EP1983530A4 - Electronic component and method for manufacturing same - Google Patents

Electronic component and method for manufacturing same

Info

Publication number
EP1983530A4
EP1983530A4 EP07713763.6A EP07713763A EP1983530A4 EP 1983530 A4 EP1983530 A4 EP 1983530A4 EP 07713763 A EP07713763 A EP 07713763A EP 1983530 A4 EP1983530 A4 EP 1983530A4
Authority
EP
European Patent Office
Prior art keywords
electronic component
manufacturing same
manufacturing
same
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07713763.6A
Other languages
German (de)
French (fr)
Other versions
EP1983530A1 (en
Inventor
Seiji Goto
Masahiro Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of EP1983530A1 publication Critical patent/EP1983530A1/en
Publication of EP1983530A4 publication Critical patent/EP1983530A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors
EP07713763.6A 2006-02-03 2007-02-01 Electronic component and method for manufacturing same Withdrawn EP1983530A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006027594 2006-02-03
PCT/JP2007/051735 WO2007088948A1 (en) 2006-02-03 2007-02-01 Electronic component and method for manufacturing same

Publications (2)

Publication Number Publication Date
EP1983530A1 EP1983530A1 (en) 2008-10-22
EP1983530A4 true EP1983530A4 (en) 2015-04-15

Family

ID=38327517

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07713763.6A Withdrawn EP1983530A4 (en) 2006-02-03 2007-02-01 Electronic component and method for manufacturing same

Country Status (4)

Country Link
EP (1) EP1983530A4 (en)
JP (1) JP4183020B2 (en)
CN (1) CN101379572B (en)
WO (1) WO2007088948A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112007003214T5 (en) 2007-01-05 2009-10-29 Murata Manufacturing Co. Ltd., Nagaokakyo-shi Electronic component and method for manufacturing the same
JP5734737B2 (en) * 2010-05-20 2015-06-17 富士フイルム株式会社 Method and apparatus for manufacturing functionally gradient material
JP5782367B2 (en) * 2011-11-18 2015-09-24 富士フイルム株式会社 Method and apparatus for manufacturing thermal radiation film

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0252406A (en) * 1988-08-16 1990-02-22 Matsushita Electric Ind Co Ltd Chip resistor
US20040246303A1 (en) * 2002-04-16 2004-12-09 Takeo Eguchi Liquid ejecting device and liquid ejecting method
WO2006076615A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Ink-jet printing of compositionally no-uniform features

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59215763A (en) * 1983-05-23 1984-12-05 Matsushita Electric Ind Co Ltd Printer for thick film
JPS6030101A (en) 1983-07-29 1985-02-15 アルプス電気株式会社 Variable resistor
JPH06275934A (en) * 1993-03-23 1994-09-30 Fujitsu General Ltd Thick film resistor
JPH10189305A (en) 1996-12-20 1998-07-21 Tdk Corp Angular plate type chip resistor and its manufacture
JP4829463B2 (en) * 2002-11-08 2011-12-07 独立行政法人産業技術総合研究所 Thick film resistor, adjusting device therefor, and resistance value adjusting method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0252406A (en) * 1988-08-16 1990-02-22 Matsushita Electric Ind Co Ltd Chip resistor
US20040246303A1 (en) * 2002-04-16 2004-12-09 Takeo Eguchi Liquid ejecting device and liquid ejecting method
WO2006076615A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Ink-jet printing of compositionally no-uniform features

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2007088948A1 *

Also Published As

Publication number Publication date
WO2007088948A1 (en) 2007-08-09
CN101379572B (en) 2012-07-18
EP1983530A1 (en) 2008-10-22
JPWO2007088948A1 (en) 2009-06-25
CN101379572A (en) 2009-03-04
JP4183020B2 (en) 2008-11-19

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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17P Request for examination filed

Effective date: 20080902

AK Designated contracting states

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Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

DAX Request for extension of the european patent (deleted)
RA4 Supplementary search report drawn up and despatched (corrected)

Effective date: 20150317

RIC1 Information provided on ipc code assigned before grant

Ipc: H01C 17/06 20060101AFI20150311BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN

18W Application withdrawn

Effective date: 20150427