EP1898466A2 - Encased PCB switch assembly with contact device - Google Patents

Encased PCB switch assembly with contact device Download PDF

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Publication number
EP1898466A2
EP1898466A2 EP07011533A EP07011533A EP1898466A2 EP 1898466 A2 EP1898466 A2 EP 1898466A2 EP 07011533 A EP07011533 A EP 07011533A EP 07011533 A EP07011533 A EP 07011533A EP 1898466 A2 EP1898466 A2 EP 1898466A2
Authority
EP
European Patent Office
Prior art keywords
conductive layer
circuit arrangement
contact
semi
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP07011533A
Other languages
German (de)
French (fr)
Other versions
EP1898466A3 (en
EP1898466B1 (en
Inventor
Christian Göbl
Harald Dr. Kobolla
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron GmbH and Co KG
Semikron Elektronik GmbH and Co KG
Original Assignee
Semikron GmbH and Co KG
Semikron Elektronik GmbH and Co KG
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Publication of EP1898466A2 publication Critical patent/EP1898466A2/en
Publication of EP1898466A3 publication Critical patent/EP1898466A3/en
Application granted granted Critical
Publication of EP1898466B1 publication Critical patent/EP1898466B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/63—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to another shape cable
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28—Clamped connections, spring connections
    • H01R4/30—Clamped connections, spring connections utilising a screw or nut clamping member
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28—Clamped connections, spring connections
    • H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
    • H01R4/4809—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring to bias the conductor toward the busbar
    • H01R4/48185—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring to bias the conductor toward the busbar adapted for axial insertion of a wire end
    • H01R4/4819—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring to bias the conductor toward the busbar adapted for axial insertion of a wire end the spring shape allowing insertion of the conductor end when the spring is unbiased
    • H01R4/4821—Single-blade spring
    • H—ELECTRICITY
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28—Clamped connections, spring connections
    • H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
    • H01R4/4809—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring to bias the conductor toward the busbar
    • H01R4/4846—Busbar details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
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    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/061—Disposition
    • H01L2224/0618—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/06181—On opposite sides of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32153—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
    • H01L2224/32175—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic
    • H01L2224/32188—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic the layer connector connecting to a bonding area protruding from the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8384—Sintering
    • H—ELECTRICITY
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits

Definitions

  • the invention describes a hopped semiconductor circuit arrangement, for example a power semiconductor module, with contact devices for the electrical connection of the semiconductor components to external supply lines.
  • connection will be understood in the following to mean a connection between an inner connection element of the power semiconductor module with an external supply line, wherein the connection device is connected to the control contact devices of a power semiconductor component.
  • connection device is connected to the control contact devices of a power semiconductor component.
  • all other external connections should be subsumed under this term by way of example of integrated circuits, which are not external load connections. Even if the semiconductor circuit arrangement according to the invention is represented by means of an embodiment as a power semiconductor module, this does not limit the generality.
  • a starting point of the invention are power semiconductor modules, as exemplified by the DE 10 2004 0255 609 A1 , or the DE 103 55 925 A1 are known.
  • the first document discloses a power semiconductor module in screw pressure contact.
  • the external load connections of the power semiconductor module with an external printed circuit board are in this case achieved by means of a screw connection according to the prior art.
  • the external control connections are in this case designed as a connection between one. Spring contact element and a conductor track portion of the external circuit board.
  • a pressure introduction to the control terminals by the arrangement and screwing of the printed circuit board with the load connection elements takes place for electrical contacting.
  • the design of a power semiconductor module in the aforementioned type is particularly suitable for current loads of the load terminals of more than 10 amps.
  • the semiconductor circuit arrangement has at least one connection device for connecting the semiconductor components.
  • This consists of a film composite with at least two electrically conductive layers, for example made of copper or aluminum, each with an insulating layer arranged therebetween, wherein at least one conductive layer is structured in itself and thus forms printed conductors.
  • the first conductive layer (60) has an external contact device (600), designed here as a solder connection, to the printed circuit board (7).
  • This first conductive layer (60) is structured in itself and thus forms conductor tracks.
  • the film composite (6) furthermore has circuit-compatible plated-through holes of printed conductors of this first conductive layer (60) to form the second conductive layer (64) or conductor tracks formed there.
  • FIG. 3 shows a third embodiment of a semiconductor semiconductor circuit arrangement (1) according to the invention in section, whereby this differs from that according to FIG. 2 in that here the first conductive layer (60) is connected to an external supply line (8).

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Electric Clocks (AREA)

Abstract

The arrangement has a substrate with conductive paths, and two conductive layers (60, 64) structured to form the conductive paths. The layers comprise a contact device to a joint surface of a semiconductor component (58) e.g. power diode, and a part of the conductive layers is a part of another contact device (4). The latter contact device comprises a spring unit with a support (30) in a housing (3) and a locking screw. The spring unit comprises a contact surface (402) for an external supply and another contact surface (606) for the layers.

