EP1786711B1 - Credential substrate rotator and processing module - Google Patents
Credential substrate rotator and processing module Download PDFInfo
- Publication number
- EP1786711B1 EP1786711B1 EP05803865A EP05803865A EP1786711B1 EP 1786711 B1 EP1786711 B1 EP 1786711B1 EP 05803865 A EP05803865 A EP 05803865A EP 05803865 A EP05803865 A EP 05803865A EP 1786711 B1 EP1786711 B1 EP 1786711B1
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- EP
- European Patent Office
- Prior art keywords
- substrate
- support
- credential
- substrate support
- rotator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
- B65H29/58—Article switches or diverters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H5/00—Feeding articles separated from piles; Feeding articles to machines
- B65H5/02—Feeding articles separated from piles; Feeding articles to machines by belts or chains, e.g. between belts or chains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H15/00—Overturning articles
- B65H15/016—Overturning articles employing rotary or reciprocating elements supporting transport means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
- B65H2301/30—Orientation, displacement, position of the handled material
- B65H2301/33—Modifying, selecting, changing orientation
- B65H2301/332—Turning, overturning
- B65H2301/3321—Turning, overturning kinetic therefor
- B65H2301/33214—Turning, overturning kinetic therefor about an axis perpendicular to the direction of displacement and parallel to the surface of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2402/00—Constructional details of the handling apparatus
- B65H2402/10—Modular constructions, e.g. using preformed elements or profiles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2404/00—Parts for transporting or guiding the handled material
- B65H2404/10—Rollers
- B65H2404/14—Roller pairs
- B65H2404/142—Roller pairs arranged on movable frame
- B65H2404/1421—Roller pairs arranged on movable frame rotating, pivoting or oscillating around an axis, e.g. parallel to the roller axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2511/00—Dimensions; Position; Numbers; Identification; Occurrences
- B65H2511/20—Location in space
- B65H2511/21—Angle
- B65H2511/212—Rotary position
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2511/00—Dimensions; Position; Numbers; Identification; Occurrences
- B65H2511/20—Location in space
- B65H2511/23—Coordinates, e.g. three dimensional coordinates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2553/00—Sensing or detecting means
- B65H2553/60—Details of intermediate means between the sensing means and the element to be sensed
- B65H2553/61—Mechanical means, e.g. contact arms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2601/00—Problem to be solved or advantage achieved
- B65H2601/40—Increasing or maximizing
- B65H2601/42—Increasing or maximizing entities relating to the handling machine
- B65H2601/422—Versatility
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/10—Handled articles or webs
- B65H2701/19—Specific article or web
- B65H2701/1914—Cards, e.g. telephone, credit and identity cards
Definitions
- Credentials include identification cards, driver's licenses, passports, and other documents. Such credentials are formed from credential substrates including paper substrates, plastic substrates, cards and other materials. Such credentials generally include printed information, such as a photo, account numbers, identification numbers, and other personal information. A secure overlaminate may also be laminated to the surfaces of the credential substrate to protect the surfaces from damage and, in some instances, provide a security feature (e.g., hologram). Additionally, credentials can include data that is encoded in a smartcard chip, a magnetic stripe, or a barcode, for example.
- FR 2 770 174 discloses a paper handling feed drum that rotates on a support to position the paper in front of an optical scanner or a printer.
- a paper sensor activates an actuator on the drum which co-operates with a detector on the drum so only when the handling drum is in the correct position can paper be delivered for processing.
- Embodiments of the present invention provide solutions to these and other problems, and offer other advantages over the prior art.
- a credential substrate rotator and a system comprising a credential substrate module and an adjoining credential manufacturing device as claimed in the appended claims.
- the present invention is generally directed to credential substrate processing including substrate rotating and data encoding.
- a substrate rotator that includes a substrate support, a substrate feeder and a substrate sensor.
- the substrate support is configured to support a substrate in a substrate support plane and rotate about a central axis.
- the substrate feeder is configured to feed a substrate along the substrate support plane.
- the substrate sensor includes a substrate position indicator that is aligned with the central axis and has first and second positions. The first position indicates an absence of a substrate from a predetermined location of the substrate support. The second position indicates a presence of a substrate in the predetermined location of the substrate support.
- Another embodiment of the invention is directed to a credential substrate processing module that includes the substrate rotator described above.
- the credential substrate processing module includes a credential substrate rotator, a first data encoder and a module controller.
- the credential substrate rotator includes a substrate support and a substrate feeder.
- the substrate support is configured to support a substrate in a substrate support plane and rotate about a central axis.
- the substrate support includes indexed angular positions including a substrate receiving position, in which the substrate support is positioned to receive a substrate fed from an adjoining stand-alone credential manufacturing device, and a first encoding position.
- the first data encoder is configured to encode data to a substrate presented by the substrate rotator when the substrate support is oriented with the first encoding position.
- the module controller is configured to control the substrate rotator and the first encoder module and communicate with a controller of the stand-alone credential manufacturing device
- Embodiments of the present invention are generally related to a credential substrate processing module 100 (hereinafter “module") that attaches to a stand-alone credential manufacturing device (CMD) 102 to form a credential manufacturing system 104, as illustrated in the exploded perspective view of FIG. 1 .
- FIG. 2 is a schematic diagram of the system 104 in accordance with several embodiments of the invention.
- CMD 102 and module 100 of the present invention will be depicted as being operable with credential substrates that are generally in the form of card substrates, it should be understood that the CMD 102 and the module 100 can be configured for use with other types of credential substrates such as, for example, paper substrates, plastic substrates, substrates used to form passports, and other credential-related materials.
- system 104 can be customized to the needs of a particular user.
- the ability to select only the features that are desired allows the user to avoid the cost of purchasing undesired or unnecessary credential processing functions.
- the user has the option of obtaining the module 100 and installing it in the field. Additionally, the module 100 itself can be updated with different credential substrate processing components.
- the stand-alone CMD 102 includes at least one credential substrate processing component 106, such as a printing device for printing to a surface of a credential substrate 108, a laminating device for laminating a surface of a credential substrate 108, and/or another credential substrate processing component.
- a printing device for printing to a surface of a credential substrate 108
- a laminating device for laminating a surface of a credential substrate 108
- another credential substrate processing component is described in U.S. Application Numbers 11/135,619 , 10/647,666 and 10/647,798 .
- stand-alone CMD is intended to describe a CMD 102 that is configured for operation by itself while being configured for connection to the module 100. That is, the CMD 102 is configured to perform a credential processing function without the aid of the module 100, whereas the module 100 is generally configured for operation only with the CMD 102.
- the CMD 102 includes a substrate transport mechanism 110 for feeding the substrate 108 through the CMD 102 including presenting the substrate 108 to the substrate processing component 106 for processing and discharging the substrate 108 through a substrate output 112.
- the transport mechanism 110 can include, for example, motor-driven rollers including pinch roller assemblies, such as assemblies 114, or other substrate feeding components designed to feed the particular credential substrate 108 being processed.
- a CMD controller 116 operates to control the operation of the CMD 102 including, for example, the processing mechanism 106 and the transport mechanism 110.
- the controller 116 can be accessed directly by a user through buttons 118 on a control panel 120 of the device 102, or through a credential production application and/or driver software 122 running on a computer 124.
- Power is preferably supplied to the CMD through a cable 126 connected to a line level power outlet.
- power can be supplied to the CMD 102 from a battery or other power supply.
- Several substrates 108 can be contained in a substrate supply 128 of the CMD 102, from which the substrate transport mechanism 110 can receive individual substrates 108 for feeding through the CMD 102.
- a hopper (not shown) can be positioned to collect substrates that are discharged through the substrate output 112.
- a housing section 130 FIG. 1 ) covers the components of the CMD 102 including the substrate output end of the CMD 102 when it is operating as a stand-alone unit.
- the module 100 is configured to couple to the CMD 102 and perform processing of credential substrates 108 received from the CMD 102 using at least one substrate processing component 150.
