EP2355644A3 - Shield structure for an electronic element and electronic device - Google Patents

Shield structure for an electronic element and electronic device Download PDF

Info

Publication number
EP2355644A3
EP2355644A3 EP11152031A EP11152031A EP2355644A3 EP 2355644 A3 EP2355644 A3 EP 2355644A3 EP 11152031 A EP11152031 A EP 11152031A EP 11152031 A EP11152031 A EP 11152031A EP 2355644 A3 EP2355644 A3 EP 2355644A3
Authority
EP
European Patent Office
Prior art keywords
shield structure
electronic
electronic device
electronic element
ground pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11152031A
Other languages
German (de)
French (fr)
Other versions
EP2355644A2 (en
Inventor
Naomi Fukunaga
Hisashi Yoshinaga
Junichi Ogou
Naofumi Kosugi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of EP2355644A2 publication Critical patent/EP2355644A2/en
Publication of EP2355644A3 publication Critical patent/EP2355644A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0067—Devices for protecting against damage from electrostatic discharge
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/186—Securing of expansion boards in correspondence to slots provided at the computer enclosure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0058—Casings specially adapted for optoelectronic applications

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

A shield structure for an electronic element (4) includes a ground pattern (5) provided in a board (2); and a first member (6) having electrical conductivity, covering the electronic element (4), and connected with the ground pattern (5).
EP11152031A 2010-01-29 2011-01-25 Shield structure for an electronic element and electronic device Withdrawn EP2355644A3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010019361A JP5593714B2 (en) 2010-01-29 2010-01-29 Electronic element shield structure and electronic device equipped with the same

Publications (2)

Publication Number Publication Date
EP2355644A2 EP2355644A2 (en) 2011-08-10
EP2355644A3 true EP2355644A3 (en) 2011-10-05

Family

ID=44041562

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11152031A Withdrawn EP2355644A3 (en) 2010-01-29 2011-01-25 Shield structure for an electronic element and electronic device

Country Status (4)

Country Link
US (1) US8797763B2 (en)
EP (1) EP2355644A3 (en)
JP (1) JP5593714B2 (en)
KR (1) KR101191468B1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8724343B2 (en) * 2011-06-27 2014-05-13 Crestron Electronics Inc. Hi-definition multimedia interface shield with fingers
DE112011105896T5 (en) * 2011-11-30 2014-09-11 Mitsubishi Electric Corporation Control system, control device, connecting line and drive device
EP3163995B1 (en) 2014-08-01 2019-01-02 Huawei Technologies Co. Ltd. Electromagnetic shielding material and method for packaging optical module
US11457524B2 (en) * 2019-04-29 2022-09-27 Nxp B.V. Integrated filter for de-sense reduction
US11102894B2 (en) * 2020-01-10 2021-08-24 The Boeing Company Saddle type electrical enclosure

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001028305A1 (en) * 1999-10-12 2001-04-19 Shielding For Electronics, Inc. Emi containment apparatus
US20030161108A1 (en) * 2002-03-06 2003-08-28 Bright Edward John Pluggable electronic module and receptacle with heat sink
EP1871157A2 (en) * 2006-06-21 2007-12-26 ASUSTeK Computer Inc. EMI shielding module