Description

Beschreibungdescription

Die Erfindung beschreibt eine gehauste Halbleiterschaltungsanordnung, beispielhaft ein Leistungshalbleitermodul, mit Kontakteinrichtungen zur elektrischen Verbindung der Halbleiterbauelemente mit externen Zuleitungen.The invention describes a hopped semiconductor circuit arrangement, for example a power semiconductor module, with contact devices for the electrical connection of the semiconductor components to external supply lines.

Hierbei soll im Folgenden mit dem Begriff des externen Lastanschlusses eine Verbindung zwischen einem inneren Verbindungselement des Leistungshalbleitermoduls mit einer externen Zuleitung verstanden werden, wobei die Verbindungseinrichtung mit den Leistungskontakteinrichtungen eines Leistungshalbleiterbauelements verbunden ist.Hereinafter, the term external load connection is to be understood as meaning a connection between an inner connection element of the power semiconductor module with an external supply line, wherein the connection device is connected to the power contact devices of a power semiconductor component.

Analog wird mit dem Begriff externer Steueranschluss im Folgenden eine Verbindung zwischen einem inneren Verbindungselement des Leistungshalbleitermoduls mit einer externen Zuleitung verstanden werden, wobei die Verbindungseinrichtung mit den Steuerkontakteinrichtungen eines Leistungshalbleiterbauelements verbunden ist. Ebenso sollten unter diesen Begriff auch alle weiteren externen Anschlüsse beispielhaft von integrierten Schaltungen, subsumiert werden, die keine externen Lastanschlüsse sind. Auch wenn die erfindungsgemäße Halbleiterschaltungsanordnung an Hand einer Ausführung als Leistungshalbleitermodul dargestellt wird bedeutet dies keine Beschränkung der Allgemeinheit.Analogously, the term external control connection will be understood in the following to mean a connection between an inner connection element of the power semiconductor module with an external supply line, wherein the connection device is connected to the control contact devices of a power semiconductor component. Likewise, all other external connections should be subsumed under this term by way of example of integrated circuits, which are not external load connections. Even if the semiconductor circuit arrangement according to the invention is represented by means of an embodiment as a power semiconductor module, this does not limit the generality.

Einen Ausgangspunkt der Erfindung bilden Leistungshalbleitermodule, wie sie beispielhaft aus der DE 10 2004 0255 609 A1 , oder der DE 103 55 925 A1 bekannt sind. Erstgenannte Druckschrift offenbart ein Leistungshalbleitermodul in Schraub-Druckkontaktierung. Die externen Lastanschlüsse des Leistungshalbleitermoduls mit einer externen Leiterplatte werden hierbei mittels eine Schraubverbindung nach dem Stand der Technik erreicht. Die externen Steueranschlüsse sind hierbei ausgebildet als-Verbindung zwischen einem. Federkontaktelement und einem Leiterbahnabschnitt der externen Leiterplatte. Erfindungsgemäß, erfolgt zur elektrischen Kontaktierung eine Druckeinleitung auf die Steueranschlüsse durch die Anordnung und Verschraubung der Leiterplatte mit den Lastanschlusselementen. Die Ausgestaltung eines Leistungshalbleitermoduls in der genannten Art ist besonders geeignet für Strombelastungen der Lastanschlüsse von mehr als 10 Ampere.A starting point of the invention are power semiconductor modules, as exemplified by the DE 10 2004 0255 609 A1 , or the DE 103 55 925 A1 are known. The first document discloses a power semiconductor module in screw pressure contact. The external load connections of the power semiconductor module with an external printed circuit board are in this case achieved by means of a screw connection according to the prior art. The external control connections are in this case designed as a connection between one. Spring contact element and a conductor track portion of the external circuit board. According to the invention, a pressure introduction to the control terminals by the arrangement and screwing of the printed circuit board with the load connection elements takes place for electrical contacting. The design of a power semiconductor module in the aforementioned type is particularly suitable for current loads of the load terminals of more than 10 amps.

Die DE 103 55 925 A1 offenbart eine Verbindungseinrichtung für Leistungshalbleiterbauelemente bestehend aus einem Folienverbund einer ersten und einer zweiten leitenden Folie mit einer isolierenden Zwischenlage. Die Leistungshalbleiterbauelemente sind mit der ersten leitenden Schicht mittels Ultraschallschweißen dauerhaft sicher elektrisch verbunden. Die modulinterne schaltungsgerechte Verbindung der Leistungshalbleiterbauelemente, die sowohl interne Last- als auch Steueranschlüsse beinhaltet ist hier offen gelegt. Allerdings offenbart die genannte Druckschrift keine Details der externen Last- und Steueranschlüsse.The DE 103 55 925 A1 discloses a connecting device for power semiconductor components consisting of a film composite of a first and a second conductive foil with an insulating intermediate layer. The power semiconductor components are permanently securely electrically connected to the first conductive layer by means of ultrasonic welding. The module-internal circuit-compatible connection of the power semiconductor components, which contains both internal load and control connections, is disclosed here. However, the cited document does not disclose details of the external load and control connections.