- the module 100 is configured to be mounted to the CMD 102 such that a substrate input 152 of the module 100 is in substrate handoff alignment with the substrate output 112 of the CMD.
- substrates 108 can be fed between the substrate input 152 of the module 100 and the substrate output 112 of the CMD 102, as shown in FIG. 2 .
- the module 100 includes brackets 154 ( FIG. 3 ) that mate to the CMD 102 using screws or other suitable fasteners to mount the module 100 to the CMD 102 in substrate handoff alignment.
- the module 100 preferably includes a housing 156 that mates with the housing 130 of the CMD 102, as shown in FIG. 1 .
- the module 100 can pass the substrate 108 back to the CMD 102 through the substrate input 152 for additional processing by the substrate processing component 106, or discharge the substrate through a substrate output 158.
- the at least one substrate processing component 150 can include a substrate rotator, one or more a data encoders, and/or other credential substrate processing components.
- Substrates 108 can be driven through the module 100 by substrate feeding components 160, such as drive and idler rollers and pinch roller pairs, or other substrate feeding components that are suitable for feeding the particular type of substrate 108 being processed.
- the module 100 includes a module controller 162 that can control the at least one substrate processing component 150 and the substrate feeding components 160 and is separate from the controller 116 of the CMD 102.
- At least one cable 164 ( FIG. 2 ) connects the controllers 162 and 116 together to facilitate communication there between. Additionally, power can be supplied to the module 100 through the one or more cables 164.
- the controllers 162 and 116 communicate with each other through the at least one cable 164 to synchronize substrate feeding operations, provide processing instructions in accordance with a credential processing job produced by the application and/or the driver software 122, and communicate other information useful in the processing of substrates 108.
- the module controller 162 can access memory 166 ( FIG. 2 ), in which firmware, default module settings, and other information can be stored.
- the controller 116 can also be provided access to the memory 166 and the module controller 162 can be provided access to memory of the CMD 102.
- the substrate processing component 150 of the module 100 includes a substrate rotator 170, shown schematically in FIG. 4 .
- the substrate rotator 170 is configured to rotate a credential substrate 108 that is received from the CMD 102 to different angular positions.
- the substrate rotator 170 can invert the substrate 108 then send the substrate 108 back to the stand-alone CMD 102 for additional processing.
- FIGS. 5-7 Perspective, side and exploded perspective views of the substrate rotator 170 in accordance with embodiments of the invention are respectively shown in FIGS. 5-7 .
- FIGS. 8 and 9 are top plan views of the module 100 that illustrate features of the rotator 170.
- the substrate rotator 170 includes stub shafts 172 and 174 connected to a substrate support 176.
- the substrate support 176 defines a substrate support plane 178 ( FIG. 6 ), in which the substrate 108 is supported and fed by the rotator 170.
- the stub shafts 172 and 174 are respectively supported between opposing side walls 180 and 182 shown in FIG. 3 .
- the substrate support 176 rotates about a central axis 184 ( FIG. 4 ) that is aligned with the stub shafts 172 and 174.
- the central axis 184 extends through the substrate 108 supported by the substrate support 176. Accordingly, the substrate support plane 178 and any substrate 108 held within the substrate support 176 are rotated about the central axis 184 as the substrate support 176 is rotated.
- the substrate support 176 includes first and second sections 186 and 188 that are joined together by screws 190.
- the substrate support also includes front and rear substrate guides 192 and 194 having flared ports 196 and 198, respectively, through which substrates 108 are received and discharged.
- a central opening 200 in the substrate support 176 accommodates a drive roller 202 and an idler pinch roller 204, respectively, which form a substrate feeder 206.
- the first and second sections 186 and 188 of the substrate support 176 each include a drive roller support 208 that is configured to receive a bearing or bushing 210, for rotatable support of a shaft 212 of the drive roller 202.
- One end 214 of the shaft 212 extends through the support 208 of the first section 186 and is attached to a gear 216 (e.g., a spur gear) that engages a gear 218, which is driven by a motor (not shown) driving stub shaft 172.
- a gear 216 e.g., a spur gear
- the first and second sections 186 and 188 of the substrate support 176 each include a pinch roller support 220 that is configured to receive ends of a spring member 222, which extends through a hub 224 of the pinch roller 204.
- the pinch roller 204 is configured to rotate about the spring member 222 and is biased by the spring member 222 toward the drive roller 202 for contact engagement therewith. Accordingly, the pinch roller 204 is configured for rotation and movement toward and away from the drive roller 202.
- the pinch roller 204 pinches the substrate 108 against the drive roller 202 and the drive roller 202 either holds the substrate 108 in the substrate support plane 178, or is driven to feed the substrate 108 in the desired direction along the substrate support plane 178 while the pinch roller 204 responsively rotates in accordance with the direction the substrate 108 is driven.
- the pinching force applied by the pinch roller 204 to the substrate 108 is preferably sufficient to hold or clamp the substrate 108 in place.
- the first section 186 of the substrate support 176 is attached with screws 226 or other means to a support gear 228, through which an end of the stub shaft 172 extends.
- the support gear 228 is driven by a motor for rotation about the stub shaft 172.
- the rotation of the support gear 220 rotates the substrate support 176 and a substrate 108 received between the drive and pinch rollers 202 and 204, about the central axis 184 that is co-axially aligned with the central axis 184 of the stub shafts 172 and 174, and is aligned with the central plane of the substrate 108 supported between the drive and pinch rollers 202 and 204.
- the stub shaft 172 and the gear support 228 are driven by motors through an appropriate gear arrangement in a gear housing 230 ( FIG. 3 ).
- the stub shaft 172 is received within the gear housing 230 and serves to drive the gear 218 to drive the gear 216, which in turn drives the shaft 212 of the drive roller 202.
- the stub shaft 172 is preferably driven by a stepper motor, or other suitable motor.
- a stepper motor (not shown) is also preferably used for driving the gear support 228 in a suitable manner to rotate the attached substrate support 176 about the central axis 184.
- the stepper motor and the motor driving the stub shaft 172 are controlled by the controller 162 to rotate the substrate support 176 and the substrate support plane 178 in any desired angular position and to feed the substrate 108 relative to the substrate support 176 along the substrate support plane 178.
- the drive roller 202 is rotated in the opposite direction of the rotation of the gear support 228 to maintain the substrate 108 in the center of the substrate support 176.
- the controller 162 drives the drive roller 202 in a clockwise direction to prevent the substrate 108 from moving relative to the substrate support 176. If the drive roller 202 was not driven in this manner, the gear 216 would roll over the gear 218 causing the drive roller 202 to rotate in the same direction (clockwise or counterclockwise) of the support gear 228 thereby moving the substrate 108 relative to the substrate support 176.
- One advantage to maintaining the substrate 108 substantially in the center of the substrate support 176 during rotating operations is that it reduces the space required to perform the substrate rotating operation. As a result, the size of the module 100 can be formed smaller than would be possible if the substrate 108 moved relative to the substrate support 176 during rotating operations.
- the rotator 170 includes a substrate sensor 240 that detects the presence or absence of a substrate 108 at a predetermined location relative to the substrate support 176.
- the substrate sensor 240 does not utilize an electrical connection, such as a slip ring connection, between the rotating substrate support 176 and the nonrotating controller 162.
- the substrate sensor 240 of the present invention comprises a mechanical switch 242 mounted to the substrate support 176 that is moved from a first position 244 ( FIGS. 5 and 8 ) when the substrate 108 is not fully loaded into the substrate support 176 or is absent from the predetermined location, to a second position 246 ( FIG. 9 ) when a substrate 108 is loaded into the substrate support 176 or is present in the predetermined location.
- the switch 242 is moved to the second position 246 when the substrate 108 is fully seated in the desired position (e.g., centered) in the substrate support 176 between the driver and pinch rollers 202 and 204.
- One embodiment of the switch 242 of the substrate sensor 240 includes a lever arm 250 that pivots about a pin 252 mounted to the second section 188 of the substrate support 176.
