EP2356267A4 - Bäder, systeme und verfahren zur elektrotauchlackierung - Google Patents

Bäder, systeme und verfahren zur elektrotauchlackierung

Info

Publication number
EP2356267A4
EP2356267A4 EP09825108.5A EP09825108A EP2356267A4 EP 2356267 A4 EP2356267 A4 EP 2356267A4 EP 09825108 A EP09825108 A EP 09825108A EP 2356267 A4 EP2356267 A4 EP 2356267A4
Authority
EP
European Patent Office
Prior art keywords
systems
methods
electrodeposition baths
electrodeposition
baths
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09825108.5A
Other languages
English (en)
French (fr)
Other versions
EP2356267A1 (de
Inventor
Glenn Sklar
John Cahalen
Nazila Dadvand
Alan C Lund
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xtalic Corp
Original Assignee
Xtalic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/266,979 external-priority patent/US20100116675A1/en
Priority claimed from US12/267,010 external-priority patent/US7951600B2/en
Application filed by Xtalic Corp filed Critical Xtalic Corp
Publication of EP2356267A1 publication Critical patent/EP2356267A1/de
Publication of EP2356267A4 publication Critical patent/EP2356267A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/619—Amorphous layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/66—Electroplating: Baths therefor from melts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/416—Systems
    • G01N27/42—Measuring deposition or liberation of materials from an electrolyte; Coulometry, i.e. measuring coulomb-equivalent of material in an electrolyte
EP09825108.5A 2008-11-07 2009-11-04 Bäder, systeme und verfahren zur elektrotauchlackierung Withdrawn EP2356267A4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/266,979 US20100116675A1 (en) 2008-11-07 2008-11-07 Electrodeposition baths, systems and methods
US12/267,010 US7951600B2 (en) 2008-11-07 2008-11-07 Electrodeposition baths, systems and methods
PCT/US2009/005967 WO2010053540A1 (en) 2008-11-07 2009-11-04 Electrodeposition baths, systems and methods

Publications (2)

Publication Number Publication Date
EP2356267A1 EP2356267A1 (de) 2011-08-17
EP2356267A4 true EP2356267A4 (de) 2016-03-30

Family

ID=42153138

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09825108.5A Withdrawn EP2356267A4 (de) 2008-11-07 2009-11-04 Bäder, systeme und verfahren zur elektrotauchlackierung

Country Status (6)

Country Link
EP (1) EP2356267A4 (de)
JP (2) JP2012508322A (de)
KR (1) KR20110083707A (de)
CN (1) CN102272356A (de)
CA (1) CA2742934A1 (de)
WO (1) WO2010053540A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013040400A1 (en) * 2011-09-14 2013-03-21 Xtalic Corporation Coated articles, electrodeposition baths, and related systems
EP2639335B1 (de) * 2012-03-14 2015-09-16 Atotech Deutschland GmbH Alkalisches Plattierbad für stromlose Abscheidung von Kobaltlegierungen
EP2671969A1 (de) * 2012-06-04 2013-12-11 ATOTECH Deutschland GmbH Plattierbad zur stromlosen Abscheidung von Nickelschichten
KR101270770B1 (ko) * 2012-10-04 2013-06-03 와이엠티 주식회사 인쇄회로기판의 도금방법
JP2015209589A (ja) * 2014-04-30 2015-11-24 日本エレクトロプレイテイング・エンジニヤース株式会社 ニッケル−タングステン合金めっき液
CN105420775A (zh) * 2015-12-31 2016-03-23 上海应用技术学院 一种在碳钢基体上制备La-Ni-Mo-W/GO复合沉积层的方法
JP6687409B2 (ja) * 2016-02-09 2020-04-22 福田金属箔粉工業株式会社 高彩度処理銅箔及び該処理銅箔を用いた銅張積層板並びに該処理銅箔の製造方法
KR101931202B1 (ko) * 2017-04-04 2018-12-20 스카이다이아몬드 주식회사 초음파 진동자를 이용한 액상교반장치 및 그 방법
CN108728871B (zh) * 2018-06-26 2019-11-08 中南大学 一种采用氟碳表面活性剂制备纳米铜粉的方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5413874A (en) * 1994-06-02 1995-05-09 Baldwin Hardware Corporation Article having a decorative and protective multilayer coating simulating brass
US5525206A (en) * 1995-02-01 1996-06-11 Enthone-Omi, Inc. Brightening additive for tungsten alloy electroplate
US20060154084A1 (en) * 2005-01-10 2006-07-13 Massachusetts Institute Of Technology Production of metal glass in bulk form