Die nicht vorveröffentlichte DE 10 2006 013 078 offenbart ein Leistungshalbleitermodul mit einem Gehäuse, einem Substrat mit Leiterbahnen und auf diesen Leiterbahnen schaltungsgerecht angeordnete Leistungshalbleiterbauelemente. Weiterhin weist das Leistungshalbleitermodul eine Verbindungseinrichtung auf, wobei diese jeweils aus einem Folienverbund aus einer ersten und einer zweiten leitenden Schicht mit einer zwischen diesen leitenden Schichten angeordneten isolierenden Schicht besteht.The not pre-published DE 10 2006 013 078 discloses a power semiconductor module having a housing, a substrate with conductor tracks and power semiconductor components arranged in a circuitally appropriate manner on these conductor tracks. Furthermore, the power semiconductor module has a connection device, wherein this each consists of a film composite of a first and a second conductive layer with an insulating layer arranged between these conductive layers.

Die jeweiligen leitenden Schichten sind in sich strukturiert und bilden somit dort Leiterbahnen aus. Die erste leitende Schicht des Folienverbunds weist erste, als Punktschweißverbindungen ausgebildete interne Lastanschlüsse zu Leistungsanschlussflächen von Leistungshalbleiterbauelementen auf. Ebenso weist diese erste leitende Schicht auf einer weiteren Leiterbahn interne Steueranschlüsse zu Steueranschlussflächen von Leistungshalbleiterbauelementen auf. Weiterhin weist die erste leitende Schicht externe Lastanschlüsse zur Lastverbindung mit einer Leiterplatte auf. Die zweite leitende Schicht weist gleichartige externe Steueranschlüsse zur Steuerverbindung mit der Leiterplatte auf, wobei diese Anschlüsse jeweils als Lötverbindungen ausgebildet sind.The respective conductive layers are structured in themselves and thus form there conductor tracks. The first conductive layer of the film composite has first, as spot welding connections formed internal load connections to power pads of power semiconductor devices. Likewise, this first conductive layer has internal control connections to control connection surfaces of power semiconductor components on a further conductor track. Furthermore, the first conductive layer has external load terminals for load connection to a printed circuit board on. The second conductive layer has similar external control terminals for control connection with the printed circuit board, wherein these terminals are each formed as solder joints.

Der Folienverbund selbst weist Folienabschnitte zwischen den internen, sowie den externen Anschlüssen auf, die in Führungsabschnitten des Gehäuses angeordnet sind, wobei die externen Anschlüsse parallele Flächennormalen aufweisen.The film composite itself has film sections between the internal and the external terminals, which are arranged in guide portions of the housing, wherein the external terminals have parallel surface normals.

Der Erfindung liegt die Aufgabe zugrunde eine gehauste Halbleiterschaltungsanordnung mit einer Verbindungseinrichtung in Ausgestaltung eines Folienverbunds und mit externen Kontakteinrichtungen zur reversiblen Verbindung mit externen Zuleitungen vorzustellen.The invention has for its object to present a hopped semiconductor circuit arrangement with a connection device in an embodiment of a film composite and with external contact devices for reversible connection to external leads.

Die Aufgabe wird erfindungsgemäß gelöst, durch die Maßnahmen der Merkmale des Anspruchs 1. Bevorzugte Ausführungsformen sind in den Unteransprüchen beschrieben.The object is achieved by the measures of the features of claim 1. Preferred embodiments are described in the subclaims.

Der erfinderische Gedanke geht aus von einer gehausten Halbleiterschaltungsanordnung mit mindestens einem Substrat. Dieses Substrat weist eine Mehrzahl von Leiterbahnen auf, worauf Halbleiterbauelemente schaltungsgerecht angeordnet sind. Diese Halbleiterbauelemente sind beispielhaft als integrierte Schaltungen oder als Einzelbauelemente wie Dioden oder Transistoren ausgebildet. Es kann bevorzugt sein wenn mindestens eines der Halbleiterbauelemente ein Leistungshalbleiterbauelement, wie beispielhaft ein Leistungstransistor oder eine Leistungsdiode ist. Weiterhin können auf den Leiterbahnen des Substrats passive elektronische Bauelemente wie Widerstände und / oder Kondensatoren schaltungsgerecht angeordnet sein.The inventive idea is based on a gehausten semiconductor circuit arrangement with at least one substrate. This substrate has a plurality of conductor tracks, whereupon semiconductor components are arranged in a circuit-oriented manner. These semiconductor devices are exemplified as integrated circuits or as individual components such as diodes or transistors. It may be preferred if at least one of the semiconductor components is a power semiconductor component, such as, for example, a power transistor or a power diode. Furthermore, passive electronic components such as resistors and / or capacitors can be arranged in a circuit-compatible manner on the conductor tracks of the substrate.