- a spring 254, or other suitable biasing member biases the lever 250 toward the first position 244, in which an end 256 protrudes into the substrate path or the support plane 178 and an opposing end 258 is displaced away from the second section 188 of the substrate support 176 along the central axis 184.
- the end 258 includes a protrusion 260 that extends through an opening 262 in the stub shaft 174 and is received by a pin trigger 264 in a notch 266.
- the pin trigger 264 is coaxial with the central axis 184.
- the stub shaft 174 and the pin trigger 264 are configured to rotate with the substrate support 176 about the central axis 184.
- a portion 267 of the pin trigger 264 extends outside of the stub shaft 174, as shown in FIGS. 5 and 8 .
- a pin sensor 270 detects the first or second position of the switch 242 and provides a signal indicating such to the module controller 162 or the CMD controller 116.
- the pin sensor 270 is a slotted optical sensor that includes a receiver 271 and an emitter 272, between which the portion 267 of the pin trigger 264 extends when the lever arm 250 is in the first position 244, as shown in FIGS. 5 and 8 .
- the pin sensor 270 provides an output signal to the module controller 162 or the CMD controller 116, that indicates the absence of the portion 167 of the pin trigger 264 from between the emitter and receiver of the pin sensor 270 thereby indicating the absence of a substrate 108 from the predetermined location of the substrate support 176.
- the substrate 108 engages the end 256 of the lever 250 and moves the end 256 out of the substrate path as the substrate 108 is driven by the drive roller 202 to move the lever 250 from the first position 244 toward the second position 246 ( FIG. 9 ).
- the movement of the end 256 of the lever 250 causes the opposing end 258 and the connected trigger pin 264 to move along the central axis 184 such that the portion 267 of the pin trigger 264 is retracted within the shaft 174 and withdrawn from the pin sensor 270.
- the output signal from the pin sensor 270 can then indicate that the switch 242 is in the second position 246 and that the substrate 108 is loaded into the substrate support 176 at the predetermined location of the substrate support 176.
- the rotator 170 is preferably configured to align the substrate support plane 178 at any desired angle.
- the rotator 170 is configured to rotate the substrate support 176 and the corresponding support plane 178 about the central axis 184 to a plurality of indexed or predefined angular positions, such as those shown in FIGS. 4 and 10-14 .
- One such indexed angular position is a substrate receiving position, indicated by the substrate support plane 178A ( FIGS. 4 and 12 ), in which the substrate support plane 178 is aligned such that a substrate 108 can be transferred between the rotator 170 and the output 112 of the CMD 102.
- a substrate inversion is performed by the rotator 170 by rotating the substrate support 176 180° such that the substrate support plane 178 is substantially realigned with the substrate receiving position 178A.
- the substrate 108 can then be fed back to the output 112 of the CMD 102 through the input 152 for additional processing.
- Other indexed angular positions will be discussed below.
- Embodiments of the present invention include the use of the above-described substrate sensor with other substrate rotators, including substrate rotators that are not components of credential manufacturing device modules.
- the substrate processing component 150 includes one or more data encoders 300, shown in FIG. 4 , for encoding data to the substrate 108.
- the module 100 includes one or more data encoders 300 and the rotator 170.
- FIGS 10-14 are simplified side cross-sectional views of embodiments of the module 100 connected to the CMD 102 (partial view).
- the data encoders 300 can each be located in one of a plurality of bays in the housing of the module, such as bay 302 or bay 304.
- Each data encoder 300 can include a data writer 306 configured to write data to a memory chip, a bar code, or other component of the substrate 108, and a data reader 308 configured to read data from the substrate 108, in accordance with known methods.
- the encoders 300 can be either a contact encoder 300A configured to encode the substrate 108 through direct contact, or a proximity encoder 300B configured to perform proximity or radio frequency encoding of the substrate 108 as shown in FIG. 10 .
- the encoding can be conducted in accordance with a standardized method such as, for example, HID®, iCLASStm, MIFARE, Legic, or other encoding method.
- One embodiment of the encoders 300 includes a housing 310 that is configured to contain the circuit boards and components of multiple types of proximity encoders and readers.
- a housing 310 can contain an HID® iCLASS proximity encoder and reader boards, MIFARE proximity encoder and reader boards, or Legic proximity encoder and reader boards.
- HID® iCLASS proximity encoder and reader boards MIFARE proximity encoder and reader boards
- Legic proximity encoder and reader boards Such a housing 310 provides a cost savings since there is no need to produce multiple housing types. Additionally, the single standardized housing 310 simplifies the installation of the encoders 300 in the module 100.
- the housing 310 includes a bottom portion 312 and a top portion 314 that is configured to snap-fit to the bottom portion 312. Shoulder portions within the housing 310 provide support for the proximity encoding and reading boards.
- the housing 310 includes multiple shoulder portions to accommodate the different types of boards in different locations within the housing 310. For example, shoulder portions 316 can be positioned and the interior of the housing 310 can be shaped, to receive an iCLASS board 318, whereas shoulder portions 320 can be positioned and the interior of the housing 310 can be shaped, to receive a MIFARE board 322, as shown in FIG. 10 .
- the housing 310 includes a base plate 324.
- the base plate 324 covers an opening of the bay 304 of the module 100 when the encoder 300 is installed.
- Cables connect the encoder modules 300 to the module controller 162 of the module 100 to provide a communication link therewith. Power can also be supplied through the cables.
- the cables connecting the encoder modules 300 to the module controller 162 are multipin (e.g., 8-pin) cables. Identification of the particular encoder 300 that is installed is automatically determined based upon the pins that are active/inactive in the cable. This can be accomplished using a look-up table contained in the memory 166, or other suitable method.
- one embodiment of the module 100 includes a "plug and play" feature that quickly identifies the setup of the module 100 for the module controller 162, the CMD controller 116 and/or the substrate producing application 122.
- the substrate processing job can include, for example, printing instructions, laminating instructions, encoding instructions, rotating instructions, and other substrate processing instructions.
- the rotator 170 is positioned in a receiving position indicated by substrate support plane 178A ( FIGS. 4 and 12 ), in which the substrate support 176 is in substrate handoff alignment with the substrate output 112 of the CMD 102.
- the substrate support plane 178A is generally horizontally aligned with the substrate path that a substrate 108 follows when discharge through the substrate output 112, as shown in FIG. 4 .
- One embodiment of the module 100 includes a substrate sensor 330 ( FIGS. 2 and 4 ) at the substrate input 152, such as a slotted optical sensor, that provides an indicator to the module controller 162 that a substrate 108 is ready to be received in the substrate support 176.
- the substrate 108 is then received by the rotator 170 by driving the substrate 108 into the substrate support 176 using the drive roller 202 until the substrate sensor 240 indicates receipt of the substrate 108 (e.g., the switch 242 moves from the first position to the second position).
- rotating operations can be performed on the substrate 108.
- a 180° rotation, or inversion, of the substrate 108 is performed by rotating the gear support 228 180°.
- the gear support 228 is indexed to provide accurate angular substrate positioning.
- the substrate 108 is then discharged by driving it past the end 256 of the lever 250 of the switch 242 where it is detected by the substrate sensor 330 and received at the substrate output 112 of the CMD 102. Additional processing of the substrate 108, such as printing, can then be carried out on the substrate 108.
- the rotator 170 can be used to direct the substrate 108 toward one or both of the encoding modules 300 to perform encoding operations on the substrate 108. Accordingly, rotator 270 can rotate the substrate support 176 to a first encoding position, indicated by substrate support plane 178B ( FIGS. 4 and 10 ), to align the substrate support 176 and the substrate 108 for encoding with the encoder 332. Likewise the rotator 170 can rotate the substrate support 176 in alignment with a second encoding position, indicated by substrate support plane 178C ( FIGS. 4 and 11 ), for encoding a substrate 108 with the encoder 334.
- FIG. 10 illustrates the rotation and insertion of the substrate 108 within the contact encoder 300A for contact smart chip encoding.
