EP1976806A4 - Procédé et dispositif de traitement d'un substrat - Google Patents
Procédé et dispositif de traitement d'un substratInfo
- Publication number
- EP1976806A4 EP1976806A4 EP06844980A EP06844980A EP1976806A4 EP 1976806 A4 EP1976806 A4 EP 1976806A4 EP 06844980 A EP06844980 A EP 06844980A EP 06844980 A EP06844980 A EP 06844980A EP 1976806 A4 EP1976806 A4 EP 1976806A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- substrate
- methods
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02021—Edge treatment, chamfering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/298,555 US20070131653A1 (en) | 2005-12-09 | 2005-12-09 | Methods and apparatus for processing a substrate |
US11/299,295 US7993485B2 (en) | 2005-12-09 | 2005-12-09 | Methods and apparatus for processing a substrate |
PCT/US2006/046765 WO2007070353A2 (fr) | 2005-12-09 | 2006-12-07 | Procédé et dispositif de traitement d'un substrat |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1976806A2 EP1976806A2 (fr) | 2008-10-08 |
EP1976806A4 true EP1976806A4 (fr) | 2011-08-10 |
Family
ID=38163413
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP06844980A Withdrawn EP1976806A4 (fr) | 2005-12-09 | 2006-12-07 | Procédé et dispositif de traitement d'un substrat |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1976806A4 (fr) |
JP (2) | JP2009518872A (fr) |
KR (1) | KR101236855B1 (fr) |
TW (1) | TWI362697B (fr) |
WO (1) | WO2007070353A2 (fr) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7993485B2 (en) | 2005-12-09 | 2011-08-09 | Applied Materials, Inc. | Methods and apparatus for processing a substrate |
US7976361B2 (en) * | 2007-06-29 | 2011-07-12 | Ebara Corporation | Polishing apparatus and polishing method |
JP5274993B2 (ja) * | 2007-12-03 | 2013-08-28 | 株式会社荏原製作所 | 研磨装置 |
JP2014083647A (ja) * | 2012-10-25 | 2014-05-12 | Avanstrate Inc | ガラス基板研磨用磁性流動体 |
CN104956467B (zh) * | 2013-01-31 | 2018-02-16 | 应用材料公司 | 用于化学机械平坦化后的基板清洗的方法及设备 |
WO2015061741A1 (fr) | 2013-10-25 | 2015-04-30 | Applied Materials, Inc | Systèmes, méthodes et appareil de pré-nettoyage par polissage de substrat de planarisation mécanique post-chimique |
DE102015008814A1 (de) | 2015-07-10 | 2017-01-12 | Thielenhaus Technologies Gmbh | Andrückschuh mit Expansionskammer |
JP2017087305A (ja) * | 2015-11-02 | 2017-05-25 | 日本電気硝子株式会社 | 円板状ワークの研磨加工方法及び研磨加工装置 |
JP6920849B2 (ja) * | 2017-03-27 | 2021-08-18 | 株式会社荏原製作所 | 基板処理方法および装置 |
JP6414353B1 (ja) * | 2018-03-27 | 2018-10-31 | 株式会社不二越 | フィルムラップ加工装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6622334B1 (en) * | 2000-03-29 | 2003-09-23 | International Business Machines Corporation | Wafer edge cleaning utilizing polish pad material |
US20040185751A1 (en) * | 2003-02-03 | 2004-09-23 | Masayuki Nakanishi | Substrate processing apparatus |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4533399A (en) * | 1983-04-12 | 1985-08-06 | Minnesota Mining And Manufacturing Company | Contact lens cleaning method |
JPH081494A (ja) * | 1994-06-27 | 1996-01-09 | Sanshin:Kk | ウエハー材縁端部研磨装置 |
JP2924890B2 (ja) * | 1998-04-20 | 1999-07-26 | トヨタ自動車株式会社 | 研摩方法 |
US6629875B2 (en) * | 2000-01-28 | 2003-10-07 | Accretech Usa, Inc. | Machine for grinding-polishing of a water edge |
JP2002154041A (ja) * | 2000-11-17 | 2002-05-28 | I M T Kk | 研磨装置 |
JP4156200B2 (ja) * | 2001-01-09 | 2008-09-24 | 株式会社荏原製作所 | 研磨装置及び研磨方法 |
JP2005186176A (ja) * | 2003-12-24 | 2005-07-14 | Shinko Electric Ind Co Ltd | ウエハ端面研磨装置 |
EP1719161B1 (fr) * | 2004-02-25 | 2014-05-07 | Ebara Corporation | Appareil à polir |
-
2006
- 2006-12-07 EP EP06844980A patent/EP1976806A4/fr not_active Withdrawn
- 2006-12-07 JP JP2008544516A patent/JP2009518872A/ja active Pending
- 2006-12-07 KR KR1020087015337A patent/KR101236855B1/ko not_active IP Right Cessation
- 2006-12-07 WO PCT/US2006/046765 patent/WO2007070353A2/fr active Application Filing
- 2006-12-08 TW TW095146154A patent/TWI362697B/zh not_active IP Right Cessation
-
2012
- 2012-04-25 JP JP2012100094A patent/JP2012183637A/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6622334B1 (en) * | 2000-03-29 | 2003-09-23 | International Business Machines Corporation | Wafer edge cleaning utilizing polish pad material |
US20040185751A1 (en) * | 2003-02-03 | 2004-09-23 | Masayuki Nakanishi | Substrate processing apparatus |
Also Published As
Publication number | Publication date |
---|---|
JP2012183637A (ja) | 2012-09-27 |
KR101236855B1 (ko) | 2013-02-26 |
WO2007070353A2 (fr) | 2007-06-21 |
TW200735200A (en) | 2007-09-16 |
TWI362697B (en) | 2012-04-21 |
WO2007070353A3 (fr) | 2007-11-29 |
EP1976806A2 (fr) | 2008-10-08 |
KR20080075001A (ko) | 2008-08-13 |
JP2009518872A (ja) | 2009-05-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20080708 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: CHEN, LIANG-YUH Inventor name: KO, SEN-HOU Inventor name: WASINGER, ERIK C. Inventor name: HSU, WEI-YUNG Inventor name: OLGADO, DONALD Inventor name: ETTINGER, GARY C. Inventor name: SHIN, HO, SEON |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20110707 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: C03C 15/00 20060101AFI20110701BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20120207 |
|
DAX | Request for extension of the european patent (deleted) |