EP1745888A4 - METHOD AND DEVICE FOR LINEAR ADVANCED POLISHING - Google Patents

METHOD AND DEVICE FOR LINEAR ADVANCED POLISHING

Info

Publication number
EP1745888A4
EP1745888A4 EP05727544A EP05727544A EP1745888A4 EP 1745888 A4 EP1745888 A4 EP 1745888A4 EP 05727544 A EP05727544 A EP 05727544A EP 05727544 A EP05727544 A EP 05727544A EP 1745888 A4 EP1745888 A4 EP 1745888A4
Authority
EP
European Patent Office
Prior art keywords
work
surface plates
pair
flat plane
plane surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05727544A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1745888A1 (en
Inventor
Heiji Yasui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YASUI, HEIJI
Original Assignee
Japan Science and Technology Agency
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Science and Technology Agency filed Critical Japan Science and Technology Agency
Publication of EP1745888A1 publication Critical patent/EP1745888A1/en
Publication of EP1745888A4 publication Critical patent/EP1745888A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

　回転型研磨加工法では、工作物を連続的に装置に送り込むことや装置周辺の空間の有効利用は難しい。本発明は、これらの問題を解決した新しい概念の直進型研磨加工法と装置を提供する。平行に隣接した１組の平行平面定盤の各々が互いに反対方向に直線運動を行う。この定盤の両方に、工作物を押しつけることにより、工作物に回転運動のための偶力を与える。工作物の回転と直線運動をする１組の定盤との相対運動により、工作物を砥粒で研磨する。１組の平行平面定盤を別の１組の平行平面定盤と対向させて、その間に工作物を挟んで片面又は両面を研磨することができる。平面定盤に代えて工作物支持台上を通過するベルト型のポリシャを用いることもできる。
EP05727544A 2004-03-31 2005-03-29 METHOD AND DEVICE FOR LINEAR ADVANCED POLISHING Withdrawn EP1745888A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004105655 2004-03-31
PCT/JP2005/005858 WO2005095053A1 (ja) 2004-03-31 2005-03-29 直進型研磨方法及び装置

Publications (2)

Publication Number Publication Date
EP1745888A1 EP1745888A1 (en) 2007-01-24
EP1745888A4 true EP1745888A4 (en) 2008-01-02

Family

ID=35063594

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05727544A Withdrawn EP1745888A4 (en) 2004-03-31 2005-03-29 METHOD AND DEVICE FOR LINEAR ADVANCED POLISHING

Country Status (7)

Country Link
US (1) US20070202777A1 (ja)
EP (1) EP1745888A4 (ja)
JP (1) JP4472694B2 (ja)
KR (1) KR100806949B1 (ja)
CN (1) CN1929954B (ja)
TW (1) TWI271261B (ja)
WO (1) WO2005095053A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101249632B (zh) * 2008-03-20 2010-06-09 沈阳材佳机械设备有限公司 往复直线加旋转运动研磨抛光装置
US8684791B2 (en) * 2011-11-09 2014-04-01 Alvin Gabriel Stern Linear, automated apparatus and method for clean, high purity, simultaneous lapping and polishing of optics, semiconductors and optoelectronic materials
US9950404B1 (en) 2012-03-29 2018-04-24 Alta Devices, Inc. High throughput polishing system for workpieces

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0696495A1 (en) * 1994-08-09 1996-02-14 Ontrak Systems, Inc. Linear polisher and method for semiconductor wafer planarization
US6422929B1 (en) * 2000-03-31 2002-07-23 Taiwan Semiconductor Manufacturing Co., Ltd. Polishing pad for a linear polisher and method for forming

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2144354B (en) * 1983-07-15 1987-03-11 Helical Springs Limited Grinding apparatus
JPS6080559A (ja) 1983-10-12 1985-05-08 Mitsubishi Metal Corp 研磨装置
US5371973A (en) * 1992-09-30 1994-12-13 Western Atlas Inc. Grinding machine utilizing multiple, parallel, abrasive belts simultaneously grinding surfaces on a workpiece
US5575707A (en) * 1994-10-11 1996-11-19 Ontrak Systems, Inc. Polishing pad cluster for polishing a semiconductor wafer
JPH10249720A (ja) 1997-03-13 1998-09-22 Kobe Steel Ltd 平板状工作物のポリッシング加工方法
US6241583B1 (en) * 1999-02-04 2001-06-05 Applied Materials, Inc. Chemical mechanical polishing with a plurality of polishing sheets
US6626744B1 (en) * 1999-12-17 2003-09-30 Applied Materials, Inc. Planarization system with multiple polishing pads
US20040137830A1 (en) * 2002-12-24 2004-07-15 Kazumasa Ohnishi Lapping method and lapping machine

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0696495A1 (en) * 1994-08-09 1996-02-14 Ontrak Systems, Inc. Linear polisher and method for semiconductor wafer planarization
JPH0852652A (ja) * 1994-08-09 1996-02-27 Ontrak Syst Inc リニアポリシャ及び半導体ウエハ平滑化方法
US6422929B1 (en) * 2000-03-31 2002-07-23 Taiwan Semiconductor Manufacturing Co., Ltd. Polishing pad for a linear polisher and method for forming

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2005095053A1 *

Also Published As

Publication number Publication date
KR20060132954A (ko) 2006-12-22
CN1929954A (zh) 2007-03-14
JP4472694B2 (ja) 2010-06-02
WO2005095053A1 (ja) 2005-10-13
EP1745888A1 (en) 2007-01-24
US20070202777A1 (en) 2007-08-30
JPWO2005095053A1 (ja) 2008-07-31
TWI271261B (en) 2007-01-21
TW200531781A (en) 2005-10-01
KR100806949B1 (ko) 2008-02-22
CN1929954B (zh) 2011-12-14

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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17P Request for examination filed

Effective date: 20061019

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): DE

DAX Request for extension of the european patent (deleted)
RBV Designated contracting states (corrected)

Designated state(s): DE

A4 Supplementary search report drawn up and despatched

Effective date: 20071203

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: YASUI, HEIJI

RIN1 Information on inventor provided before grant (corrected)

Inventor name: YASUI, HEIJI

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20121002