- FIG. 11 illustrates the rotation of the substrate 108 and the feeding of the substrate 108 toward the proximity encoder 300B for a wireless encoding of the smart chip of the substrate 108.
- the substrate support 176 of the rotator 170 includes different indexed angular positions for discharging correctly processed substrates 108 and incorrectly or incompletely processed substrates 108.
- the substrate support 176 is rotated to a substrate collection output position, indicated by substrate support plane 178D ( FIGS. 4 and 12 ), which aligns the substrate with the substrate collection output 158.
- the substrate collection output position 178D is coplanar with the substrate receiving position 178A, as shown in FIG. 4 .
- the substrate 108 can then be fed or discharged through the substrate collection output 158 for collection in an optional hopper ( FIG. 4 ) 340.
- the substrate support 176 can be angularly aligned with a substrate reject output position, indicated by substrate support plane 178E ( FIGS. 4 and 13 ), which is aligned with a substrate reject output 342.
- the substrate 108 can then be fed or discharge through the substrate reject output 342 for collection in an optional reject tray or hopper 344, as shown in FIG. 4 .
- Substrates that are configured for proximity encoding of their smart chips include an antenna that receives the encoding signals from the data writer 306 and an antenna that transmits signals for reading of the smart chip by the corresponding proximity reader 308 of the encoder 300. It is desirable to position the antenna of the substrate 108 as close as possible to the proximity encoder module 300 to ensure proper encoding of the smart chip. Some substrates have antennas that are positioned more toward one end of the substrate than the other. As a result, the end of the substrate that is fed toward the encoder 300 ( FIG. 11 ) by the rotator 170 may not be the end that contains the antenna, which may result in a failed encoding attempt.
- One embodiment of the invention includes commands that can be used to ensure that the substrate 108 is in the best position for encoding.
- the controller 162 can be provided to the controller 162 to orient the substrate 108 such that the antenna is as close as possible to the proximity substrate encoder 300.
- the substrate 108 can be flipped, if necessary, prior to feeding it toward the encoder 300 to position the antenna in the optimum location.
- Another embodiment of the invention operates to ensure that the best attempt to encode the substrate is made even when the specific substrate configuration is unknown.
- the smart chip of the substrate 108 is read by the proximity substrate reader of the encoder 300. If the encoding operation fails (i.e., the smart chip was not properly encoded), the substrate 108 is reloaded into the rotator 170, rotated 180° and fed back toward the encoding module 300 for a second encoding attempt. Ultimately, the antenna of the substrate 108 will be in a better position on the second attempt for a successful encoding operation. Thus, it is ensured that the best attempt to encode the substrate has been made.
- Another embodiment of the invention relates to an initialization routine that operates to check that the system 104 is ready for substrate processing.
- an initialization routine that operates to check that the system 104 is ready for substrate processing.
- prior to beginning substrate processing particularly when power to the system 104 is activated from an off state, it is desirable to perform a check to determine whether a substrate remains within the CMD 102 or the module 100.
- a check is made to determine whether a substrate 108 is loaded in the module 100, by first checking the substrate sensor 240 to determine whether it indicates the presence or absence of a substrate 108 in the substrate support 176. If a substrate 108 is detected, the rotator 170 preferably discharges the substrate 108 through the output 158 or 342.
- the drive roller 202 is activated to rotate in a direction that would pull any substrate 108 that may be held between the drive roller 202 and the pinch roller 204 into the substrate support 176 for detection by the substrate sensor 240.
- a substrate 108 may be held between the drive and pinch rollers 202 and 204 when, for example, power to the system 104 was lost or turned off while the substrate 108 was being encoded by one of the encoder modules 300.
- a check is made to determine whether the substrate sensor 240 detects a substrate 108 in the substrate support 176. If a substrate 108 is detected, the substrate 108 is preferably discharged through the reject output 164. If no substrate 108 is detected, it can be assumed that the module 100 is clear of substrates 108 and substrate processing operations can commence on a new substrate provided that similar operations in the CMD 102 do not reveal the presence of a substrate therein.
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Abstract
Description
- Credentials include identification cards, driver's licenses, passports, and other documents. Such credentials are formed from credential substrates including paper substrates, plastic substrates, cards and other materials. Such credentials generally include printed information, such as a photo, account numbers, identification numbers, and other personal information. A secure overlaminate may also be laminated to the surfaces of the credential substrate to protect the surfaces from damage and, in some instances, provide a security feature (e.g., hologram). Additionally, credentials can include data that is encoded in a smartcard chip, a magnetic stripe, or a barcode, for example.
- It is desirable to provide customers with affordable credential manufacturing devices that meet their particular needs. While most customers will desire a set of basic features, such as credential substrate printing, some clients will demand more features, such as a substrate flipping, encoding and laminating.
- To that end, it is desirable to provide substrate rotating, encoding and/or other substrate processing functions in a modular or add-on device that can be attached to an existing stand-alone credential manufacturing device to expand its functionality. Such a modular system allows customers to customize their credential manufacturing system to their particular needs and avoid paying for unnecessary substrate processing functions.
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FR 2 770 174 - Embodiments of the present invention provide solutions to these and other problems, and offer other advantages over the prior art.
- According to the present invention there is provided a credential substrate rotator and a system comprising a credential substrate module and an adjoining credential manufacturing device as claimed in the appended claims.
- The present invention is generally directed to credential substrate processing including substrate rotating and data encoding. One embodiment of the invention is directed to a substrate rotator that includes a substrate support, a substrate feeder and a substrate sensor. The substrate support is configured to support a substrate in a substrate support plane and rotate about a central axis. The substrate feeder is configured to feed a substrate along the substrate support plane. The substrate sensor includes a substrate position indicator that is aligned with the central axis and has first and second positions. The first position indicates an absence of a substrate from a predetermined location of the substrate support. The second position indicates a presence of a substrate in the predetermined location of the substrate support.
- Another embodiment of the invention is directed to a credential substrate processing module that includes the substrate rotator described above.
- Another embodiment of the invention is directed to a credential substrate processing module that includes a credential substrate rotator, a first data encoder and a module controller. The credential substrate rotator includes a substrate support and a substrate feeder. The substrate support is configured to support a substrate in a substrate support plane and rotate about a central axis. The substrate support includes indexed angular positions including a substrate receiving position, in which the substrate support is positioned to receive a substrate fed from an adjoining stand-alone credential manufacturing device, and a first encoding position. The first data encoder is configured to encode data to a substrate presented by the substrate rotator when the substrate support is oriented with the first encoding position. The module controller is configured to control the substrate rotator and the first encoder module and communicate with a controller of the stand-alone credential manufacturing device
- Other features and benefits that characterize embodiments of the present invention will be apparent upon reading the following detailed description and review of the associated drawings.