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4002543A (en) * 1974-04-01 1977-01-11 Oxy Metal Industries Corporation Electrodeposition of bright nickel-iron deposits
US4699696A (en) * 1986-04-15 1987-10-13 Omi International Corporation Zinc-nickel alloy electrolyte and process
JPS648717A (en) * 1987-07-01 1989-01-12 Nec Corp Pseudo noise series code generating circuit
DE19637018A1 (de) * 1996-09-12 1998-03-19 Bayer Ag Verfahren zur Herstellung von starren und flexiblen Schaltungen
US6683446B1 (en) * 1998-12-22 2004-01-27 John Pope Electrode array for development and testing of materials
JP2004325441A (ja) * 2003-04-25 2004-11-18 Rohm & Haas Electronic Materials Llc 分析方法
US20050173255A1 (en) * 2004-02-05 2005-08-11 George Bokisa Electroplated quaternary alloys
CN100585399C (zh) * 2006-01-23 2010-01-27 浙江大学宁波理工学院 一种测定光亮镀镍镀液中多种光亮剂的方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5413874A (en) * 1994-06-02 1995-05-09 Baldwin Hardware Corporation Article having a decorative and protective multilayer coating simulating brass
US5525206A (en) * 1995-02-01 1996-06-11 Enthone-Omi, Inc. Brightening additive for tungsten alloy electroplate
US20060154084A1 (en) * 2005-01-10 2006-07-13 Massachusetts Institute Of Technology Production of metal glass in bulk form

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2010053540A1 *

Also Published As

Publication number Publication date
CA2742934A1 (en) 2010-05-14
KR20110083707A (ko) 2011-07-20
EP2356267A1 (de) 2011-08-17
CN102272356A (zh) 2011-12-07
WO2010053540A1 (en) 2010-05-14
JP2015165053A (ja) 2015-09-17
JP2012508322A (ja) 2012-04-05

Similar Documents

Publication Publication Date Title
HK1217306A1 (zh) 用於葡萄糖調節的方法和系統
EP2350789A4 (de) Proximitätsschnittstellenvorrichtungen, systeme und verfahren
EP2370615A4 (de) Elektroplattierungsverfahren und elektroplattiertes produkt
IL209985A0 (en) Systems, apparatuses, and methods for providing non-transcranial electrotherapy
EP2356267A4 (de) Bäder, systeme und verfahren zur elektrotauchlackierung
HUE046118T2 (hu) Csontserkentõ-alakító eszköz, rendszer és eljárás
EP2349034A4 (de) Beschichtungsverfahren, systeme und entsprechende artikel
IL208496A0 (en) Bioretention system and method
GB0917044D0 (en) Agents, uses and methods
GB0917054D0 (en) Agents, uses and methods
EP2280905A4 (de) Mehrebenen-mikrofluidsysteme und -verfahren
IL208976A0 (en) Textiles and methods and systems for producing textiles
EP2293095A4 (de) Funkverfolgungsverfahren, -system und -einrichtungen
GB2465810B8 (en) Telecommunication system and method
EP2379130A4 (de) Autoretroperfusionsvorrichtungen, systeme und verfahren zur erzielung von venöser arterialisierung
EP2304593A4 (de) Verfahren und systeme für soziale vernetzung
GB0810413D0 (en) Method and system
EP2336393A4 (de) Elektroforming-verfahren
GB2485925B (en) Connection methods and systems
PT2934047T (pt) Sistema e método de configuração de recursos
IL213321A0 (en) Descenting systems and methods
GB2476779B (en) Provisioning method and system
EP2306889A4 (de) Ophthalmische vorrichtungen, systeme und verfahren
IL232271A0 (en) Memory is a system and a method
HK1132307A1 (en) Electroplating device and method for electroplating

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20110607

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

DAX Request for extension of the european patent (deleted)
RIC1 Information provided on ipc code assigned before grant

Ipc: C25D 5/18 20060101ALI20151029BHEP

Ipc: C25D 3/56 20060101AFI20151029BHEP

Ipc: C25D 3/66 20060101ALN20151029BHEP

Ipc: C25D 21/12 20060101ALI20151029BHEP

Ipc: G01N 27/42 20060101ALN20151029BHEP

Ipc: B22F 7/04 20060101ALI20151029BHEP

Ipc: B22F 7/00 20060101ALI20151029BHEP

RA4 Supplementary search report drawn up and despatched (corrected)

Effective date: 20160226

RIC1 Information provided on ipc code assigned before grant

Ipc: G01N 27/42 20060101ALN20160222BHEP

Ipc: B22F 7/00 20060101ALI20160222BHEP

Ipc: C25D 3/66 20060101ALN20160222BHEP

Ipc: B22F 7/04 20060101ALI20160222BHEP

Ipc: C25D 21/12 20060101ALI20160222BHEP

Ipc: C25D 5/18 20060101ALI20160222BHEP

Ipc: C25D 3/56 20060101AFI20160222BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN

17Q First examination report despatched

Effective date: 20170403

18W Application withdrawn

Effective date: 20170424