Die Halbleiterschaltungsanordnung weist zur Verbindung der Halbleiterbauelemente mindestens eine Verbindungseinrichtung auf. Diese besteht aus einem Folienverbund mit mindestens zwei elektrisch leitenden Schichten, beispielhaft aus Kupfer oder Aluminium, mit jeweils einer dazwischen angeordneten isolierenden Schicht, wobei mindestens eine leitende Schicht in sich strukturiert ist und somit Leiterbahnen ausbildet.The semiconductor circuit arrangement has at least one connection device for connecting the semiconductor components. This consists of a film composite with at least two electrically conductive layers, for example made of copper or aluminum, each with an insulating layer arranged therebetween, wherein at least one conductive layer is structured in itself and thus forms printed conductors.

Mindestens eine dieser leitenden Schichten weist erste interne Kontakteinrichtungen zu Anschlussflächen zugeordneter Halbleiterbauelemente auf. Erfindungsgemäß weist diese und / oder eine weitere leitende Schicht einen Teilabschnitt auf, der Teil mindestens einer zweiten reversibel ausgebildeten Kontakteinrichtung zur Verbindung mit externen Zuleitungen ist. Diese externe Kontakteinrichtung weist mindestens ein Federelement mit einem Widerlager im Gehäuse und / oder mindestens eine Feststellschraube auf. Die Variante mit dem Federelement bildet somit eine selbst arretierende Kontakteinrichtung aus, bei der eine externe Zuleitung eine Steckverbindung mit der Kontakteinrichtung eingeht. Die Variante mit Feststellschraube ist als Schräub-Klemmverbindung nach dem Stand der Technik ausgebildet.
Die erfinderische Lösung wird an Hand der Ausführungsbeispiele der Fig. 1 bis 4 weiter erläutert.At least one of these conductive layers has first internal contact devices to pads of associated semiconductor devices. According to the invention, these and / or a further conductive layer has a partial section which is part of at least one second reversibly formed contact device for connection to external supply lines. This external contact device has at least one spring element with an abutment in the housing and / or at least one locking screw. The variant with the spring element thus forms a self-locking contact device, in which an external supply line receives a plug connection with the contact device. The variant with locking screw is designed as a pre-clamp connection according to the prior art.
The inventive solution will be explained with reference to the embodiments of FIGS. 1 to 4 on.

Fig. 1 zeigt eine erste Ausgestaltung einer erfindungsgemäßen gehausten Halbleiterschaltungsanordnung im Schnitt.1 shows a first embodiment of a semiconductor semiconductor circuit arrangement according to the invention in section.

Fig. 2 zeigt eine zweite Ausgestaltung einer erfindungsgemäßen gehausten Halbleiterschaltungsanordnung im Schnitt.FIG. 2 shows a second embodiment of a semiconductor semiconductor circuit arrangement according to the invention in section.

Fig. 3 zeigt eine dritte Ausgestaltung einer erfindungsgemäßen gehausten Halbleiterschaltungsanordnung im Schnitt.Fig. 3 shows a third embodiment of a gehausten semiconductor circuit arrangement according to the invention in section.

Fig. 4 zeigt eine vierte Ausgestaltung einer erfindungsgemäßen gehausten Halbleiterschaltungsanordnung im Schnitt.4 shows a fourth embodiment of a semiconductor semiconductor circuit arrangement according to the invention in section.

Fig. 1 zeigt eine erste Ausgestaltung einer erfindungsgemäßen gehausten Halbleiterschaltungsanordnung (1) im Schnitt in einer Anordnung mit einem Kühlkörper (2) und einer Leiterplatte (7). Die Halbleiterschaltungsanordnung (1) ist hier als Leistungshalbleitermodul ausgestaltet. Dieses besteht aus einem Gehäuse (3), welches ein Substrat (5) teilweise umschließt. An diesem elektrisch isolierend ausgebildeten Substrat (5) ist der Kühlkörper (2) angeordnet und thermisch leitend mit dem Substrat (5) verbunden.1 shows a first embodiment of a semiconductor semiconductor circuit arrangement (1) according to the invention in section in an arrangement with a heat sink (2) and a printed circuit board (7). The semiconductor circuit arrangement (1) is designed here as a power semiconductor module. This consists of a housing (3), which encloses a substrate (5) partially. At this electrically insulated substrate (5), the heat sink (2) is arranged and thermally conductively connected to the substrate (5).