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0796009B2 (en) 1989-01-23 1995-10-18 オリンパス光学工業株式会社 Shield device for endoscopic imaging device
JPH0397997A (en) 1989-09-08 1991-04-23 Oji Paper Co Ltd Production of gravure printing coated paper
JPH0397997U (en) * 1990-01-25 1991-10-09
JPH052482A (en) 1991-06-24 1993-01-08 Fujitsu Ltd Data processor
JPH06283234A (en) * 1993-03-29 1994-10-07 Nec Eng Ltd Internally storing method of external interface connector and cover structure
JPH0796009A (en) 1993-09-30 1995-04-11 Suzuki Motor Corp Motor-driven tricycle
JP3516407B2 (en) 1994-04-08 2004-04-05 株式会社東芝 Data transmission apparatus and X-ray CT apparatus using the same
KR0169840B1 (en) * 1995-11-14 1999-04-15 양승택 An electrostatic discharge protection guide rail system for printed circuit board
US5696669A (en) 1996-01-11 1997-12-09 Molex Incorporated Shielding system for PC cards
US5717577A (en) * 1996-10-30 1998-02-10 Ericsson, Inc. Gasketed shield can for shielding emissions of electromagnetic energy
US5763900A (en) * 1996-12-05 1998-06-09 Taiwan Liton Electronic Co. Ltd. Infrared transceiver package
US6049469A (en) * 1997-08-20 2000-04-11 Dell Usa, L.P. Combination electromagnetic shield and heat spreader
JP2000340305A (en) * 1999-05-25 2000-12-08 Seiko Epson Corp Grounding structure of external interface connector
US6320122B1 (en) * 1999-10-12 2001-11-20 Hewlett Packard Company Electromagnetic interference gasket
JP3315969B2 (en) * 2000-05-09 2002-08-19 株式会社ソニー・コンピュータエンタテインメント Electronics
NL1016549C2 (en) 2000-10-06 2002-04-10 Stork Screens Bv Method for the production of a card protected against interference radiation with a printed circuit.
JP2003017193A (en) * 2001-07-04 2003-01-17 Nec Tokin Iwate Ltd Shield connector
US6443768B1 (en) * 2001-09-14 2002-09-03 Molex Incorporated Small form factor connector cage
US7135643B2 (en) * 2001-12-14 2006-11-14 Laird Technologies, Inc. EMI shield including a lossy medium
US6744640B2 (en) * 2002-04-10 2004-06-01 Gore Enterprise Holdings, Inc. Board-level EMI shield with enhanced thermal dissipation
US7259969B2 (en) * 2003-02-26 2007-08-21 Wavezero, Inc. Methods and devices for connecting and grounding an EMI shield to a printed circuit board
WO2004091055A2 (en) * 2003-03-31 2004-10-21 Molex Incorporated Shielding cage with improved emi shielding gasket construction
JP4299152B2 (en) * 2004-01-08 2009-07-22 日本碍子株式会社 Electromagnetic wave shielding case and manufacturing method thereof
JP2006090471A (en) 2004-09-24 2006-04-06 Fuji Heavy Ind Ltd Design device for orthogonal gear pair
WO2006090471A1 (en) * 2005-02-25 2006-08-31 Fujitsu Limited Plug-in unit and communication device
JP4703454B2 (en) * 2006-03-27 2011-06-15 富士通株式会社 Cage mounting structure for optical modules
CN101600331B (en) * 2008-06-04 2012-10-03 富士康(昆山)电脑接插件有限公司 Shield
JP2010192759A (en) * 2009-02-19 2010-09-02 Sanyo Electric Co Ltd Electromagnetic shield structure of electronic apparatus housing

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001028305A1 (en) * 1999-10-12 2001-04-19 Shielding For Electronics, Inc. Emi containment apparatus
US20030161108A1 (en) * 2002-03-06 2003-08-28 Bright Edward John Pluggable electronic module and receptacle with heat sink
EP1871157A2 (en) * 2006-06-21 2007-12-26 ASUSTeK Computer Inc. EMI shielding module

Also Published As

Publication number Publication date
JP5593714B2 (en) 2014-09-24
US8797763B2 (en) 2014-08-05
EP2355644A2 (en) 2011-08-10
KR20110089080A (en) 2011-08-04
KR101191468B1 (en) 2012-10-15
JP2011159741A (en) 2011-08-18
US20110188227A1 (en) 2011-08-04

Similar Documents

Publication Publication Date Title
EP2216790A4 (en) Electrically conductive paste, and electrical and electronic device comprising the same
TW200745568A (en) Probe structures with electronic components
EP2387105A3 (en) Re-configurable built-in antenna for portable terminal
EP2876987A3 (en) Electronic device and car battery charger
EP2876984A3 (en) Power conversion device and method for assembling the same
EP2738807A3 (en) An apparatus including a semiconductor device coupled to a decoupling device
EP2538499A4 (en) Receptacle, printed circuit board, and electronic device
EP2846356A3 (en) Electronic device
EP2779812A3 (en) Chip package connector assembly
EP2439776A3 (en) Antenna on an integrated circuit
EP2116184A3 (en) Antenna for capsule type medical device
EP2575167A3 (en) Electronic device
EP2784639A3 (en) Touch panel and touch device with the same
EP2579696A4 (en) Circuit board and electronic device using the same
EP2773083A3 (en) Fixation of the battery with a metal plate to the housing of an electronic device
EP2849545A3 (en) Portable electronic device and battery pack for the same
TW201130097A (en) Interconnect layouts for electronic assemblies
TWI366946B (en) Thin antenna and an electronic device having the thin antenna thereof
EP2568351A3 (en) Electronic device having a slide-tilt operation
EP2071908A3 (en) Peripheral telecommunications device having movable cover with integrated antenna
EP2355644A3 (en) Shield structure for an electronic element and electronic device
EP2227072A3 (en) Printed circuit board with an adaptable connector module
EP2804452A3 (en) Printed wiring board and board module
EP2662960A3 (en) Control device, and motor unit including control device
EP2618442A3 (en) Electronic device and board usable in the electronic device with ESD and leakage current protection

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

RIC1 Information provided on ipc code assigned before grant

Ipc: G06F 1/18 20060101ALI20110829BHEP

Ipc: H05K 9/00 20060101AFI20110829BHEP

17P Request for examination filed

Effective date: 20120402

17Q First examination report despatched

Effective date: 20120920

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN

18W Application withdrawn

Effective date: 20141201