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FIG. 1 is a perspective view of a credential manufacturing system in accordance with embodiments of the invention. -
FIG. 2 is a schematic diagram of a credential manufacturing system in accordance with embodiments of the invention. -
FIG. 3 is a perspective view of a credential substrate processing module with a housing and cover removed in accordance with embodiments of the invention. -
FIG. 4 is a schematic diagram of a credential substrate processing module in accordance with embodiments of the invention. -
FIG. 5 is a perspective view of a substrate rotator in accordance with embodiments of the invention. -
FIG. 6 is a side cross-sectional view of a substrate rotator in accordance with embodiments of the invention. -
FIG. 7 is an exploded perspective view of a substrate rotator in accordance with embodiments of the invention. -
FIGS. 8 and9 are top plan views of a credential substrate processing module in accordance with embodiments of the invention. -
FIGS. 10-14 are side cross-sectional views of the module in accordance with embodiments of the invention. - Embodiments of the present invention are generally related to a credential substrate processing module 100 (hereinafter "module") that attaches to a stand-alone credential manufacturing device (CMD) 102 to form a
credential manufacturing system 104, as illustrated in the exploded perspective view ofFIG. 1 .FIG. 2 is a schematic diagram of thesystem 104 in accordance with several embodiments of the invention. - Although embodiments of the
CMD 102 andmodule 100 of the present invention will be depicted as being operable with credential substrates that are generally in the form of card substrates, it should be understood that theCMD 102 and themodule 100 can be configured for use with other types of credential substrates such as, for example, paper substrates, plastic substrates, substrates used to form passports, and other credential-related materials. - One advantage of the
system 104 over more complex stand-alone credential manufacturing devices, is that thesystem 104 can be customized to the needs of a particular user. The ability to select only the features that are desired allows the user to avoid the cost of purchasing undesired or unnecessary credential processing functions. - In the event that additional functionality, over that provided by the stand-
alone CMD 102 is desired, the user has the option of obtaining themodule 100 and installing it in the field. Additionally, themodule 100 itself can be updated with different credential substrate processing components. - The stand-
alone CMD 102 includes at least one credentialsubstrate processing component 106, such as a printing device for printing to a surface of acredential substrate 108, a laminating device for laminating a surface of acredential substrate 108, and/or another credential substrate processing component. Onesuitable CMD 102 that includes a printing mechanism is described inU.S. Application Numbers 11/135,619 ,10/647,666 10/647,798 - The term "stand-alone CMD" is intended to describe a
CMD 102 that is configured for operation by itself while being configured for connection to themodule 100. That is, the CMD 102 is configured to perform a credential processing function without the aid of themodule 100, whereas themodule 100 is generally configured for operation only with theCMD 102. - In addition to the at least one credential
substrate processing component 106, the CMD 102 includes asubstrate transport mechanism 110 for feeding thesubstrate 108 through theCMD 102 including presenting thesubstrate 108 to thesubstrate processing component 106 for processing and discharging thesubstrate 108 through asubstrate output 112. Thetransport mechanism 110 can include, for example, motor-driven rollers including pinch roller assemblies, such asassemblies 114, or other substrate feeding components designed to feed theparticular credential substrate 108 being processed. - A
CMD controller 116 operates to control the operation of theCMD 102 including, for example, theprocessing mechanism 106 and thetransport mechanism 110. Thecontroller 116 can be accessed directly by a user throughbuttons 118 on acontrol panel 120 of thedevice 102, or through a credential production application and/ordriver software 122 running on acomputer 124. - Power is preferably supplied to the CMD through a
cable 126 connected to a line level power outlet. Alternatively, power can be supplied to the CMD 102 from a battery or other power supply. -
Several substrates 108 can be contained in asubstrate supply 128 of theCMD 102, from which thesubstrate transport mechanism 110 can receiveindividual substrates 108 for feeding through theCMD 102. When operating as a stand-alone device (i.e., themodule 100 is not attached), a hopper (not shown) can be positioned to collect substrates that are discharged through thesubstrate output 112. A housing section 130 (FIG. 1 ) covers the components of theCMD 102 including the substrate output end of theCMD 102 when it is operating as a stand-alone unit. - The
module 100 is configured to couple to theCMD 102 and perform processing ofcredential substrates 108 received from theCMD 102 using at least onesubstrate processing component 150. In accordance with one embodiment of the invention, themodule 100 is configured to be mounted to theCMD 102 such that asubstrate input 152 of themodule 100 is in substrate handoff alignment with thesubstrate output 112 of the CMD. When positioned in such substrate handoff alignment,substrates 108 can be fed between thesubstrate input 152 of themodule 100 and thesubstrate output 112 of theCMD 102, as shown inFIG. 2 . - In accordance with one embodiment of the invention, the
module 100 includes brackets 154 (FIG. 3 ) that mate to theCMD 102 using screws or other suitable fasteners to mount themodule 100 to theCMD 102 in substrate handoff alignment. Themodule 100 preferably includes ahousing 156 that mates with thehousing 130 of theCMD 102, as shown inFIG. 1 . Thus, following the processing of asubstrate 108 by thesubstrate processing component 150 of themodule 100, themodule 100 can pass thesubstrate 108 back to theCMD 102 through thesubstrate input 152 for additional processing by thesubstrate processing component 106, or discharge the substrate through asubstrate output 158. - The at least one
substrate processing component 150 can include a substrate rotator, one or more a data encoders, and/or other credential substrate processing components.Substrates 108 can be driven through themodule 100 bysubstrate feeding components 160, such as drive and idler rollers and pinch roller pairs, or other substrate feeding components that are suitable for feeding the particular type ofsubstrate 108 being processed. - In accordance with one embodiment of the invention, the
module 100 includes amodule controller 162 that can control the at least onesubstrate processing component 150 and thesubstrate feeding components 160 and is separate from thecontroller 116 of theCMD 102. At least one cable 164 (FIG. 2 ) connects thecontrollers module 100 through the one ormore cables 164. - The
controllers cable 164 to synchronize substrate feeding operations, provide processing instructions in accordance with a credential processing job produced by the application and/or thedriver software 122, and communicate other information useful in the processing ofsubstrates 108. - In accordance with one embodiment of the
module 100, themodule controller 162 can access memory 166 (FIG. 2 ), in which firmware, default module settings, and other information can be stored. Thecontroller 116 can also be provided access to thememory 166 and themodule controller 162 can be provided access to memory of theCMD 102. - In accordance with one embodiment of the invention, the
substrate processing component 150 of themodule 100 includes asubstrate rotator 170, shown schematically inFIG. 4 . Thesubstrate rotator 170 is configured to rotate acredential substrate 108 that is received from theCMD 102 to different angular positions. For example, thesubstrate rotator 170 can invert thesubstrate 108 then send thesubstrate 108 back to the stand-alone CMD 102 for additional processing. - Perspective, side and exploded perspective views of the
substrate rotator 170 in accordance with embodiments of the invention are respectively shown inFIGS. 5-7 .FIGS. 8 and9 are top plan views of themodule 100 that illustrate features of therotator 170. - One embodiment of the
substrate rotator 170 includesstub shafts substrate support 176. Thesubstrate support 176 defines a substrate support plane 178 (FIG. 6 ), in which thesubstrate 108 is supported and fed by therotator 170. Thestub shafts side walls FIG. 3 . Thesubstrate support 176 rotates about a central axis 184 (FIG. 4 ) that is aligned with thestub shafts central axis 184 extends through thesubstrate 108 supported by thesubstrate support 176. Accordingly, thesubstrate support plane 178 and anysubstrate 108 held within thesubstrate support 176 are rotated about thecentral axis 184 as thesubstrate support 176 is rotated. - One embodiment of the
