EP2325694A4 - Composition de résine radio-sensible et procédé de formation d'un motif de réserve - Google Patents

Composition de résine radio-sensible et procédé de formation d'un motif de réserve

Info

Publication number
EP2325694A4
EP2325694A4 EP09813128A EP09813128A EP2325694A4 EP 2325694 A4 EP2325694 A4 EP 2325694A4 EP 09813128 A EP09813128 A EP 09813128A EP 09813128 A EP09813128 A EP 09813128A EP 2325694 A4 EP2325694 A4 EP 2325694A4
Authority
EP
European Patent Office
Prior art keywords
radiation
resin composition
resist pattern
formation method
pattern formation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP09813128A
Other languages
German (de)
English (en)
Other versions
EP2325694A1 (fr
EP2325694B1 (fr
Inventor
Yukio Nishimura
Yasuhiko Matsuda
Hiroki Nakagawa
Tomohisa Fujisawa
Yukari Hama
Kazuki Kasahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Publication of EP2325694A1 publication Critical patent/EP2325694A1/fr
Publication of EP2325694A4 publication Critical patent/EP2325694A4/fr
Application granted granted Critical
Publication of EP2325694B1 publication Critical patent/EP2325694B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
EP09813128.7A 2008-09-12 2009-09-10 Composition de résine radio-sensible et procédé de formation d'un motif de réserve Active EP2325694B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008235509 2008-09-12
PCT/JP2009/065875 WO2010029982A1 (fr) 2008-09-12 2009-09-10 Composition de résine radio-sensible et procédé de formation d'un motif de réserve

Publications (3)

Publication Number Publication Date
EP2325694A1 EP2325694A1 (fr) 2011-05-25
EP2325694A4 true EP2325694A4 (fr) 2012-07-18
EP2325694B1 EP2325694B1 (fr) 2017-11-08

Family

ID=42005232

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09813128.7A Active EP2325694B1 (fr) 2008-09-12 2009-09-10 Composition de résine radio-sensible et procédé de formation d'un motif de réserve

Country Status (7)

Country Link
US (1) US20110212401A1 (fr)
EP (1) EP2325694B1 (fr)
JP (1) JP5360065B2 (fr)
KR (1) KR101701523B1 (fr)
CN (1) CN102150083B (fr)
TW (1) TWI524135B (fr)
WO (1) WO2010029982A1 (fr)

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JP5402809B2 (ja) 2009-04-21 2014-01-29 セントラル硝子株式会社 トップコート組成物
JP5223775B2 (ja) * 2009-05-25 2013-06-26 セントラル硝子株式会社 液浸レジスト用撥水性添加剤
JP5386236B2 (ja) 2009-06-01 2014-01-15 東京応化工業株式会社 ポジ型レジスト組成物及びレジストパターン形成方法
WO2010140637A1 (fr) 2009-06-04 2010-12-09 Jsr株式会社 Composition de résine sensible au rayonnement, polymère et procédé de formation de motif de résist
CN103472674B (zh) 2009-09-18 2017-04-26 Jsr株式会社 放射线敏感性树脂组合物、抗蚀图案形成方法、聚合物和聚合性化合物
WO2011062168A1 (fr) * 2009-11-18 2011-05-26 Jsr株式会社 Composition de résine sensible au rayonnement, polymère et procédé de formation de motif de réserve
WO2011122590A1 (fr) * 2010-03-30 2011-10-06 Jsr株式会社 Composition de photoréserve et procédé de formation de motifs de réserve
TWI457318B (zh) 2010-10-05 2014-10-21 Shinetsu Chemical Co 含氟酯單體及其製造方法、與含氟酯高分子化合物
JP5940800B2 (ja) * 2010-12-15 2016-06-29 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
KR20140007833A (ko) * 2011-02-04 2014-01-20 제이에스알 가부시끼가이샤 포토레지스트 조성물
WO2013047536A1 (fr) * 2011-09-30 2013-04-04 Jsr株式会社 Composition de résine photosensible et procédé de formation d'un motif de réserve
JP6581811B2 (ja) * 2015-06-15 2019-09-25 東京応化工業株式会社 レジスト組成物及びレジストパターン形成方法
JP6670555B2 (ja) * 2015-06-15 2020-03-25 東京応化工業株式会社 レジスト組成物及びレジストパターン形成方法
US10324377B2 (en) 2015-06-15 2019-06-18 Tokyo Ohka Kogyo Co., Ltd. Resist composition and method of forming resist pattern
JP6579044B2 (ja) 2015-06-30 2019-09-25 信越化学工業株式会社 レジスト組成物及びパターン形成方法
US11016386B2 (en) * 2018-06-15 2021-05-25 Taiwan Semiconductor Manufacturing Co., Ltd. Photoresist composition and method of forming photoresist pattern
EP3919981A4 (fr) * 2019-01-28 2022-03-30 FUJIFILM Corporation Composition de résine sensible à la lumière actinique ou au rayonnement, film de réserve, procédé de formation de motif, et procédé de production de dispositif électronique
JP7149241B2 (ja) * 2019-08-26 2022-10-06 信越化学工業株式会社 レジスト材料及びパターン形成方法
CN112925167A (zh) * 2021-01-26 2021-06-08 宁波南大光电材料有限公司 具有光酸活性的光刻胶树脂及光刻胶
CN116046941B (zh) * 2022-12-30 2024-06-25 徐州博康信息化学品有限公司 一种光刻胶树脂中残余单体含量的测试方法

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Also Published As

Publication number Publication date
TWI524135B (zh) 2016-03-01
EP2325694A1 (fr) 2011-05-25
KR101701523B1 (ko) 2017-02-01
US20110212401A1 (en) 2011-09-01
TW201022839A (en) 2010-06-16
JP5360065B2 (ja) 2013-12-04
CN102150083A (zh) 2011-08-10
EP2325694B1 (fr) 2017-11-08
KR20110057154A (ko) 2011-05-31
JPWO2010029982A1 (ja) 2012-02-02
WO2010029982A1 (fr) 2010-03-18
CN102150083B (zh) 2013-09-04

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