EP1799402A4 - Method and apparatus for improved chemical mechanical planarization - Google Patents
Method and apparatus for improved chemical mechanical planarizationInfo
- Publication number
- EP1799402A4 EP1799402A4 EP05808056A EP05808056A EP1799402A4 EP 1799402 A4 EP1799402 A4 EP 1799402A4 EP 05808056 A EP05808056 A EP 05808056A EP 05808056 A EP05808056 A EP 05808056A EP 1799402 A4 EP1799402 A4 EP 1799402A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- chemical mechanical
- mechanical planarization
- improved chemical
- improved
- planarization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US61694404P | 2004-10-06 | 2004-10-06 | |
US63925704P | 2004-12-27 | 2004-12-27 | |
PCT/US2005/035979 WO2006042010A1 (en) | 2004-10-06 | 2005-10-05 | Method and apparatus for improved chemical mechanical planarization |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1799402A1 EP1799402A1 (en) | 2007-06-27 |
EP1799402A4 true EP1799402A4 (en) | 2009-12-16 |
Family
ID=36148660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP05808056A Withdrawn EP1799402A4 (en) | 2004-10-06 | 2005-10-05 | Method and apparatus for improved chemical mechanical planarization |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1799402A4 (en) |
JP (1) | JP5025478B2 (en) |
KR (1) | KR101165114B1 (en) |
TW (1) | TWI270438B (en) |
WO (1) | WO2006042010A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102131618A (en) * | 2008-06-26 | 2011-07-20 | 3M创新有限公司 | Polishing pad with porous elements and method of making and using same |
WO2010009420A1 (en) * | 2008-07-18 | 2010-01-21 | 3M Innovative Properties Company | Polishing pad with floating elements and method of making and using the same |
JP5551479B2 (en) * | 2010-03-19 | 2014-07-16 | ニッタ・ハース株式会社 | Polishing apparatus, polishing pad and polishing information management system |
US9751189B2 (en) * | 2014-07-03 | 2017-09-05 | Applied Materials, Inc. | Compliant polishing pad and polishing module |
US11325221B2 (en) * | 2017-11-16 | 2022-05-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with multipurpose composite window |
US11192215B2 (en) * | 2017-11-16 | 2021-12-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with pad wear indicator |
JP7010166B2 (en) * | 2018-07-24 | 2022-01-26 | 株式会社Sumco | Work double-sided polishing device and double-sided polishing method |
CN109616412A (en) * | 2018-12-14 | 2019-04-12 | 大连理工大学 | A kind of semiconductor wafer processing method that photochemistry is combined with mechanical polishing |
JP7317440B2 (en) * | 2019-04-15 | 2023-07-31 | 株式会社ディスコ | dressing tool |
KR102570825B1 (en) * | 2020-07-16 | 2023-08-28 | 한국생산기술연구원 | Polishing pad including porous protruding pattern and polishing apparatus including the same |
CN115365922B (en) * | 2022-10-24 | 2023-02-28 | 西安奕斯伟材料科技有限公司 | Grinding wheel, grinding equipment and silicon wafer |
CN116276337B (en) * | 2023-04-23 | 2023-11-07 | 南京茂莱光学科技股份有限公司 | Processing method and processing device for high-flatness planar glass |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9309972D0 (en) * | 1993-05-14 | 1993-06-30 | De Beers Ind Diamond | Tool insert |
US5795218A (en) * | 1996-09-30 | 1998-08-18 | Micron Technology, Inc. | Polishing pad with elongated microcolumns |
JPH10225864A (en) * | 1997-02-17 | 1998-08-25 | Sony Corp | Polishing pad and manufacture thereof and polishing method of wafer using its |
JP2000158327A (en) | 1998-12-02 | 2000-06-13 | Rohm Co Ltd | Polishing cloth for chemimechanical polishing and chemimechanical polisher using same |
US20020077037A1 (en) * | 1999-05-03 | 2002-06-20 | Tietz James V. | Fixed abrasive articles |
US6962524B2 (en) * | 2000-02-17 | 2005-11-08 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US6612916B2 (en) * | 2001-01-08 | 2003-09-02 | 3M Innovative Properties Company | Article suitable for chemical mechanical planarization processes |
JP2003103470A (en) * | 2001-09-28 | 2003-04-08 | Dainippon Printing Co Ltd | Polishing sheet having recessed part in polishing layer |
JP4165118B2 (en) | 2002-05-14 | 2008-10-15 | ソニー株式会社 | Polishing apparatus, polishing member thickness detection method, and polishing member thickness detection apparatus |
-
2005
- 2005-10-05 EP EP05808056A patent/EP1799402A4/en not_active Withdrawn
- 2005-10-05 WO PCT/US2005/035979 patent/WO2006042010A1/en active Application Filing
- 2005-10-05 JP JP2007535807A patent/JP5025478B2/en not_active Expired - Fee Related
- 2005-10-05 KR KR1020077010346A patent/KR101165114B1/en active IP Right Grant
- 2005-10-06 TW TW094135023A patent/TWI270438B/en not_active IP Right Cessation
Non-Patent Citations (1)
Title |
---|
No further relevant documents disclosed * |
Also Published As
Publication number | Publication date |
---|---|
TWI270438B (en) | 2007-01-11 |
WO2006042010A1 (en) | 2006-04-20 |
JP2008516452A (en) | 2008-05-15 |
KR101165114B1 (en) | 2012-07-12 |
JP5025478B2 (en) | 2012-09-12 |
TW200626291A (en) | 2006-08-01 |
KR20070057271A (en) | 2007-06-04 |
EP1799402A1 (en) | 2007-06-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1799402A4 (en) | Method and apparatus for improved chemical mechanical planarization | |
EP1810321A4 (en) | Polishing apparatus and polishing method | |
GB0417328D0 (en) | Apparatus and method | |
GB0425008D0 (en) | Method and apparatus | |
EP1807186A4 (en) | Apparatus and method for solid-liquid contact | |
EP1851002A4 (en) | Polishing apparatus and polishing method | |
GB2412393B (en) | Apparatus and method | |
GB0406336D0 (en) | Apparatus and method | |
HK1088199A1 (en) | Biopsy apparatus and method | |
EP1800797A4 (en) | Polishing apparatus and polishing method | |
GB0507538D0 (en) | Apparatus and method | |
PT1831102E (en) | Chemical process and apparatus | |
GB2433267B (en) | Special reaction method and special reaction apparatus | |
GB0424224D0 (en) | Encoding apparatus and method | |
GB0504159D0 (en) | Apparatus and method | |
GB0502965D0 (en) | Apparatus and method | |
EP1796153A4 (en) | Ashing method and ashing apparatus | |
GB0419915D0 (en) | Apparatus and method | |
SG119232A1 (en) | Desalination apparatus and method | |
GB0409691D0 (en) | Apparatus and method | |
TWI368184B (en) | Drawing apparatus and drawing method | |
AP2007003949A0 (en) | Apparatus and method | |
GB0501979D0 (en) | Apparatus and method | |
GB0416471D0 (en) | Apparatus and method | |
EP1608101A4 (en) | Encrypting apparatus and encrypting method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20070427 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR |
|
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20091116 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: B24B 37/04 20060101AFI20091110BHEP Ipc: B24D 11/00 20060101ALI20091110BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
18W | Application withdrawn |
Effective date: 20110411 |