substrate support 176 includes first andsecond sections screws 190. The substrate support also includes front and rear substrate guides 192 and 194 having flaredports substrates 108 are received and discharged. Acentral opening 200 in thesubstrate support 176 accommodates adrive roller 202 and anidler pinch roller 204, respectively, which form asubstrate feeder 206. - The first and
second sections substrate support 176 each include adrive roller support 208 that is configured to receive a bearing orbushing 210, for rotatable support of ashaft 212 of thedrive roller 202. Oneend 214 of theshaft 212 extends through thesupport 208 of thefirst section 186 and is attached to a gear 216 (e.g., a spur gear) that engages agear 218, which is driven by a motor (not shown) drivingstub shaft 172. - The first and
second sections substrate support 176 each include apinch roller support 220 that is configured to receive ends of aspring member 222, which extends through ahub 224 of thepinch roller 204. Thepinch roller 204 is configured to rotate about thespring member 222 and is biased by thespring member 222 toward thedrive roller 202 for contact engagement therewith. Accordingly, thepinch roller 204 is configured for rotation and movement toward and away from thedrive roller 202. - As a
substrate 108 is received between thedrive roller 202 and thepinch roller 204, thepinch roller 204 pinches thesubstrate 108 against thedrive roller 202 and thedrive roller 202 either holds thesubstrate 108 in thesubstrate support plane 178, or is driven to feed thesubstrate 108 in the desired direction along thesubstrate support plane 178 while thepinch roller 204 responsively rotates in accordance with the direction thesubstrate 108 is driven. The pinching force applied by thepinch roller 204 to thesubstrate 108 is preferably sufficient to hold or clamp thesubstrate 108 in place. - The
first section 186 of thesubstrate support 176 is attached withscrews 226 or other means to asupport gear 228, through which an end of thestub shaft 172 extends. Thesupport gear 228 is driven by a motor for rotation about thestub shaft 172. The rotation of thesupport gear 220 rotates thesubstrate support 176 and asubstrate 108 received between the drive and pinchrollers central axis 184 that is co-axially aligned with thecentral axis 184 of thestub shafts substrate 108 supported between the drive and pinchrollers - The
stub shaft 172 and thegear support 228 are driven by motors through an appropriate gear arrangement in a gear housing 230 (FIG. 3 ). Thestub shaft 172 is received within thegear housing 230 and serves to drive thegear 218 to drive thegear 216, which in turn drives theshaft 212 of thedrive roller 202. Thestub shaft 172 is preferably driven by a stepper motor, or other suitable motor. - A stepper motor (not shown) is also preferably used for driving the
gear support 228 in a suitable manner to rotate the attachedsubstrate support 176 about thecentral axis 184. The stepper motor and the motor driving thestub shaft 172 are controlled by thecontroller 162 to rotate thesubstrate support 176 and thesubstrate support plane 178 in any desired angular position and to feed thesubstrate 108 relative to thesubstrate support 176 along thesubstrate support plane 178. In accordance with one embodiment of the invention, thedrive roller 202 is rotated in the opposite direction of the rotation of thegear support 228 to maintain thesubstrate 108 in the center of thesubstrate support 176. For example, if thegear support 228 is rotated in a counterclockwise direction, thecontroller 162 drives thedrive roller 202 in a clockwise direction to prevent thesubstrate 108 from moving relative to thesubstrate support 176. If thedrive roller 202 was not driven in this manner, thegear 216 would roll over thegear 218 causing thedrive roller 202 to rotate in the same direction (clockwise or counterclockwise) of thesupport gear 228 thereby moving thesubstrate 108 relative to thesubstrate support 176. - One advantage to maintaining the
substrate 108 substantially in the center of thesubstrate support 176 during rotating operations, is that it reduces the space required to perform the substrate rotating operation. As a result, the size of themodule 100 can be formed smaller than would be possible if thesubstrate 108 moved relative to thesubstrate support 176 during rotating operations. - One embodiment of the
rotator 170 includes asubstrate sensor 240 that detects the presence or absence of asubstrate 108 at a predetermined location relative to thesubstrate support 176. One embodiment of thesubstrate sensor 240 does not utilize an electrical connection, such as a slip ring connection, between therotating substrate support 176 and thenonrotating controller 162. Rather, thesubstrate sensor 240 of the present invention comprises amechanical switch 242 mounted to thesubstrate support 176 that is moved from a first position 244 (FIGS. 5 and8 ) when thesubstrate 108 is not fully loaded into thesubstrate support 176 or is absent from the predetermined location, to a second position 246 (FIG. 9 ) when asubstrate 108 is loaded into thesubstrate support 176 or is present in the predetermined location. Preferably, theswitch 242 is moved to thesecond position 246 when thesubstrate 108 is fully seated in the desired position (e.g., centered) in thesubstrate support 176 between the driver and pinchrollers - One embodiment of the
switch 242 of thesubstrate sensor 240 includes alever arm 250 that pivots about apin 252 mounted to thesecond section 188 of thesubstrate support 176. Aspring 254, or other suitable biasing member biases thelever 250 toward thefirst position 244, in which anend 256 protrudes into the substrate path or thesupport plane 178 and anopposing end 258 is displaced away from thesecond section 188 of thesubstrate support 176 along thecentral axis 184. Theend 258 includes aprotrusion 260 that extends through anopening 262 in thestub shaft 174 and is received by apin trigger 264 in anotch 266. In accordance with one embodiment of the invention, thepin trigger 264 is coaxial with thecentral axis 184. Thestub shaft 174 and thepin trigger 264 are configured to rotate with thesubstrate support 176 about thecentral axis 184. When thelever arm 250 is in thefirst position 244, aportion 267 of thepin trigger 264 extends outside of thestub shaft 174, as shown inFIGS. 5 and8 . - A pin sensor 270 (
FIG. 3 ) detects the first or second position of theswitch 242 and provides a signal indicating such to themodule controller 162 or theCMD controller 116. In accordance with one embodiment of the invention, thepin sensor 270 is a slotted optical sensor that includes areceiver 271 and anemitter 272, between which theportion 267 of thepin trigger 264 extends when thelever arm 250 is in thefirst position 244, as shown inFIGS. 5 and8 . Thepin sensor 270 provides an output signal to themodule controller 162 or theCMD controller 116, that indicates the absence of the portion 167 of thepin trigger 264 from between the emitter and receiver of thepin sensor 270 thereby indicating the absence of asubstrate 108 from the predetermined location of thesubstrate support 176. - As the
substrate 108 is loaded into thesubstrate support 176 from, for example, thesubstrate output 112 of theCMD 102, thesubstrate 108 engages theend 256 of thelever 250 and moves theend 256 out of the substrate path as thesubstrate 108 is driven by thedrive roller 202 to move thelever 250 from thefirst position 244 toward the second position 246 (FIG. 9 ). The movement of theend 256 of thelever 250 causes theopposing end 258 and theconnected trigger pin 264 to move along thecentral axis 184 such that theportion 267 of thepin trigger 264 is retracted within theshaft 174 and withdrawn from thepin sensor 270. - The output signal from the
pin sensor 270 can then indicate that theswitch 242 is in thesecond position 246 and that thesubstrate 108 is loaded into thesubstrate support 176 at the predetermined location of thesubstrate support 176. Once themodule controller 162 receives the signal from thepin sensor 240 that thesubstrate 108 is loaded into thesubstrate support 176, rotating operations are allowed to commence. - The
rotator 170 is preferably configured to align thesubstrate support plane 178 at any desired angle. Preferably, therotator 170 is configured to rotate thesubstrate support 176 and thecorresponding support plane 178 about thecentral axis 184 to a plurality of indexed or predefined angular positions, such as those shown inFIGS. 4 and10-14 . - One such indexed angular position is a substrate receiving position, indicated by the
substrate support plane 178A (FIGS. 4 and12 ), in which thesubstrate support plane 178 is aligned such that asubstrate 108 can be transferred between therotator 170 and theoutput 112 of theCMD 102. A substrate inversion is performed by therotator 170 by rotating thesubstrate support 176 180° such that thesubstrate support plane 178 is substantially realigned with thesubstrate receiving position 178A. Thesubstrate 108 can then be fed back to theoutput 112 of theCMD 102 through theinput 152 for additional processing. Other indexed angular positions will be discussed below. - Embodiments of the present invention include the use of the above-described substrate sensor with other substrate rotators, including substrate rotators that are not components of credential manufacturing device modules.
