EP2057667A4 - A method of antistatic deposition on components of mobile phone - Google Patents

A method of antistatic deposition on components of mobile phone

Info

Publication number
EP2057667A4
EP2057667A4 EP07793777A EP07793777A EP2057667A4 EP 2057667 A4 EP2057667 A4 EP 2057667A4 EP 07793777 A EP07793777 A EP 07793777A EP 07793777 A EP07793777 A EP 07793777A EP 2057667 A4 EP2057667 A4 EP 2057667A4
Authority
EP
European Patent Office
Prior art keywords
components
mobile phone
antistatic
deposition
antistatic deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07793777A
Other languages
German (de)
French (fr)
Other versions
EP2057667A1 (en
Inventor
Byung Hoon Ryou
Won Mo Sung
Jun Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kespion Co Ltd
Original Assignee
EMW Antenna Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EMW Antenna Co Ltd filed Critical EMW Antenna Co Ltd
Publication of EP2057667A1 publication Critical patent/EP2057667A1/en
Publication of EP2057667A4 publication Critical patent/EP2057667A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/02—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0067—Devices for protecting against damage from electrostatic discharge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2009/00—Layered products
    • B29L2009/005—Layered products coated
    • B29L2009/008—Layered products coated metalized, galvanized
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3431—Telephones, Earphones
    • B29L2031/3437—Cellular phones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3493—Moulded interconnect devices, i.e. moulded articles provided with integrated circuit traces
EP07793777A 2006-09-01 2007-08-31 A method of antistatic deposition on components of mobile phone Withdrawn EP2057667A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020060083994A KR100797627B1 (en) 2006-09-01 2006-09-01 A method of antistatic deposition on components of mobile phone
PCT/KR2007/004197 WO2008026893A1 (en) 2006-09-01 2007-08-31 A method of antistatic deposition on components of mobile phone

Publications (2)

Publication Number Publication Date
EP2057667A1 EP2057667A1 (en) 2009-05-13
EP2057667A4 true EP2057667A4 (en) 2013-03-20

Family

ID=39136127

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07793777A Withdrawn EP2057667A4 (en) 2006-09-01 2007-08-31 A method of antistatic deposition on components of mobile phone

Country Status (6)

Country Link
US (1) US20100039745A1 (en)
EP (1) EP2057667A4 (en)
JP (1) JP2010501727A (en)
KR (1) KR100797627B1 (en)
CN (1) CN101506945B (en)
WO (1) WO2008026893A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101441920B1 (en) 2007-12-24 2014-09-19 엘지전자 주식회사 Portable terminal
KR101889370B1 (en) * 2011-10-14 2018-08-21 삼성전자주식회사 Electronic device case and method for treating surface thereof
KR101761942B1 (en) * 2012-08-27 2017-07-26 삼성전기주식회사 Electrostatic discharge protection device and method for manufacturing the same
KR20140128057A (en) * 2013-04-26 2014-11-05 삼성전기주식회사 Thin film type chip device and method for manufacturing the same
KR20210074910A (en) * 2019-12-12 2021-06-22 삼성전자주식회사 Electronic device having metal housing for decreasing vibration by leakage current and method for manufacturing the metal housing

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5757117A (en) * 1995-08-29 1998-05-26 Hitachi, Ltd. Cathode ray tube with conductive silicon adhesive
JP2004156098A (en) * 2002-11-06 2004-06-03 Toyoda Gosei Co Ltd Vapor deposition mask holder
US6768654B2 (en) * 2000-09-18 2004-07-27 Wavezero, Inc. Multi-layered structures and methods for manufacturing the multi-layered structures

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2889639B2 (en) * 1990-03-20 1999-05-10 尾池工業株式会社 Electrically insulating metal deposited film
JPH0547218A (en) * 1991-08-09 1993-02-26 Sumitomo Electric Ind Ltd Lead for electronic part
JP2588230Y2 (en) * 1993-06-02 1999-01-06 王子タック販売株式会社 Adhesive label with metal deposition film
JP3643904B1 (en) * 2004-10-28 2005-04-27 尾池工業株式会社 Method for producing metal-deposited film and metal-deposited film
JP4629485B2 (en) * 2005-04-26 2011-02-09 大日本印刷株式会社 Book with non-contact IC tag

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5757117A (en) * 1995-08-29 1998-05-26 Hitachi, Ltd. Cathode ray tube with conductive silicon adhesive
US6768654B2 (en) * 2000-09-18 2004-07-27 Wavezero, Inc. Multi-layered structures and methods for manufacturing the multi-layered structures
JP2004156098A (en) * 2002-11-06 2004-06-03 Toyoda Gosei Co Ltd Vapor deposition mask holder

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2008026893A1 *

Also Published As

Publication number Publication date
KR100797627B1 (en) 2008-01-24
EP2057667A1 (en) 2009-05-13
US20100039745A1 (en) 2010-02-18
CN101506945B (en) 2012-06-20
JP2010501727A (en) 2010-01-21
WO2008026893A1 (en) 2008-03-06
CN101506945A (en) 2009-08-12

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 20090225

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AX Request for extension of the european patent

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DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20130220

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 21/20 20060101AFI20130214BHEP

Ipc: C23C 14/20 20060101ALI20130214BHEP

Ipc: B29C 45/00 20060101ALI20130214BHEP

Ipc: B29C 45/16 20060101ALI20130214BHEP

Ipc: H05K 9/00 20060101ALI20130214BHEP

Ipc: B29C 45/14 20060101ALI20130214BHEP

Ipc: H04B 1/38 20060101ALI20130214BHEP

Ipc: H04M 1/18 20060101ALN20130214BHEP

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18D Application deemed to be withdrawn

Effective date: 20130924