Die dem Inneren des Leistungshalbleitermoduls (1) zugewandte Seite des Substrats (5) ist ausgebildet als eine Mehrzahl von voneinander elektrisch isolierten Leiterbahnen (54). Auf diesen Leiterbahnen ist eine Mehrzahl von Halbleiterbauelementen (58), beispielhaft Leistungsdioden und / oder Leistungstransistoren und / oder integrierte Schaltkreise angeordnet und schaltungsgerecht verbunden. Zwischen dem Grundkörper (52) des Substrats und dem Kühlkörper (2) ist eine thermisch leitende Schicht (56) angeordnet.The interior of the power semiconductor module (1) facing side of the substrate (5) is formed as a plurality of mutually electrically insulated conductor tracks (54). A multiplicity of semiconductor components (58), for example power diodes and / or power transistors and / or integrated circuits, are arranged on these interconnects and are connected in a circuit-compatible manner. Between the base body (52) of the substrate and the heat sink (2), a thermally conductive layer (56) is arranged.

Weiterhin weist das Leistungshalbleitermodul (1) eine Verbindungseinrichtung (6) auf, die aus einem Folienverbund besteht. Dieser Folienverbund wird hier gebildet aus einer ersten (60) und einer zweiten (64) leitenden jeweils in sich strukturierten und somit Leiterbahnen ausbildenden Schicht und einer dazwischen angeordneten isolierenden Schicht (62). Die erste leitende Schicht (60) ist hier als Aluminiumfolie, die zweite (64) als eine Kupferfolie und die isolierende (62) als Kunststofffolie ausgebildet. Die jeweiligen Schichten (60, 62; 64) weisen eine der jeweiligen Funktion angepasste Schichtdicke zwischen 10µm und 500µm auf.Furthermore, the power semiconductor module (1) has a connection device (6), which consists of a film composite. This film composite is formed here from a first (60) and a second (64) conductive layer which is in each case structured in itself and thus forms conductor tracks and an insulating layer (62) arranged therebetween. The first conductive layer (60) is here formed as aluminum foil, the second (64) as a copper foil and the insulating (62) as a plastic film. The respective layers (60, 62, 64) have a layer thickness adapted to the respective function between 10 μm and 500 μm.

Die erste leitende Schicht (60) weist eine externe Kontakteinrichtung (600), hier ausgebildet als eine Lötverbindung, zur Leiterplatte (7) auf. Diese erste leitende Schicht (60) ist in sich strukturiert und bildet somit Leiterbahnen aus. Der Folienverbund (6) weist weiterhin schaltungsgerechte Durchkontaktierungen von Leiterbahnen dieser ersten leitenden Schicht (60) zur zweiten leitenden Schicht (64) bzw. dort ausgebildeten Leiterbahnen auf.The first conductive layer (60) has an external contact device (600), designed here as a solder connection, to the printed circuit board (7). This first conductive layer (60) is structured in itself and thus forms conductor tracks. The film composite (6) furthermore has circuit-compatible plated-through holes of printed conductors of this first conductive layer (60) to form the second conductive layer (64) or conductor tracks formed there.

Diese zweite leitende Schicht (64) dieses Folienverbunds (6) weist erste, als Punktschweißverbindungen ausgebildete innere Kontakteinrichtungen (640) zu Anschlussflächen (580) von Halbleiterbauelementen (58) auf. Alternativ sind hier Klebe-, Löt- oder auch Druckkontaktverbindungen möglich. Die Halbleiterbauelemente (58) sind hier als Leistungshalbleiterbauelemente, je ein Leistungstransistor und eine Leistungsdiode ausgebildet. Grundsätzlich ist hier allerdings die Anordnung beliebiger aktiver, beispielhaft in Ausgestaltung integrierter Schaltkreise, und / oder passiver elektronischer Bauelemente, beispielhaft in Ausgestaltung von Widerständen, möglich.This second conductive layer (64) of this film composite (6) has first inner contact devices (640) designed as spot-welded connections to connection surfaces (580) of semiconductor components (58). Alternatively, adhesive, solder or pressure contact connections are possible here. The semiconductor components (58) are designed here as power semiconductor components, depending on a power transistor and a power diode. Basically, however, the arrangement of any active, exemplary in design integrated circuits, and / or passive electronic components, for example in embodiment of resistors possible.

Erfindungsgemäß bildet ein Teil der zweiten leitenden Schicht (64) einen Teil einer zweiten externen Kontakteinrichtung (4), hier ein Lastanschluss, zur Verbindung mit einer externen Zuleitung (8). Hierzu ist ein Abschnitt (644) der zweiten leitenden Schicht (64) im Bereich der zweiten Kontakteinrichtung (4) in einer Führung (32) im Gehäuse (3) derart angeordnet, dass sie um mehr als 180 Grad gebogen ist und eine Kontaktfläche (642) zur externen Zuleitung (8) ausbildet.According to the invention, part of the second conductive layer (64) forms part of a second external contact device (4), here a load connection, for connection to an external supply line (8). For this purpose, a portion (644) of the second conductive layer (64) in the region of the second contact device (4) in a guide (32) in the housing (3) is arranged such that it is bent by more than 180 degrees and a contact surface (642 ) to the external supply line (8) is formed.