- In accordance with another embodiment of the
module 100, thesubstrate processing component 150 includes one ormore data encoders 300, shown inFIG. 4 , for encoding data to thesubstrate 108. In accordance with another embodiment of the invention, themodule 100 includes one ormore data encoders 300 and therotator 170. -
FIGS 10-14 are simplified side cross-sectional views of embodiments of themodule 100 connected to the CMD 102 (partial view). The data encoders 300 can each be located in one of a plurality of bays in the housing of the module, such asbay 302 orbay 304. Each data encoder 300 can include adata writer 306 configured to write data to a memory chip, a bar code, or other component of thesubstrate 108, and adata reader 308 configured to read data from thesubstrate 108, in accordance with known methods. - The
encoders 300 can be either acontact encoder 300A configured to encode thesubstrate 108 through direct contact, or aproximity encoder 300B configured to perform proximity or radio frequency encoding of thesubstrate 108 as shown inFIG. 10 . The encoding can be conducted in accordance with a standardized method such as, for example, HID®, iCLASStm, MIFARE, Legic, or other encoding method. - One embodiment of the
encoders 300 includes ahousing 310 that is configured to contain the circuit boards and components of multiple types of proximity encoders and readers. For example, onehousing 310 can contain an HID® iCLASS proximity encoder and reader boards, MIFARE proximity encoder and reader boards, or Legic proximity encoder and reader boards. Such ahousing 310 provides a cost savings since there is no need to produce multiple housing types. Additionally, the singlestandardized housing 310 simplifies the installation of theencoders 300 in themodule 100. - One embodiment of the
housing 310, shown inFIG. 10 , includes abottom portion 312 and atop portion 314 that is configured to snap-fit to thebottom portion 312. Shoulder portions within thehousing 310 provide support for the proximity encoding and reading boards. In accordance with one embodiment of the invention, thehousing 310 includes multiple shoulder portions to accommodate the different types of boards in different locations within thehousing 310. For example,shoulder portions 316 can be positioned and the interior of thehousing 310 can be shaped, to receive aniCLASS board 318, whereasshoulder portions 320 can be positioned and the interior of thehousing 310 can be shaped, to receive aMIFARE board 322, as shown inFIG. 10 . - In accordance with another embodiment of the invention, the
housing 310 includes abase plate 324. Thebase plate 324 covers an opening of thebay 304 of themodule 100 when theencoder 300 is installed. - Cables, depicted schematically in
FIG. 4 , connect theencoder modules 300 to themodule controller 162 of themodule 100 to provide a communication link therewith. Power can also be supplied through the cables. In accordance with one embodiment of the invention, the cables connecting theencoder modules 300 to themodule controller 162 are multipin (e.g., 8-pin) cables. Identification of theparticular encoder 300 that is installed is automatically determined based upon the pins that are active/inactive in the cable. This can be accomplished using a look-up table contained in thememory 166, or other suitable method. As a result, one embodiment of themodule 100 includes a "plug and play" feature that quickly identifies the setup of themodule 100 for themodule controller 162, theCMD controller 116 and/or thesubstrate producing application 122. - Instructions regarding the rotating of a
substrate 108 that is loaded into thesubstrate support 176 of therotator 170 are generally provided by the substrate processing job generated by the substrate producing application ordriver software 122. The substrate processing job can include, for example, printing instructions, laminating instructions, encoding instructions, rotating instructions, and other substrate processing instructions. - Initially, the
rotator 170 is positioned in a receiving position indicated bysubstrate support plane 178A (FIGS. 4 and12 ), in which thesubstrate support 176 is in substrate handoff alignment with thesubstrate output 112 of theCMD 102. In other words, thesubstrate support plane 178A is generally horizontally aligned with the substrate path that asubstrate 108 follows when discharge through thesubstrate output 112, as shown inFIG. 4 . - One embodiment of the
module 100 includes a substrate sensor 330 (FIGS. 2 and4 ) at thesubstrate input 152, such as a slotted optical sensor, that provides an indicator to themodule controller 162 that asubstrate 108 is ready to be received in thesubstrate support 176. Thesubstrate 108 is then received by therotator 170 by driving thesubstrate 108 into thesubstrate support 176 using thedrive roller 202 until thesubstrate sensor 240 indicates receipt of the substrate 108 (e.g., theswitch 242 moves from the first position to the second position). - Once the
substrate 108 is received within thesubstrate support 176 of therotator 170, rotating operations can be performed on thesubstrate 108. For instance, a 180° rotation, or inversion, of thesubstrate 108 is performed by rotating thegear support 228 180°. Preferably, thegear support 228 is indexed to provide accurate angular substrate positioning. Thesubstrate 108 is then discharged by driving it past theend 256 of thelever 250 of theswitch 242 where it is detected by thesubstrate sensor 330 and received at thesubstrate output 112 of theCMD 102. Additional processing of thesubstrate 108, such as printing, can then be carried out on thesubstrate 108. - Additionally, the
rotator 170 can be used to direct thesubstrate 108 toward one or both of theencoding modules 300 to perform encoding operations on thesubstrate 108. Accordingly,rotator 270 can rotate thesubstrate support 176 to a first encoding position, indicated bysubstrate support plane 178B (FIGS. 4 and10 ), to align thesubstrate support 176 and thesubstrate 108 for encoding with theencoder 332. Likewise therotator 170 can rotate thesubstrate support 176 in alignment with a second encoding position, indicated bysubstrate support plane 178C (FIGS. 4 and11 ), for encoding asubstrate 108 with theencoder 334. After thesubstrate 108 is rotated to the desired angular position corresponding to theencoder 300 to be used, thesubstrate 108 can be fed toward theencoder 300 by thefeeder 206, if necessary, to position thesubstrate 108 for encoding.FIG. 10 illustrates the rotation and insertion of thesubstrate 108 within thecontact encoder 300A for contact smart chip encoding.FIG. 11 illustrates the rotation of thesubstrate 108 and the feeding of thesubstrate 108 toward theproximity encoder 300B for a wireless encoding of the smart chip of thesubstrate 108. - In accordance with one embodiment of the invention, the
substrate support 176 of therotator 170 includes different indexed angular positions for discharging correctly processedsubstrates 108 and incorrectly or incompletely processedsubstrates 108. When the substrate has been correctly processed, thesubstrate support 176 is rotated to a substrate collection output position, indicated bysubstrate support plane 178D (FIGS. 4 and12 ), which aligns the substrate with thesubstrate collection output 158. In accordance with one embodiment of the invention, the substratecollection output position 178D is coplanar with thesubstrate receiving position 178A, as shown inFIG. 4 . Thesubstrate 108 can then be fed or discharged through thesubstrate collection output 158 for collection in an optional hopper (FIG. 4 ) 340. - When the
substrate 108 has not been correctly processed, thesubstrate support 176 can be angularly aligned with a substrate reject output position, indicated bysubstrate support plane 178E (FIGS. 4 and13 ), which is aligned with asubstrate reject output 342. Thesubstrate 108 can then be fed or discharge through thesubstrate reject output 342 for collection in an optional reject tray orhopper 344, as shown inFIG. 4 . - Substrates that are configured for proximity encoding of their smart chips include an antenna that receives the encoding signals from the
data writer 306 and an antenna that transmits signals for reading of the smart chip by the correspondingproximity reader 308 of theencoder 300. It is desirable to position the antenna of thesubstrate 108 as close as possible to theproximity encoder module 300 to ensure proper encoding of the smart chip. Some substrates have antennas that are positioned more toward one end of the substrate than the other. As a result, the end of the substrate that is fed toward the encoder 300 (FIG. 11 ) by therotator 170 may not be the end that contains the antenna, which may result in a failed encoding attempt. One embodiment of the invention includes commands that can be used to ensure that thesubstrate 108 is in the best position for encoding. - When the antenna position for the substrate and the position the substrate will be in when loaded into the
system 104, such as in a substrate supply 128 (FIG. 2 ), is known in advance, instructions can be provided to thecontroller 162 to orient thesubstrate 108 such that the antenna is as close as possible to theproximity substrate encoder 300. Thus, thesubstrate 108 can be flipped, if necessary, prior to feeding it toward theencoder 300 to position the antenna in the optimum location. - Another embodiment of the invention operates to ensure that the best attempt to encode the substrate is made even when the specific substrate configuration is unknown. In accordance with this embodiment of the invention, following an encoding operation where an end of the
substrate 108 is positioned adjacent the encoder module 300 (FIG. 11 ), the smart chip of thesubstrate 108 is read by the proximity substrate reader of theencoder 300. If the encoding operation fails (i.e., the smart chip was not properly encoded), thesubstrate 108 is reloaded into therotator 170, rotated 180° and fed back toward theencoding module 300 for a second encoding attempt. Hopefully, the antenna of thesubstrate 108 will be in a better position on the second attempt for a successful encoding operation. Thus, it is ensured that the best attempt to encode the substrate has been made. - Another embodiment of the invention relates to an initialization routine that operates to check that the
system 104 is ready for substrate processing. In general, prior to beginning substrate processing, particularly when power to thesystem 104 is activated from an off state, it is desirable to perform a check to determine whether a substrate remains within theCMD 102 or themodule 100. - In accordance with one embodiment of the invention, a check is made to determine whether a
substrate 108 is loaded in themodule 100, by first checking thesubstrate sensor 240 to determine whether it indicates the presence or absence of asubstrate 108 in thesubstrate support 176. If asubstrate 108 is detected, therotator 170 preferably discharges thesubstrate 108 through theoutput - If no
substrate 108 is detected, thedrive roller 202 is activated to rotate in a direction that would pull anysubstrate 108 that may be held between thedrive roller 202 and thepinch roller 204 into thesubstrate support 176 for detection by thesubstrate sensor 240. Asubstrate 108 may be held between the drive and pinchrollers system 104 was lost or turned off while thesubstrate 108 was being encoded by one of theencoder modules 300. After thedrive roller 202 activation is completed, a check is made to determine whether thesubstrate sensor 240 detects asubstrate 108 in thesubstrate support 176. If asubstrate 108 is detected, thesubstrate 108 is preferably discharged through thereject output 164. If nosubstrate 108 is detected, it can be assumed that themodule 100 is clear ofsubstrates 108 and substrate processing operations can commence on a new substrate provided that similar operations in theCMD 102 do not reveal the presence of a substrate therein. - Although the present invention has been described with reference to preferred embodiments, workers skilled in the art will recognize that changes may be made in form and detail without departing from the scope of the invention. For example, it should be understood that the present invention includes the embodiments described above taken individually and in combination with one or more of the other embodiments of the invention.
