695A1 (en) * 2006-12-27 2010-01-28 Susumu Naoyuki Engraved plate and substrate with conductor layer pattern using the same

Also Published As

Publication number Publication date
US20110240476A1 (en) 2011-10-06
WO2010077529A3 (en) 2010-08-26
EP2370348A2 (en) 2011-10-05
KR20110099039A (en) 2011-09-05
CN102300802A (en) 2011-12-28
WO2010077529A2 (en) 2010-07-08

Similar Documents

Publication Publication Date Title
EP2370348A4 (en) Fabrication of conductive nanostructures on a flexible substrate
EP2130672A4 (en) Flexible substrate
EP2257969A4 (en) Methods of patterning a conductor on a substrate
EP2234217A4 (en) Waterproof connector for flexible substrate
PL2424948T3 (en) Releasable adhesive having a multilayer substrate
EP2366270A4 (en) Method of preparing a flexible substrate assembly and flexible substrate assembly therefrom
EP2176407A4 (en) Method of patterning a substrate
HK1179198A1 (en) Transport of an object over a surface
EP2258022A4 (en) Substrate integrated waveguide
EP2250674A4 (en) Semiconductor-based large-area flexible electronic devices
EP2162237A4 (en) Method of patterning a substrate
EP2368824A4 (en) Flexible substrate processing device
GB0722016D0 (en) A semiconductor layer structure
EP2231405A4 (en) Flexible substrate tensioner
GB0904803D0 (en) Coated substrate
EP2417623A4 (en) Techniques for processing a substrate
EP2139030A4 (en) Etching solution
EP2417622A4 (en) Techniques for processing a substrate
EP2417624A4 (en) Techniques for processing a substrate
GB0920986D0 (en) Substrate patterning
EP2381487A4 (en) Substrate for light-emitting element
GB0817834D0 (en) Low cost flexible substrate
EP2168763A4 (en) Resin substrate
TWI368303B (en) Packaging substrate structure
GB0713351D0 (en) Nanoparticulate fillers

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20110629

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20161117

RIC1 Information provided on ipc code assigned before grant

Ipc: C25D 5/02 20060101ALI20161111BHEP

Ipc: B82Y 20/00 20110101ALI20161111BHEP

Ipc: B82B 1/00 20060101ALI20161111BHEP

Ipc: B82B 3/00 20060101AFI20161111BHEP

Ipc: C25D 1/00 20060101ALI20161111BHEP

Ipc: G02B 5/30 20060101ALN20161111BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20170617