Die zweite Kontakteinrichtung (4) ist hierbei selbst arretierend ausgebildet. Hierzu weist diese zweite Kontakteinrichtung (4) ein Federelement (40) mit einem Widerlager (30) im Gehäuse (3) auf. Dieses Federelement (40) drückt mit seiner Kontaktfläche (402) derart auf die externe Zuleitung (8), dass diese Zuleitung zwischen der leitenden Schicht (64) und dem Federelement (40) geklemmt ist und somit die elektrisch leitende Verbindung zur zweiten leitenden Schicht (64) hergestellt ist.The second contact device (4) is in this case self-locking. For this purpose, this second contact device (4) has a spring element (40) with an abutment (30) in the housing (3). This spring element (40) presses with its contact surface (402) on the external lead (8) such that this lead is clamped between the conductive layer (64) and the spring element (40) and thus the electrically conductive connection to the second conductive layer ( 64).

Fig. 2 zeigt eine zweite Ausgestaltung einer erfindungsgemäßen gehausten Halbleiterschaltungsanordnung (1) im Schnitt. Hierbei entspricht der grundsätzliche Aufbau des Substrats (5) und des folienverbunds (6) demjenigen gemäß Fig. 1.FIG. 2 shows a second embodiment of a semiconductor semiconductor circuit arrangement (1) according to the invention in section. Here, the basic structure of the substrate (5) and of the film composite (6) corresponds to that of FIG. 1.

Die zweite Kontakteinrichtung (4) verbindet hier wiederum als externer Lastanschluss die zweite leitende Schicht (64) des Folienverbunds (6) mit einer externen Zuleitung (8). Bei dieser Ausgestaltung weist die zweite leitende Schicht (64) keine Biegung auf, sie ist ausschließlich in einem Teilabschnitt in einer Ausnehmung (32) des Gehäuses (3) geführt.Here again, the second contact device (4), as an external load connection, connects the second conductive layer (64) of the film composite (6) to an external supply line (8). In this embodiment, the second conductive layer (64) no bending, it is guided exclusively in a section in a recess (32) of the housing (3).

Der elektrische Kontakt zwischen der externen Zuleitung (8) und der zweiten leitenden Schicht (64) ist mittels eines Federelements (40) ausgebildet. Hierzu weist das Federelement (40) ein Widerlager (30) im Gehäuse (3) des Leistungshalbleitermoduls (1) auf. Durch Einstecken der externen Zuleitung (8) wird diese mit einer ersten Kontaktfläche (402) des Federelements (40) elektrisch leitend verbunden, gleichzeitig wird eine zweite Kontaktfläche (646) des geeignet geformten Federelements (40) auf die zweite leitende Schicht (64) gedrückt und bildet somit den elektrischen Kontakt aus.The electrical contact between the external lead (8) and the second conductive layer (64) is formed by means of a spring element (40). For this purpose, the spring element (40) has an abutment (30) in the housing (3) of the power semiconductor module (1). By inserting the external supply line (8), this is electrically conductively connected to a first contact surface (402) of the spring element (40), at the same time a second contact surface (646) of the suitably shaped spring element (40) is pressed onto the second conductive layer (64) and thus forms the electrical contact.

Die externe Zuleitung (8) kann hier beispielhaft als ein einzelnes Kabel oder als Kontakteinrichtung einer Leiterplatte ausgebildet sein.The external supply line (8) can be configured here by way of example as a single cable or as a contact device of a printed circuit board.

Fig. 3 zeigt eine dritte Ausgestaltung einer erfindungsgemäßen gehausten Halbleiterschaltungsanordnung (1) im Schnitt, wobei sich diese von derjenigen gemäß Fig. 2 dahingehend unterscheidet, dass hier die erste leitende Schicht (60) mit einer externen Zuleitung (8) verbunden ist.FIG. 3 shows a third embodiment of a semiconductor semiconductor circuit arrangement (1) according to the invention in section, whereby this differs from that according to FIG. 2 in that here the first conductive layer (60) is connected to an external supply line (8).

Da es vorteilhaft sein kann die erste leitende Schicht (60) dünner im Vergleich zur zweiten (64) auszubilden ist es hier bevorzugt die isolierende Schicht (62) auch im Bereich der zweiten Kontakteinrichtung (4) nicht von der ersten leitenden Schicht (60) zu entfernen.Since it may be advantageous to form the first conductive layer (60) thinner in comparison to the second (64), it is preferable that the insulating layer (62) is not in the region of the second contact device (4) from the first conductive layer (60) remove.