Claims (8)
- A credential substrate rotator (170) comprising:a substrate support (176) configured to support a substrate (108) in a substrate
support plane (178) and said substrate support (176) configured to rotate about a central axis (184);a substrate feeder (206) configured to feed a substrate (108) along the substrate support
plane (178), anda substrate sensor (240) including a substrate position indicator coaxial
with the central axis (184) and having a first position indicative of an absence of a substrate (108) from a predetermined location of the substrate support (176), and a second position indicative of a presence of a substrate (108) in the predetermined location of the substrate support (176). - The credential substrate rotator of claim 1 including a shaft (174) coaxial with the central axis (184) and connected to the substrate support (176).
- The credential substrate rotator of claim 2, wherein:the substrate position indicator includes a pin trigger (264) received within the
shaft (174), wherein a portion (267) of the pin trigger (264) is extended beyond the shaft (174) along the central axis (184) when the substrate position indicator is in the first position, the portion of the pin trigger (264) is retracted within the shaft (174) when the substrate position indicator is in the second position; andthe substrate rotator (170) further comprises a pin trigger sensor (270) configured to
detect one of the first and second positions of the
pin trigger (264). - The credential substrate rotator of claim 1, wherein the substrate sensor (240) includes a lever arm (250) attached to the substrate support (176) and including first and second ends (256 and 258), the second end connected to the substrate position indicator, the lever arm (250) configured to pivot between first and second positions (244 and 246) respectively corresponding to the first and second positions of the substrate position indicator.
- A system comprising a credential substrate processing module (100) and an adjoining credential manufacturing device (102), the module comprising a credential substrate rotator (170) according to claim 1, wherein the module (100) comprises the substrate support (176) which includes indexed angular positions including a substrate receiving position (178A), in which the substrate support (176) is positioned to receive a substrate (108) fed from said adjoining credential manufacturing device (102) and a substrate collection output position (178D), in which the substrate support plane (178) is aligned with a substrate collection output (158).
- The system of claim 5, wherein the indexed angular positions of the substrate support (176) include a substrate reject output position (178E), in which the substrate support plane (176) is aligned with a substrate reject output (342).
- The system of claim 5, wherein:the indexed angular positions of the substrate support include a first encoding
position (178B); andthe module further comprises a first data encoder (332)
configured to encode data to a substrate (108) presented by the substrate feeder (206) when the substrate support (176) is in the first encoding position (178B). - The system of claim 7, wherein:the indexed angular positions of the substrate support (176) include a second encoding
position (178C); andthe module (100) includes a second data encoder (334) configured to
encode data to a substrate (108) presented by the substrate feeder (206) when the substrate support (176) is in the second encoding position (178C).
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US60788004P | 2004-09-08 | 2004-09-08 | |
US61125604P | 2004-09-17 | 2004-09-17 | |
PCT/US2005/031861 WO2006029205A2 (en) | 2004-09-08 | 2005-09-08 | Credential substrate rotator and processing module |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1786711A2 EP1786711A2 (en) | 2007-05-23 |
EP1786711A4 EP1786711A4 (en) | 2009-03-04 |
EP1786711B1 true EP1786711B1 (en) | 2010-10-27 |
Family
ID=36036971
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP05803865A Expired - Fee Related EP1786711B1 (en) | 2004-09-08 | 2005-09-08 | Credential substrate rotator and processing module |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1786711B1 (en) |
KR (1) | KR101150126B1 (en) |
CN (1) | CN101124137B (en) |
DE (1) | DE602005024412D1 (en) |
WO (1) | WO2006029205A2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT201600097381A1 (en) * | 2016-09-29 | 2018-03-29 | Matica Electronics S R L | Plastic card transport device for card processing devices and card treatment device comprising said transport device |
IT201700099885A1 (en) * | 2017-09-06 | 2017-12-06 | Matica Electronics S R L | Plastic card feeding device for card processing devices and card processing device comprising said feeding device |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4676678A (en) | 1984-02-21 | 1987-06-30 | Kabushiki Kaisha Toshiba | Ribbon cassette cartridge having a lid and a locator slot |
US5941522A (en) * | 1997-05-13 | 1999-08-24 | Fargo Electronics, Inc. | Printer with auxiliary operation |
US5927713A (en) * | 1997-09-18 | 1999-07-27 | Bell & Howell Mail Processing Systems | Apparatus and method for inverting, staging and diverting sheet articles |
FR2770174B1 (en) * | 1997-10-24 | 2000-02-04 | Canon Kk | DEVICE FOR TWO-SIDED PROCESSING OF SHEETS |
JP2000099807A (en) * | 1998-09-25 | 2000-04-07 | Matsushita Electric Works Ltd | Card dispenser |
NL1010937C2 (en) * | 1998-12-31 | 2000-07-03 | Neopost Bv | Device for rotating at least one flat object. |
JP2001039588A (en) * | 1999-05-21 | 2001-02-13 | Mitsubishi Electric Corp | Card inverting mechanism for printer device |
JP3667617B2 (en) * | 2000-09-28 | 2005-07-06 | ニスカ株式会社 | Card processing device |
JP2002120446A (en) | 2000-10-13 | 2002-04-23 | Alps Electric Co Ltd | Thermal transfer printer |
JP2003146510A (en) * | 2001-11-07 | 2003-05-21 | Canon Finetech Inc | Paper inversion device |
-
2005
- 2005-09-08 DE DE602005024412T patent/DE602005024412D1/en active Active
- 2005-09-08 WO PCT/US2005/031861 patent/WO2006029205A2/en active Application Filing
- 2005-09-08 KR KR1020077003153A patent/KR101150126B1/en not_active IP Right Cessation
- 2005-09-08 CN CN2005800297271A patent/CN101124137B/en not_active Expired - Fee Related
- 2005-09-08 EP EP05803865A patent/EP1786711B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE602005024412D1 (en) | 2010-12-09 |
KR101150126B1 (en) | 2012-06-21 |
EP1786711A2 (en) | 2007-05-23 |
CN101124137A (en) | 2008-02-13 |
WO2006029205A2 (en) | 2006-03-16 |
CN101124137B (en) | 2010-04-07 |
EP1786711A4 (en) | 2009-03-04 |
WO2006029205A3 (en) | 2007-05-10 |
KR20070050047A (en) | 2007-05-14 |
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