Die zweite Kontakteinrichtung (4) weist ebenso wie gemäß Fig. 2 eine erste Kontaktfläche (402) zur externen Zuleitung (8) sowie eine zweite Kontaktfläche (606) zur zugeordneten, hier der ersten, leitenden Schicht (60) auf. Da diese erste leitende Schicht (60) besonders geeignet ist für Steuer- und Hilfsanschlüsse ist es hier bevorzugt eine Mehrzahl gleichartiger zweiter Kontakteinrichtungen (4) nebeneinander anzuordnen und somit eine Mehrzahl eng benachbarter externer Verbindungen vorzusehen.As in the case of FIG. 2, the second contact device (4) has a first contact surface (402) for the external supply line (8) and a second contact surface (606) for the associated, here the first, conductive layer (60). Since this first conductive layer (60) is particularly suitable for control and auxiliary connections, it is preferred here to arrange a plurality of similar second contact devices (4) next to one another and thus to provide a plurality of closely adjacent external connections.

Die externe Zuleitung (8) kann hier beispielhaft als ein einzelnes Kabel oder als eine Ader eines Flachbandkabels ausgebildet sein.The external supply line (8) can be designed here by way of example as a single cable or as a core of a ribbon cable.

Fig.4 zeigt eine vierte Ausgestaltung einer erfindungsgemäßen gehausten Halbleiterschaltungsanordnung (1) im Schnitt. Hierbei entspricht der grundsätzliche Aufbau des Substrats und des Folienverbunds (6) demjenigen gemäß Fig. 2.4 shows a fourth embodiment of a semiconductor semiconductor circuit arrangement (1) according to the invention in section. Here, the basic structure of the substrate and of the film composite (6) corresponds to that of FIG. 2.

Die zweite Kontakteinrichtung (4) verbindet hier wiederum als Lastanschluss die zweite leitende Schicht (64) des Folienverbunds (6) mit einer externen Zuleitung.(8). Bei dieser Ausgestaltung weist die zweite leitende Schicht (64) ebenfalls keine Biegung auf, sie ist ausschließlich in einem Teilabschnitt in einer Ausnehmung (32) des Gehäuses (3) geführt.The second contact device (4) in turn connects the second conductive layer (64) of the film composite (6) with an external supply line (8) as a load connection. In this embodiment, the second conductive layer (64) also has no bending, it is guided exclusively in a section in a recess (32) of the housing (3).

Der elektrische Kontakt zwischen der externen Zuleitung (8) und der zweiten leitenden Schicht (64) ist mittels einer Schraub- Klemmverbindung mit einer Feststellschraube (80) ausgebildet. Hierzu weist der rahmenartige Teil des Gehäuses (3) eine Aufnahme (34) mit einem Gewinde auf. Die zweite leitende Schicht (64) weist ein mit dem Gewinde fluchtende Ausnehmung (648) auf. Zwischen der leitenden Schicht (64) und der externen Zuleitung (8), die hier als flächiges Metallformteil und einer passend angeordneter Ausnehmung (82) ausgebildet ist, ist mindestens ein weiteres Metallformteil (92) mit einer Ausnehmung angeordnet um Drehmomente der Schraubverbindung aufzunehmen und die daraus resultierende Belastung auf die erste leitende Schicht (64) möglichst gering zu halten. Der Deckel des Leistungshalbleitermoduls (1) weist ebenso eine fluchtende Ausnehmung (36) zur Aufnahme der Feststellschraube (80) auf.The electrical contact between the external lead (8) and the second conductive layer (64) is formed by means of a screw-clamp connection with a locking screw (80). For this purpose, the frame-like part of the housing (3) has a receptacle (34) with a thread. The second conductive layer (64) has a threaded recess (648). Between the conductive layer (64) and the external supply line (8), which is formed here as a flat metal molded part and a suitably arranged recess (82), at least one further metal molded part (92) is arranged with a recess to receive torques of the screw and the resulting stress on the first conductive layer (64) to minimize. The cover of the power semiconductor module (1) also has an aligned recess (36) for receiving the locking screw (80).

Claims (8)

Gehauste Halbleiterschaltungsanordnung (1) mit mindestens einem Substrat (5) mit Leiterbahnen (54) und hierauf schaltungsgerecht angeordneten Halbleiterbauelementen (58) und mit einer Verbindungseinrichtung (6),
aus einem Folienverbund aus mindestens zwei elektrisch leitenden Schichten (60, 64) mit jeweils einer dazwischen angeordneten isolierenden Schicht (62), wobei mindestens eine leitende Schicht (60, 64) in sich strukturiert ist und somit Leiterbahnen ausbildet ,
wobei mindestens eine leitende Schicht (60, 64) erste Kontakteinrichtungen (640) zu Anschlussflächen (580) der Halbleiterbauelemente (58) aufweist und wobei mindestens ein Teil dieser und / oder einer weiteren leitenden Schicht (60, 64) ein Teil mindestens einer zweiten Kontakteinrichtung (4) zur reversiblen Verbindung mit einer externen Zuleitungen (8) ist,
wobei die zweite Kontakteinrichtung (4) mindestens ein Federelement (40) mit einem Widerlager (32) im Gehäuse (3) und / oder mindestens eine Feststellschraube (80) aufweist.Semi-conductor semiconductor circuit arrangement (1) having at least one substrate (5) with interconnects (54) and semiconductor components (58) arranged thereon in a circuitally appropriate manner and having a connection device (6),
from a film composite of at least two electrically conductive layers (60, 64), each with an insulating layer (62) arranged therebetween, wherein at least one conductive layer (60, 64) is structured in itself and thus forms printed conductors,
wherein at least one conductive layer (60, 64) comprises first contact means (640) to pads (580) of the semiconductor devices (58) and wherein at least a portion of this and / or another conductive layer (60, 64) is part of at least one second contact means (4) is for reversible connection to an external supply lines (8),
wherein the second contact device (4) has at least one spring element (40) with an abutment (32) in the housing (3) and / or at least one locking screw (80). Gehauste Halbleiterschaltungsanordnung nach Anspruch 1,
wobei mindestens ein Halbleiterbauelement (58) ein Leistungshalbleiterbauelement, wie ein Leistungstransistor oder eine Leistungsdiode ist.Semi-conductor semiconductor circuit arrangement according to Claim 1,
wherein at least one semiconductor device (58) is a power semiconductor device, such as a power transistor or a power diode. Gehauste Halbleiterschaltungsanordnung nach Anspruch 1,
wobei mindestens ein Halbleiterbauelement (58) ein integrierter Schaltkreis ist:Semi-conductor semiconductor circuit arrangement according to Claim 1,
wherein at least one semiconductor device (58) is an integrated circuit: Gehauste Halbleiterschaltungsanordnung nach Anspruch 1,
die Schichtdicken der leitenden und isolierenden Schichten (60, 62, 64) zwischen 10µm und 500µm beträgt.Semi-conductor semiconductor circuit arrangement according to Claim 1,
the layer thicknesses of the conductive and insulating layers (60, 62, 64) is between 10 μm and 500 μm. Gehauste Halbleiterschaltungsanordnung nach Anspruch 1,
wobei das Federelement (40) der zweiten Kontakteinrichtung (4) eine erste Kontaktfläche (402) zur externen Zuleitung sowie eine zweite Kontaktfläche (606, 646) zur zugeordneten leitenden Schicht (60, 64) aufweist.Semi-conductor semiconductor circuit arrangement according to Claim 1,
wherein the spring element (40) of the second contact device (4) has a first contact surface (402) for external supply and a second contact surface (606, 646) to the associated conductive layer (60, 64). Gehauste Halbleiterschaltungsanordnung nach Anspruch 1,
wobei das Federelement (40) der zweiten Kontakteinrichtung (4) eine erste Kontaktfläche (402) und die zugeordnete leitende Schicht (60, 64) eine Kontaktfläche (642) zur externen Zuleitung (8) aufweisen.Semi-conductor semiconductor circuit arrangement according to Claim 1,
wherein the spring element (40) of the second contact device (4) has a first contact surface (402) and the associated conductive layer (60, 64) has a contact surface (642) to the external supply line (8). Gehauste Halbleiterschaltungsanordnung nach Anspruch 1,
wobei ein Abschnitt der leitenden Schicht (60, 64) im Bereich der zweiten Kontakteinrichtung (4) eine Führung (32) im Gehäuse (3) aufweist.Semi-conductor semiconductor circuit arrangement according to Claim 1,
wherein a portion of the conductive layer (60, 64) in the region of the second contact device (4) has a guide (32) in the housing (3). Gehauste Halbleiterschaltungsanordnung nach Anspruch 1,
wobei die erste Kontakteinrichtung (580) als Lötverbindung oder als Klebeverbindung oder als Druckkontaktierung oder als Punktschweißverbindung ausgebildet ist.Semi-conductor semiconductor circuit arrangement according to Claim 1,
wherein the first contact device (580) is designed as a solder connection or as an adhesive connection or as a pressure contact or as a spot-welded connection.
EP07011533.2A 2006-06-14 2007-06-13 Encased PCB switch assembly with contact device Active EP1898466B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102006027482A DE102006027482B3 (en) 2006-06-14 2006-06-14 Housed semiconductor circuit arrangement e.g. power semiconductor module, has two conductive layers with contact device to joint surface of semiconductor component, where part of conductive layers is part of another contact device

Publications (3)

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EP1898466A2 true EP1898466A2 (en) 2008-03-12
EP1898466A3 EP1898466A3 (en) 2008-05-07
EP1898466B1 EP1898466B1 (en) 2017-08-23

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EP07011533.2A Active EP1898466B1 (en) 2006-06-14 2007-06-13 Encased PCB switch assembly with contact device

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